Embedded Universal Integrated Circuit Card
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The ICIN conference, established in 1989 and praised for the richness of its social networking, is also recognized for its continuous adaptation to emerging technical trends.2019 will be the year of first large-scale 5G trials world-wide, targeting early network introduction, preliminary experimentation of network intelligence and orchestration solutions, and moving towards commercial large scale introduction in the 2020 horizon.At ICIN 2019, the driving theme is “Network AI and Zero-Touch Communication Systems”: we focus on the challenges related to the integration of analytics and orchestration solutions, enablers and methods, into automatic and autonomic service delivery and network management and operations. The conference will foster presentation of novel approaches and technical solutions, as well as experimental validation and proof of concepts.
Melecon 2018 is an IEEE Region 8 flagship conference with a long standing history of excellence both in electrotechnology and in recent years in information and communication technologies as well. Melecon 2018 covers complementary thematic areas that hold great promise for the advancement of research and technological development in the solution of complex engineering systems. In this context, Melecon 2018 foresees to attract high quality papers and provide a platform for the cross fertilization of new ideas.
NFC 2013 is the 5th International Research Workshop with focus on Near Field Communication (NFC). This workshop covers the entire technological area, beginning from RF and hardware, smartcards approach, security, applications and services, business processes, up to usability and user experience. NFC 2013 is ideal for addressing the challenges facing multidisciplinary research, development, design, and proof of concepts, pilot projects, deployment and fundamental limits of the NFC technology.
A forum dedicated to the recent advancements of the memory technology, covering topics such as memory device, circuit design, architecture, fabrication process, verification, yield analysis testing/diagnosis/repair for all kinds of memory.
No periodicals are currently tagged "Embedded Universal Integrated Circuit Card"
2012 16th IEEE Mediterranean Electrotechnical Conference, 2012
This paper presents an IC card interface using embedded technology with universal remote controller for living support system. There are many electronic and information devices in daily life. However handicapped and elderly people can find that it is very difficult to handle devices because there is many buttons and keys on interfaces of them. Although devices are needed to simple ...
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016
In this draft, our purpose is to construct a wearable multi-lead electrocardiogram (ECG) recorder with dry metal electrodes. In general, such as arrhythmia, myocardial ischemia or other heart-related symptoms, using one lead ECG measurements is difficult to accurately diagnose, three-lead ECG should be measured at least. In order to offer sufficient identification information, our scheme is a three-lead ECG solution ...
2007 IEEE International Workshop on Memory Technology, Design and Testing, 2007
The next generation memory, magnetic random access memory (MRAM), is a high- profile choice of embedded memory in modern applications. Features of the novel memory make it suitable for universal memory applications. Besides, as the evolution of information technology, embedded systems with media applications for portable devices are more important in modern life. In both of the perspectives mentioned above, ...
2013 International Conference on Availability, Reliability and Security, 2013
Embedded UICC (eUICC) is a new form of UICC, soldered into a device during manufacturing. On the contrary to the traditional UICC, the eUICC is not fully controlled by one specific MNO (Mobile Network Operator) since not removable physically from the device and not issued by the MNO. Thus, the profiles necessary for its operations should be provisioned remotely into ...
Proceedings of the IEEE 1992 National Aerospace and Electronics Conference@m_NAECON 1992, 1992
The use of design tools to create a 115,000-gate equivalent array within three generations is described. The first generation consisted of a 7800-gate equivalent array containing the glue logic for a dual redundant serial bus and was housed in a 120-pin ceramic pin grid array (PGA). CAE work stations are used for the creation of the design, and vendor-specific tools ...
Maker Faire 2008: Spectrum's Digital Clock Contest Winner
Sources of Innovation
IMS 2012 Microapps - Integrated Electrothermal Solution Delivers Thermally Aware Circuit Simulation Rick Poore, Agilent EEsof
Oral History: Jerry Minter
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
Infineon: Innovative Semiconductor Solutions
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
An Integrated Optical Parallel Multiplier Exploiting Approximate Binary Logarithms - Jun Shiomi - ICRC 2018
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
CES 2008: Eye-Fi Card for Wireless Photo Uploads
An IEEE IPC Special Session with Kasia Balakier of UCL
Advanced Capacitive Sensing for Consumer, Industrial, and Automotive Applications - Lecture by Dr. Hans Klein
BSIM Spice Model Enables FinFET and UTB IC Design
A Fully Integrated 75-83GHz FMCW Synthesizer for Automotive Radar Applications with -97dBc/Hz Phase Noise at 1MHz Offset and 100GHz/mSec Maximal Chirp Rate: RFIC Industry Showcase 2017
ISSCC 2012 - Eli Harari Plenary
From the Quantum Moore's Law toward Silicon Based Universal Quantum Computing - IEEE Rebooting Computing 2017
Education for Analog ICs
Micro-Apps 2013: Designing an ETSI E-Band Circuit for a MM Wave Wireless System
This paper presents an IC card interface using embedded technology with universal remote controller for living support system. There are many electronic and information devices in daily life. However handicapped and elderly people can find that it is very difficult to handle devices because there is many buttons and keys on interfaces of them. Although devices are needed to simple interfaces, researchers and engineers are investigating on the interfaces. With this background, the authors propose an interface which controls devices with only IC cards in daily life, and it expects to become an easy interface for controlling of them. Previous research discussed an outline and fundamental of the system, so this paper shows that development and effectiveness of the system with universal remote controller for practical use.
