1,161 resources related to Product Reliability
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Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
premier components, packaging and technology conference
APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to practicing power electronics engineer.
AUTOTESTCON is the world’s premier conference that brings together themilitary/aerospace automatic test industry and government/military acquirers and usersto share new technologies, discuss innovative applications, and exhibit products andservices.
IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.
The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.
The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...
IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...
Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
2011 IEEE 18th International Conference on Industrial Engineering and Engineering Management, 2011
The Stream of variation (SoV) model deals with process dimensional variation propagation of multistage machining processes. It describes the relationship of process dimensions and end-product dimensions. The reliability of end- products varies because of dimension deviation since the materials, designs and manufacturing processes are fixed in batch production. This paper studies the feasibility of modeling the relationship of reliability of ...
2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce (AIMSEC), 2011
The paper imports fuzzy fault tree into GIS product reliability analysis for the fist time. The paper discusses how GIS product reliability analysis uses fuzzy fault tree method, mainly researches two problems that is GIS product fuzzy fault tree construction and analysis step of GIS product fuzzy fault tree; uses example to adopt fuzzy fault tree method processing GIS product ...
IEEE Transactions on Antennas and Propagation, None
A near field scanning is usually time-consuming to map the electromagnetic field along the surface of a device. In this paper, a dual probe is proposed with a U-shaped loop to sense radio-frequency (RF) magnetic and electric fields simultaneously, so that the one-time scanning by the dual probe can replace the two-time scanning by single detector probes. Different from the ...
IEEE Transactions on Reliability, 1979
The survival capability of mechanical equipment often depends upon creep life at elevated temperature due to irregular load variations in a random service environment. The product reliability is related to the probability distribution of the creep damage, which depends, in turn, upon the statistical behavior of the stress waveform. The general stochastic connection between them is derived in this presentation ...
Proceedings of the IEEE 2012 Prognostics and System Health Management Conference (PHM-2012 Beijing), 2012
Currently, the theoretical research of reliability is mainly focused on product design, on the other hand, we do not have a sufficient knowledge on the reliability assurance for manufacturing process. Lots of engineering cases show that the product reliability usually experiences significant degradation during the phase of manufacturing, which reveals the research weakness on manufacturing reliability. Recently, the major problem ...
IEEE Standards Presents: Case Study 515 (English)
IEEE Standards Presents: Case Study 515-(English)
IEEE Standards Presents: Case Study 515 (Chinese)
Arizona Reliability Society - May 1 2015
APEC 2015: KeyTalks - How to Optimize Performance and Reliability of GaN Power Devices
IMS 2011 Microapps - New Rotary Joint Product Lines for SATCOM Applications
APEC 2015: KeyTalks - US DOE perspective on Microgrids
The Long Term Reliability of Gallium Nitride
Standards Insights for Executives: Impact of Standards on Product Design
Consistent, Reliable and Peak-Performing PCB Assemblies: MicroApps 2015 - Zentech Manufacturing, Inc.
Inventor C++ Bjarne Stroustrup (high resolution)
IMS 2011 Microapps - Pulsed S-Parameter Measurements Using PXI Instruments
Conformity Assessment: The Perspective of Product Designers - Gordon Gillerman, Director, Standards Coordination Office, NIST
IEEE Green Energy Summit 2015, Panel 2: How reliable is reliable enough?
PES Scholarship Initiative Plus - Patricia Hoffman Presentation
IEEE Power Reliability Standards for Health Care Campuses
Verizon's Marni Walden presents opportunity in Product & New Business Innovation - 2016 Women in Engineering Conference
Rogers at APEC 2016
3D Power Packaging Made Real with Embedded Component and Substrate Technologies - P.M. Raj, APEC 2018
The Stream of variation (SoV) model deals with process dimensional variation propagation of multistage machining processes. It describes the relationship of process dimensions and end-product dimensions. The reliability of end- products varies because of dimension deviation since the materials, designs and manufacturing processes are fixed in batch production. This paper studies the feasibility of modeling the relationship of reliability of products and the process dimensions (RPPD) based on the SoV model. RPPD modeling should be done in the design phase before launching the manufacturing process. Related work based on the RPPD model including key process characteristics identification, manufacturing process monitoring, feed-forward control are also discussed. It is shown that the RPPD model can be a useful tool in the assurance of reliability of end-productions in manufacturing.
