Tsunami

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A tsunami, also called a tsunami wave train, and at one time referred to as a tidal wave, is a series of water waves caused by the displacement of a large volume of a body of water, usually an ocean, though it can occur in large lakes. (Wikipedia.org)






Conferences related to Tsunami

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2019 49th Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN)

Promote the exchange of ideas between academia and industry in the field of computer and networks dependability


2019 IEEE Underwater Technology (UT)

The symposium scope is to provide a thematic umbrella for researchers working in underwater systems across the world to discuss the problems and potential long-term solutions that concern not only the Asian countries, but the world ocean in general.


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)

Circuits and Systems, Computers, Information Technology, Communication Systems, Control and Instrumentation, Electrical Power Systems, Power Electronics, Signal Processing


2018 18th IEEE/ACM International Symposium on Cluster, Cloud and Grid Computing (CCGRID)

Cluster Computing, Grid Computing, Edge Computing, Cloud Computing, Parallel Computing, Distributed Computing


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Periodicals related to Tsunami

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


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Most published Xplore authors for Tsunami

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Xplore Articles related to Tsunami

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Object-based image analysis of post-tsunami high-resolution satellite images for mapping the impact of tsunami disaster

[{u'author_order': 1, u'affiliation': u'Graduate School of Engineering, Tohoku University, Japan', u'full_name': u'Shunichi Koshimura'}, {u'author_order': 2, u'affiliation': u'Miyagi TV Broadcast Corporation, Japan', u'full_name': u'Shintaro Kayaba'}, {u'author_order': 3, u'affiliation': u'Graduate School of Engineering, Tohoku University, Japan', u'full_name': u'Hideomi Gokon'}] 2011 IEEE International Geoscience and Remote Sensing Symposium, None

The authors developed a method of object-based satellite image analysis using high-resolution post-tsunami satellite image to detect and map tsunami impact. The method is applied to QuickBird 4 band pan-sharpened composite image acquired in Banda Aceh, Indonesia, and the ground objects are classified into six ; vegetation, water, soil, building, road and debris, for mapping the impact of the 2004 ...


Evacuation and Emergency Management Using a Federated Cloud

[{u'author_order': 1, u'affiliation': u'Indian Institute of Technology, Kharagpur', u'full_name': u'Subhadeep Sarkar'}, {u'author_order': 2, u'affiliation': u'Indian Institute of Technology, Kharagpur', u'full_name': u'Subarna Chatterjee'}, {u'author_order': 3, u'affiliation': u'Indian Institute of Technology, Kharagpur', u'full_name': u'Sudip Misra'}] IEEE Cloud Computing, 2014

Contemporary disaster relief techniques fall significantly short in terms of efficiency and timeliness. In a postdisaster scenario, the generation and transmission of voluminous data at a high velocity impacts the communication framework. This work exploits the benefits of opportunistic communication and efficient big data management policies, focusing on the collaboration of multiple private and/or public clouds of diverse nature to ...


Sensor Subsystem for the Next Generation Tide and Water Level Measurement System

[{u'author_order': 1, u'affiliation': u'Raytheon Ocean Syst. Co., East Providence, RI, USA', u'full_name': u'C. Beckers'}, {u'author_order': 2, u'full_name': u'R. Franklin'}, {u'author_order': 3, u'full_name': u'T. Smith'}] OCEANS 81, None

The paper summarizes results of a study to recommend a new tide and water level measuring system to replace the existing equipment used by the National Ocean Survey. It focuses on the sensor subsystem, while companion papers address the recording subsystem and other aspects of the problem.


Cable laying ROV for Real-time seafloor observatory network construction

[{u'author_order': 1, u'affiliation': u'Japan Agency for Marine-Earth Science and Technology, Department of Oceanfloor Network System Development of Earthquakes and Tsunamis, 2-15 Natsushima-cho, Yokosuka, Kanagawa 237-0061 Japan', u'full_name': u'Katsuyoshi Kawaguchi'}, {u'author_order': 2, u'affiliation': u'Japan Agency for Marine-Earth Science and Technology, Department of Oceanfloor Network System Development of Earthquakes and Tsunamis, 2-15 Natsushima-cho, Yokosuka, Kanagawa 237-0061 Japan', u'full_name': u'Sho Kaneko'}, {u'author_order': 3, u'affiliation': u'Ocean Cable & Communications, 1-105-2 Hibiki-machi, Wakamatuku, kitakyushu 808-0021 Japan', u'full_name': u'Takato Nishida'}, {u'author_order': 4, u'affiliation': u'Nichiyu Giken Kogyo Co., Ltd., 21-2 Matoba-shinmachi, Kawagoe, Saitama 350-1107 Japan', u'full_name': u'Tetsuya Komine'}] OCEANS 2009-EUROPE, None

The Real-time seafloor observation is one of an anticipating approach for ocean research and development. Several research and development program was discussed at a lot of research communities and countries in the first decade of the twenty-first century. The submarine cabled seafloor architecture and subsea engineering capabilities are key technologies to put this novel research infrastructure into practice. For the ...


The ε-ARK Device Family for the Emergency Situations

[{u'author_order': 1, u'affiliation': u'Nara Inst. of Sci. & Technol., Ikoma, Japan', u'full_name': u'Atsuo Inomata'}, {u'author_order': 2, u'affiliation': u'Waseda Univ., Tokyo, Japan', u'full_name': u'Hironobu Suzuki'}, {u'author_order': 3, u'affiliation': u'Kanazawa Univ., Kanazawa, Japan', u'full_name': u'Hiroyuki Ohno'}] 2010 7th IEEE Consumer Communications and Networking Conference, None

Recently there are many huge earthquakes, Tsunami, pandemic of new type flu and so on. For example, Japan is one of the most earthquake-prone countries in the world. People often fall in various unexpected troubles. In this demonstration we introduce two prototypes of small information and communication devices which are called Zark and iARK of our " ε-ARK" family. We ...


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