Conferences related to Product Lifetime

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)

Science, technology and applications spanning the millimeter-waves, terahertz and infrared spectral regions


2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 28th International Symposium on Industrial Electronics (ISIE)

The conference will provide a forum for discussions and presentations of advancements inknowledge, new methods and technologies relevant to industrial electronics, along with their applications and future developments.


2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


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Periodicals related to Product Lifetime

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Design & Test of Computers, IEEE

IEEE Design & Test of Computers offers original works describing the methods used to design and test electronic product hardware and supportive software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. Topics include IC/module design, low-power design, electronic design automation, design/test verification, practical technology, and standards. IEEE Design & Test of ...


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Product Lifetime

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Xplore Articles related to Product Lifetime

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Impact of ESD-induced soft drain junction damage on CMOS product lifetime

Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548), 2001

The impact of ESD-induced soft drain junction damage on product lifetime was investigated. Several thousand input-output (I/O) pads of a 0.35 /spl mu/m CMOS IC were stressed by ESD (electrostatic discharge) and subsequently subjected to bakes, ESD re-stress and high temperature operating life tests. While the ESD-induced soft drain junction damage appears to be stable versus temperature stress and ESD ...


Accelerated testing for demonstration of product lifetime reliability

Annual Reliability and Maintainability Symposium, 2003., 2003

A reliability test is designed to simulate product lifetime usage and expectations. With the assumptions that the product reliability, as demonstrated in test, is a multiple of its reliabilities regarding various operational and environmental stresses and of their undetermined interaction, a well designed reliability test accounts for all operational and environmental cumulative exposures to the stresses that the product will ...


Copper line topology impact on the SiOCH low-k reliability in sub 45nm technology node. From the time-dependent dielectric breakdown to the product lifetime

2009 IEEE International Reliability Physics Symposium, 2009

SiOCH low-k dielectrics introduction in copper interconnects associated to the critical dimensions reduction in sub 45 nm technology nodes is a challenge for reliability engineers. Circuit wear-out linked to low-k dielectric breakdown is now becoming a major concern. With the reduction of the line to line spacing, the control of the copper line topology is becoming a first order parameter ...


A Product Quality Index Derived from Product Lifetime Distribution

2009 International Conference on Measuring Technology and Mechatronics Automation, 2009

The reliability requirement of a product (or component) is often given by the mean life. Actually, the expected service life of a product is smaller than the mean life unless the product is run to failure. This implies that ana- fractile life with 0 < alpha << 0.5 can better represent the product service lifetime than the mean life. On ...


Influencing product lifetime through product design

2003 EcoDesign 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 2003

The lifetime of the current generation of audio systems is far away from its ecological optimum. Replacing a product for a better, nicer or just more cosmetically pleasing one is the order of the day. The question this paper addresses is whether optimising the lifetime of audio systems is an interesting concept to gain environmental and business benefit The paper ...


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Educational Resources on Product Lifetime

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IEEE-USA E-Books

  • Impact of ESD-induced soft drain junction damage on CMOS product lifetime

    The impact of ESD-induced soft drain junction damage on product lifetime was investigated. Several thousand input-output (I/O) pads of a 0.35 /spl mu/m CMOS IC were stressed by ESD (electrostatic discharge) and subsequently subjected to bakes, ESD re-stress and high temperature operating life tests. While the ESD-induced soft drain junction damage appears to be stable versus temperature stress and ESD re-stress, it results in early failures during accelerated operating life tests. These life test failures are caused by breakdown of the gate oxide which was left unbroken during the ESD stress that caused the ESD-induced soft drain junction damage. Thus, ESD-induced soft drain junction damage might cause a reliability risk (latent ESD failure). Consequently, it needs to be avoided by assuring sufficient robustness of the IC against this ESD damage mechanism. A leakage current criterion of 1 /spl mu/A is rather large to detect this kind of damage after ESD stress.

  • Accelerated testing for demonstration of product lifetime reliability

    A reliability test is designed to simulate product lifetime usage and expectations. With the assumptions that the product reliability, as demonstrated in test, is a multiple of its reliabilities regarding various operational and environmental stresses and of their undetermined interaction, a well designed reliability test accounts for all operational and environmental cumulative exposures to the stresses that the product will encounter in the actual field use. To determine levels and durations of each of the separate stress to be applied in test they are assumed to be independent. The stress independency assumption allows determination of duration and intensity of each applied environmental or operational stress to prove product lifetime reliability regarding all expected stresses, while the tests are accelerated to allow for reasonable and cost effective length of test in that environment. This cannot be accomplished without detail knowledge of product's usage profile, sequence of operation, and expected use environments. The synergism or the test sequence is not disregarded as it will be the factor possibly contributing to lower demonstrated reliability.

  • Copper line topology impact on the SiOCH low-k reliability in sub 45nm technology node. From the time-dependent dielectric breakdown to the product lifetime

    SiOCH low-k dielectrics introduction in copper interconnects associated to the critical dimensions reduction in sub 45 nm technology nodes is a challenge for reliability engineers. Circuit wear-out linked to low-k dielectric breakdown is now becoming a major concern. With the reduction of the line to line spacing, the control of the copper line topology is becoming a first order parameter governing the low-k dielectric reliability. Improving the low-k reliability requires to discriminate each topological effect and quantify its impact on the lifetime at product level. This paper demonstrates the importance of the copper line shape, of the line edge roughness (LER) and of the median line to line spacing variation within the wafer on the low-k dielectrics reliability. Moreover, simple analytical models are described to quantify each effect on the Time-Dependant Dielectric Breakdown (TDDB) and particularly on the final product lifetime. Some advices are given to avoid erroneous lifetime projection.

