IEEE Organizations related to Components, Packaging, and Manufacturing Technology Society

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Conferences related to Components, Packaging, and Manufacturing Technology Society

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2017 40th International Spring Seminar on Electronics Technology (ISSE)

The main focus of the ISSE is both directed in bringing deeper knowledge and information ofelectronics technology, and, especially for young researchers, to increase or confirm amotivation for intensifying their engagement in the field of electrical engineering. The conferencewill be accompanied by an exhibition of commercial industrial exhibitors, which gives a greatmarketing opportunity to reach a broad segment of professionals in the field of electronicstechnology. The conference is an effective crucial point for institutions, government officials,pioneering engineers, academics, experienced and young researchers and many otherprofessionals working on relevant fields to discuss the current challenges and to provide up-todateknowledge

  • 2016 39th International Spring Seminar on Electronics Technology (ISSE)

    The main focus of the ISSE is both directed in bringing deeper knowledge and information of electronics technology, and, especially for young researchers, to increase or confirm a motivation for intensifying their engagement in the field of electrical engineering. The conference will be accompanied by an exhibition of commercial industrial exhibitors, which gives a great marketing opportunity to reach a broad segment of professionals in the field of electronics technology. The conference is an effective crucial point for institutions, government officials, pioneering engineers, academics, experienced and young researchers and many other professionals working on relevant fields to discuss the current challenges and to provide up-to-date knowledge.

  • 2015 38th International Spring Seminar on Electronics Technology (ISSE)

    Focus: Novel Trends in Electronics Manufacturing. The International Spring Seminar on Electronics Technology (ISSE) is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world. Topics include experimental and theoretical work in a very wide-spread field of electronics and micro/nanoelectronics technology, manufacturing, packaging and advanced research. Based on a combination of oral and poster presentations as well as individual meetings, professors, industrial participants, students, senior and junior researchers come together in a unique forum to discuss scientific and educational topics and organize international cooperation during the five-day event.

  • 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology (ISSE) is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world. Topics include experimental and theoretical work in a very wide-spread field of electronics and micro/nanoelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors, students, senior and junior researchers come together in a unique forum to discuss scientific and educational topics and organize international cooperation in a convenient atmosphere during the conference days.

  • 2013 36th International Spring Seminar on Electronics Technology (ISSE)

    This international conference focusses on exchange of information between senior and young scientists from academic communities and electronic industries. Since 1977 the conference has been hosted by different Eureopean universities.

  • 2012 35th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2011 34th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2010 33rd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging.

  • 2009 32nd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide -spread field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors and students, senio

  • 2008 31st International Spring Seminar on Electronics Technology (ISSE)

    he International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors and students, senior an

  • 2007 30th International Spring Seminar on Electronics Technology (ISSE)

  • 2006 29th International Spring Seminar on Electronics Technology (ISSE)

  • 2005 28th International Spring Seminar on Electronics Technology (ISSE)

  • 2004 27th International Spring Seminar on Electronics Technology (ISSE)

  • 2003 26th International Spring Seminar on Electronics Technology (ISSE)

  • 2001 24th International Spring Seminar on Electronics Technology (ISSE)


2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)

  • 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP)

  • 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP)

  • 2004 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP)



Periodicals related to Components, Packaging, and Manufacturing Technology Society

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Dependable and Secure Computing, IEEE Transactions on

The purpose of TDSC is to publish papers in dependability and security, including the joint consideration of these issues and their interplay with system performance. These areas include but are not limited to: System Design: architecture for secure and fault-tolerant systems; trusted/survivable computing; intrusion and error tolerance, detection and recovery; fault- and intrusion-tolerant middleware; firewall and network technologies; system management ...


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


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Most published Xplore authors for Components, Packaging, and Manufacturing Technology Society

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Xplore Articles related to Components, Packaging, and Manufacturing Technology Society

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Hybrid Optoelectronic Integration And Packaging

LEOS 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packagi, 1993

None


Professional development courses for the 59th ECTC

2009 59th Electronic Components and Technology Conference, 2009

None


William T. Chen

2007 8th International Conference on Electronic Packaging Technology, 2007

None


Short courses

2008 2nd Electronics System-Integration Technology Conference, 2008

Provides an abstract for each of the presentations and a brief professional biography of each presenter. The complete presentations were not made available for publication as part of the conference proceedings.


A paradigm shift: the emerging role of professional societies in developing technology

IEMC '98 Proceedings. International Conference on Engineering and Technology Management. Pioneering New Technologies: Management Issues and Challenges in the Third Millennium (Cat. No.98CH36266), 1998

We are exploring new strategic opportunities to advance the knowledge base in microelectronic and photonics packaging technology that, increasingly, professional societies such as the ASME, IMAPS and the IEEE will be uniquely positioned to fill. In a larger sense, the case being made applies to the entire cross-section of electrical engineering and computer science R&D that the IEEE represents. A ...


