Conferences related to Lifetime Improvement

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 28th International Symposium on Industrial Electronics (ISIE)

The conference will provide a forum for discussions and presentations of advancements inknowledge, new methods and technologies relevant to industrial electronics, along with their applications and future developments.


2019 IEEE 28th Symposium on Fusion Engineering (SOFE)

fusion engineering, physics and materials, plasma heating, vacuum technology, tritium processing, fueling, first walls, blankets and divertors


2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


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Periodicals related to Lifetime Improvement

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Computers, IEEE Transactions on

Design and analysis of algorithms, computer systems, and digital networks; methods for specifying, measuring, and modeling the performance of computers and computer systems; design of computer components, such as arithmetic units, data storage devices, and interface devices; design of reliable and testable digital devices and systems; computer networks and distributed computer systems; new computer organizations and architectures; applications of VLSI ...


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Lifetime Improvement

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Xplore Articles related to Lifetime Improvement

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Lifetime Improvement Method using Threshold-based Partial Data Compression in NoC

2018 International SoC Design Conference (ISOCC), 2018

Network-on-chip (NoC) is widely used in the multiprocessor system-on-chip (MP- SoC) because it has advantages in parallel processing and scalability. However, as the transistor density and the volume of communication increase, maintaining the reliability is becoming a major challenge. Especially, heat generation due to heavy traffic is one of the main causes of reliability degradation, that accelerates aging of chips ...


Lifetime-Improvement Routing Protocol for Wireless Sensor Networks

2018 15th International Multi-Conference on Systems, Signals & Devices (SSD), 2018

In this paper, we proposed a lifetime improvement fixed clustering energy awareness routing protocol for WSNs; named Load Balancing Cluster Head (LBCH) protocol. The LBCH protocol mainly targets reducing energy consumption in the network and balancing the workload over all nodes within the network. In order to evaluate the performance of LBCH protocol, thorough simulations have been conducted and the ...


MV cable lifetime improvement analysis through transformer tap changes

2017 IEEE Conference on Electrical Insulation and Dielectric Phenomenon (CEIDP), 2017

Cable life depends mainly on the thermal stress, which relates to the current applied on the cable. Voltage changes in medium voltage (MV) cables due to transformer tap changes will also change the current flowing through the cable, which will change the cable temperature. In order to extend the cable life, this paper aims to simulate and analyse the potential ...


CMOS hot carrier lifetime improvement from deuterium anneal

56th Annual Device Research Conference Digest (Cat. No.98TH8373), 1998

It has been demonstrated that post-metallization anneal in a deuterium ambient increases the hot carrier lifetime of NMOS devices biased at the peak substrate current (Lyding et al, 1996; Kizilyalli et al., 1997). In this work, for the first time, we report on the lifetime improvement factor for both NMOS and PMOS devices stressed at a variety of DC and ...


Lifetime Improvement of Wireless Sensor Network using Residual Energy and Distance Parameters on LEACH Protocol

2018 18th International Symposium on Communications and Information Technologies (ISCIT), 2018

Wireless Sensor Networks (WSNs) contains small battery powered devices (sensors), and it is very difficult to replace them. Thus, designing and creation of energy efficient routing protocols becomes the active research field in WSNs. The famous protocol called LEACH (Low Energy Adaptive Clustering Hierarchy) proves energy efficiency by using clustering method. In clustering, there are two main phase: heads of ...