In this draft, our purpose is to construct a wearable multi-lead electrocardiogram (ECG) recorder with dry metal electrodes. In general, such as arrhythmia, myocardial ischemia or other heart-related symptoms, using one lead ECG measurements is difficult to accurately diagnose, three-lead ECG should be measured at least. In order to offer sufficient identification information, our scheme is a three-lead ECG solution with recording mode and real-time display mode. Besides, our proposition using dry metal electrodes provide a comfortable sensation, less skin-irritating, easy clean surfaces, reusable capability, and more durability. Due to these advantages, dry metal electrodes are suitable to integrate with underwear. The whole system includes an embedded microcontroller, a memory card interface, analog front-end circuits, user interface devices, power regulators, and so on. All elements integrate within a 5.8cm × 6.8cm four-layer printed circuit board (PCB) to meet the wearable request.
The next generation memory, magnetic random access memory (MRAM), is a high- profile choice of embedded memory in modern applications. Features of the novel memory make it suitable for universal memory applications. Besides, as the evolution of information technology, embedded systems with media applications for portable devices are more important in modern life. In both of the perspectives mentioned above, a processing element called arithmetic logic unit (ALU) cluster intellectual property (IP) is designed and implemented to be integrated with MRAM and the platform baseboard in this work. To stack these components such as an ALU cluster, MRAM and versatile baseboard provides a development, verification and demonstration platform for the highly-expected MRAM. The proposed ALU cluster IP with advanced microcontroller bus architecture (AMBA) interface is taped out using TSMC 0.15 um technology and operates at 100 MHz. The chip area is 3.9*3.9 mm<sup>2</sup> and gate count is 0.2 million. A 4-layer FRP printed circuit board (PCB) is designed and fabricated as the daughter card for system integration. The daughter card carries the designed chip is integrated to ARM versatile platform board and the PCB of MRAM as the system integration and application development environment.
Embedded UICC (eUICC) is a new form of UICC, soldered into a device during manufacturing. On the contrary to the traditional UICC, the eUICC is not fully controlled by one specific MNO (Mobile Network Operator) since not removable physically from the device and not issued by the MNO. Thus, the profiles necessary for its operations should be provisioned remotely into the eUICC by new entity. For this remote provisioning, SM (Subscription Manager) is newly introduced by the standardization organization. However, this new ecosystem around eUICCs can cause tremendous security issues unless thorough consideration of security is accompanied during the standardization because the profiles usually include the security-sensitive information. In this paper, a novel secure profile provisioning architecture for eUICCs is proposed. Our architecture mainly defines the overall architecture of the secure profile provisioning for eUICCs.
The use of design tools to create a 115,000-gate equivalent array within three generations is described. The first generation consisted of a 7800-gate equivalent array containing the glue logic for a dual redundant serial bus and was housed in a 120-pin ceramic pin grid array (PGA). CAE work stations are used for the creation of the design, and vendor-specific tools are used for final simulations. The second generation fully embedded the PGA into the array to support an Intel 80960 CPU. The second-generation ASIC was housed in a 256-pin quad flat pack (QFP) and was created on work stations utilizing vendor-specific tools. The third generation, a 115,000-gate equipment array, added a second PGA, three universal asynchronous receiver transmitters (UARTs), and two synchronous data-link control serial ports permitting the creation of a stand-alone computer I/O card in a single assembly.<<ETX>>
In 2004, the Near Field Communication (NFC) forum was formed to promote and supervise the use of the NFC technology. Nowadays, 150 members are taking part init and a growing number of stakeholders are fully involved in the development of this emerging technology. Consequently, many pilots have been launched worldwide in order to test and improve it. Issues related to the level of security that should be provided by the NFC handset to store personal data and application in a safe place have then arisen. Indeed, multiple secure element alternatives, depending on the position of secure element in the handset can be considered and NFC stakeholders encounter difficulties to define which of them should be favored. After giving a brief overview over the NFC technology, the role,as well as the possible position of the secure element in the NFC enabled handset will be highlighted. Then, a discussion will be engaged in order to define what could be the most promising secure element alternatives. Afterwards, by focusing on NFC pilots in which our laboratory is taking part into, this paper will describe technical architectures currently in use. Finally, a conclusion on the topic will be provided in the last section.
