Conferences related to Computer integrated manufacturing

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2021 26th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA )

ETFA focus is on the latest developments and new technologies in the field of industrial and factory automation. The conference aims to exchange ideas with both industry leaders and a variety of experienced researchers, developers, and practitioners from several industries, research institutes, and academia


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


2020 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

All topics related to engineering and technology management, including applicable analytical methods and economical/social/human issues to be considered in making engineering decisions.


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Periodicals related to Computer integrated manufacturing

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Computers, IEEE Transactions on

Design and analysis of algorithms, computer systems, and digital networks; methods for specifying, measuring, and modeling the performance of computers and computer systems; design of computer components, such as arithmetic units, data storage devices, and interface devices; design of reliable and testable digital devices and systems; computer networks and distributed computer systems; new computer organizations and architectures; applications of VLSI ...


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Most published Xplore authors for Computer integrated manufacturing

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Xplore Articles related to Computer integrated manufacturing

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Technology '89: industrial electronics

IEEE Spectrum, 1989

Advances in industrial electronics during 1988 are examined. Significant developments included the increased use of networking in computer-integrated manufacturing; increased use of embedded 32-bit microprocessors; faster, more flexible support ICs for these microprocessors; and several large acquisitions and consolidations that changed the competitive profile of the market for industrial electronics.<<ETX>>


CIM model management

2009 IEEE/PES Power Systems Conference and Exposition, 2009

The CIM standard (IEC 61970-301) is released on a yearly cycle. Major enhancements to the CIM are planned a few years into the future as part of a CIM road map. The CIM is also modified to address issues that are discovered as it is used in real world implementations. Issues are also uncovered during the yearly multi-vendor CIM interoperability ...


Physical Integration As A Phase Of CIM

Electro International, 1991, 1991

None


Business Integration As A Phase Of CIM

Electro International, 1991, 1991

None


Enhanced Turbo Decoding for Error Floor Reduction

SCC 2013; 9th International ITG Conference on Systems, Communication and Coding, 2013

In this paper, we consider enhanced decoding of turbo codes in the error floor region. Allowing no modifications at the transmitter side, we focus on enhanced decoding algorithms which aim principally at reducing the error floor. We employ a combination of two methods which have been applied separately in the literature: the correction impulse method (CIM) and the list Viterbi ...


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Educational Resources on Computer integrated manufacturing

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IEEE.tv Videos

Surgical Robotics: Medical robotics and computer-integrated interventional medicine
Integrated Photonics Manufacturing Initiative - Michael Liehr Plenary from the 2016 IEEE Photonics Conference
Cafe: Cloud Appliances for Enterprises
U.S. Department of Energy Advanced Manufacturing Overview - Dev Shenoy: 2016 International Conference on Rebooting Computing
Maker Faire 2008: Spectrum's Digital Clock Contest Winner
Robotics History: Narratives and Networks Oral Histories:Hendrik Van Brussel
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
R. Jacob Baker - SSCS Chip Chat Podcast, Episode 4
Integrated Nanophotonic Architectures - Tarek El Ghazawi - ICRC San Mateo, 2019
Q&A Government Agencies Panel: 2016 International Conference on Rebooting Computing
Some Thoughts on a Gap Between Theory and Practice of Evolutionary Algorithms - WCCI 2012
Jim Davis on Deploying IoT in Manufacturing and Supply Chains - WF-IoT 2015
IMS 2011 Microapps - Volume Manufacturing Trends for Automotive Radar Devices
Robotics History: Narratives and Networks Oral Histories: Gary Bradsky
Edge Computing and Network Slicing for the Factories of the Future - Future X Network Panel Talk - Andreas Mueller - Brooklyn 5G Summit 2018
Zero Emission Powertrains and Fuel Cell Engines: APEC 2019
Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing - Peter Petre: 2016 International Conference on Rebooting Computing
Dr. Bernd Kosch on Industrie 4.0 and manufacturing - WF-IoT 2015
IEEE Custom Integrated Circuits Conference
Tech Super Stars Panelist - Vincent Chan: 2016 Technology Time Machine

IEEE-USA E-Books

  • Technology '89: industrial electronics

    Advances in industrial electronics during 1988 are examined. Significant developments included the increased use of networking in computer-integrated manufacturing; increased use of embedded 32-bit microprocessors; faster, more flexible support ICs for these microprocessors; and several large acquisitions and consolidations that changed the competitive profile of the market for industrial electronics.<<ETX>>

  • CIM model management

    The CIM standard (IEC 61970-301) is released on a yearly cycle. Major enhancements to the CIM are planned a few years into the future as part of a CIM road map. The CIM is also modified to address issues that are discovered as it is used in real world implementations. Issues are also uncovered during the yearly multi-vendor CIM interoperability tests. The current CIM road map will be discussed with particular emphasis on the next release. The issues resolution process and interoperability testing will also be covered.

  • Physical Integration As A Phase Of CIM

    None

  • Business Integration As A Phase Of CIM

    None

  • Enhanced Turbo Decoding for Error Floor Reduction

    In this paper, we consider enhanced decoding of turbo codes in the error floor region. Allowing no modifications at the transmitter side, we focus on enhanced decoding algorithms which aim principally at reducing the error floor. We employ a combination of two methods which have been applied separately in the literature: the correction impulse method (CIM) and the list Viterbi algorithm (LVA). We explicitly consider the impact of a practical error detection code and show its limitations.

  • Operational control for robot systems integration into CIM

    None

  • The Study Of Integrated Manufacturing System For Plant Managers And Staffs

    None

  • SCC-ProModeling: a practical tool for integrated product modeling

    To realize data integration and process integration in contemporary integrated manufacturing system (CIMS), a framework of integrated product mode (IPM) is presented. This framework is composed of master model (MM) and domain model (DM). By building a model for extracting DM from MM, the reusability of IPM is improved significantly. In addition, a software prototype for integrated product modeling is developed-SCC-ProModeling, which is pretty practical as it can integrate legacy systems effectively. Finally, the key technologies of SCC-ProModeling are discussed. SCC-ProModeling has been applied successfully to the "Model Project" of Chinese aerospace area.

  • IMSEI: a graduate education, research, and technology transfer program in integrated manufacturing systems supported by a university/industry consortium

    A cooperative industry/university graduate education research, and technology transfer program in computer integrated manufacturing systems at North Carolina State University is described. Administrated through the Integrated Manufacturing Systems Engineering Institute (IMSEI), the program draws its resources from six academic departments in the College of Engineering and a consortium of industrial associates. Details are presented on the organization, structure, and operation of the Institute, including university and industry participation, the academic program, research mechanisms and areas of interest, laboratory facilities, technology transfer activities, and program funding.<<ETX>>

  • Application of CIMS in cement enterprises

    Computer integrated manufacturing system based on the three structures of enterprise resource planning system, manufacturing execution system and process control system has become the mainstream frame of process industry CIMS theory and product at home and abroad. The conception of CIMS and meaning of process CIMS is briefly introduced. Given the characteristics of production and operation in cement enterprise, the architecture of cement CIMS is brought forward. And some key points, such as manufacturing execution system, real- time database and so forth, are expounded.



Standards related to Computer integrated manufacturing

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No standards are currently tagged "Computer integrated manufacturing"


Jobs related to Computer integrated manufacturing

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