  • A Product Quality Index Derived from Product Lifetime Distribution

    The reliability requirement of a product (or component) is often given by the mean life. Actually, the expected service life of a product is smaller than the mean life unless the product is run to failure. This implies that ana- fractile life with 0 < alpha << 0.5 can better represent the product service lifetime than the mean life. On the other hand, the life of about 50% of the products is larger than the mean life. As such, the (1-alpha)-fractile lifetime reflects the lifetime of the quality products, and can be viewed as a goal for most of the products to achieve by improvement of the product quality. A product quality index is defined by combining these two lifetime measures. The quality indices associated with several well-known lifetime distributions are derived as functions of some distributional parameter(s). The proposed index represents the life consistence of the products produced in batches and can be used for evaluating and comparing the quality of the products produced by different manufacturers. The usefulness of the quality index is illustrated by an example.

  • Influencing product lifetime through product design

    The lifetime of the current generation of audio systems is far away from its ecological optimum. Replacing a product for a better, nicer or just more cosmetically pleasing one is the order of the day. The question this paper addresses is whether optimising the lifetime of audio systems is an interesting concept to gain environmental and business benefit The paper concludes that in the case of audio systems lifetime optimisation can be used to bring about innovative new ideas that at the same time reduce environmental impact substantially.

  • Predicting electromigration mortality under temperature and product lifetime specifications

    Today's methodologies for electromigration (EM) identify EM-susceptible wires based on their current density, using the Blech criterion to filter out wires that are EM-immortal. The Blech criterion is agnostic to the product lifetime and temperature conditions: many Blech-mortal wires may never experience EM during the product lifetime. We develop new methods that evaluate the transient evolution of stress, relative to the product lifetime, and present an improved set of simple and practical mortality criteria. On a set of power grid benchmarks, we demonstrate that the actual number of mortal wires may depend strongly on the lifetime and reliability conditions.

  • Utilisation of product lifetime information across organizational boundaries in the development of maintenance services

    Creating a successful service offering for a physical product and implementing the services require extensive information exchange across the boundaries of the service provider and client organisations. A change from a transaction-to- relationship-based service model calls for new capabilities from the product manufacturer. This change, however, also offers new possibilities for the utilisation of lifetime information in a more effective way. Product lifetime information has several purposes of use including the development, management and implementation of services. Additionally, the manufacturer providing services has the advantage of efficiently utilising the accumulated information in the product development. The basic idea for the service provider is to create added value by processing, analysing and converting the gathered data into knowledge that can be utilised in providing better services. Thus, the asset owner will benefit from sharing the information by receiving better managed and implemented services resulting in improved equipment efficiency. Sharing relevant lifetime information calls for transparency from all parties involved. Building the kind of framework presented in this paper for the shared information content and procedures for the utilisation of the information will help in clarifying the common objectives in the relationship between the customer and service provider.

  • Mission profile driven component design for adjusting product lifetime on system level

    The design of power electronics modules has always been carried out with major focus on product reliability. As the chip sizes and module sizes shrink, but the power dissipation remains constant or even increases, the growing power densities create thermal problems which make designers explore new die attach, substrate and bonding technologies, bringing thermal design to its limits. On the other hand the requirements of the application, the final product which will make use of the power modules may give some additional margin to the designer. If the expected lifetime and the so-called `mission profile', in other words operating requirements of the target application is known, the reliability requirements for the power modules can be more accurately defined. The mission profile will directly result in a power profile, which will determine the top junction temperature and the junction temperature swings in the module. Having this information and the possibility to create accurate lifetime tests the requirements of the final application and the module design can be synchronized, giving more freedom, yet more responsibility to the designer to fine tune the power module's reliability characteristics. In this article we would like to show the detailed steps of the above described process.

  • Efficient circuit failure probability calculation along product lifetime considering device aging

    A device-aging simulation that efficiently estimates temporal degradation of failure probability of a circuit is proposed. As the size of transistors shrinks, consideration of device aging in addition to manufacturing variability has become an urgent issue for maintaining reliability of LSIs. Contrary to existing techniques that separately handle manufacturing variability and the device aging, we propose a simultaneous evaluation approach using an augmented reliability and subset simulation. By eliminating the repetitive failure-probability calculations at each device-age, the proposed method reduces the number of required circuit simulations to about 1/6 of that of the conventional method without compromising accuracy.

  • Accurate product lifetime predictions based on device-level measurements

    Product level lifetime margins, determined by HCI and BTI, are shrinking with scaling. We developed highly accurate device-level HCI degradation models that, together with known BTI models, are able to accurately predict frequency degradation of a ring oscillator. We show that despite substantial relief from HCI damage in balanced switching circuits, HCI degradation still accounts for 40-50% of frequency degradation for a 10-year product life.



Standards related to Product Lifetime

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IEEE Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.


IEEE Standard for Rechargeable Batteries for Cellular Telephones

This standard establishes criteria for design analysis for qualification, quality, and reliability of rechargeable lithium ion and lithium ion polymer batteries for cellular telephone applications. Also included in the standard are: battery pack electrical and mechanical construction, packaging technologies, and pack and cell level charge and discharge controls and overall system considerations.


IEEE Standard for Rechargeable Batteries for Multi-Cell Mobile Computing Devices

This standard establishes criteria for design analysis for qualification, quality, and reliability of rechargeable battery systems for multi-cell mobile computing devices. It also provides methods for quantifying the operational performance of these batteries and their associated management and control systems including considerations for end-user notification. This standard covers rechargeable battery systems for mobile computing. The battery technologies covered are limited ...



Jobs related to Product Lifetime

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