IEEE Organizations related to Environmentally Friendly Manufacturing Techniques

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Conferences related to Environmentally Friendly Manufacturing Techniques

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 18th International Conference on Industrial Informatics (INDIN)

INDIN focuses on recent developments, deployments, technology trends, and research results in Industrial Informatics-related fields from both industry and academia


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Frontiers in Education Conference (FIE)

The Frontiers in Education (FIE) Conference is a major international conference focusing on educational innovations and research in engineering and computing education. FIE 2019 continues a long tradition of disseminating results in engineering and computing education. It is an ideal forum for sharing ideas, learning about developments and interacting with colleagues inthese fields.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Environmentally Friendly Manufacturing Techniques

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Most published Xplore authors for Environmentally Friendly Manufacturing Techniques

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Xplore Articles related to Environmentally Friendly Manufacturing Techniques

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Marine Pollution Monitoring in China

OCEANS '86, 1986

Pollution monitoring in China in the last fifteen years are briefly reviewed. From 1972, three monitoring programs have been carried out so far. The first is so called pre-investigation; the second is baseline investigation; the third is regular monitoring. They play important roles in making progress in our understanding of pollution conditions in China Seas, designing national environment projects and ...


The Rhine: Its Geographical and Geopolitical Context

OCEANS '87, 1987

None


The Rhine and its Underground Water Table: Environmental Problems: Transport Mechanisms of Pollutants: Chlorides

OCEANS '87, 1987

The Rhine, after the Volga and the Danube, the third European river, is one of the world water courses of medium importance. The impact of industrial activity can be seen, among other things, by the presence of chlorides in its water. This type of pollution affects a potential aquifer widely developed for the needs of communities, agriculture and industry. Investigations ...


At the cutting edge of power engineering

IEEE Spectrum, 1989

The Southern California Edison Co., the product of some 200 mergers and now one merger away from becoming the largest electric utility in the US, is discussed. The benefits it will reap by its proposed acquisition of San Diego Gas & Electric are examined. The social and regulatory issues the company is facing are addressed. The company's management and R&D; ...


Technical progress on printed wired assembly using Nortel's no-lead solder assemble process

Proceedings of the 1998 IEEE International Symposium on Electronics and the Environment. ISEE - 1998 (Cat. No.98CH36145), 1998

In 1996, Nortel (Northern Telecom Ltd.) produced telephone set printed wired boards with no lead in the solder. Results from this experiment indicated performance that was equal to or better than that of the standard tin-lead solder process. Following this achievement, Nortel is currently evaluating the requirements necessary to apply this technology to low volume manufacturing yields of telephones. In ...


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Educational Resources on Environmentally Friendly Manufacturing Techniques

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IEEE-USA E-Books

  • Marine Pollution Monitoring in China

    Pollution monitoring in China in the last fifteen years are briefly reviewed. From 1972, three monitoring programs have been carried out so far. The first is so called pre-investigation; the second is baseline investigation; the third is regular monitoring. They play important roles in making progress in our understanding of pollution conditions in China Seas, designing national environment projects and making decisions for national contructions. Three gaps of knowledge seem especially striking. With the growth of population and the development of industry and agriculture, Environmental problem has prompted global concerns. Since 1970, our Government has shown great concern for environmental pollution. In early 1970s under pre-Premier Zhou's advocating, we took the first step on environmental protection. One of the basic works is environmental pollution monitoring.

  • The Rhine: Its Geographical and Geopolitical Context

    None

  • The Rhine and its Underground Water Table: Environmental Problems: Transport Mechanisms of Pollutants: Chlorides

    The Rhine, after the Volga and the Danube, the third European river, is one of the world water courses of medium importance. The impact of industrial activity can be seen, among other things, by the presence of chlorides in its water. This type of pollution affects a potential aquifer widely developed for the needs of communities, agriculture and industry. Investigations have been carried out in order to provide information on the phenomenon.

  • At the cutting edge of power engineering

    The Southern California Edison Co., the product of some 200 mergers and now one merger away from becoming the largest electric utility in the US, is discussed. The benefits it will reap by its proposed acquisition of San Diego Gas & Electric are examined. The social and regulatory issues the company is facing are addressed. The company's management and R&D; are described.<>

  • Technical progress on printed wired assembly using Nortel's no-lead solder assemble process

    In 1996, Nortel (Northern Telecom Ltd.) produced telephone set printed wired boards with no lead in the solder. Results from this experiment indicated performance that was equal to or better than that of the standard tin-lead solder process. Following this achievement, Nortel is currently evaluating the requirements necessary to apply this technology to low volume manufacturing yields of telephones. In 1997, Nortel expanded the lead free program into other fields of board assembly technology. Testing of the technology was expanded to include: halogen-free printed wired boards; lower cost Chopped Epoxy Material (CEM3) Printed Wired Boards (PWBs); higher density wireless circuit boards (which are free of gold); back panel assembly; and finally an electronic shelf (power board). Additionally, Nortel subjected these boards to thermal cycling tests then microscopic examination of the solder joints.

