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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting
The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science
Technical presentations will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, theory and computational tool development, active and passive components, systems, and supporting technologies.System developers will find that IVEC provides a unique snapshot of the current state-of-the-art in vacuum electron devices. These devices continue to provide unmatched power and performance for advanced electromagnetic systems, particularly in the challenging frequency regimes of millimeter-wave and THz electronics.Plenary talks will provide insights into the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current directions in vacuum electronics research.
APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics
2020 IEEE International Conference on Industrial Technology (ICIT)
ICIT focuses on industrial and manufacturing applications of electronics, controls, communications, instrumentation, and computational intelligence.
ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
IEEE Power Engineering Review, 1991
1962 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1962
1977 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1977
1966 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1966
Proceedings of the Institute of Radio Engineers, 1938
Single Crystal AlGaN Bulk Acoustic Wave Resonators on Silicon Substrates with High Electromechanical Coupling: RFIC Industry Showcase
Quantum Computation - ASC-2014 Plenary series - 4 of 13 - Tuesday 2014/8/12
On the Characterization of Thermal Coupling Resistance in a Current Mirror: RFIC Industry Showcase 2016
IEEE Custom Integrated Circuits Conference
IEEE Magnetics Distinguished Lecture - Can-Ming Hu
Physical Restraints on Quantum Circuits - IEEE Rebooting Computing 2017
ISSCC 2012 - Awards Ceremony
Alice Wang - SSCS Chip Chat Podcast, Episode 6
Multi-Level Optical Weights in Integrated Circuits - IEEE Rebooting Computing 2017
IMS 2011 Microapps - Memory Effects in RF Circuits: Definition, Manifestations and Fast, Accurate Simulation
RF Induced Communication Errors in RFFE MIPI Controlled Power Amplifiers: RFIC Interactive Forum
IMS 2011 Microapps - STAN Tool: A New Method for Linear and Nonlinear Stability Analysis of Microwave Circuits
How to Optimize the Performance of Your RF Layout: MicroApps 2015 - Keysight Technologies
2017 IEEE Donald O. Pederson Award in Solid-State Circuits: Takao Nishitani and John S. Thompson
Multi-Level Optimization for Large Fan-In Optical Logic Circuits - Takumi Egawa - ICRC 2018
William S. Carter and Stephen Trimberger - 2018 Donald O. Pederson Award in Solid-State Circuits at IEEE ISSCC
THz Transistors: Present and Future
Wireless Power Charging of Plug-In Electric Vehicles
Interview with Takao Nishitani - IEEE Donald O. Pederson Award in Solid-State Circuits Co-Recipient 2017
Summary form only given. A new method to measure electron energy distribution function by an emissive probe has been proposed. The method is based on measurement of the functional relationship of the floating potential and the heating voltage of emissive probe. From the measured data of the floating potential change as a function of the heating voltage, the curve of the probe collection current-voltage is analytically obtained and subsequently the electron energy distribution function is obtained by the second derivative method. The present method has several important advantages of the following: (1) it is even applicable to radio-frequency plasma in which the potentials are usually fluctuating, (2) also applicable to plasmas which are produced in non-conductive containers. In the experiment, the emissive probe 30 micrometer diameter tungsten was heated by 40 kHz pulse voltage, and the floating potential at the heating voltage off period and the floating potential difference between the heating off and on period were measured by digital oscilloscope in argon plasma. The measurements were made in both the capacitively coupled and inductively coupled plasmas. The data acquisitions were performed by GPIB and the data analysis was made with a personal computer. It was shown that the plasma electron energy probability function could be obtained without any RF compensating circuit even in capacitively coupled plasmas. In particular, since the method is very sensitive near the plasma potential, the clear depletion of the low energy electron, which has already been found and analyzed by Godyak and Piejak, could be obtained. This low energy electron depletion is due to high plasma potential. Therefore, in the inductively coupled plasma this low energy electron depletion was obtained near the induction antenna, but at the further positions from the antenna the energy distribution became Maxwellian. This feature has also been reported by Godyak recently. This change in the electron energy distribution found in ICP was very systematic with the gas pressures and the distances from the antenna. Thus the present method is quite innovative in that it is applicable to the potential fluctuating RF plasma and measurements are all done in a floating condition of probe.
This paper describes how the bandpass fourth-order antimetric-elliptic-filter function can be synthesized in a waveguide structure. A mathematical model is shown to predict accurately the performance of an experimental waveguide filter.
This paper will describe an IC compandor that provides improved noise performance in high quality telephone systems. An accuracy Of 0.2 dB has been achieved over 60-dB dynamic and10-55°C temperature ranges.
A bipolar IC capable of selection, feedback-stabilized bias and 1OOMb modulation of any one of a group of four semiconductor diode lasers for optical communications will be described. The chip includes on-board failure detection and power-limiting circuitry.
his standard revises and enhances the VHDL language reference manual (LRM) by including a standard C language interface specification; specifications from previously separate, but related, standards IEEE Std 1164 -1993,1 IEEE Std 1076.2 -1996, and IEEE Std 1076.3-1997; and general language enhancements in the areas of design and verification of electronic systems.
This guide applies to low-voltage ac power circuit breakers of the 635 V maximum voltage class with separately-mounted current-limiting fuses for use on ac circuits with available short-circuit currents of 200 000 A (rms symmetrical) or less. Low-voltage ac fused power circuit breakers and combinations of fuses and molded-case circuit breakers are not covered by this guide. This guide sets ...