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Packaging And Interconnections
Top Conferences on Packaging And Interconnections
2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
2021 IEEE International Electron Devices Meeting (IEDM)
2019 IEEE 62nd International Midwest Symposium on Circuits and Systems (MWSCAS)
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
2018 IEEE International Interconnect Technology Conference (IITC)
2018 International Conference on IC Design & Technology (ICICDT)
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation andExperiments in Microelectronics and Microsystems (EuroSimE)
2017 IEEE 13th Malaysia International Conference on Communications (MICC)
2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting
2015 IEEE Energy Conversion Congress and Exposition
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)
2013 International Semiconductor Conference Dresden - Grenoble (ISCDG)
2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)
2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS 2011)
2009 3rd International Conference on Signals, Circuits and Systems (SCS 2009)
2009 20th International Zurich Symposium on Electromagnetic Compatibility
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Dependable and Secure Computing, IEEE Transactions on
Power Electronics, IEEE Transactions on
Selected Topics in Quantum Electronics, IEEE Journal of
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Standards related to Packaging And Interconnections
Standard for High Frequency Characterization for Low Temperature Co-Fired Ceramic (LTCC)Materials
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