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Educational Resources on Lifetime Improvement

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IEEE.tv Videos

MicroApps: Recent Improvement on Y-Factor Noise Figure Measurement Uncertainty (Agilent Technologies)
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M. George Craford accepts the IEEE Edison Medal - Honors Ceremony 2017
Glenn Fink on Priorities for IoT Security and Privacy From Here to 2020: End to End Trust and Security Workshop for the Internet of Things 2016
A 40GHz PLL with -92.5dBc/Hz In-Band Phase Noise and 104fs-RMS-Jitter: RFIC Interactive Forum 2017
Design of Monolithic Silicon-Based Envelope-Tracking Power Amplifiers for Broadband Wireless Applications
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HKN Member Marcian E. "Ted" Hoff Receives Award at the 2012 EAB Award Ceremony
Next Generation Power Supplies - APEC 2016
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Critical Skills in the Engineering Workforce
IEEE Themes - Social Networks: Dynamic Social Interaction Data
26 Years of Risk Management Standardisation - Kevin Knight - Closing Ceremony: Sections Congress 2017
Neuromorphic computing with integrated photonics and superconductors - Jeffrey Shainline: 2016 International Conference on Rebooting Computing
ASC-2014 SQUIDs 50th Anniversary: 6 of 6 - Kent Irwin - SQUIDs as detectors for cosmology
Kurt Petersen: 2019 IEEE Medal of Honor Recipient
The Future of Innovation and the Creation of Knowledge in a Post-Internet World: Joi Ito, MIT Media Lab

IEEE-USA E-Books

  • Lifetime Improvement Method using Threshold-based Partial Data Compression in NoC

    Network-on-chip (NoC) is widely used in the multiprocessor system-on-chip (MP- SoC) because it has advantages in parallel processing and scalability. However, as the transistor density and the volume of communication increase, maintaining the reliability is becoming a major challenge. Especially, heat generation due to heavy traffic is one of the main causes of reliability degradation, that accelerates aging of chips and results in permanent faults. In previous studies, mapping and routing methods had been used to distribute unbalanced traffic for extending the lifetime. However, these methods have a limitation because the overall amount of traffic is not changed. In this paper, we propose a method to extend the lifetime by threshold-based partially applied Huffman coding in order to reduce the total amount of traffic considering implementation overhead. Experimental results show that the traffic volume is reduced by 17.24 % on average, mean time to failure (MTTF) is increased by 13.55 % compared to that of the aging aware fully adaptive routing without compression.

  • Lifetime-Improvement Routing Protocol for Wireless Sensor Networks

    In this paper, we proposed a lifetime improvement fixed clustering energy awareness routing protocol for WSNs; named Load Balancing Cluster Head (LBCH) protocol. The LBCH protocol mainly targets reducing energy consumption in the network and balancing the workload over all nodes within the network. In order to evaluate the performance of LBCH protocol, thorough simulations have been conducted and the results are compared with other related protocols. The simulations showed that LBCH protocol overcomes other related protocols for continuous-based data models.

  • MV cable lifetime improvement analysis through transformer tap changes

    Cable life depends mainly on the thermal stress, which relates to the current applied on the cable. Voltage changes in medium voltage (MV) cables due to transformer tap changes will also change the current flowing through the cable, which will change the cable temperature. In order to extend the cable life, this paper aims to simulate and analyse the potential thermal lifetime improvement of cables through long-term tap changes within the statutory levels. Firstly, the IEC standard (60287) method for rating and modelling cables is applied to evaluate the cable temperature under different voltages and relative currents. Different cable configurations will also be considered in simulations as temperature is dependent on the cable dimensions. Then, typical thermal lifetime analytical expressions will be used to evaluate the long-term influence of voltage changes. Lastly, the obtained thermal lifetime assessments under different transformer tap changes and different cable configurations will provide a potential understanding of cable lifetime changes through implementation of permitted regulatory voltage changes.

  • CMOS hot carrier lifetime improvement from deuterium anneal

    It has been demonstrated that post-metallization anneal in a deuterium ambient increases the hot carrier lifetime of NMOS devices biased at the peak substrate current (Lyding et al, 1996; Kizilyalli et al., 1997). In this work, for the first time, we report on the lifetime improvement factor for both NMOS and PMOS devices stressed at a variety of DC and AC bias conditions. The devices studied were fabricated using an advanced 0.25 μm dual-poly gate CMOS technology with 4 nm gate oxide thickness.

