IEEE Organizations related to Dielectric Measurement

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Conferences related to Dielectric Measurement

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)

Technical presentations will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, theory and computational tool development, active and passive components, systems, and supporting technologies.System developers will find that IVEC provides a unique snapshot of the current state-of-the-art in vacuum electron devices. These devices continue to provide unmatched power and performance for advanced electromagnetic systems, particularly in the challenging frequency regimes of millimeter-wave and THz electronics.Plenary talks will provide insights into the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current directions in vacuum electronics research.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2020 IEEE/MTT-S International Microwave Symposium (IMS)

The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96


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Periodicals related to Dielectric Measurement

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Most published Xplore authors for Dielectric Measurement

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Xplore Articles related to Dielectric Measurement

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Wave tilt sounding of multilayered structures

Radio Science, 1979

The relationship between the wave tilt and the electrical parameters of a multilayered structure is investigated. Particular emphasis is placed on the inverse problem associated with the sounding of planetary surfaces. An inversion technique, based on multifrequency wave tilt, is proposed and demonstrated with several computer models. There is close agreement between the electrical parameters used in the models and ...


Comments and Corrections Comments on ``Complex Dielectric Measurements of Forest Fire Ash at X-Band Frequencies''

IEEE Geoscience and Remote Sensing Letters, None

In the above letter, the authors investigate and present dielectric measurements of powdered forest fire ash using the Nicholson-Ross-Weir method within a WR-90 waveguide (X-band 8-12 GHz). However, some errors have been found, which are clarified in this letter.


A power diagram indicator for high-tension circuits

Proceedings of the American Institute of Electrical Engineers, 1911

Introduction and Summary The power diagram indicator was produced as a feasible, inexpensive instrument to observe dielectric or similar stray power losses that occur in high-tension circuits.1A cathode ray-pointer is used to trace the power diagram. It is actuated electrostatically. The pressure of the high-tension circuit applied to “quadrants” causes a proportional displacement of the ray-pointer in one axis; the ...


Correlation between domain structure and piezoelectric properties: Experimental study of (111)c oriented BaTiO3 single crystal

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy, 2014

It is known that longitudinal and transversal piezoelectric coefficients of (111)c, oriented poled tetragonal crystal plate depend on its domain structure. Expected strong variation of these coefficients for different domain patterns in poled crystals was experimentally confirmed on the example of BaTiO3 single crystal. The correlation between a piezoelectric coefficient d31 and the domain pattern observed with polarizing microscope is ...


Calibration method of microwave measurement system for dielectric samples detection

2016 9th International Kharkiv Symposium on Physics and Engineering of Microwaves, Millimeter and Submillimeter Waves (MSMW), 2016

In this paper, calibration method of microwave measurement system for dielectric samples detection composed of two baluns and coupled-line sensor inserted in-between is presented. The presented sensor allows for detection of dielectric sample having size comparable to the distance between the sensor's coupled strips and therefore is dedicated for biomedical or industrial applications. To directly measure the coupled-line sensor and ...


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Educational Resources on Dielectric Measurement

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IEEE.tv Videos

IMS 2011 Microapps - Understanding the Proper Dielectric Constant of High Frequency Laminates to Be Used for Circuit Modeling and Design
Micro-Apps 2013: Determining Circuit Material Dielectric Constant from Phase Measurements
IMS 2011 Microapps - A Comparison of Noise Parameter Measurement Techniques
IMS 2011 Microapps - Ultra Low Phase Noise Measurement Technique Using Innovative Optical Delay Lines
IMS 2011 Microapps - Waveguide Characteristics and Measurement Errors
IMS 2012 Microapps - Passive Intermodulation (PIM) measurement using vector network analyzer Osamu Kusano, Agilent CTD-Kobe
IMS 2011 Microapps - Vector-Receiver Load Pull - Measurement Accuracy at its Best
I2MTC 2014 Conference Preview
APEC 2012 - Thomas S. Buzak Plenary
5G Wireless A Measurement and Metrology Perspective: MicroApps 2015 - Keysight Technologies
MicroApps: Recent Improvement on Y-Factor Noise Figure Measurement Uncertainty (Agilent Technologies)
Micro-Apps Keynote 2013: Modern RF Measurements and How They Drive Spectrum Analyzer Digital IF Processor Design
MicroApps: Measurement Advances for Differential and I/Q Devices (Agilent Technologies)
Innovative Transmission Line Measurement and Characterization Reduce Time to Repair for Complex Communication Systems: MicroApps 2015 - Keysight Technologies
Voltage Metrology with Superconductive Electronics
IMS 2014: LNA Modules for the WR4 (170-260 GHz) Frequency Range
IMS 2014: Wideband mmWave Channels: Implications for Design and Implementation of Adaptive Beam Antennas
Brooklyn 5G Summit 2014: Channel Measurements Summary by Ted Rappaport
IMS 2014:Flip Chip Assembly for Sub-millimeter Wave Amplifier MMIC on Polyimide Substrate
Generating Stochastic Bits Using Tunable Quantum Systems - Erik Blair at INC 2019

IEEE-USA E-Books

  • Wave tilt sounding of multilayered structures

    The relationship between the wave tilt and the electrical parameters of a multilayered structure is investigated. Particular emphasis is placed on the inverse problem associated with the sounding of planetary surfaces. An inversion technique, based on multifrequency wave tilt, is proposed and demonstrated with several computer models. There is close agreement between the electrical parameters used in the models and the inversion values.

