Embedded Universal Integrated Circuit Card

View this topic in
The Universal Integrated Circuit Card (UICC) is the smart card used in mobile terminals in GSM and UMTS networks. The UICC ensures the integrity and security of all kinds of personal data, and it typically holds a few hundred kilobytes. With the advent of more services, the storage space will need to be larger. (Wikipedia.org)




IEEE Organizations related to Embedded Universal Integrated Circuit Card

Back to Top


Conferences related to Embedded Universal Integrated Circuit Card

Back to Top

2019 22nd Conference on Innovation in Clouds, Internet and Networks and Workshops (ICIN)

The ICIN conference, established in 1989 and praised for the richness of its social networking, is also recognized for its continuous adaptation to emerging technical trends.2019 will be the year of first large-scale 5G trials world-wide, targeting early network introduction, preliminary experimentation of network intelligence and orchestration solutions, and moving towards commercial large scale introduction in the 2020 horizon.At ICIN 2019, the driving theme is “Network AI and Zero-Touch Communication Systems”: we focus on the challenges related to the integration of analytics and orchestration solutions, enablers and methods, into automatic and autonomic service delivery and network management and operations. The conference will foster presentation of novel approaches and technical solutions, as well as experimental validation and proof of concepts.

  • 2018 21st Conference on Innovation in Clouds, Internet and Networks and Workshops (ICIN)

    ICIN 2018 will be held 20-22 February 2018 at Orange Gardens premises near Paris, France. The ICIN conference, established in 1989 and praised for the richness of its social networking, is also recognized for its continuous adaptation to emerging technical trends.2018 will be the year of coordinated 5G deployment across all EU Member states, targeting early network introduction, and moving towards commercial large scale introduction by the end of 2020 at the latest.As the main theme for ICIN 2018, “5G Network Architecture and Solutions: are we ready?” will explore the maturity and gaps remaining for end-to-end and large scale 5G technologies deployment. The conference will foster presentation of novel approaches and technical solutions, as well as experimental validation and proof of concepts. In addition to this edition theme, ICIN 2018 will keep a wide range of topics of interest within the fields of Cloud, Internet, and Networks.

  • 2017 20th Conference on Innovations in Clouds, Internet and Networks (ICIN)

    Since 1989 the ICIN series of conferences has been bringing together leading telecom and internet experts from industry, universities and government worldwide. ICIN operates on a rigorous peer review process and has become the established industry forum for addressing intelligence in Information and Communications Technology (ICT). ICIN conferences are renowned for their debates on the impact of emerging technology, architecture and industry trends on intelligent communications services. ICIN has an enviable track record of identifying key technology and service trends – and analysing their impact on business models – before they become widely recognized.

  • 2015 18th International Conference on Intelligence in Next Generation Networks (ICIN)

    Since 1989 the ICIN conferences have been bringing together leading internet and telecom experts from industry, universities and government worldwide. Major service providers and manufacturers from the most active markets worldwide have consistently contributed and provided insight on the technical and strategic directions that the industry is taking. ICIN operates on a rigorous peer review process and has an enviable track record of identifying key technology and service trends

  • 2013 17th International Conference on Intelligence in Next Generation Networks (ICIN): Unlocking Value from the Networks

    The primary focus of ICIN 2013 is twofold, addressing both how to make networks smarter with a stream on the transformation of Telcos

  • 2012 16th International Conference on Intelligence in Next Generation Networks (ICIN): Realising the Power of the Network

    ICIN addresses challenges of design, deployment, delivery, and management of services and applications over different platforms and diverse networks from both technical and business perspectives. The primary focus of ICIN 2012 is voice, data or multimedia services for enterprises or consumers that make use of capabilities in the operator network.

  • 2011 15th International Conference on Intelligence in Next Generation Networks (ICIN): "From Bits to Data, from Pipes to Clouds"

    Software-driven, context-aware services delivered and composed in the cloud and on smart devices will continue to transform the user experience and the ICT industry landscape. ICIN 2011 will bring together technical and business innovators to share their insight and experience of the technology, service and business transformation ahead.

