Conferences related to Product Reliability

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2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to practicing power electronics engineer.


2019 IEEE AUTOTESTCON

AUTOTESTCON is the world’s premier conference that brings together themilitary/aerospace automatic test industry and government/military acquirers and usersto share new technologies, discuss innovative applications, and exhibit products andservices.

  • 2018 IEEE AUTOTESTCON

    AUTOTESTCON is the world’s premier conference that brings together the military/aerospace automatic test industry and government/military acquirers and users to share new technologies, discuss innovative applications, and exhibit products and services

  • 2017 IEEE AUTOTESTCON

    IEEE AUTOTESTCON is also known as the Systems Readiness Technology Conference. This major conference and exposition provides focus on the maintenance aspects of systems readiness and providing Mission Assurance through Advanced ATE (Automatic Test Equpmenrt/Systems). This includes Maintenance Repair & Overhaul as well as factory and development automated test equipment. This conference brings military and aerospace industry principals together to share new concepts, technologies and applications in this essential field of supportability and sustainability. The conference includes a major exhibit of exciting new products from a wide variety of exhibitors, and provides the opportunity to meet with senior military and aerospace leaders to discuss their future needs and expectations and the ways in which we can satisfy those needs.

  • 2016 IEEE AUTOTESTCON

    echnical Interchange Meeting for military/aerospace automatic test industry together to share new technologies, discuss innovative applications, and exhibit products and services

  • 2015 IEEE AUTOTESTCON

    IEEE AUTOTEST is an annual Technical Interchange Meeting sponsored by the Institute of Electrical and Electronic Engineers (IEEE). This event serves to gather the military/aerospace automatic test industry together to share new technologies, discuss innovative applications, and exhibit products and services

  • 2014 IEEE AUTOTEST

    IEEE AUTOTESTCON is the world s only conference that focuses primarily on Automated Test and related technology for military, government and aerospace applications. The conference also has an expanded focus into commercial areas that share a common technical base, including aerospace, vehicle and automotive, and commercial factory test applications. Autotestcon provides a unique opportunity to discuss platform support requirements with all DoD Branches, provides hands-on experience with test equipment, and

  • 2013 IEEE AUTOTESTCON

    Content focused on automatic test systems for US military systems.

  • 2012 IEEE AUTOTESTCON

    Automated Test Systems (ATE) and related technologies such as Test Program Sets for US military and defense equipment

  • 2011 IEEE AUTOTESTCON

    Annual conference of the automatic testing industry.

  • 2010 IEEE AUTOTESTCON

    IEEE AUTOTESTCON, The Support Systems Technology Conference, is the largest conference focused on automatic test systems for military and aerospace systems, and has been held annually since 1965. It features more than 120 quality application-focused papers and 250 Exhibits. Attendance ranges between 650 and 750 registered professionals.

  • 2009 IEEE AUTOTESTCON

    Automated Test, Test Technology, and related Support Systems for Defense Systems.

  • 2008 IEEE AUTOTESTCON

    All theoretical and application aspects for an appropriate topic dealing with system readiness, in general, and automatic test technology, in particular. In keeping with our conference theme "Surpassing the Limits-Forging Ahead" our focus will be on new ideas and concepts, unusual testing solutions, and future technologies, e.g. ATE Architectures, Artificial Intelligence in Test, ATE/TPS Development Techniques, ATE/TPS Management, BIT/BIST

  • 2007 IEEE AUTOTESTCON

  • 2006 IEEE AUTOTESTCON

  • 2005 IEEE AUTOTESTCON

  • 2004 IEEE AUTOTESTCON

  • 2003 IEEE AUTOTESTCON

  • 2002 IEEE AUTOTESTCON

  • 2001 IEEE AUTOTESTCON

  • 2000 IEEE AUTOTESTCON

  • AUTOTESTCON '99

  • AUTOTESTCON '98

  • AUTOTESTCON '97

  • AUTOTESTCON '96


2019 IEEE Energy Conversion Congress and Exposition (ECCE)

IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2018 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.

