Conferences related to Monitoring

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Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2009

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2007

  • OCEANS 2006

  • OCEANS 2005

  • OCEANS 2004

  • OCEANS 2003

  • OCEANS 2002

  • OCEANS 2001

  • OCEANS 2000

  • OCEANS '99

  • OCEANS '98

  • OCEANS '97

  • OCEANS '96


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 17th International Conference on Industrial Informatics (INDIN)

Industrial information technologies


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Periodicals related to Monitoring

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Reviews in

The IEEE Reviews in Biomedical Engineering will review the state-of-the-art and trends in the emerging field of biomedical engineering. This includes scholarly works, ranging from historic and modern development in biomedical engineering to the life sciences and medicine enabled by technologies covered by the various IEEE societies.


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


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Most published Xplore authors for Monitoring

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Xplore Articles related to Monitoring

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Enabling the multiple use of condition monitoring devices for real-time monitoring, real-time data logging and remote condition monitoring

7th IET Conference on Railway Condition Monitoring 2016 (RCM 2016), 2016

Historically, disparate devices have been utilised for longterm monitoring, field installation and data logging due to their different requirements in the railway area. However, there is a strong case for creating condition monitoring equipment and the associated infrastructure to allow multiple modes of operation, including real-time monitoring, real-time data logging and remote condition monitoring. Smart Component Technologies Ltd. has developed ...


Can we measure our way out of trouble? the truth behind condition monitoring

6th IET Conference on Railway Condition Monitoring (RCM 2014), 2014

Condition monitoring is widely accepted across the rail industry in many different guises and varying degrees of success. So do we really make the best of Condition Monitoring, from basic rudimentary measurements through to more advanced state of the art? This paper aims to break down the barriers of condition monitoring, delving into research both inside and outside the rail ...


Real-Time 2D Microwave Differential Imaging for Temperature Monitoring

2018 International Symposium on Antennas and Propagation (ISAP), 2018

A non-invasive 2D microwave differential imaging (MDI) system for real-time temperature change monitoring is presented. The proposed MDI system operating at 925 MHz consists of a 16 channel array antenna, a cylindrical shaped imaging tank, a microwave switching matrix and a vector network analyzer. The MDI method for temperature monitoring is predicated on the changes in dielectric contrast of imaging ...


IEE Colloquium on 'Advanced Condition Monitoring Systems for Power Generation' (Digest No.155)

IEE Colloquium on Advanced Condition Monitoring Systems for Power Generation, 1991

None


IEE Colloquium on 'Condition Monitoring and Fault Tolerance' (Digest No.145)

IEE Colloquium on Condition Monitoring and Fault Tolerance, 1990

None


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Educational Resources on Monitoring

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IEEE.tv Videos

IMS 2011 Microapps - Low-PIM Filter Solutions for Broadband Emission Monitoring
EMBC 2011 -Keynote- Applications and Opportunities for Wearable Technology in Physiological Monitoring -Dale Wiggins
Q&A with Chris Berka: IEEE Brain Podcast, Episode 9
Engineering in Medicine and Biology: Segment 3
Generation of Models for Wireless Sensor Network Assessment
Marin Litoiu: Beyond Network Control - End to End Performance of CPS: WF IoT 2016
Tech Super Stars Panelist - Marc Bracken: 2016 Technology Time Machine
Remote Sensing in Community Forestry - GHTC 2012 Sessions - Eric Kaiser & Kimberly Roberts
NeXOS: Observations Supporting Ocean Sustainability
Ignite! Session: Blake Lloyd
From THz imaging to millimeter-wave stimulation of neurons: Is there a killer application for high frequency RF in the medical community? (RFIC 2015 Keynote)
Fragility of Interconnected Cyber-Physical Systems - Marios M. Polycarpou - WCCI 2016
Fog Computing in Energy and Environment Panel - Fog World Congress 2017
IEEE in the North and South Poles (INSP) - Tony Milne - Ignite: Sections Congress 2017
Raffaele Giaffreda: Solving IoT Interoperability and Security Problems in an eHealth Context: WF-IoT 2016
IEEE Themes - Social dynamics in peer-to-peer sharing networks
IEEE Sections Congress 2014: Luc Van den Hove, Wearable Medical Technology
Societal Impacts and Benefits - GHTC 2012 Session - Mary Ann Stewart
NeXOS: Observations Supporting Ocean Sustainability (short version)
Airship Renaissance

IEEE-USA E-Books

  • Enabling the multiple use of condition monitoring devices for real-time monitoring, real-time data logging and remote condition monitoring

    Historically, disparate devices have been utilised for longterm monitoring, field installation and data logging due to their different requirements in the railway area. However, there is a strong case for creating condition monitoring equipment and the associated infrastructure to allow multiple modes of operation, including real-time monitoring, real-time data logging and remote condition monitoring. Smart Component Technologies Ltd. has developed a multi-faceted ecosystem to allow condition monitoring devices to operate in multiple modes of operation without the need for modification or reconfiguration. In this paper, the requirements for these working modes are discussed in detail and the state-of-the-art wireless technology, cloud based services and smart portable devices are utilised to build such a system. On this basis, an implementation for measuring the clamping force is presented with the capability for long-term monitoring with a low sample rate, live data view during installation, and short bursts of data logging with a high sample rate.

