Tin

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Tin is a chemical element with the symbol Sn and atomic number 50. (Wikipedia.org)






Conferences related to Tin

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2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.

  • 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    The theme is IMPACT-Leading Innovation. Advanced Packaging Technologies, Power Module and Green Packaging,3D Integration,LED & Optoelectronics Packaging,Interconnections & nanotechnology,Modeling, Simulation & Design.

  • 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    The theme is IMPACT-Leading Innovation which reflects the age of technology resolution. The appearance of smart phones and touch panels declare the innovation time and we highly welcome outstanding papers from all over the world to respond the theme and compete with elites overseas on the international stage.

  • 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    Advanced and Emerging Packaging Technology, Nanotechnology & Interconnection, Thermal Management, Advanced Materials, Process & , Advanced Sensor & Microsystems Technology, Modeling, Testing & Design, Electro Deposition and Electrochemical Processing Technology

  • 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    Advanced and Emerging Packaging Technology, Nanotechnology & Interconnection, Thermal Management, Advanced Materials, Process & , Advanced Sensor & Microsystems Technology, Modeling, Testing & Design, Electro Deposition and Electrochemical Processing Technology

  • 2008 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf. (IMPACT) & 10th Intl. Conf. on Electronic Materials & Packaging (EMAP)

    Expected to establish a Creative Collaboration, More Than Packaging program to bring together scientists, engineers and experts actively engaged in research and development on Microsystems, IC Packaging, Assembly, Materials and PCB to discuss the current progress and emerging technologies in the fields.


2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

EPTC aims to provide a good coverage of technological developments in allareas of electronic packaging from design to manufacturing and operation. It is a major forum for theexchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

    Advanced Electronics Packaging Technologies.

  • 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2009 11th Electronics Packaging Technology Conference - (EPTC 2009)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.


SICE 2012 - 51st Annual Conference of the Society of Instrument and Control Engineers of Japan

This conference covers a wide range of fields from measurement and control to system analysis and design, from theory to application and from software to hardware.



Periodicals related to Tin

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Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.



Most published Xplore authors for Tin

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Xplore Articles related to Tin

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Nano-structured ZnO/ITO based SO<inf>2</inf> detector in room temperature operation

U. B. Memon; A. Ibrahim; S. P. Duttagupta; S. Roy 2015 2nd International Symposium on Physics and Technology of Sensors (ISPTS), 2015

ZnO Nanostructured thin film of thickness 200nm was deposited on quartz by spray pyrolysis technique; further interdigitated ITO electrodes were fabricated by lithography. Compositional, surface morphology and electrical characterization of ZnO nanostructure thin film was done using X-ray photo electron spectroscopy (XPS), Secondary electron microscopy (SEM), and current- voltage (I-V) measurement technique respectively. SO2 sensing was done by using a ...


The coupled resonances of multiple dielectric resonator structures in metal waveguides

A. A. Trubin 2008 18th International Crimean Conference - Microwave & Telecommunication Technology, 2008

Presented in this paper are the results of theoretical analysis regarding natural oscillations of the systems with a number of coupled spherical dielectric resonators (DR) in flat and rectangular waveguides. It is demonstrated that these systems have frequency isolated high - Q coupling resonances, localized in the region of structure discontinuity. The phenomenon of pulses self-filtration in DR periodic structures ...


Microstructural and Magnetic Characterization of <formula formulatype="inline"><tex>${hbox{CuNb}}/{hbox{Nb}}_{3}{hbox{Sn}}$</tex> </formula> Wires With Different Architectures

Maria J. R. Sandim; Maxwell P. Cangani; Hugo R. Z. Sandim; Luis Ghivelder; Satoshi Awaji; Petre Badica; Kazuo Watanabe IEEE Transactions on Applied Superconductivity, 2008

In this work we focus on the microstructural and magnetic characterization of wires with different architectures (design and reinforcement). The microstructural characterization was performed using scanning electron microscopy. AC magnetic susceptibility was measured with field applied both parallel and perpendicular to the wire axis. The heat treatment performed to form the A-15 superconducting phase leads to partial spheroidization followed by ...


