305 resources related to Product Lifetime
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IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.
Science, technology and applications spanning the millimeter-waves, terahertz and infrared spectral regions
EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.
The conference will provide a forum for discussions and presentations of advancements inknowledge, new methods and technologies relevant to industrial electronics, along with their applications and future developments.
Photovoltaic materials, devices, systems and related science and technology
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
IEEE Design & Test of Computers offers original works describing the methods used to design and test electronic product hardware and supportive software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. Topics include IC/module design, low-power design, electronic design automation, design/test verification, practical technology, and standards. IEEE Design & Test of ...
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548), 2001
The impact of ESD-induced soft drain junction damage on product lifetime was investigated. Several thousand input-output (I/O) pads of a 0.35 /spl mu/m CMOS IC were stressed by ESD (electrostatic discharge) and subsequently subjected to bakes, ESD re-stress and high temperature operating life tests. While the ESD-induced soft drain junction damage appears to be stable versus temperature stress and ESD ...
Annual Reliability and Maintainability Symposium, 2003., 2003
A reliability test is designed to simulate product lifetime usage and expectations. With the assumptions that the product reliability, as demonstrated in test, is a multiple of its reliabilities regarding various operational and environmental stresses and of their undetermined interaction, a well designed reliability test accounts for all operational and environmental cumulative exposures to the stresses that the product will ...
2009 IEEE International Reliability Physics Symposium, 2009
SiOCH low-k dielectrics introduction in copper interconnects associated to the critical dimensions reduction in sub 45 nm technology nodes is a challenge for reliability engineers. Circuit wear-out linked to low-k dielectric breakdown is now becoming a major concern. With the reduction of the line to line spacing, the control of the copper line topology is becoming a first order parameter ...
2009 International Conference on Measuring Technology and Mechatronics Automation, 2009
The reliability requirement of a product (or component) is often given by the mean life. Actually, the expected service life of a product is smaller than the mean life unless the product is run to failure. This implies that ana- fractile life with 0 < alpha << 0.5 can better represent the product service lifetime than the mean life. On ...
2003 EcoDesign 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 2003
The lifetime of the current generation of audio systems is far away from its ecological optimum. Replacing a product for a better, nicer or just more cosmetically pleasing one is the order of the day. The question this paper addresses is whether optimising the lifetime of audio systems is an interesting concept to gain environmental and business benefit The paper ...
Standards Insights for Executives: Impact of Standards on Product Design
M. George Craford accepts the IEEE Edison Medal - Honors Ceremony 2017
Conformity Assessment: The Perspective of Product Designers - Gordon Gillerman, Director, Standards Coordination Office, NIST
IMS 2011 Microapps - Pulsed S-Parameter Measurements Using PXI Instruments
Verizon's Marni Walden presents opportunity in Product & New Business Innovation - 2016 Women in Engineering Conference
Heuristics for Design for Reliability in Electrical and Electronic Products
Rogers at APEC 2016
HKN Member Marcian E. "Ted" Hoff Receives Award at the 2012 EAB Award Ceremony
The Ethical Imperative of Safety - Stefan Mozar - Ignite: Sections Congress 2017
Q&A with Kip Ludwig: IEEE Brain Podcast, Episode 7
IMS 2011 Microapps - Maximizing VSA Dynamic Range Through Appropriate IF Path Selection
APEC 2011-PSMA Power Technology Roadmap 2011 Summary
GHTC 2012 - Krista Bauer Keynote
Real-Time, Event-Driven Applications on the Edge - Blaine Mathieu at Fog World Congress 2018
IEEE.tv Product Promotion: Collaboration
The Prospects for Scalable Quantum Computing with Superconducting Circuits - Applied Superconductivity Conference 2018
Next Generation Power Supplies - APEC 2016
Jacopo Cassina: The Scorpius Roadmap for Cyber, Physical and System - WF-IoT 2015
ASC-2014 SQUIDs 50th Anniversary: 3 of 6 - Bob Fagaly
The impact of ESD-induced soft drain junction damage on product lifetime was investigated. Several thousand input-output (I/O) pads of a 0.35 /spl mu/m CMOS IC were stressed by ESD (electrostatic discharge) and subsequently subjected to bakes, ESD re-stress and high temperature operating life tests. While the ESD-induced soft drain junction damage appears to be stable versus temperature stress and ESD re-stress, it results in early failures during accelerated operating life tests. These life test failures are caused by breakdown of the gate oxide which was left unbroken during the ESD stress that caused the ESD-induced soft drain junction damage. Thus, ESD-induced soft drain junction damage might cause a reliability risk (latent ESD failure). Consequently, it needs to be avoided by assuring sufficient robustness of the IC against this ESD damage mechanism. A leakage current criterion of 1 /spl mu/A is rather large to detect this kind of damage after ESD stress.
A reliability test is designed to simulate product lifetime usage and expectations. With the assumptions that the product reliability, as demonstrated in test, is a multiple of its reliabilities regarding various operational and environmental stresses and of their undetermined interaction, a well designed reliability test accounts for all operational and environmental cumulative exposures to the stresses that the product will encounter in the actual field use. To determine levels and durations of each of the separate stress to be applied in test they are assumed to be independent. The stress independency assumption allows determination of duration and intensity of each applied environmental or operational stress to prove product lifetime reliability regarding all expected stresses, while the tests are accelerated to allow for reasonable and cost effective length of test in that environment. This cannot be accomplished without detail knowledge of product's usage profile, sequence of operation, and expected use environments. The synergism or the test sequence is not disregarded as it will be the factor possibly contributing to lower demonstrated reliability.