  • Lifetime Improvement of Wireless Sensor Network using Residual Energy and Distance Parameters on LEACH Protocol

    Wireless Sensor Networks (WSNs) contains small battery powered devices (sensors), and it is very difficult to replace them. Thus, designing and creation of energy efficient routing protocols becomes the active research field in WSNs. The famous protocol called LEACH (Low Energy Adaptive Clustering Hierarchy) proves energy efficiency by using clustering method. In clustering, there are two main phase: heads of clusters choosing phase and clusters making phase. Among them, cluster heads (CHs) selection is the most important. LEACH suffers from early dead nodes problem because it chooses cluster heads (CHs) without considering the remaining energy of each node and remoteness to base station (BS). Therefore, this paper proposes the lifetime improvement of wireless sensor network (WSN) using residual energy and distance to base station (BS) parameters on LEACH protocol and the proposed protocol is termed as RED\_LEACH. To prolong the network life in WSNs, RED\_LEACH uses two parameters: remaining energy in each node and remoteness to base station in heads of clusters selection and its results is compared with the results of original LEACH in terms of sum of energy of nodes against round and the number of dead nodes against round.

  • 1180nm DBR-ridge waveguide lasers with strain compensation layers in the active region for lifetime improvement

    DBR ridge waveguide lasers at 1180nm were developed based on strained InGaAs quantum wells. The lasers feature a lifetime of more than 1000h at 100mW and are believed to be a key component for miniaturized SHG laser modules emitting in the yellow spectral range.

  • A case study of NMOS AC hot carrier injection lifetime improvement

    The work presented here shows a series of engineering runs to improve the AC HCI lifetime for a 0.60 mum NMOS. The conventional method of increasing NLDD energy and reducing NLDD dose did not achieve significant improvement. The study concludes that tilting the NLDD implant, coupled with prolonging the NLDD anneal and increasing the Poly CD can improve the lifetime significantly. A short HCI test was performed to compare the response of different splits. Process simulation was also being performed to visualise variances in electrical field distribution associated with the differing splits.

  • Network lifetime improvement by relaying node re-selection in the IEEE 802.15.6 BAN

    In this paper, we study a relaying node re-selection problem in the IEEE 802.15.6 body area network (BAN) protocol, which requires to alleviate energy consumption burden of a relaying node and enhance the network life time. To this end, we develop a procedure for wake-up schedule control for a node that can be accommodated in the IEEE 802.15.6 standard. Numerical results show that by allowing a node to re-select its relaying node with our procedure, we can improve the network lifetime.

  • Cluster Based Energy Efficient Lifetime Improvement Mechanism for WSN with Multiple Mobile Sink and Single Static Sink

    In recent days Lifetime of Wireless Sensor Network (WSN) is an important consideration. The lifetime of a WSN depends on the power consumption of sensor nodes. To minimize the power consumption of WSN we propose "Bubbling Mechanism" in which the transmission ranges of nodes are altered temporarily, a concept "Border Cluster" in which we keep more number of active nodes in border clusters than in inner clusters when there is no target in the area of interest in WSN. We also use the concept of Dual Sink i.e. a static sink and multiple mobile sink to increase the efficiency of data collection. On an average approximately 10.62% energy of highly loaded cluster head (?CH?hl) is saved using Bubbling Mechanism in our new approach.

  • The enhancement net power control for lifetime improvement of AMOLED

    As one of the next generation display panel, active matrix organic light emitting diodes (AMOLED) had been widely employed for the multimedia platforms. However, AMOLED is rapidly increase power consumption when fullwhite color expression. Therefore, the lifetime of panel is decline. In this paper, we propose the enhancement net power control algorithm that makes use of the local power control and the global power control respectively based pixel by pixel and frame operation was presented. The proposed system that controlled overall and partial current takes advantage of the reduced power consumption under dynamic conditions of video sequences without offensive flicker and color distortion.



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