  • An evaluation of components offset and solder spreadability using factorial experiments

    This article presents a comparison of various modifications of surfaces of components and the methods of soldering and their influences on the lead-free solders [1]. The parameters studied were the spreadability of solder and offset components. These properties depend not only on the type of solder but also on the modifying of the surface of components. To evaluate a series of samples we used 3D microscope HAWK QC 5000 NIS Elements BR. The method for analyses of factor effects was chosen the statistical method of Developing of Experiments (DOE) [2]. This work would help to facilitate the selection of suitable material combinations for achieving the highest quality solder joint.

  • SAC Alloys Implementation in Electronic Products Manufacturing

    The paper intents to present the applied research performed by a few Romanian technological teams for an optimum implementation of SAC alloys in electronics industry, based on RoHS Directive, in order to investigate the behavior of SAC solder alloys in electronic products. Because manufacturers will need to ensure that their products comply with the requirements of European Regulations by July 2006 and designers are forced to change their strategy to accommodate lead-free soldering and not only, the paper shall emphasize the work on understanding and implementing SAC alloys, trying to underline advantages and disadvantages during the manufacturing flow. These new materials must be correctly modeled for their electrical characteristics when designers are involved in signal integrity analysis issues. Special component placement rules and new configurations of various structures/masks have to be designed for a good compliance between PCB layout design and manufacturing process. The main goal of the paper is to find and promote new methods for reducing to zero all unknown factors which can affect the assembling and manufacturing process of electronic products.

  • Social and Economic Aspects of Acceptable Risk of Ensuring Ecological Safety at Management of Municipal Waste

    This article analyzes social and economic aspects of acceptable risk in the field of ensuring ecological safety at management of municipal waste. The retrospective analysis of development of system of ensuring ecological safety at management of municipal waste is carried out. Key aspects of application of theories of absolute, allowable and acceptable risk concerning ecological safety at management of municipal waste are considered. The basic difference between concepts of admissible and acceptable risk in the field of management of municipal waste is defined.

  • Impact of Air Pollution on Daily Respiratory Hospitalization in Lanzhou, China

    The objective of the research was to explore the impact of air pollution on the health of human respiratory system. The method of the study was to collect data of Air Pollution Index (API), meteorology and the hospitalization of respiratory from 2004 to 2007 in urban of Lanzhou,China. The impact of the air pollution on the health of respiratory was investigated Generalized Additive Poisson models after controlling long-term time trend, week and meteorology, and stratified by gender, age and respiratory disease type. The result of the study is that every one of IQR (48 units) rising in daily API, there was a 5.50 (95%CI: 4.03%, 6.99%) increase in respiratory hospitalizations, and this influence was delayed effects.Males are more susceptible than females to air pollution and air pollution is more likely to affect under 15-years-old and over 65-years-old. As well as the delayed effects of API rising to pneumonia patients is higher than upper respiratory tract infection (URTI). The conclusion of the study is that air pollution considerably affects urban residents' respiratory morbidity, and gender, age and respiratory disease type had different effects.

  • Sn whisker concern in IC packaging for high reliability application

    In the study, the Ni underlayer plus matt Sn plated IC packaging of PLCC, PDIP and LQFP were subject to lead free (SAC) and SnPb surface mounting and wave soldering, respectively, then followed by TCT (-55degC to 85degC) 1000 cycle, THT (60degC /90%RH) 3000 hrs to investigate whisker growth propensity. The practical whisker performance confirmation on the PCB beyond reflow simulation and component level was concluded to understand the Sn whisker potential in term of Ni underlayer efficiency. Additionally, various Sn thickness over Ni layer in packaging level was also applied to explore the Sn thickness effect on the whisker growth over TCT. The Ni underlayer as Cu migration barrier to mitigate Sn whisker growth efficiency was concluded for high reliability application.



Standards related to Environmentally Friendly Manufacturing Techniques

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Jobs related to Environmentally Friendly Manufacturing Techniques

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