SiOCH low-k dielectrics introduction in copper interconnects associated to the critical dimensions reduction in sub 45 nm technology nodes is a challenge for reliability engineers. Circuit wear-out linked to low-k dielectric breakdown is now becoming a major concern. With the reduction of the line to line spacing, the control of the copper line topology is becoming a first order parameter governing the low-k dielectric reliability. Improving the low-k reliability requires to discriminate each topological effect and quantify its impact on the lifetime at product level. This paper demonstrates the importance of the copper line shape, of the line edge roughness (LER) and of the median line to line spacing variation within the wafer on the low-k dielectrics reliability. Moreover, simple analytical models are described to quantify each effect on the Time-Dependant Dielectric Breakdown (TDDB) and particularly on the final product lifetime. Some advices are given to avoid erroneous lifetime projection.
The reliability requirement of a product (or component) is often given by the mean life. Actually, the expected service life of a product is smaller than the mean life unless the product is run to failure. This implies that ana- fractile life with 0 < alpha << 0.5 can better represent the product service lifetime than the mean life. On the other hand, the life of about 50% of the products is larger than the mean life. As such, the (1-alpha)-fractile lifetime reflects the lifetime of the quality products, and can be viewed as a goal for most of the products to achieve by improvement of the product quality. A product quality index is defined by combining these two lifetime measures. The quality indices associated with several well-known lifetime distributions are derived as functions of some distributional parameter(s). The proposed index represents the life consistence of the products produced in batches and can be used for evaluating and comparing the quality of the products produced by different manufacturers. The usefulness of the quality index is illustrated by an example.
The lifetime of the current generation of audio systems is far away from its ecological optimum. Replacing a product for a better, nicer or just more cosmetically pleasing one is the order of the day. The question this paper addresses is whether optimising the lifetime of audio systems is an interesting concept to gain environmental and business benefit The paper concludes that in the case of audio systems lifetime optimisation can be used to bring about innovative new ideas that at the same time reduce environmental impact substantially.
Today's methodologies for electromigration (EM) identify EM-susceptible wires based on their current density, using the Blech criterion to filter out wires that are EM-immortal. The Blech criterion is agnostic to the product lifetime and temperature conditions: many Blech-mortal wires may never experience EM during the product lifetime. We develop new methods that evaluate the transient evolution of stress, relative to the product lifetime, and present an improved set of simple and practical mortality criteria. On a set of power grid benchmarks, we demonstrate that the actual number of mortal wires may depend strongly on the lifetime and reliability conditions.
Creating a successful service offering for a physical product and implementing the services require extensive information exchange across the boundaries of the service provider and client organisations. A change from a transaction-to- relationship-based service model calls for new capabilities from the product manufacturer. This change, however, also offers new possibilities for the utilisation of lifetime information in a more effective way. Product lifetime information has several purposes of use including the development, management and implementation of services. Additionally, the manufacturer providing services has the advantage of efficiently utilising the accumulated information in the product development. The basic idea for the service provider is to create added value by processing, analysing and converting the gathered data into knowledge that can be utilised in providing better services. Thus, the asset owner will benefit from sharing the information by receiving better managed and implemented services resulting in improved equipment efficiency. Sharing relevant lifetime information calls for transparency from all parties involved. Building the kind of framework presented in this paper for the shared information content and procedures for the utilisation of the information will help in clarifying the common objectives in the relationship between the customer and service provider.
The design of power electronics modules has always been carried out with major focus on product reliability. As the chip sizes and module sizes shrink, but the power dissipation remains constant or even increases, the growing power densities create thermal problems which make designers explore new die attach, substrate and bonding technologies, bringing thermal design to its limits. On the other hand the requirements of the application, the final product which will make use of the power modules may give some additional margin to the designer. If the expected lifetime and the so-called `mission profile', in other words operating requirements of the target application is known, the reliability requirements for the power modules can be more accurately defined. The mission profile will directly result in a power profile, which will determine the top junction temperature and the junction temperature swings in the module. Having this information and the possibility to create accurate lifetime tests the requirements of the final application and the module design can be synchronized, giving more freedom, yet more responsibility to the designer to fine tune the power module's reliability characteristics. In this article we would like to show the detailed steps of the above described process.
A device-aging simulation that efficiently estimates temporal degradation of failure probability of a circuit is proposed. As the size of transistors shrinks, consideration of device aging in addition to manufacturing variability has become an urgent issue for maintaining reliability of LSIs. Contrary to existing techniques that separately handle manufacturing variability and the device aging, we propose a simultaneous evaluation approach using an augmented reliability and subset simulation. By eliminating the repetitive failure-probability calculations at each device-age, the proposed method reduces the number of required circuit simulations to about 1/6 of that of the conventional method without compromising accuracy.
Product level lifetime margins, determined by HCI and BTI, are shrinking with scaling. We developed highly accurate device-level HCI degradation models that, together with known BTI models, are able to accurately predict frequency degradation of a ring oscillator. We show that despite substantial relief from HCI damage in balanced switching circuits, HCI degradation still accounts for 40-50% of frequency degradation for a 10-year product life.
To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.
This standard establishes criteria for design analysis for qualification, quality, and reliability of rechargeable lithium ion and lithium ion polymer batteries for cellular telephone applications. Also included in the standard are: battery pack electrical and mechanical construction, packaging technologies, and pack and cell level charge and discharge controls and overall system considerations.
This standard establishes criteria for design analysis for qualification, quality, and reliability of rechargeable battery systems for multi-cell mobile computing devices. It also provides methods for quantifying the operational performance of these batteries and their associated management and control systems including considerations for end-user notification. This standard covers rechargeable battery systems for mobile computing. The battery technologies covered are limited ...