  • 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

    ECCE is the premier global conference covering topics in energy conversion from electric machines, power electronics, drives, devices and applications both existing and emergent

  • 2016 IEEE Energy Conversion Congress and Exposition (ECCE)

    The Energy Conversion Congress and Exposition (ECCE) is focused on research and industrial advancements related to our sustainable energy future. ECCE began as a collaborative effort between two societies within the IEEE: The Power Electronics Society (PELS) and the Industrial Power Conversion Systems Department (IPCSD) of the Industry Application Society (IAS) and has grown to the premier conference to discuss next generation technologies.

  • 2015 IEEE Energy Conversion Congress and Exposition

    The scope of ECCE 2015 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power and power electronics.

  • 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

    Those companies who have an interest in selling to: research engineers, application engineers, strategists, policy makers, and innovators, anyone with an interest in energy conversion systems and components.

  • 2013 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the congress interests include all technical aspects of the design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power conversion and power electronics.

  • 2012 IEEE Energy Conversion Congress and Exposition (ECCE)

    The IEEE Energy Conversion Congress and Exposition (ECCE) will be held in Raleigh, the capital of North Carolina. This will provide a forum for the exchange of information among practicing professionals in the energy conversion business. This conference will bring together users and researchers and will provide technical insight as well.

  • 2011 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE 3rd Energy Conversion Congress and Exposition follows the inagural event held in San Jose, CA in 2009 and 2nd meeting held in Atlanta, GA in 2010 as the premier conference dedicated to all aspects of energy processing in industrial, commercial, transportation and aerospace applications. ECCE2011 has a strong empahasis on renewable energy sources and power conditioning, grid interactions, power quality, storage and reliability.

  • 2010 IEEE Energy Conversion Congress and Exposition (ECCE)

    This conference covers all areas of electrical and electromechanical energy conversion. This includes power electrics, power semiconductors, electric machines and drives, components, subsystems, and applications of energy conversion systems.

  • 2009 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the conference include all technical aspects of the design, manufacture, application and marketing of devices, circuits, and systems related to electrical energy conversion technology


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Periodicals related to Product Reliability

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Product Reliability

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Xplore Articles related to Product Reliability

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The relationship of product reliability and its process dimensions: A study on product reliability assurance in manufacturing

2011 IEEE 18th International Conference on Industrial Engineering and Engineering Management, 2011

The Stream of variation (SoV) model deals with process dimensional variation propagation of multistage machining processes. It describes the relationship of process dimensions and end-product dimensions. The reliability of end- products varies because of dimension deviation since the materials, designs and manufacturing processes are fixed in batch production. This paper studies the feasibility of modeling the relationship of reliability of ...


GIS product reliability analysis based fuzzy fault tree

2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce (AIMSEC), 2011

The paper imports fuzzy fault tree into GIS product reliability analysis for the fist time. The paper discusses how GIS product reliability analysis uses fuzzy fault tree method, mainly researches two problems that is GIS product fuzzy fault tree construction and analysis step of GIS product fuzzy fault tree; uses example to adopt fuzzy fault tree method processing GIS product ...


Simultaneous Measurement of Electric and Magnetic Fields with a Dual Probe for Efficient Near Field Scanning

IEEE Transactions on Antennas and Propagation, None

A near field scanning is usually time-consuming to map the electromagnetic field along the surface of a device. In this paper, a dual probe is proposed with a U-shaped loop to sense radio-frequency (RF) magnetic and electric fields simultaneously, so that the one-time scanning by the dual probe can replace the two-time scanning by single detector probes. Different from the ...


Product Reliability Due to Random Load Variations at Elevated Temperatures

IEEE Transactions on Reliability, 1979

The survival capability of mechanical equipment often depends upon creep life at elevated temperature due to irregular load variations in a random service environment. The product reliability is related to the probability distribution of the creep damage, which depends, in turn, upon the statistical behavior of the stress waveform. The general stochastic connection between them is derived in this presentation ...