  • 2010 14th International Conference on Intelligence in Next Generation Networks (ICIN): "Weaving Applications Into the Network Fabric"

    ICIN is a forum covering telecoms and web services and service architectures from both technical and business perspectives. ICIN 2010 will focus on new applications formed by weaving together emerging network capabilities, computational power, network and customer data, and content in valuable new and different patterns.

  • 2009 13th International Conference on Intelligence in Next Generation Networks (ICIN): "Beyond the Bit Pipes"

    ICIN 2009 will highlight the future services, enablers and architectures that will drive the market for communications products and services in the emerging high speed IP environment. The focus of ICIN 2009 will be on new and emerging business models, technology and value chains based on communications networks and devices.


2018 19th IEEE Mediterranean Electrotechnical Conference (MELECON)

Melecon 2018 is an IEEE Region 8 flagship conference with a long standing history of excellence both in electrotechnology and in recent years in information and communication technologies as well. Melecon 2018 covers complementary thematic areas that hold great promise for the advancement of research and technological development in the solution of complex engineering systems. In this context, Melecon 2018 foresees to attract high quality papers and provide a platform for the cross fertilization of new ideas.


2013 5th International Workshop on Near Field Communication (NFC)

NFC 2013 is the 5th International Research Workshop with focus on Near Field Communication (NFC). This workshop covers the entire technological area, beginning from RF and hardware, smartcards approach, security, applications and services, business processes, up to usability and user experience. NFC 2013 is ideal for addressing the challenges facing multidisciplinary research, development, design, and proof of concepts, pilot projects, deployment and fundamental limits of the NFC technology.

  • 2012 4th International Workshop on Near Field Communication (NFC)

    NFC2012 is 4th International Research Workshop with focus on Near Field Communication (NFC). This conference covers the entire technological area, beginning from RF and hardware, smartcards approach, security, applications and services, business processes, up to usability and user experience. NFC2012 is ideal for addressing the challenges facing multidisciplinary research, development, design, and proof of concepts, pilot projects, deployment and fundamental limits of the NFC technology.

  • 2011 3rd International Workshop on Near Field Communication - NFC'11

    This workshop covers the entire technological area, beginning from RF & hardware related topics, smartcards approaches, security, applications and services, business processes, up to usability and user experience. It aims to provide a forum for a full and detailed discussion of the research issues of NFC as an integrative concept that covers hardware, software, security, usability and different fields of applications.

  • 2010 2nd International Workshop on Near Field Communication - NFC'10

    The international workshop on Near Field Communication (NFC) will bring together researchers and practitioners in the area of RF & hardware related topics, smartcards & security, applications & services and usability & user experience. The workshop is ideal for addressing the challenges facing the research, development, design, manufacture, deployment and fundamental limits.

  • 2009 1st International Workshop on Near Field Communication - NFC'09

    Near Field Communication


2009 IEEE International Workshop on Memory Technology, Design and Testing (MTDT)

A forum dedicated to the recent advancements of the memory technology, covering topics such as memory device, circuit design, architecture, fabrication process, verification, yield analysis testing/diagnosis/repair for all kinds of memory.



Periodicals related to Embedded Universal Integrated Circuit Card

Back to Top

No periodicals are currently tagged "Embedded Universal Integrated Circuit Card"


Most published Xplore authors for Embedded Universal Integrated Circuit Card

Back to Top

Xplore Articles related to Embedded Universal Integrated Circuit Card

Back to Top

An IC card interface using embedded technology with universal remote controller for living support system

2012 16th IEEE Mediterranean Electrotechnical Conference, 2012

This paper presents an IC card interface using embedded technology with universal remote controller for living support system. There are many electronic and information devices in daily life. However handicapped and elderly people can find that it is very difficult to handle devices because there is many buttons and keys on interfaces of them. Although devices are needed to simple ...


Wearable multi-lead ECG recorder with dry metal electrodes

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016

In this draft, our purpose is to construct a wearable multi-lead electrocardiogram (ECG) recorder with dry metal electrodes. In general, such as arrhythmia, myocardial ischemia or other heart-related symptoms, using one lead ECG measurements is difficult to accurately diagnose, three-lead ECG should be measured at least. In order to offer sufficient identification information, our scheme is a three-lead ECG solution ...