  • Comments and Corrections Comments on ``Complex Dielectric Measurements of Forest Fire Ash at X-Band Frequencies''

    In the above letter, the authors investigate and present dielectric measurements of powdered forest fire ash using the Nicholson-Ross-Weir method within a WR-90 waveguide (X-band 8-12 GHz). However, some errors have been found, which are clarified in this letter.

  • A power diagram indicator for high-tension circuits

    Introduction and Summary The power diagram indicator was produced as a feasible, inexpensive instrument to observe dielectric or similar stray power losses that occur in high-tension circuits.1A cathode ray-pointer is used to trace the power diagram. It is actuated electrostatically. The pressure of the high-tension circuit applied to “quadrants” causes a proportional displacement of the ray-pointer in one axis; the pressure drop between the terminals of a condenser in series with the high-tension circuit is applied to the other pair of quadrants and gives the ray-pointer a quadrature velocity proportional to the current. The ray-pointer is thus made to trace a diagram that encloses an area proportional to the e.m.f.-current-time product.2Alternating current will produce a closed diagram or “card” having an area which is proportional to the energy of the circuit delivered per cycle. At constant frequency, therefore, the card-area measures the power applied in the circuit. The form of the card tells of many things besides the amount of power just as the steam-engine indicator card does in steam engineering.

  • Correlation between domain structure and piezoelectric properties: Experimental study of (111)c oriented BaTiO3 single crystal

    It is known that longitudinal and transversal piezoelectric coefficients of (111)c, oriented poled tetragonal crystal plate depend on its domain structure. Expected strong variation of these coefficients for different domain patterns in poled crystals was experimentally confirmed on the example of BaTiO3 single crystal. The correlation between a piezoelectric coefficient d31 and the domain pattern observed with polarizing microscope is shown.

  • Calibration method of microwave measurement system for dielectric samples detection

    In this paper, calibration method of microwave measurement system for dielectric samples detection composed of two baluns and coupled-line sensor inserted in-between is presented. The presented sensor allows for detection of dielectric sample having size comparable to the distance between the sensor's coupled strips and therefore is dedicated for biomedical or industrial applications. To directly measure the coupled-line sensor and eliminate the influence of the baluns on the obtained measurement results, the recently published calibration method has been adopted and utilized. The obtained results prove the correctness of the presented approach.

  • Complex Permittivity Calculation of Tiny Biological Materials using Cavity Perturbation Method at Millimeter Wave Frequency

    In this paper, a revised calculation method based on resonant cavity perturbation technique is presented, which is suitable for performing the complex permittivity (CP) of tiny biological material at Ka Band. Through the improved perturbation method, more accurate simulation results can be obtained for high-loss biological materials.

  • Single and dual-polarized wideband simultaneous transmit and receive antenna system

    A shared antenna aperture for simultaneous transmit and receive (STAR) operating from 0.5 to 45GHz with isolation >50dB over the entire band is discussed. The proposed system utilizes four distinct band breaks: 0.5-2.5GHz, 2-7GHz, 619GHz, and 18-45GHz. The transmitting and receiving apertures of each band are designed, fabricated, and integrated on 46cm×46cm ground plane. A monostatic STAR system based on a lens-loaded cavity-backed four-arm spiral antenna is used to cover 0.5-2.5GHz band requirements. Other bands have dual- polarization capability and rely on physically displaced TX and RX antennas, engineered antenna patterns, and implementation of high impedance surfaces (i.e. bed of nails) to achieve desired isolation level. A dual-polarized Vivaldi array recessed in a cavity and quad-ridge horns are employed for the 2-7GHz and 6-45GHz bands; respectively.

  • Return-loss minimization of package interconnects through input space mapping using FEM-based models

    Highly efficient CAD methodologies based on full-wave EM analysis, for the design of package interconnects are necessary due to the increased frequencies of operation and a desire of faster time-to-market. In this work, we exploit a Broyden-based input space mapping (SM) algorithm with both fine and coarse models implemented with the finite-element method (FEM), to efficiently optimize design parameters of a modern package interconnect. This optimization algorithm has been applied to a single-ended package line resulting in a significant decrease of the return loss in the 5-10 GHz range, requiring just a few fine model evaluations.

  • Complex Permittivity Determination of Thin-Films Through RF-Measurements of a MIM Capacitor

    A method for determining the permittivity and loss tangent of thin-film layers is presented. The method relies on the measurement of the reflection coefficient to a single metal-insulator-metal (MIM) structure without requiring additional de-embedding dummy structures to account for the test- fixture parasitics. Results allow to obtain the frequency-dependent dielectric parameters, whereas the impact of the test-fixture parasitics is quantified by developing the corresponding equivalent circuit model. The accuracy of this model is verified by obtaining excellent simulation-experiment correlation of the MIM admittance at microwave frequencies.

  • A 410 GHz OOK Transmitter in 28 nm CMOS for Short Distance Chip-to-Chip Communications

    This paper presents a 410 GHz OOK transmitter in 28 nm bulk CMOS. The transmitter is packaged together with a metal coated 3D printed horn antenna and has a measured EIRP of -3.99dBm. Modulated measurements are demonstrated through a dielectric waveguide channel. 5 Gbps is demonstrated over a 13 cm channel and up to 1 Gbps over a 61 cm long channel. The transmitter provides a solution for high frequency short distance chip-to-chip or intra-board interconnects.



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