Field Device Operation
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AMC2020 is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.
IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.
Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies
Science, technology and applications spanning the millimeter-waves, terahertz and infrared spectral regions
EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.
The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.
2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual., 2003
We focus on 1/f noise appearing in MOSFETs. In wafer fabrication, plasma discharges are often used for processes such as etching, photoresist ashing and plasma enhanced CVD. After gate electrode formation, an electrical field higher than the device operation limit might be applied between the gate and substrate because of so-called plasma damage. Such high field stress can result in ...
2012 IEEE International Reliability Physics Symposium (IRPS), 2012
This paper investigates the validity of distributed-cycling schemes on scaled Flash memory technologies. These schemes rely on the possibility to emulate on-field device operation by increasing the cycling temperature according to an Arrhenius law, but the assessment of the activation energy that has to be used on scaled technologies requires a careful control of the experimental tests, preventing spurious second-order ...
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15
Recent Research Activities of Applied Superconductivity in China
Localization Services for Online Common Operational Picture and Situation Awareness
Accelerating Machine Learning with Non-Volatile Memory: Exploring device and circuit tradeoffs - Pritish Narayanan: 2016 International Conference on Rebooting Computing
Mobile Internet Devices at Intel
Micro-Apps 2013: Precision RF/MW Cable and Antenna Test in the Field
Q&A with Heather Benz: IEEE Brain Podcast, Episode 4
2015 IEEE Honors: IEEE Jun-ichi Nishizawa Medal - Dimitri A. Antoniadis
High Temperature Superconductors (HTS) as Enabling Technology for Sustainable Mobility and Energy Efficiency - Applied Superconductivity Conference 2018
Neural Processor Design Enabled by Memristor Technology - Hai Li: 2016 International Conference on Rebooting Computing
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 3 of 7 - MEG and ULF-MRI
IMS 2011 Microapps - Beyond the S-Parameter: The Benefits of Nonlinear Device Models
Wireless Power Charging of Plug-In Electric Vehicles
Towards Truly Adiabatic Operation: IEEE Rebooting Computing 2017
Nanoscale Magnetism with Picosecond Time Resolution and High Sensitivity - Hendrik Ohldag - IEEE Magnetics Distinguished Lecture
IMS 2011 Microapps - Advanced Terahertz Device Characterization
IMS 2011 Microapps - Improved Microwave Device Characterization and Qualification Using Affordable Microwave Microprobing Techniques for High-Yield Production of Microwave Components
Micro-Apps 2013: Creating and Analyzing Multi-Emitter Environment Test Signals with COTS Equipment
We focus on 1/f noise appearing in MOSFETs. In wafer fabrication, plasma discharges are often used for processes such as etching, photoresist ashing and plasma enhanced CVD. After gate electrode formation, an electrical field higher than the device operation limit might be applied between the gate and substrate because of so-called plasma damage. Such high field stress can result in a significant increase in low frequency noise in MOSFETs. The purpose of this work is to investigate in detail the degradation of 1/f noise levels caused by Fowler-Nordheim tunneling stress.
This paper investigates the validity of distributed-cycling schemes on scaled Flash memory technologies. These schemes rely on the possibility to emulate on-field device operation by increasing the cycling temperature according to an Arrhenius law, but the assessment of the activation energy that has to be used on scaled technologies requires a careful control of the experimental tests, preventing spurious second-order effects to emerge. In particular, long gate-stresses required to gather the array threshold voltage (V<sub>T</sub>) map are shown to give rise to parasitic V<sub>T</sub>-drifts, which add to the V<sub>T</sub>-loss coming from damage recovery during post-cycling bake. When the superposition of the two phenomena is taken into account, the effectiveness of the conventional qualification schemes relying on a 1.1 eV activation energy is fully confirmed at the 45 nm NOR node.
This project provides recommended practices for the prediction and practical determination of safe distances from radio and radar transmitting antennas when using electric initiators to remotely detonate an explosive charge. Specifically, this document includes mathematical formulas, tables, and charts that allow the user to determine safe distances from RF transmitters with spectrum bands from 0.5 MHz to 300 GHz, including ...
This document is part of the POSIX series of standards for applications and user interfaces to open systems. It defines the Ada language bindings as package specifications and accompanying textual descriptions of the applications program interface (API). This standard supports application portability at the source code level through the binding between ISO 8652:1995 (Ada) and ISO/IEC 9945-1:1990 (IEEE Std 1003.1-1990 ...
This standard, IEEE 1284.3, defines system extensions consistent with the implementation and functionality of IEEE Std 1284. These functions include: Multi-port expansion architectures Multiplexor Daisy Chain Application and Device Driver Programming Interface architecture that can be supported across various operating systems. Data link layer services for supporting IEEE Std 1284 parallel ports.
For the purpose of providing compatible authentication, authorization, and cryptographic key agreement mechanisms to support secure communication between devices connected by IEEE 802ﾮ Local Area Networks (LANs), this standard a) Specifies a general method for provision of port-based network access control. b) Specifies protocols that establish secure associations for IEEE Std 802.1AEﾙ MAC Security. c) Facilitates the use of industry ...
This standard covers drawout type, indoor, medium-voltage ground and test (G&T) devices for use in drawout metal-clad switchgear rated 4.76 kV through 38 kV as described in IEEE Std C37.20.2. Four G&T device types are generally supplied for temporary circuit maintenance procedures for insertion in place of the circuit breaker as follows: a) Simple manual devices b) Complex manual devices ...