An ALU cluster intellectual property for magnetic RAM media applications platform

2007 IEEE International Workshop on Memory Technology, Design and Testing, 2007

The next generation memory, magnetic random access memory (MRAM), is a high- profile choice of embedded memory in modern applications. Features of the novel memory make it suitable for universal memory applications. Besides, as the evolution of information technology, embedded systems with media applications for portable devices are more important in modern life. In both of the perspectives mentioned above, ...


Secure Profile Provisioning Architecture for Embedded UICC

2013 International Conference on Availability, Reliability and Security, 2013

Embedded UICC (eUICC) is a new form of UICC, soldered into a device during manufacturing. On the contrary to the traditional UICC, the eUICC is not fully controlled by one specific MNO (Mobile Network Operator) since not removable physically from the device and not issued by the MNO. Thus, the profiles necessary for its operations should be provisioned remotely into ...


Rapid migration to VLSI

Proceedings of the IEEE 1992 National Aerospace and Electronics Conference@m_NAECON 1992, 1992

The use of design tools to create a 115,000-gate equivalent array within three generations is described. The first generation consisted of a 7800-gate equivalent array containing the glue logic for a dual redundant serial bus and was housed in a 120-pin ceramic pin grid array (PGA). CAE work stations are used for the creation of the design, and vendor-specific tools ...


More Xplore Articles

Educational Resources on Embedded Universal Integrated Circuit Card

Back to Top

IEEE-USA E-Books

  • An IC card interface using embedded technology with universal remote controller for living support system

    This paper presents an IC card interface using embedded technology with universal remote controller for living support system. There are many electronic and information devices in daily life. However handicapped and elderly people can find that it is very difficult to handle devices because there is many buttons and keys on interfaces of them. Although devices are needed to simple interfaces, researchers and engineers are investigating on the interfaces. With this background, the authors propose an interface which controls devices with only IC cards in daily life, and it expects to become an easy interface for controlling of them. Previous research discussed an outline and fundamental of the system, so this paper shows that development and effectiveness of the system with universal remote controller for practical use.

  • Wearable multi-lead ECG recorder with dry metal electrodes

    In this draft, our purpose is to construct a wearable multi-lead electrocardiogram (ECG) recorder with dry metal electrodes. In general, such as arrhythmia, myocardial ischemia or other heart-related symptoms, using one lead ECG measurements is difficult to accurately diagnose, three-lead ECG should be measured at least. In order to offer sufficient identification information, our scheme is a three-lead ECG solution with recording mode and real-time display mode. Besides, our proposition using dry metal electrodes provide a comfortable sensation, less skin-irritating, easy clean surfaces, reusable capability, and more durability. Due to these advantages, dry metal electrodes are suitable to integrate with underwear. The whole system includes an embedded microcontroller, a memory card interface, analog front-end circuits, user interface devices, power regulators, and so on. All elements integrate within a 5.8cm × 6.8cm four-layer printed circuit board (PCB) to meet the wearable request.

  • An ALU cluster intellectual property for magnetic RAM media applications platform

    The next generation memory, magnetic random access memory (MRAM), is a high- profile choice of embedded memory in modern applications. Features of the novel memory make it suitable for universal memory applications. Besides, as the evolution of information technology, embedded systems with media applications for portable devices are more important in modern life. In both of the perspectives mentioned above, a processing element called arithmetic logic unit (ALU) cluster intellectual property (IP) is designed and implemented to be integrated with MRAM and the platform baseboard in this work. To stack these components such as an ALU cluster, MRAM and versatile baseboard provides a development, verification and demonstration platform for the highly-expected MRAM. The proposed ALU cluster IP with advanced microcontroller bus architecture (AMBA) interface is taped out using TSMC 0.15 um technology and operates at 100 MHz. The chip area is 3.9*3.9 mm<sup>2</sup> and gate count is 0.2 million. A 4-layer FRP printed circuit board (PCB) is designed and fabricated as the daughter card for system integration. The daughter card carries the designed chip is integrated to ARM versatile platform board and the PCB of MRAM as the system integration and application development environment.

