Electrical products industry
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2021 IEEE International Conference on Mechatronics (ICM)
CM focuses on recent developments and future prospects related to the synergetic integration of mechanics, electronics, and information processing.
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
The PCIC provides an international forum for the exchange of electrical applications technology related to the petroleum and chemical industry. The PCIC annual conference is rotated across North American locations of industry strength to attract national and international participation. User, manufacturer, consultant, and contractor participation is encouraged to strengthen the conference technical base. Success of the PCIC is built upon high quality papers, individual recognition, valued standards activities, mentoring, tutorials, networking and conference sites that appeal to all.
The Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.
This symposium pertains to the field of electromagnetic compatibility.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.
Design and analysis of algorithms, computer systems, and digital networks; methods for specifying, measuring, and modeling the performance of computers and computer systems; design of computer components, such as arithmetic units, data storage devices, and interface devices; design of reliable and testable digital devices and systems; computer networks and distributed computer systems; new computer organizations and architectures; applications of VLSI ...
Serves as a compendium for papers on the technological advances in control engineering and as an archival publication which will bridge the gap between theory and practice. Papers will highlight the latest knowledge, exploratory developments, and practical applications in all aspects of the technology needed to implement control systems from analysis and design through simulation and hardware.
IEEE Power Engineering Review, 1991
IEEE Transactions on Professional Communication, 1998
IEEE Power Engineering Review, 1982
2009 International Symposium on Information Engineering and Electronic Commerce, 2009
This paper first analyzed previous index and relevant theory, then design an index for household electrical appliances (especially for lager household electrical appliances). And source material were obtained through questionnaire, analysis on factor was performed with SPSS, various factorspsila variance contribution ration, accumulative contribution ration and degrees of common were studied. Analysis shows that the scale has high reliability and ...
2008 4th International Conference on Wireless Communications, Networking and Mobile Computing, 2008
This article has been retracted by the publisher.
Heuristics for Design for Reliability in Electrical and Electronic Products
How to be a Star Engineer
Dorabot: Products & Solutions Promo Trailer
The BEST Way and the BEST Place to Publish Your BEST Work: A Step by Step Process for Publishing a Journal Paper with IEEE
Flywheel Energy Storage for the 21st Century: APEC 2019
HKN: Industry Connections Panel
Understanding and Improving Microwave Cable Performance in Aircraft and Land Vehicles: MicroApps 2015 - W.L. Gore & Associates
Grounding for Hybrid Vehicles
Brain Fuel: Issues, Opportunities, and Challenges Facing Young Technology Professionals in Industry - 2017
The European Startup Scene - Jose Pozo - IPC 2018
What's New in Storage Devices - Jim Gathman from IBM
IRDS: Yield Enhancement - Slava Libman at INC 2019
Technical Tours: Eaton
IEEE Standards Presents: Case Study 515 (English)
Q-Band CMOS Transmitter System-on-Chip - Tim Larocca - RFIC Showcase 2018
IMS MicroApp: Advances in High Frequency Printed Circuit Board (PCB)
Pt. 2: More Moore: Scaling of CMOS - An Chen - Industry Panel 2, IEEE Globecom, 2019
IMS MicroApps: Multi-Chip Module Design Challenges
This paper first analyzed previous index and relevant theory, then design an index for household electrical appliances (especially for lager household electrical appliances). And source material were obtained through questionnaire, analysis on factor was performed with SPSS, various factorspsila variance contribution ration, accumulative contribution ration and degrees of common were studied. Analysis shows that the scale has high reliability and better validity, and experimental results are credible.
This article has been retracted by the publisher.
Nitto Denko has created many products to reduce environmental impact. I will introduce a double coated adhesive tape for recycle application, especially for the process cartridges of laser printer and photocopies as one of environmental friendly products. We did choose the backing with high strength and appropriate elasticity and the adhesive which would maintain constant level of adhesive performance over the long term to satisfy the contradictory requirements of high bonding strength and easy removability.
Summary form only given. The paper explores the challenges and successful strategies of design for environment (DFE) by bringing together representatives from both parent companies and subsidiaries. The authors each provide their perspectives on the issue, followed by a facilitated group discussion.
Currently, coastal cities become major forces to promote Liaoning's processing trade development. Speeding up the development of Liaoning coastal economic zone has an important strategic significance for revitalizing the northeast old industrial base. This thesis introduced the status of Liaoning coastal cities' processing trade and calculated value-added coefficient of processing trade, the contribution rate and stimulating degree of processing trade to economic growth, the result showed that coastal cities' processing trade played an important role for Liaoning's economic growth. But there is a big gap between Liaoning costal cities and other costal provinces in developing processing trade, so Liaoning should take measures to realize processing trade upgrade.
There are many measuring methods of the environment impacts. Toxic Potential Indicator is one of the simple methods to evaluate them. This method is calculated from the hazardous potential of contained materials in the productions, and they depended on law or the regulations. In this paper, we customized TPI as Japanese regulations, then compared the TPI values of metals contained in conventional solders and lead-free solders between original one and customized one. As a result, it has been confirmed that TPI method was also available in other regulations with appropriate customization
Some products are reverse engineered RE as an origin in the design process while others are based on a new inception. In a globally competitive market it is important to reverse engineer electrical products and components for manufacture. Competitor's products are reverse engineered to generate a cost basis to keep a manufacturer's pricing in line with markets. The process of reverse engineering can also be used to regenerate obsolete parts or ones that are out of production and needed for service needs. The reverse engineered part or one designed completely in a solid modeling (SM) package parallels the future manufacture of the part and corresponding assembly. Animation and analysis are integrated into the SM and FEA modeling of the part