Dendrite-preventive additive (DPA) for lead-acid batteries

G. E. Mayer Sixteenth Annual Battery Conference on Applications and Advances. Proceedings of the Conference (Cat. No.01TH8533), 2001

Many lead-acid batteries of both flooded and starved electrolyte design have been observed to develop "soft shorts" in float service. BTC has developed a battery additive that mitigates or prevents this


Au-Sn fluxless SLID bonding: Effect of bonding temperature for stability at high temperature, above 400 &#x00B0;C

Knut E. Aasmundtveit; Thi Thuy Luu; Hoang-Vu Nguyen; Rolf Johannessen; Nils Hoivik; Kaiying Wang 3rd Electronics System Integration Technology Conference ESTC, 2010

Fluxless SLID (Solid-Liquid InterDiffusion) bonding based on Au and Sn is presented, using two different processes, and bonding temperatures in the range 300-350°C. The decomposition of the bond was tested by applying shear force while heating the samples. No bond delamination was observed for temperatures up to 350-400°C, with 95% of the tested samples surviving 400°C without bond delamination. This ...


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Educational Resources on Tin

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eLearning

Nano-structured ZnO/ITO based SO<inf>2</inf> detector in room temperature operation

U. B. Memon; A. Ibrahim; S. P. Duttagupta; S. Roy 2015 2nd International Symposium on Physics and Technology of Sensors (ISPTS), 2015

ZnO Nanostructured thin film of thickness 200nm was deposited on quartz by spray pyrolysis technique; further interdigitated ITO electrodes were fabricated by lithography. Compositional, surface morphology and electrical characterization of ZnO nanostructure thin film was done using X-ray photo electron spectroscopy (XPS), Secondary electron microscopy (SEM), and current- voltage (I-V) measurement technique respectively. SO2 sensing was done by using a ...


The coupled resonances of multiple dielectric resonator structures in metal waveguides

A. A. Trubin 2008 18th International Crimean Conference - Microwave & Telecommunication Technology, 2008

Presented in this paper are the results of theoretical analysis regarding natural oscillations of the systems with a number of coupled spherical dielectric resonators (DR) in flat and rectangular waveguides. It is demonstrated that these systems have frequency isolated high - Q coupling resonances, localized in the region of structure discontinuity. The phenomenon of pulses self-filtration in DR periodic structures ...


Microstructural and Magnetic Characterization of <formula formulatype="inline"><tex>${hbox{CuNb}}/{hbox{Nb}}_{3}{hbox{Sn}}$</tex> </formula> Wires With Different Architectures

Maria J. R. Sandim; Maxwell P. Cangani; Hugo R. Z. Sandim; Luis Ghivelder; Satoshi Awaji; Petre Badica; Kazuo Watanabe IEEE Transactions on Applied Superconductivity, 2008

In this work we focus on the microstructural and magnetic characterization of wires with different architectures (design and reinforcement). The microstructural characterization was performed using scanning electron microscopy. AC magnetic susceptibility was measured with field applied both parallel and perpendicular to the wire axis. The heat treatment performed to form the A-15 superconducting phase leads to partial spheroidization followed by ...


Dendrite-preventive additive (DPA) for lead-acid batteries

G. E. Mayer Sixteenth Annual Battery Conference on Applications and Advances. Proceedings of the Conference (Cat. No.01TH8533), 2001

Many lead-acid batteries of both flooded and starved electrolyte design have been observed to develop "soft shorts" in float service. BTC has developed a battery additive that mitigates or prevents this


Au-Sn fluxless SLID bonding: Effect of bonding temperature for stability at high temperature, above 400 &#x00B0;C

Knut E. Aasmundtveit; Thi Thuy Luu; Hoang-Vu Nguyen; Rolf Johannessen; Nils Hoivik; Kaiying Wang 3rd Electronics System Integration Technology Conference ESTC, 2010

Fluxless SLID (Solid-Liquid InterDiffusion) bonding based on Au and Sn is presented, using two different processes, and bonding temperatures in the range 300-350°C. The decomposition of the bond was tested by applying shear force while heating the samples. No bond delamination was observed for temperatures up to 350-400°C, with 95% of the tested samples surviving 400°C without bond delamination. This ...


