Electronics Systems On Chip
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Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies
The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE
ISIE focuses on advancements in knowledge, new methods, and technologies relevant to industrial electronics, along with their applications and future developments.
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
2016 Tenth IEEE/ACM International Symposium on Networks-on-Chip (NOCS), 2016
Emerging flexible hybrid electronics paradigm integrates traditional rigid integrated circuits and printed electronics on a flexible substrate. This hybrid approach aims to combine the physical benefits of flexible electronics with the computational advantages of the silicon technology. In this paper, we discuss the possibility to implement a physically flexible system capable of sensing, computation and communication. We argue that this ...
2017 IEEE 26th International Symposium on Industrial Electronics (ISIE), 2017
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Q-Band CMOS Transmitter System-on-Chip - Tim Larocca - RFIC Showcase 2018
The Future of Home & Factory Automation Systems: Mouser's Innovation Spotlight with Grant Imahara
Connecting Silicon & Brain Neurons: Neuromorphic Computing - Stefano Vassanelli at INC 2019
R. Jacob Baker - SSCS Chip Chat Podcast, Episode 4
Patrizio Vinciarelli, Newell Award: APEC 2019
A 10-40GHz Frequency Quadrupler Source with Switchable Bandpass Filters and >30dBc Harmonic Rejection: RFIC Interactive Forum 2017
KeyTalk with Ljubisa Stevanovic: From SiC MOSFET Devices to MW-scale Power Converters - APEC 2017
On-chip Passive Photonic Reservoir Computing with Integrated Optical Readout - IEEE Rebooting Computing 2017
Towards On-Chip Optical FFTs for Convolutional Neural Networks - IEEE Rebooting Computing 2017
IMS 2014:Flip Chip Assembly for Sub-millimeter Wave Amplifier MMIC on Polyimide Substrate
Engineering Meets Biology in Tech News
A 28GHz CMOS Direct Conversion Transceiver with Packaged Antenna Arrays for 5G Cellular Systems: RFIC Industry Showcase 2017
Qing-Chang Zhong, Distinguished Lecturer - PELS
Silicon Labs' Thunderboard Sense (SLTB001A): Mouser Engineering Bench Talk
IRDS: IFT Cryogenic Electronics & Quantum Information Processing - Scott Holmes at INC 2019
Infineon: Innovative Semiconductor Solutions
CES 2009: One OS Per Hard Drive
Nanophotonic Devices for Quantum Information Processing: Optical Computing - Carsten Schuck at INC 2019
IMS 2015: Panel Session: Wearable Electronics - Fad or Future?
Emerging flexible hybrid electronics paradigm integrates traditional rigid integrated circuits and printed electronics on a flexible substrate. This hybrid approach aims to combine the physical benefits of flexible electronics with the computational advantages of the silicon technology. In this paper, we discuss the possibility to implement a physically flexible system capable of sensing, computation and communication. We argue that this capability can transform personalized computing by enabling the next big leap forward in the form factor design, similar to the shift from desktop and laptop computers to hand-held devices. Designing this type of a comprehensive system requires integrating many flexible and rigid resources on the same substrate. As a result, efficient interconnection network design rises as one of the major challenges similar to the system-on-chip experience. Therefore, we also discuss the interconnect design challenges and promising solutions for flexible hybrid systems.
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The scope of this standard includes the following enclosed low-voltage ac power circuit breakers: a) Stationary or drawout type of two-, three-, or four-pole construction with one or more rated maximum voltages of 635 V (600 V for units incorporating fuses), 508 V, and 254 V for application on systems having nominal voltages of 600 V, 480 V, and 240 ...