  • Secure Profile Provisioning Architecture for Embedded UICC

    Embedded UICC (eUICC) is a new form of UICC, soldered into a device during manufacturing. On the contrary to the traditional UICC, the eUICC is not fully controlled by one specific MNO (Mobile Network Operator) since not removable physically from the device and not issued by the MNO. Thus, the profiles necessary for its operations should be provisioned remotely into the eUICC by new entity. For this remote provisioning, SM (Subscription Manager) is newly introduced by the standardization organization. However, this new ecosystem around eUICCs can cause tremendous security issues unless thorough consideration of security is accompanied during the standardization because the profiles usually include the security-sensitive information. In this paper, a novel secure profile provisioning architecture for eUICCs is proposed. Our architecture mainly defines the overall architecture of the secure profile provisioning for eUICCs.

  • Rapid migration to VLSI

    The use of design tools to create a 115,000-gate equivalent array within three generations is described. The first generation consisted of a 7800-gate equivalent array containing the glue logic for a dual redundant serial bus and was housed in a 120-pin ceramic pin grid array (PGA). CAE work stations are used for the creation of the design, and vendor-specific tools are used for final simulations. The second generation fully embedded the PGA into the array to support an Intel 80960 CPU. The second-generation ASIC was housed in a 256-pin quad flat pack (QFP) and was created on work stations utilizing vendor-specific tools. The third generation, a 115,000-gate equipment array, added a second PGA, three universal asynchronous receiver transmitters (UARTs), and two synchronous data-link control serial ports permitting the creation of a stand-alone computer I/O card in a single assembly.<<ETX>>

  • Promising Secure Element Alternatives for NFC Technology

    In 2004, the Near Field Communication (NFC) forum was formed to promote and supervise the use of the NFC technology. Nowadays, 150 members are taking part init and a growing number of stakeholders are fully involved in the development of this emerging technology. Consequently, many pilots have been launched worldwide in order to test and improve it. Issues related to the level of security that should be provided by the NFC handset to store personal data and application in a safe place have then arisen. Indeed, multiple secure element alternatives, depending on the position of secure element in the handset can be considered and NFC stakeholders encounter difficulties to define which of them should be favored. After giving a brief overview over the NFC technology, the role,as well as the possible position of the secure element in the NFC enabled handset will be highlighted. Then, a discussion will be engaged in order to define what could be the most promising secure element alternatives. Afterwards, by focusing on NFC pilots in which our laboratory is taking part into, this paper will describe technical architectures currently in use. Finally, a conclusion on the topic will be provided in the last section.

  • 94% power-recycle and near-zero driving-dead-zone N-type low-dropout regulator with 20mV undershoot at short-period load transient of flash memory in smart phone

    In power-management integrated circuits (PMIC) for smart phones, cascaded buck and low-dropout (LDO) regulators with N-type power MOSFETs are commonly utilized for high conversion efficiency, power quality and high-density integration as shown in Fig. 27.8.1 [1]. Long paths on printed-circuit board (PCB) from the PMIC to the following applications result in obvious parasitic effects of large L<sub>PCB</sub> and R<sub>PCB</sub>, and multilayer ceramic capacitors (MLCC) placed near the application side are necessary. Complex and unpredictable PCB networks induce unexpected poles and zeros in the LDO loop so that an LDO with wide bandwidth (BW) and fast transient response is difficult to design. Furthermore, flash memory, such as universal flash storage (UFS) and embedded-multimedia cards (eMMC), has short-period heavy-to- light-to-heavy (H-L-H) load transients which makes LDO design more challenging. In the waveform shown in Fig. 27.8.1, the gate voltage of the power MOSFET (V<sub>GATE</sub>) is pulled toward 0V when overshoot of V<sub>OUT</sub> is caused by a heavy-to-light load transient. Once the light- to-heavy load transient occurs at moment t<sub>0</sub> with V<sub>OUT</sub> overshoot, V<sub>OUT</sub> then suffers from large undershoot because the N-type power MOSFET has a driving dead zone. The driving dead zone is defined as the region of gate voltage V<sub>GATE</sub> lower than the V<sub>OUT</sub> level and the power MOSFET delivers no current. The power MOSFET and compensation capacitance forms a heavy capacitance load so that transient performance is degraded. In prior art, the amplifier (amp) and buffer stage consume large quiescent current (I<sub>Q</sub>) for easier stability compensation and higher slew rate (SR). In addition, dummy load current (I<sub>dummyload</sub>) at V<sub>OUT</sub> or a complex clamping function at V<sub>GATE</sub> are utilized for the short-period H-L-H load transient of flash memory. However, the efficiency and circuit complexity are sacrificed as a result.