The paper imports fuzzy fault tree into GIS product reliability analysis for the fist time. The paper discusses how GIS product reliability analysis uses fuzzy fault tree method, mainly researches two problems that is GIS product fuzzy fault tree construction and analysis step of GIS product fuzzy fault tree; uses example to adopt fuzzy fault tree method processing GIS product reliability analysis; because the technique considers not only GIS product random uncertainty but also GIS product fuzzy uncertainty, the result is precise, scientific and reasonable; finally summarizes up and points out the problems to need solving.
A near field scanning is usually time-consuming to map the electromagnetic field along the surface of a device. In this paper, a dual probe is proposed with a U-shaped loop to sense radio-frequency (RF) magnetic and electric fields simultaneously, so that the one-time scanning by the dual probe can replace the two-time scanning by single detector probes. Different from the traditional near field scanning by using a single detector probe and spectrum analyzer, the proposed scanning can be achieved by the two-output probe and a two-port vector network analyzer connecting to the probe. The efficient near field scanning measurements of the electric and magnetic field on a conductorbacked coplanar waveguide transmission line and an RF power divider by using the dual probe are in agreement with those by using two single detector probes.
The survival capability of mechanical equipment often depends upon creep life at elevated temperature due to irregular load variations in a random service environment. The product reliability is related to the probability distribution of the creep damage, which depends, in turn, upon the statistical behavior of the stress waveform. The general stochastic connection between them is derived in this presentation for linear damage accumulation in a material with a power law of failure. The creep damage is related to the damage rate by a stochastic integral, while the damage rate is a stochastic function of the stress intensity. The statistical behavior of the damage rate depends upon the standard deviation of a stationary, Gaussian stress variation about a zero mean stress level. This paper illustrates the specific analysis of a time-invariant, linear system for a broadband, stationary, Gaussian excitation with a zero mean value and a uniform spectral density.
Currently, the theoretical research of reliability is mainly focused on product design, on the other hand, we do not have a sufficient knowledge on the reliability assurance for manufacturing process. Lots of engineering cases show that the product reliability usually experiences significant degradation during the phase of manufacturing, which reveals the research weakness on manufacturing reliability. Recently, the major problem for industry is that how to keep the reliability of products manufactured in the mass production phase as high as that achieved in the design phase and develop the related standard which can be followed directly by the reliability engineer. To deal with this problem, a decomposition model of product reliability for manufacturing process is presented. In this model, the design requirements of product reliability are transferred to the manufacturing process improvement methods by the structure of product, manufacturing features and failure causes. According to the model, we propose a reliability decomposition approach based on the waterfall decomposition of the House of Quality (HoQ) in Quality Function Deployment (QFD), the product reliability indexes are transferred to process parameters by matrix multiplication. And then, we find the most valuable process improvement methods through multi-layer fuzzy comprehensive evaluation optimization methods which will enhance the product reliability effectively. The method is then verified with an example of a shell component of a missile, the result shows that the decomposition approach is a useful tool to keep the reliability of products in mass production phase.
Single-event upset sensitivity of 55- and 180-nm SRAM devices with error detection and correction (EDAC) exhibits obvious ion flux and scrubbing time dependence. On-orbit soft error rates (SERs) of EDAC SRAM devices are extrapolated from accelerator heavy-ion data and compared with rectangular parallelepiped-predicted SER, based on an experimentally verified formula. It is found that on-orbit SER of EDAC SRAM is contributed by both the memory array and the EDAC circuitry. This method can guide the optimization of EDAC SRAM hardening strategy and also the on-orbit hardness assurance.