More Xplore Articles

Educational Resources on Components, Packaging, and Manufacturing Technology Society

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IEEE-USA E-Books

  • Hybrid Optoelectronic Integration And Packaging

    None

  • Professional development courses for the 59th ECTC

    None

  • William T. Chen

    None

  • Short courses

    Provides an abstract for each of the presentations and a brief professional biography of each presenter. The complete presentations were not made available for publication as part of the conference proceedings.

  • A paradigm shift: the emerging role of professional societies in developing technology

    We are exploring new strategic opportunities to advance the knowledge base in microelectronic and photonics packaging technology that, increasingly, professional societies such as the ASME, IMAPS and the IEEE will be uniquely positioned to fill. In a larger sense, the case being made applies to the entire cross-section of electrical engineering and computer science R&D that the IEEE represents. A major paradigm shift for R&D management and support in the 21/sup st/ century is forecast that will create new centers of excellence managed from within the engineering and scientific professions. Dramatic shifts from the current industrial-academic-government partnerships can be expected.

  • Electronics packaging education: NSF and IEEE initiatives and modules

    The packaging of electronic devices-passives, ICs, sensors, optoelectronics, MEMS-has been identified as a limiting constraint on the design, production and use of high-density or new-application electronics. In addition, many engineers responsible for various portions of a system or device package, and its modeling, thermal management, testing, and assembly, have limited familiarity with some of the basic materials and processes in our field, or need to quickly understand specific issues and design directions in order to complete a design or review task, or add to their basic skills. The U.S. National Science Foundation (NSF) has provided a series of grants over a three-year period which, when paired with funding from the IEEE's Components, Packaging and Manufacturing Technology (CPMT) Society, has funded a number of authoring efforts. Some of this content is now available for technologists and college instructors to use. In this talk, I profile the new IEEE/CPMT educational server site (the CPMT Virtual Classroom) with its many educational modules. There are two areas on the site: shareable content that has been developed by individuals or groups; and an author-support service with a shareware authoring module which instructors can use without cost to create their own content from existing lecture material or presentation slides.

  • Low-tech studies of isotropic electrically conductive adhesives

    The experiments described here can provide a laboratory component to a course on isotropic conductive adhesives (ICAs), with minimal specialized equipment. Furthermore, some of the techniques can be used in ICA research to provide more controllable, reproducible results than are typically obtained with commercial devices.

  • The 2004 International Electronics Manufacturing Initiative (iNEMI) Technology Roadmaps

    The tenth anniversary edition of the biennial roadmap is the first edition under our new name: International Electronics Manufacturing Initiative (iNEMI). The nineteen technology roadmaps identify future research, development, and implementation needs to continue the growth of the worldwide electronics industry. During this roadmap cycle, we consciously targeted participation from key Asian and European firms/organizations in order to help insure that the technology projections truly represent a global view. With this roadmap we established an international collaborative agreement with the IEEE / CPMT (Institute of Electrical and Electronics Engineers / Components, Packaging and Manufacturing Technology), while continuing our strong linkages with other international roadmapping organizations - ITRS, IPC, IMAPS, INSIC, SCC, and OIDA- and with USDC. The 2004 iNEMI Roadmap consists of over 1200 pages, with more than 470 participants from over 220 companies, universities and associations from 11 countries. This paper highlights technology needs, paradigm shifts, strategic concerns, and key recommendations from the roadmap. Emphasis is placed on the advanced packaging, sensors, system in package, and organic and ceramic substrate roadmap chapters. This roadmap has increased the focus on forecasting potentially disruptive technology in the 2012-2015 time frame such as the use of nanotechnology to address the projected end of Moore's law and the scaling of CMOS devices. This roadmap balances the market needs against the future technology capabilities. The 2004 iNEMI Roadmap is a valuable snapshot of our industry in the third millennium. The challenge now shifts to leveraging these findings for the good of the electronics manufacturing supply chain

  • Modern Problems of Radio Engineering, Telecommunications and Computer Science (IEEE Cat. No.02EX542)

    The following topics are dealt with: mathematical modeling of signals, circuits and fields; information selection and processing; radioelectronic equipment and telecommunication devices; signal and image processing in radioelectronic and telecommunication systems; information technology; biomedical technology and devices; semiconductor device modeling; education and training.

  • Proceedings of the 4th IEEE-Russia Conference. 2003 Microwave Electronics: Measurements, Identification, Applications. MEMIA 2003 (IEEE Cat. No.03EX800)

    This following topics are dealt with: microwave electronic components and materials; active and passive functional devices; telecommunication systems, networks and devices; microwave techniques in industry, science and medicine.



Standards related to Components, Packaging, and Manufacturing Technology Society

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Jobs related to Components, Packaging, and Manufacturing Technology Society

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