Field Device Operation

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At the foundation of any process are the field devices that measure and control the flow of air, steam, water, gas or hundreds of other materials. Without proper basic setup, calibration and configuration of these devices, advanced control techniques cannot provide the levels of efficiency the technology is capable of. (Wikipedia.org)






Conferences related to Field Device Operation

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2020 IEEE 16th International Workshop on Advanced Motion Control (AMC)

AMC2020 is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)

Science, technology and applications spanning the millimeter-waves, terahertz and infrared spectral regions


2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


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Periodicals related to Field Device Operation

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Most published Xplore authors for Field Device Operation

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Xplore Articles related to Field Device Operation

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1/f noise degradation caused by Fowler-Nordheim tunneling stress in MOSFETs

2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual., 2003

We focus on 1/f noise appearing in MOSFETs. In wafer fabrication, plasma discharges are often used for processes such as etching, photoresist ashing and plasma enhanced CVD. After gate electrode formation, an electrical field higher than the device operation limit might be applied between the gate and substrate because of so-called plasma damage. Such high field stress can result in ...


Assessment of distributed-cycling schemes on 45nm NOR flash memory arrays

2012 IEEE International Reliability Physics Symposium (IRPS), 2012

This paper investigates the validity of distributed-cycling schemes on scaled Flash memory technologies. These schemes rely on the possibility to emulate on-field device operation by increasing the cycling temperature according to an Arrhenius law, but the assessment of the activation energy that has to be used on scaled technologies requires a careful control of the experimental tests, preventing spurious second-order ...



Educational Resources on Field Device Operation

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IEEE.tv Videos

ASC-2014 SQUIDs 50th Anniversary: 2 of 6 - John Clarke - The Ubiquitous SQUID
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15
Recent Research Activities of Applied Superconductivity in China
Localization Services for Online Common Operational Picture and Situation Awareness
Accelerating Machine Learning with Non-Volatile Memory: Exploring device and circuit tradeoffs - Pritish Narayanan: 2016 International Conference on Rebooting Computing
Mobile Internet Devices at Intel
Micro-Apps 2013: Precision RF/MW Cable and Antenna Test in the Field
Q&A with Heather Benz: IEEE Brain Podcast, Episode 4
2015 IEEE Honors: IEEE Jun-ichi Nishizawa Medal - Dimitri A. Antoniadis
High Temperature Superconductors (HTS) as Enabling Technology for Sustainable Mobility and Energy Efficiency - Applied Superconductivity Conference 2018
Neural Processor Design Enabled by Memristor Technology - Hai Li: 2016 International Conference on Rebooting Computing
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 3 of 7 - MEG and ULF-MRI
IMS 2011 Microapps - Beyond the S-Parameter: The Benefits of Nonlinear Device Models
Wireless Power Charging of Plug-In Electric Vehicles
Towards Truly Adiabatic Operation: IEEE Rebooting Computing 2017
Lantronix Premierwave
Nanoscale Magnetism with Picosecond Time Resolution and High Sensitivity - Hendrik Ohldag - IEEE Magnetics Distinguished Lecture
IMS 2011 Microapps - Advanced Terahertz Device Characterization
IMS 2011 Microapps - Improved Microwave Device Characterization and Qualification Using Affordable Microwave Microprobing Techniques for High-Yield Production of Microwave Components
Micro-Apps 2013: Creating and Analyzing Multi-Emitter Environment Test Signals with COTS Equipment

IEEE-USA E-Books

  • 1/f noise degradation caused by Fowler-Nordheim tunneling stress in MOSFETs

    We focus on 1/f noise appearing in MOSFETs. In wafer fabrication, plasma discharges are often used for processes such as etching, photoresist ashing and plasma enhanced CVD. After gate electrode formation, an electrical field higher than the device operation limit might be applied between the gate and substrate because of so-called plasma damage. Such high field stress can result in a significant increase in low frequency noise in MOSFETs. The purpose of this work is to investigate in detail the degradation of 1/f noise levels caused by Fowler-Nordheim tunneling stress.

  • Assessment of distributed-cycling schemes on 45nm NOR flash memory arrays

    This paper investigates the validity of distributed-cycling schemes on scaled Flash memory technologies. These schemes rely on the possibility to emulate on-field device operation by increasing the cycling temperature according to an Arrhenius law, but the assessment of the activation energy that has to be used on scaled technologies requires a careful control of the experimental tests, preventing spurious second-order effects to emerge. In particular, long gate-stresses required to gather the array threshold voltage (V<sub>T</sub>) map are shown to give rise to parasitic V<sub>T</sub>-drifts, which add to the V<sub>T</sub>-loss coming from damage recovery during post-cycling bake. When the superposition of the two phenomena is taken into account, the effectiveness of the conventional qualification schemes relying on a 1.1 eV activation energy is fully confirmed at the 45 nm NOR node.



Standards related to Field Device Operation

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IEEE Recommended Practice for Determining Safe Distances From Radio Frequency Transmitting Antennas When Using Electric Blasting Caps During Explosive Operations

This project provides recommended practices for the prediction and practical determination of safe distances from radio and radar transmitting antennas when using electric initiators to remotely detonate an explosive charge. Specifically, this document includes mathematical formulas, tables, and charts that allow the user to determine safe distances from RF transmitters with spectrum bands from 0.5 MHz to 300 GHz, including ...


IEEE Standard for Information Technology - POSIX Ada Language Interfaces - Part 1: Binding for System Application Program Interface (API)

This document is part of the POSIX series of standards for applications and user interfaces to open systems. It defines the Ada language bindings as package specifications and accompanying textual descriptions of the applications program interface (API). This standard supports application portability at the source code level through the binding between ISO 8652:1995 (Ada) and ISO/IEC 9945-1:1990 (IEEE Std 1003.1-1990 ...


IEEE Standard for Interface and Protocol Extensions to IEEE Std 1284 Compliant Peripherals and Host Adapters

This standard, IEEE 1284.3, defines system extensions consistent with the implementation and functionality of IEEE Std 1284. These functions include: Multi-port expansion architectures Multiplexor Daisy Chain Application and Device Driver Programming Interface architecture that can be supported across various operating systems. Data link layer services for supporting IEEE Std 1284 parallel ports.


IEEE Standard for Local and metropolitan area networks--Port-Based Network Access Control

For the purpose of providing compatible authentication, authorization, and cryptographic key agreement mechanisms to support secure communication between devices connected by IEEE 802ᆴ Local Area Networks (LANs), this standard a) Specifies a general method for provision of port-based network access control. b) Specifies protocols that establish secure associations for IEEE Std 802.1AEル MAC Security. c) Facilitates the use of industry ...


Standard for 4.76 kV to 38 kV Rated Ground and Test Devices Used in Enclosures

This standard covers drawout type, indoor, medium-voltage ground and test (G&T) devices for use in drawout metal-clad switchgear rated 4.76 kV through 38 kV as described in IEEE Std C37.20.2. Four G&T device types are generally supplied for temporary circuit maintenance procedures for insertion in place of the circuit breaker as follows: a) Simple manual devices b) Complex manual devices ...



Jobs related to Field Device Operation

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