Research on the decomposition approach to product reliability for manufacturing process

Proceedings of the IEEE 2012 Prognostics and System Health Management Conference (PHM-2012 Beijing), 2012

Currently, the theoretical research of reliability is mainly focused on product design, on the other hand, we do not have a sufficient knowledge on the reliability assurance for manufacturing process. Lots of engineering cases show that the product reliability usually experiences significant degradation during the phase of manufacturing, which reveals the research weakness on manufacturing reliability. Recently, the major problem ...


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Educational Resources on Product Reliability

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IEEE-USA E-Books

  • The relationship of product reliability and its process dimensions: A study on product reliability assurance in manufacturing

    The Stream of variation (SoV) model deals with process dimensional variation propagation of multistage machining processes. It describes the relationship of process dimensions and end-product dimensions. The reliability of end- products varies because of dimension deviation since the materials, designs and manufacturing processes are fixed in batch production. This paper studies the feasibility of modeling the relationship of reliability of products and the process dimensions (RPPD) based on the SoV model. RPPD modeling should be done in the design phase before launching the manufacturing process. Related work based on the RPPD model including key process characteristics identification, manufacturing process monitoring, feed-forward control are also discussed. It is shown that the RPPD model can be a useful tool in the assurance of reliability of end-productions in manufacturing.

  • GIS product reliability analysis based fuzzy fault tree

    The paper imports fuzzy fault tree into GIS product reliability analysis for the fist time. The paper discusses how GIS product reliability analysis uses fuzzy fault tree method, mainly researches two problems that is GIS product fuzzy fault tree construction and analysis step of GIS product fuzzy fault tree; uses example to adopt fuzzy fault tree method processing GIS product reliability analysis; because the technique considers not only GIS product random uncertainty but also GIS product fuzzy uncertainty, the result is precise, scientific and reasonable; finally summarizes up and points out the problems to need solving.

  • Simultaneous Measurement of Electric and Magnetic Fields with a Dual Probe for Efficient Near Field Scanning

    A near field scanning is usually time-consuming to map the electromagnetic field along the surface of a device. In this paper, a dual probe is proposed with a U-shaped loop to sense radio-frequency (RF) magnetic and electric fields simultaneously, so that the one-time scanning by the dual probe can replace the two-time scanning by single detector probes. Different from the traditional near field scanning by using a single detector probe and spectrum analyzer, the proposed scanning can be achieved by the two-output probe and a two-port vector network analyzer connecting to the probe. The efficient near field scanning measurements of the electric and magnetic field on a conductorbacked coplanar waveguide transmission line and an RF power divider by using the dual probe are in agreement with those by using two single detector probes.

  • Product Reliability Due to Random Load Variations at Elevated Temperatures

    The survival capability of mechanical equipment often depends upon creep life at elevated temperature due to irregular load variations in a random service environment. The product reliability is related to the probability distribution of the creep damage, which depends, in turn, upon the statistical behavior of the stress waveform. The general stochastic connection between them is derived in this presentation for linear damage accumulation in a material with a power law of failure. The creep damage is related to the damage rate by a stochastic integral, while the damage rate is a stochastic function of the stress intensity. The statistical behavior of the damage rate depends upon the standard deviation of a stationary, Gaussian stress variation about a zero mean stress level. This paper illustrates the specific analysis of a time-invariant, linear system for a broadband, stationary, Gaussian excitation with a zero mean value and a uniform spectral density.

