Titanium

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Titanium is a chemical element with the symbol Ti and atomic number 22. (Wikipedia.org)






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2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 IEEE 28th Symposium on Fusion Engineering (SOFE)

fusion engineering, physics and materials, plasma heating, vacuum technology, tritium processing, fueling, first walls, blankets and divertors


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 19th International Symposium on Quality Electronic Design (ISQED)

19th International Symposium on Quality Electronic Design (ISQED 2018) is the premier interdisciplinary and multidisciplinary Electronic Design conference?bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integratedcircuit technologies, semiconductor technology,packaging, assembly & test to achieve design quality.


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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


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Xplore Articles related to Titanium

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The use of NbTiTa as a high field superconducting alloy

[{u'author_order': 1, u'affiliation': u'Magnetic Corporation of America, Waltham, Massachusetts', u'full_name': u'H. Segal'}, {u'author_order': 2, u'full_name': u'T. de Winter'}, {u'author_order': 3, u'full_name': u'Z. Stekly'}, {u'author_order': 4, u'full_name': u'K. Hemachalam'}] IEEE Transactions on Magnetics, 1981

NbTi-based alloys containing 8% and 25% tantalum have been studied for use at fields around 12 tesla and at temperatures between 2 K and 3 K. These materials have significantly higher current densities at reduced temperatures than other NbTi-based alloys. Using the results of these studies, a 10,000 A, nominal 12 tesla conductor has been designed and is presently being ...


Compositional control of ferroelectric Pb(Zr,Ti)O/sub 3/ thin films by reactive sputtering and MOCVD

[{u'author_order': 1, u'affiliation': u'Dept. of Electron., Kyoto Univ., Japan', u'full_name': u'M. Shimizu'}, {u'author_order': 2, u'full_name': u'K. Hayashi'}, {u'author_order': 3, u'full_name': u'T. Katayama'}, {u'author_order': 4, u'full_name': u'T. Shiosaki'}] ISAF '92: Proceedings of the Eighth IEEE International Symposium on Applications of Ferroelectrics, 1992

The preparation and compositional control of Pb(Zr,Ti)O/sub 3/ films obtained using two kinds of reactive sputtering processes and MOCVD (metal-organic chemical vapor deposition) were investigated. When a metal composite target was used in reactive sputtering, the film composition Zr/(Zr+Ti) could be controlled from 0.25 to 0.81 by changing the total area of Ti in the target. When an alloy target ...


Critical current density and n-value of NbTi wires at low field

[{u'author_order': 1, u'affiliation': u'Electron. Res. Lab., Kobe Steel Ltd., Japan', u'full_name': u'Y. Inoue'}, {u'author_order': 2, u'affiliation': u'Electron. Res. Lab., Kobe Steel Ltd., Japan', u'full_name': u'H. Kurahashi'}, {u'author_order': 3, u'affiliation': u'Electron. Res. Lab., Kobe Steel Ltd., Japan', u'full_name': u'Y. Fukumoto'}, {u'author_order': 4, u'affiliation': u'Electron. Res. Lab., Kobe Steel Ltd., Japan', u'full_name': u'M. Shimada'}] IEEE Transactions on Applied Superconductivity, 1995

The manufacturing process of NbTi wires for lower field applications is optimized concerning both the number of heat treatments and the final true strain, the strain of a wire from the wire diameter at the last heat treatment to the final diameter. The sample wires were made from Nb 54wt%Ti alloy and were manufactured to vary the number of heat ...


Microstructure control in high Ti NbTi alloys

[{u'author_order': 1, u'affiliation': u'Appl. Supercond. Center, Wisconsin Univ., Madison, WI, USA', u'full_name': u'P.J. Lee'}, {u'author_order': 2, u'affiliation': u'Appl. Supercond. Center, Wisconsin Univ., Madison, WI, USA', u'full_name': u'J.C. McKinnell'}, {u'author_order': 3, u'affiliation': u'Appl. Supercond. Center, Wisconsin Univ., Madison, WI, USA', u'full_name': u'D.C. Larbalestier'}] IEEE Transactions on Magnetics, 1989

The microstructures of five high-Ti NbTi alloys (Nb49-62-wt.%Ti) and a ternary Nb-54-wt.%Ti, 4-wt.%Zr alloy have been observed following heat treatments of 80 h at 420 degrees C at prestrains of between 8.3 and 12.6. It was found that increasing prestrain suppressed the formation of deleterious Widmanstatten alpha -Ti and omega phases and that the higher the Ti content, the higher ...


Review of several solid-state devices and their applications

[{u'author_order': 1, u'affiliation': u'General Electric Company, Syracuse, NY, USA', u'full_name': u'H. Katz'}] 1958 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1958

Presents an abstract of the conference paper.


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IEEE-USA E-Books

  • Integrated‐Optic Components

    This chapter discusses the passive components of integrated‐optic devices. Here, the passivity refers to the creation and recombination of charge carriers in connection with photon generation and absorption, respectively. An integrated‐optic waveguide is the simplest device. Here, a titanium doped coating is added to a lithium niobate substrate by means of sputtering techniques. A phase modulation/intensity modulation conversion is obtained, that is, an intensity modulator being based on polarization effects. The chapter discusses a deposition on the waveguide of a buffer layer consisting of calcium fluoride or silicon nitrite will be carried tangentally to the core area, followed by a further layer of aluminium. By means of deposition of a partial reflecting silver layer on both abutting sides of a lithium niobate waveguide, an integrated‐optic Fabry‐Perot Interferometer is obtained. The losses per coupling point are also about 1 dB, provided that an adaption of the refraction index is carried out.

  • Smart Materials for Chipless RFID Sensors

    This chapter explores smart sensing materials for microwave sensing applications. It first discusses a comparative analysis of various nonconductive, semiconductive, and high conductive materials in the context of their microwave sensing properties. The chapter then reviews various smart materials for microwave sensing applications and explores their microwave characteristics in the influence of physical parameters such as temperature, humidity, pressure, strain, gas, pH, and light. These materials are investigated for microwave sensing materials in the chipless radio‐frequency identification (RFID) platform. A number of materials including polymer shows sensitivity to pH variation of product. A number of conducting polymers also show noticeable changes in conductivity with pH. Various materials such as glass microfiber‐reinforced polytetrafluoroethylene (PTFE) composite, polyester‐based stretchable fabric, Nickel‐Titanium (Nitinol) alloy can be used as strain and crack sensors for structural health monitoring. The stepped impedance resonator (SIR) was designed and fabricated for the light sensing experiments.



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