More eLearning Resources

IEEE-USA E-Books

  • Alloy Selection

    This chapter contains sections titled: Introduction Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin-Lead Eutectic Solder Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability R&D Issues Remaining in Lead-Free Solder Implementation Summary References

  • Review and Analysis of LeadFree Solder Material Properties

    This chapter contains sections titled: Introduction Tin-Lead Properties and Models Tin-Silver Properties and Creep Data Tin-Silver-Copper Properties and Creep Data Alloy Comparisons General Conclusions/Recommendations Appendix A: Tin-Silver Creep Data Appendix B: Tin-Silver-Copper Creep Data Acknowledgments References

  • Major Driving Forces and Growth Mechanisms for Tin Whiskers

    This chapter focuses on describing the primary driving forces and mechanisms causing the growth of whiskers and hillocks. It devotes to describing how the growth of intermetallic phase (IMC) leads to stress in the Sn layer. It also discusses the impact of Sn whiskers on reliability and the importance of suppressing their formation. The chapter discusses results from simultaneously measuring the growth of the IMC between the Cu and Sn whiskers, the stress in the Sn layer, and the whisker density to understand how these different processes interact. It describes experimental studies that are designed to identify the other processes that play a role in whiskers forming, for example, plasticity, diffusion???mediated creep, and prevention of surface diffusion by the Sn oxide. The chapter also describes results from real???time studies of whisker growth in the scanning electron microscope/focused ion beam milling (SEM/FIB) that show how whiskers and hillocks evolve in time.

  • The Tin Men

    You don't have to have a degree in computer science to enjoy this unique collection of funny stories, parodies, laughable true-life incidents, comic song lyrics, and jokey poems from the world of computing. Humour the Computer brings together a selection of some of the best computer-related humorous material culled from a variety of sources: news groups and FTP sites on the Internet, The New Yorker, Punch, New Scientist, BYTE, Datamation, Communications of the ACM, The Journal of Irreproducible Results, and many more. Among other topics, the 70-odd assorted writings embrace the impact of computing on our lives, hilarious hardware, silly software, first encounters with computing, computer companies that we love, programming pains, and absurd academia.

  • Approaches of Modeling and Simulation of Stresses in S Finishes

    This chapter discusses the constitutive model of Sn grain as the foundation of finite element method (FEM) modeling. It introduces the strain energy density (SED) as the failure criterion. The chapter presents a common technique in Sn finish FEM modeling and grain rotation. It provides two FEM examples to explore the impact of the grain orientation on whisker growth in Sn finishes. The first example focuses on the elastic behavior of three immediately adjacent grains without considering the effects of grains in longer distances, while the second example considered elastoplastic behavior of a much larger group of grains. In order to describe the geometric characteristics of the textural Sn finish on a Cu leadframe, a Voronoi diagram method is used to generate the grain pattern. The simplified plasticity model is useful if the SED criterion is adapted for Sn whisker growth.

  • Growing Crystals

    This chapter contains sections titled: Bismuth-Arsenic Using Zone Melting, Cadmium-Tin-Phosphide, Conclusion to Part III

  • Properties and Whisker Formation Behavior of Tin???Based Alloy Finishes

    This chapter reviews the basic properties of tin???based alloy finishes and the effect of various alloying elements on whisker formation. The focus is on whisker test data and potential mechanisms for whisker suppression or enhancement for each element. A close look based on experimental data at the mechanisms of spontaneous whisker formation or suppression in matte Sn???Cu alloy finishes reveals how adding minor elements to the copper base material (lead frame) can significantly change the whisker formation propensity of the alloy finish. Significantly different tendencies of whisker formation from the same matte Sn???Cu coating electrodeposited on two different copper lead frames, namely, copper???iron and copper???chromium, were found. The results of these examinations clarified the mechanisms of formation and suppression of whiskers grown from the Sn???Cu coating, and they established a countermeasure against the spontaneous whisker formation through the selection of the copper lead???frame material.

  • Tin Whiskers: Mitigation Strategies and Testing

    This chapter contains sections titled: Introduction Mitigation Strategies Tin Whisker Test Development Summary Acknowledgments References

  • Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects

    This chapter focuses on development and validation of a surface???defect counting procedure, which can be applied in research on the specific mechanisms responsible for stress relaxation and tin whisker formation in tin films. It describes how to quantify the stress relaxation that can be attributed to the separate types of defects, each with a lower reliability risk than tin whiskers, and how the data can be combined to quantify overall stress relaxation in a given film under a given set of conditions. The chapter explains what comparisons of such data from the same films under different conditions, or different films under the same stressing conditions. It reveals about the relationship between film microstructure, stressing conditions, and stress relaxation. The defect assessment methodology documented evolution of film microstructure and defect formation among the 18 different sample types, providing a method to quantify the complexity of stress relaxation in tin surface finishes.

  • Implementing RoHS and WEEECompliant Products

    This chapter contains sections titled: Introduction Are Your Products within the Scope of the EU ROHS? Ten Steps to ROHS Compliance Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards A Standards-Based Approach to Materials Declaration Standards High-Reliability Requirements Business Impact of Supply Chain Conversion Summary References



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