  • Can we measure our way out of trouble? the truth behind condition monitoring

    Condition monitoring is widely accepted across the rail industry in many different guises and varying degrees of success. So do we really make the best of Condition Monitoring, from basic rudimentary measurements through to more advanced state of the art? This paper aims to break down the barriers of condition monitoring, delving into research both inside and outside the rail industry and proposes concepts on how we can adopt a best practice approach going forward.

  • Real-Time 2D Microwave Differential Imaging for Temperature Monitoring

    A non-invasive 2D microwave differential imaging (MDI) system for real-time temperature change monitoring is presented. The proposed MDI system operating at 925 MHz consists of a 16 channel array antenna, a cylindrical shaped imaging tank, a microwave switching matrix and a vector network analyzer. The MDI method for temperature monitoring is predicated on the changes in dielectric contrast of imaging targets with changing temperature. For reconstructed image, we use the Distorted Born Approximation (DBA) and Tikhonov regularization to solve 2D surface integral equation (SIE) and discrete linear inverse problem. The MDI system is tested on water target and a honeycomb shape phantom. Experimental results are presented to show the feasibility of the temperature monitoring inside human body for biomedical applications.

  • IEE Colloquium on 'Advanced Condition Monitoring Systems for Power Generation' (Digest No.155)

    None

  • IEE Colloquium on 'Condition Monitoring and Fault Tolerance' (Digest No.145)

    None

  • LIKWID Monitoring Stack: A Flexible Framework Enabling Job Specific Performance monitoring for the masses

    System monitoring is an established tool to measure the utilization and health of HPC systems. Usually system monitoring infrastructures make no connection to job information and do not utilize hardware performance monitoring (HPM) data. To increase the efficient use of HPC systems automatic and continuous performance monitoring of jobs is an essential component. It can help to identify pathological cases, provides instant performance feedback to the users, offers initial data to judge on the optimization potential of applications and helps to build a statistical foundation about application specific system usage. The LIKWID monitoring stack is a modular framework build on top of the LIKWID tools library. It aims on enabling job specific performance monitoring using HPM data, system metrics and application-level data for small to medium sized commodity clusters. Moreover, it is designed to integrate in existing monitoring infrastructures to speed up the change from pure system monitoring to job-aware monitoring.

  • Condition monitoring of railway tracks using compact size on-board monitoring device

    This paper summarizes a new development of a compact size on-board device for condition monitoring of railway tracks and the monitoring software. Track irregularities are estimated from a vertical and lateral acceleration and roll rate of a car body. A GPS system and a map-matching algorithm are used to pinpoint the location of faults on tracks. The device is driven by Li-ion battery for 6 hours or outside power source. Accelerometers, rate gyroscope and GPS were redesigned to give higher performance. One can add a microphone outside if a condition monitoring of rail corrugation is necessary. Collected data are usually kept in an inside un-volatility memory (SSD) or a SD card. Communication unit transfers the collected data to a data server via cellular phone. The monitoring software provides a function to detect track irregularities using RMS of the carbody acceleration. It also provides a function to analyse in time-frequency domain using continuous wavelet transform. A monitoring experience in a local railway line showed that the system is effective for practical use.

  • IEE Colloquium on 'The Use of Personal Computer Systems for Plant Monitoring and Control' (Digest No.47)

    None

  • IEE Colloquium on 'Condition Monitoring and Failure Diagnosis - Part 1' (Digest No.112)

    None

  • IEE Colloquium on 'Condition Monitoring for Fault Diagnosis' (Digest No.156)

    None



Standards related to Monitoring

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American National Standard for Performance Specification for Tritium Monitors


IEEE Application Guide for Distributed Digital Control and Monitoring for Power Plants


IEEE Guide for Assessing, Monitoring, and Mitigating Aging Effects on Class 1E Equipment Used in Nuclear Power Generating Stations

This document provides the guidelines for assessing, monitoring, and mitigating aging degradation effects on class 1E equipment used in nuclear power generating stations.


IEEE Guide for Assessing, Monitoring, and Mitigating Aging Effects on Class 1E Equipment Used in Nuclear Power Generating Stations - Corrigendum 1: Thermal Aging Model Corrections

The scope of the corrigendum is to correct three typographical errors of a minor technical nature (two in Clause 6.6.3 and one in Annex D, Clause D.1.7) related to performing thermal aging analysis.


IEEE Guide for Monitoring, Information Exchange, and Control of Distributed Resources Interconnected with Electric Power Systems

This document provides guidelines for monitoring, information exchange, and control for distributed resources (DR) interconnected with electric power systems (EPS).


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