In power-management integrated circuits (PMIC) for smart phones, cascaded buck and low-dropout (LDO) regulators with N-type power MOSFETs are commonly utilized for high conversion efficiency, power quality and high-density integration as shown in Fig. 27.8.1 . Long paths on printed-circuit board (PCB) from the PMIC to the following applications result in obvious parasitic effects of large L<sub>PCB</sub> and R<sub>PCB</sub>, and multilayer ceramic capacitors (MLCC) placed near the application side are necessary. Complex and unpredictable PCB networks induce unexpected poles and zeros in the LDO loop so that an LDO with wide bandwidth (BW) and fast transient response is difficult to design. Furthermore, flash memory, such as universal flash storage (UFS) and embedded-multimedia cards (eMMC), has short-period heavy-to- light-to-heavy (H-L-H) load transients which makes LDO design more challenging. In the waveform shown in Fig. 27.8.1, the gate voltage of the power MOSFET (V<sub>GATE</sub>) is pulled toward 0V when overshoot of V<sub>OUT</sub> is caused by a heavy-to-light load transient. Once the light- to-heavy load transient occurs at moment t<sub>0</sub> with V<sub>OUT</sub> overshoot, V<sub>OUT</sub> then suffers from large undershoot because the N-type power MOSFET has a driving dead zone. The driving dead zone is defined as the region of gate voltage V<sub>GATE</sub> lower than the V<sub>OUT</sub> level and the power MOSFET delivers no current. The power MOSFET and compensation capacitance forms a heavy capacitance load so that transient performance is degraded. In prior art, the amplifier (amp) and buffer stage consume large quiescent current (I<sub>Q</sub>) for easier stability compensation and higher slew rate (SR). In addition, dummy load current (I<sub>dummyload</sub>) at V<sub>OUT</sub> or a complex clamping function at V<sub>GATE</sub> are utilized for the short-period H-L-H load transient of flash memory. However, the efficiency and circuit complexity are sacrificed as a result.
The fast growing market for wireless Machine-to-Machine (M2M) communication services is facing specific challenges which do not exist comparably in the traditional cellular subscriber market. The challenges are emerging around the changed ecosystem and value chain and dealing with different traffic and load profiles in the network. The significantly reduced ARPDs (average revenue per device) are calling for increased operational efficiency and flexibility and tangible cost reductions. With regard to the requirements arising in this context this paper focuses on new concepts for SIM management (SIM: Subscriber Identity Module) in the M2M domain from a subscription management perspective in order to develop an economic MCIM provisioning process (MCIM: M2M communication identity module). Three technical concepts were addressed and described with a look on the critical features. Essential items are the circle of trust, the grade of flexibility, the complexity of the solution and the impact on security. A further evolution of the Embedded UICC (Universal Integrated Circuit Card) proposal currently handled in standardization is presented and discussed, which gives the device owner and the M2M service provider a more active role and responsibility in the process. This approach enables full flexibility for change of operator and subscription and requires less administrative effort from MNOs (Mobile Network Operators), in particular for devices currently not requiring an active subscription. The respective business processes for MCIM management are presented as blueprints and discussed with regard to the lifecycle phases. There is a need for an increased grade of automation and integration of these workflows going beyond the boundaries of a particular stakeholder participating in the value net.
Design of Small Ultra-Wideband Antennas
This is a hot topic due to immediate demand from industry. However, the key design issues are often ignored, in particular by the students. In this course, these issues will be highlighted from an application point of view. The theoretical analysis is also given to help students understand the broadband radiation behavior well. The following is the abstract of the course. The research and development of ultra-wideband (UWB) technology has greatly spurred the design of small broadband antennas. The requirements for the UWB antennas include consistent impedance and radiation performance over an ultra-wide bandwidth of 3.1-4.8GHz/6-10.6GHz/3.1-10.6GHz. The miniaturization of the antennas becomes the most critical design challenges in commercial UWB systems such as high-speed wireless USB dongles. This course reviews the development of the small UWB antennas. The key design issues of the UWB antennas such as planar printed UWB antennas are highlighted. The new techniques to reduce the effect of ground plane on the antenna performance, to further miniaturize antenna, and to co-design antenna with RF filters are elaborated. The latest applications of small printed antennas in wireless UWB systems are described in brief.
This chapter presents key technologies related to smartcards and secure elements (SEs), especially as they relate to the wireless systems. It outlines the available and future alternatives for traditional and enhanced variants of smartcards. Smartcards represent a type of SE hardware. Examples of solutions for providing SEs are the Subscriber Identity Module (SIM), Universal Integrated Circuit Card (UICC), eSE, and external micro Secure Digital (SD) cards. Smartcards can be categorized by their physical characteristics such as contact and contactless variants, and by their functionality such as memory cards, Central Processing Unit (CPU) or Multi Processing Unit (MPU) cards with embedded OS, multi‐mode communications cards and hybrid cards. Smartcards can be divided into sub‐categories to distinguish between contact cards, contactless cards and multi‐component cards. The UICC communications are based on secure channels which ensure the secure communication between the smartcard and external world.
No standards are currently tagged "Embedded Universal Integrated Circuit Card"