Conferences related to Encapsulation

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Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS 2021 San Diego

    Covering Oceanography as a whole - instrumentation, science, research, biology, subsea and surface vehicles, autonomous vehicles, AUV, ROV, manned submersibles, global climate, oceanography, oceanology, rivers, estuaries, aquatic life and biology, water purity, water treatment, sonar, mapping, charting, navigation, navigation safety, oil and gas, military, and commercial applications of the oceans, subsea mining, hot vents, adn more.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2009

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2007

  • OCEANS 2006

  • OCEANS 2005

  • OCEANS 2004

  • OCEANS 2003

  • OCEANS 2002

  • OCEANS 2001

  • OCEANS 2000

  • OCEANS '99

  • OCEANS '98

  • OCEANS '97

  • OCEANS '96


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

The EMPC 2019 program will focus on industrial needs, trends and solutions, and academic R&DThis event brings together researchers, innovators, technologists, business and marketingmanagers with an interest in microelectronics and photonics packaging, providing communication,education and interaction focused on developments of technologies of the present and for thefuture, including 3D Integration, SMT, CoB and FC-Assembly, Embedding, Wafer LevelPackaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF, HT and Power-Electronics, Flexible Electronics, Advanced Materials, Thermal Management,Modeling/Design/Simulation and Reliability.


2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


2019 9th International IEEE/EMBS Conference on Neural Engineering (NER)

Neural Engineering

  • 2017 8th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural Engineering is an emerging core discipline,which coalesces neuroscience with engineering.Members of both the Neuroscience and Engineering Communities areencouraged to attend this highly multidisciplinarymeeting. The conference will highlight the emergingengineering innovations in the restoration andenhancement of impaired sensory, motor, andcognitive functions, novel engineering for deepeningknowledge of brain function, and advanced designand use of neurotechnologies

  • 2015 7th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural engineering deals with many aspects of basic and clinical problemsassociated with neural dysfunction including the representation of sensory and motor information, theelectrical stimulation of the neuromuscular system to control the muscle activation and movement, theanalysis and visualization of complex neural systems at multi -scale from the single -cell and to the systemlevels to understand the underlying mechanisms, the development of novel neural prostheses, implantsand wearable devices to restore and enhance the impaired sensory and motor systems and functions.

  • 2013 6th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural engineering deals with many aspects of basic and clinical problems associated with neural dysfunction including the representation of sensory and motor information, the electrical stimulation of the neuromuscular system to control the muscle activation and movement, the analysis and visualization of complex neural systems at multi-scale from the single-cell and to the system levels to understand the underlying mechanisms, the development of novel neural prostheses, implants and wearable devices to restore and enhance the impaired sensory and motor systems and functions.

  • 2011 5th International IEEE/EMBS Conference on Neural Engineering (NER)

    highlight the emerging field, Neural Engineering that unites engineering, physics, chemistry, mathematics, computer science with molecular, cellular, cognitive and behavioral neuroscience and encompasses such areas as replacing or restoring lost sensory and motor abilities, defining the organizing principles and underlying mechanisms of neural systems, neurorobotics, neuroelectronics, brain imaging and mapping, cognitive science and neuroscience.

  • 2009 4th International IEEE/EMBS Conference on Neural Engineering (NER)

    highlight the emerging field, Neural Engineering that unites engineering, physics, chemistry, mathematics, computer science with molecular, cellular, cognitive and behavioral neuroscience and encompasses such areas as replacing or restoring lost sensory and motor abilities, defining the organizing principles and underlying mechanisms of neural systems, neurorobotics, neuroelectronics, brain imaging and mapping, cognitive science and neuroscience.

  • 2007 3rd International IEEE/EMBS Conference on Neural Engineering

  • 2005 2nd International IEEE/EMBS Conference on Neural Engineering

  • 2003 1st International IEEE/EMBS Conference on Neural Engineering


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Periodicals related to Encapsulation

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


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Most published Xplore authors for Encapsulation

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Xplore Articles related to Encapsulation

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Developer Testing Object-oriented Software With Emphasis On Java

Proceedings. Technology of Object-Oriented Languages. TOOLS 26 (Cat. No.98EX176), 1998

None


Understanding SMPTE ST 2110: Data Encapsulation

Understanding SMPTE ST 2110: Data Encapsulation, 07/06/2018

This course is intended for engineers and technologists who need to understand the detail in SMPTE's ST 2110 suite of standards. It assumes a basic understanding of IP and associated terminology. The focus of this course is Background and System Overview. We begin by describing why the move to IP is important for the broadcast industry. Next we explain how ...


IEEE Guide for Loading Dry-Type Distribution and Power Transformers - Redline

IEEE Std C57.96-2013 (Revision of IEEE Std C57.96-1999) - Redline, 2014

General recommendations for the loading of dry-type distribution and power transformers installed in ventilated, non-ventilated, and sealed type enclosures are included in this standard.


Packetization strategies for MVD-based 3D video transmission

2016 Visual Communications and Image Processing (VCIP), 2016

In multi-view video plus depth (MVD) format, virtual views are synthesized by the compressed texture videos and their associated depth through depth-image- based rendering. In this paper, we consider the setup where both the encoded texture and depth bitstreams experience packet losses during transmission. Different packetization strategies are investigated and a novel strategy is developed to improve error resilience of ...