  • Evolution of SIM provisioning towards a flexible MCIM provisioning in M2M vertical industries

    The fast growing market for wireless Machine-to-Machine (M2M) communication services is facing specific challenges which do not exist comparably in the traditional cellular subscriber market. The challenges are emerging around the changed ecosystem and value chain and dealing with different traffic and load profiles in the network. The significantly reduced ARPDs (average revenue per device) are calling for increased operational efficiency and flexibility and tangible cost reductions. With regard to the requirements arising in this context this paper focuses on new concepts for SIM management (SIM: Subscriber Identity Module) in the M2M domain from a subscription management perspective in order to develop an economic MCIM provisioning process (MCIM: M2M communication identity module). Three technical concepts were addressed and described with a look on the critical features. Essential items are the circle of trust, the grade of flexibility, the complexity of the solution and the impact on security. A further evolution of the Embedded UICC (Universal Integrated Circuit Card) proposal currently handled in standardization is presented and discussed, which gives the device owner and the M2M service provider a more active role and responsibility in the process. This approach enables full flexibility for change of operator and subscription and requires less administrative effort from MNOs (Mobile Network Operators), in particular for devices currently not requiring an active subscription. The respective business processes for MCIM management are presented as blueprints and discussed with regard to the lifecycle phases. There is a need for an increased grade of automation and integration of these workflows going beyond the boundaries of a particular stakeholder participating in the value net.

  • Design of Small Ultra-Wideband Antennas

    This is a hot topic due to immediate demand from industry. However, the key design issues are often ignored, in particular by the students. In this course, these issues will be highlighted from an application point of view. The theoretical analysis is also given to help students understand the broadband radiation behavior well. The following is the abstract of the course. The research and development of ultra-wideband (UWB) technology has greatly spurred the design of small broadband antennas. The requirements for the UWB antennas include consistent impedance and radiation performance over an ultra-wide bandwidth of 3.1-4.8GHz/6-10.6GHz/3.1-10.6GHz. The miniaturization of the antennas becomes the most critical design challenges in commercial UWB systems such as high-speed wireless USB dongles. This course reviews the development of the small UWB antennas. The key design issues of the UWB antennas such as planar printed UWB antennas are highlighted. The new techniques to reduce the effect of ground plane on the antenna performance, to further miniaturize antenna, and to co-design antenna with RF filters are elaborated. The latest applications of small printed antennas in wireless UWB systems are described in brief.

  • Smartcards and Secure Elements

    This chapter presents key technologies related to smartcards and secure elements (SEs), especially as they relate to the wireless systems. It outlines the available and future alternatives for traditional and enhanced variants of smartcards. Smartcards represent a type of SE hardware. Examples of solutions for providing SEs are the Subscriber Identity Module (SIM), Universal Integrated Circuit Card (UICC), eSE, and external micro Secure Digital (SD) cards. Smartcards can be categorized by their physical characteristics such as contact and contactless variants, and by their functionality such as memory cards, Central Processing Unit (CPU) or Multi Processing Unit (MPU) cards with embedded OS, multi‐mode communications cards and hybrid cards. Smartcards can be divided into sub‐categories to distinguish between contact cards, contactless cards and multi‐component cards. The UICC communications are based on secure channels which ensure the secure communication between the smartcard and external world.



Standards related to Embedded Universal Integrated Circuit Card

Back to Top

No standards are currently tagged "Embedded Universal Integrated Circuit Card"


Jobs related to Embedded Universal Integrated Circuit Card

Back to Top