Military program offices and commercial product developers are challenged to make effective reliability decisions throughout product/systems development, acquisition, production and operation/maintenance phases. The decisions range from determining what reliability goals/requirements are appropriate to meet user's mission needs and market demands to select the most cost effective means to assess whether the system reliability is adequate to pass through various program decision "gates". These challenges are often faced by personnel with varying levels of reliability-specific experience and training, who often have multiple program responsibilities. These individuals need the benefit of the accumulated knowledge and experience that the Product Reliability On-line Tools Collection (PROTOCOL) provides. This paper presents the results of the recent Small Business Innovation Research (SBIR) Phase II PROTOCOL program carried out for the US Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) at Redstone Arsenal, Alabama. PROTOCOL provides tailorable reliability decision recommendations, analysis tools, rules-of-thumb, checklists, and lessons-learned coupled with the program specific constraints/schedule, requirements, and results tracking in a Web-based environment. For example, basic statistical analysis tools, a Weibull Analysis tool, a reliability activity cost calculator, and a thermal design advisor are examples of the tools included. The "environment" also includes a comprehensive reliability risk management tool and an interactive 5-part on-line tutorial in basic reliability. Completing PROTOCOL's knowledge content is an on-line library of more than 5000 reliability-related reports, standards, and guidance documents. PROTOCOL has been developed primarily to serve the reliability engineer, but it can also be used as a management aid to track the progress of development efforts and to ensure consistency among reliability approaches across a reliability organization with varying experience levels. Access to various portions of PROTOCOL can also be provided to interested parties outside the future reliability organization. PROTOCOL has been designed to be a reliability knowledge environment that grows over time. Users continually add knowledge as new data/information sources, new definitions, new lessons-learned, new rules-of-thumb and the like, all while tracking the reliability progress of products/systems that have been developed. PROTOCOL "learns" from informed decisions as it is used, as a means to improve the organization's reliability decision-making processes. A PROTOCOL prototype has been delivered to the Army completing the Phase II SBIR effort. Phase II Plus is currently underway, refining and expanding many of the tools included in the prototype. While PROTOCOL is being developed for military use, it has tremendous value as a resource to non-military government organizations and to the industrial community as well
Over the course of the last 25 years, Hewlett-Packard has dramatically improved the performance, speed, and print quality of its Thermal Inkjet (TIJ) products. Reliability test and integration has evolved alongside the technology. Early reliability drivers focused on characterizing the TIJ technology by conducting high sample size tests at the system level. As HP's product lines diversified and the technology became more complex, reliability drivers turned to increasing quality. With abundant resources fueled by high growth, reliability teams could run large experiments at all levels of the system and conduct elaborate multi-stress experiments to investigate failure mechanisms. More recently, cost considerations have forced a shift in the reliability approach at Hewlett-Packard. Under the new Reliability Strategy TIJ programs are now developed around three core reliability concepts; Analyze, Discover and Characterize. The reliability and integration challenges of a development program are anticipated and then designed out at a fundamental level. Overstress testing is used to build confidence in design iterations and failure mechanisms are explored to the lowest possible level. System reliability is calculated by a roll-up of failure mode and subsystem experimental data with system test run only as a validation of the model. Use of the Reliability Strategy methodology is illustrated with two case studies. Using the new Reliability Strategy Hewlett-Packard's Inkjet Division has achieved a significant reduction in both testing cost and development iteration time while maintaining a high level of product reliability.
Product reliability is determined by the design stage and qualified in the manufacturing stage. The fluctuations of manufacturing process result in inherent reliability lower than design reliability, called reliability degradation phenomenon. Based on the existing research on manufacturing system reliability and process reliability, this paper analyzes how the manufacturing process quality variation influences product reliability and studies the inhibition of product reliability degradation based on manufacturing process quality variation control. Firstly, the normal and abnormal manufacturing process fluctuations are explained and distinguished. After analyzing traditional process capability analysis, the Bayesian estimation based process capacity index analytical method aiming at the small batch production pattern is proposed and the superiority is verified. Finally, combined with state space model based variation source diagnosis, the framework of manufacturing process product reliability degradation inhibition is put forward.
In recent years, some obvious fault problems have been solved gradually with the continuous development of reliability engineering technologies, whereas the no fault found (NFF) phenomenon remains a big obstacle that troubles various manufacturers. Especially in the household appliance industry, NFF accounts for about 30-70% of the returned faulty products. Some electronic product manufacturers just ignore customers' complaints of intermittent failure or the NFF phenomenon during retesting which may indicate defects in the products and simply attribute the problems as maintenance engineers' misjudgment. Consequently, they rather lose the opportunity of improving product reliability. This paper reviews the NFF phenomenon commonly occurred in household appliances, with in-depth analysis on the failure modes and mechanisms. Based on failure physics, a few solutions to the NFF problems are also suggested, which can reduce substantially the NFF rate by approximately 50%.
The scope of this document is to provide guidance for conducting and assessing reliability predictions (techniques and methods) for electronic products and systems.
Processes and methodologies for conducting reliability predictions for electronic systems and equipment.
This document presents a standard that defines the reliability capability of organizations and identifies the criteria for assessing the reliability capability of an organization. This standard is intended to be usable by all organizations that design, manufacture or procure electrical/electronics components or products. Although the concepts described in this standard could be applied to both hardware and software products, the ...
A standardized medium for developing reliability predictions of electronic systems and equipment.
This project will develop for electronic products and systems a standard set of reliability-program objectives which can be used to express reliability requirements when a customer is contracting with a producer for electronic products.