C<sub>++</sub> objects for beam physics

Conference Record of the 1991 IEEE Particle Accelerator Conference, 1991

A description is presented of a few C++ classes and applications that have been written at Fermilab for problems in accelerator physics. Described are: MXYZPTLK, beamline, AESOP, and canvas.<>


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Educational Resources on Encapsulation

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IEEE.tv Videos

No IEEE.tv Videos are currently tagged "Encapsulation"

IEEE-USA E-Books

  • Developer Testing Object-oriented Software With Emphasis On Java

    None

  • Understanding SMPTE ST 2110: Data Encapsulation

    This course is intended for engineers and technologists who need to understand the detail in SMPTE's ST 2110 suite of standards. It assumes a basic understanding of IP and associated terminology. The focus of this course is Background and System Overview. We begin by describing why the move to IP is important for the broadcast industry. Next we explain how media is transported over IP networks. We then discuss how the SMPTE ST 2110 standards suite was created. Finally we will specify the different areas of application for SMPTE ST 2110 and SMPTE ST 2022.

  • IEEE Guide for Loading Dry-Type Distribution and Power Transformers - Redline

    General recommendations for the loading of dry-type distribution and power transformers installed in ventilated, non-ventilated, and sealed type enclosures are included in this standard.

  • Packetization strategies for MVD-based 3D video transmission

    In multi-view video plus depth (MVD) format, virtual views are synthesized by the compressed texture videos and their associated depth through depth-image- based rendering. In this paper, we consider the setup where both the encoded texture and depth bitstreams experience packet losses during transmission. Different packetization strategies are investigated and a novel strategy is developed to improve error resilience of MVD-based video transmission, where texture data and its corresponding depth are put into the same packet. The size of texture plus associated depth data included in each packet needs to be less than the Maximum Transfer Unit (MTU). Experimental results demonstrate that our proposed packetization scheme yields a significant improvement in terms of both texture views and synthesized virtual views quality when fit in H.264/AVC.

  • C<sub>++</sub> objects for beam physics

    A description is presented of a few C++ classes and applications that have been written at Fermilab for problems in accelerator physics. Described are: MXYZPTLK, beamline, AESOP, and canvas.<>

  • HgI/sub 2/ low energy beta particle detector

    A HgI/sub 2/ device structure was designed and tested which allows HgI/sub 2/ to be used to make low energy beta particle detectors. The devices detected tritium beta particles with an efficiency of about 25%. A protective encapsulant has been developed which should protect the devices for up to 20 years and will attenuate only a small fraction of the beta particles. It is noted that the devices hold significant promise to provide a practical alternative to liquid scintillation counters and gas flow-through proportional counters.<<ETX>>

  • Clusters of magnetic nanoparticles as contrast agents for MRI: The effect of aggregation on T<inf>2</inf> relaxivity

    Magnetic resonance imaging (MRI) reveals anatomical structures with fascinating details, providing efficient diagnostic tool for medicine and powerful non-invasive method for biological studies in vivo. Specific contrast and labelling agents further enhance MRI applications and the most efficient ones might enable even detection of single cells. However, such enormous sensitivity is accomplished only by means of magnetic nanoparticles. These so- called susceptibility agents markedly decrease the transverse relaxation time T2, which is described by the transverse relaxivity r2. The traditional studies have been particularly focused on the dependence of r2 on magnetic properties and the mean size of crystallites, employing almost exclusively iron-based materials. In contrast, the present contribution attempts to analyse the effect of clustering of magnetic cores on T2 relaxation and it utilizes nanoparticles of ferromagnetic La0.75Sr0.25MnO3 perovskite phase. Contrary to majority of studies dealing with biomedical applications of magnetic particles, the agglomerates are intentionally isolated and subjected to relaxometry. Furthermore, a supplemental analysis is dedicated to the effect of the silica shell thickness on T2.

  • Agent Class Methodology: a new kind of autonomous object generation methodology

    We present a class based object oriented programming methodology, the Agent Class Methodology (ACM), a new kind of autonomous object generation methodology. The ACM specifies how to construct general purpose agents that can be used to construct a communicating, distributed, concurrent system. We explain the ACM's autonomous control mechanism together with the four-layered class inheritance architecture of agent class, and we also describe the features of agent class to demonstrate that the ACM meets with the basic features of object orientation. As shown by our application of ACM, the traditional object oriented programming technique can be promoted to an agent oriented counterpart by the use of ACM.

  • An object model for simulation of manufacturing systems

    Simulation imposes itself in the field of support and decision making for the analysis, design and exploitation of manufacturing systems. The main properties expected in the simulation tools are reusability, abstraction and hierarchy. However, the actual simulation approaches do not offer all these features especially the reusability, except those which are based on the object model. In this paper we present an object oriented approach allowing the modelling and simulation of manufacturing systems. This approach uses a particular object model and a new analysis approach.

  • Iterators and encapsulation

    Iterators are an important object oriented design pattern, providing sequential access to the state stored in other objects. Precisely because iterators need to access the state of other objects, iterators' design can be at odds with the encapsulation provided by object oriented languages. We present a range of designs for iterator objects, showing how different designs have different encapsulation properties. Studying a range of different iterators can help programmers to identify the strengths and weaknesses of particular designs, and also illustrates some of the issues in the design of encapsulation mechanisms in programming languages.



Standards related to Encapsulation

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IEEE Standard for Broadband over Power Line Networks: Medium Access Control and Physical Layer Specifications

The project defines a standard for high-speed (>100 Mbps at the physical layer) communication devices via electric power lines, so-called broadband over power line (BPL) devices. This standard uses transmission frequencies below 100 MHz. It is usable by all classes of BPL devices, including BPL devices used for the first-mile/last-mile connection (<1500 m to the premise) to broadband services as ...