  • Research on the decomposition approach to product reliability for manufacturing process

    Currently, the theoretical research of reliability is mainly focused on product design, on the other hand, we do not have a sufficient knowledge on the reliability assurance for manufacturing process. Lots of engineering cases show that the product reliability usually experiences significant degradation during the phase of manufacturing, which reveals the research weakness on manufacturing reliability. Recently, the major problem for industry is that how to keep the reliability of products manufactured in the mass production phase as high as that achieved in the design phase and develop the related standard which can be followed directly by the reliability engineer. To deal with this problem, a decomposition model of product reliability for manufacturing process is presented. In this model, the design requirements of product reliability are transferred to the manufacturing process improvement methods by the structure of product, manufacturing features and failure causes. According to the model, we propose a reliability decomposition approach based on the waterfall decomposition of the House of Quality (HoQ) in Quality Function Deployment (QFD), the product reliability indexes are transferred to process parameters by matrix multiplication. And then, we find the most valuable process improvement methods through multi-layer fuzzy comprehensive evaluation optimization methods which will enhance the product reliability effectively. The method is then verified with an example of a shell component of a missile, the result shows that the decomposition approach is a useful tool to keep the reliability of products in mass production phase.

  • Extrapolation Method of On-Orbit Soft Error Rates of EDAC SRAM Devices From Accelerator-Based Tests

    Single-event upset sensitivity of 55- and 180-nm SRAM devices with error detection and correction (EDAC) exhibits obvious ion flux and scrubbing time dependence. On-orbit soft error rates (SERs) of EDAC SRAM devices are extrapolated from accelerator heavy-ion data and compared with rectangular parallelepiped-predicted SER, based on an experimentally verified formula. It is found that on-orbit SER of EDAC SRAM is contributed by both the memory array and the EDAC circuitry. This method can guide the optimization of EDAC SRAM hardening strategy and also the on-orbit hardness assurance.

  • PROTOCOL: An on-line environment for reducing product reliability risk

    Military program offices and commercial product developers are challenged to make effective reliability decisions throughout product/systems development, acquisition, production and operation/maintenance phases. The decisions range from determining what reliability goals/requirements are appropriate to meet user's mission needs and market demands to select the most cost effective means to assess whether the system reliability is adequate to pass through various program decision "gates". These challenges are often faced by personnel with varying levels of reliability-specific experience and training, who often have multiple program responsibilities. These individuals need the benefit of the accumulated knowledge and experience that the Product Reliability On-line Tools Collection (PROTOCOL) provides. This paper presents the results of the recent Small Business Innovation Research (SBIR) Phase II PROTOCOL program carried out for the US Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) at Redstone Arsenal, Alabama. PROTOCOL provides tailorable reliability decision recommendations, analysis tools, rules-of-thumb, checklists, and lessons-learned coupled with the program specific constraints/schedule, requirements, and results tracking in a Web-based environment. For example, basic statistical analysis tools, a Weibull Analysis tool, a reliability activity cost calculator, and a thermal design advisor are examples of the tools included. The "environment" also includes a comprehensive reliability risk management tool and an interactive 5-part on-line tutorial in basic reliability. Completing PROTOCOL's knowledge content is an on-line library of more than 5000 reliability-related reports, standards, and guidance documents. PROTOCOL has been developed primarily to serve the reliability engineer, but it can also be used as a management aid to track the progress of development efforts and to ensure consistency among reliability approaches across a reliability organization with varying experience levels. Access to various portions of PROTOCOL can also be provided to interested parties outside the future reliability organization. PROTOCOL has been designed to be a reliability knowledge environment that grows over time. Users continually add knowledge as new data/information sources, new definitions, new lessons-learned, new rules-of-thumb and the like, all while tracking the reliability progress of products/systems that have been developed. PROTOCOL "learns" from informed decisions as it is used, as a means to improve the organization's reliability decision-making processes. A PROTOCOL prototype has been delivered to the Army completing the Phase II SBIR effort. Phase II Plus is currently underway, refining and expanding many of the tools included in the prototype. While PROTOCOL is being developed for military use, it has tremendous value as a resource to non-military government organizations and to the industrial community as well

  • Transformation of Thermal Ink-Jet product Reliability Strategy

    Over the course of the last 25 years, Hewlett-Packard has dramatically improved the performance, speed, and print quality of its Thermal Inkjet (TIJ) products. Reliability test and integration has evolved alongside the technology. Early reliability drivers focused on characterizing the TIJ technology by conducting high sample size tests at the system level. As HP's product lines diversified and the technology became more complex, reliability drivers turned to increasing quality. With abundant resources fueled by high growth, reliability teams could run large experiments at all levels of the system and conduct elaborate multi-stress experiments to investigate failure mechanisms. More recently, cost considerations have forced a shift in the reliability approach at Hewlett-Packard. Under the new Reliability Strategy TIJ programs are now developed around three core reliability concepts; Analyze, Discover and Characterize. The reliability and integration challenges of a development program are anticipated and then designed out at a fundamental level. Overstress testing is used to build confidence in design iterations and failure mechanisms are explored to the lowest possible level. System reliability is calculated by a roll-up of failure mode and subsystem experimental data with system test run only as a validation of the model. Use of the Reliability Strategy methodology is illustrated with two case studies. Using the new Reliability Strategy Hewlett-Packard's Inkjet Division has achieved a significant reduction in both testing cost and development iteration time while maintaining a high level of product reliability.

  • A method for inhibition of product reliability degradation based on manufacturing process quality variation control

    Product reliability is determined by the design stage and qualified in the manufacturing stage. The fluctuations of manufacturing process result in inherent reliability lower than design reliability, called reliability degradation phenomenon. Based on the existing research on manufacturing system reliability and process reliability, this paper analyzes how the manufacturing process quality variation influences product reliability and studies the inhibition of product reliability degradation based on manufacturing process quality variation control. Firstly, the normal and abnormal manufacturing process fluctuations are explained and distinguished. After analyzing traditional process capability analysis, the Bayesian estimation based process capacity index analytical method aiming at the small batch production pattern is proposed and the superiority is verified. Finally, combined with state space model based variation source diagnosis, the framework of manufacturing process product reliability degradation inhibition is put forward.

  • Case study of no fault founds in household appliances

    In recent years, some obvious fault problems have been solved gradually with the continuous development of reliability engineering technologies, whereas the no fault found (NFF) phenomenon remains a big obstacle that troubles various manufacturers. Especially in the household appliance industry, NFF accounts for about 30-70% of the returned faulty products. Some electronic product manufacturers just ignore customers' complaints of intermittent failure or the NFF phenomenon during retesting which may indicate defects in the products and simply attribute the problems as maintenance engineers' misjudgment. Consequently, they rather lose the opportunity of improving product reliability. This paper reviews the NFF phenomenon commonly occurred in household appliances, with in-depth analysis on the failure modes and mechanisms. Based on failure physics, a few solutions to the NFF problems are also suggested, which can reduce substantially the NFF rate by approximately 50%.



Standards related to Product Reliability

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Guide for Developing and Assessing Reliability Predictions Based on IEEE Standard 1413

The scope of this document is to provide guidance for conducting and assessing reliability predictions (techniques and methods) for electronic products and systems.


IEEE Guide for Selecting and Using Reliability Predictions Based on IEEE 1413

Processes and methodologies for conducting reliability predictions for electronic systems and equipment.


IEEE Standard for Organizational Reliability Capability

This document presents a standard that defines the reliability capability of organizations and identifies the criteria for assessing the reliability capability of an organization. This standard is intended to be usable by all organizations that design, manufacture or procure electrical/electronics components or products. Although the concepts described in this standard could be applied to both hardware and software products, the ...


IEEE Standard Methodology for Reliability Predictions and Assessment for Electronic Systems Equipment

A standardized medium for developing reliability predictions of electronic systems and equipment.


IEEE Standard Reliability Program for the Development and Production of Electronic Systems and Equipment

This project will develop for electronic products and systems a standard set of reliability-program objectives which can be used to express reliability requirements when a customer is contracting with a producer for electronic products.


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