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Tin is a chemical element with the symbol Sn and atomic number 50. (Wikipedia.org)

Conferences related to Tin

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.

2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications

2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore

2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology

2019 IEEE 58th Conference on Decision and Control (CDC)

The CDC is recognized as the premier scientific and engineering conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, systems and control, and related areas.The 58th CDC will feature contributed and invited papers, as well as workshops and may include tutorial sessions.The IEEE CDC is hosted by the IEEE Control Systems Society (CSS) in cooperation with the Society for Industrial and Applied Mathematics (SIAM), the Institute for Operations Research and the Management Sciences (INFORMS), the Japanese Society for Instrument and Control Engineers (SICE), and the European Union Control Association (EUCA).

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Periodicals related to Tin

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.

Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission

Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...

Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.

Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.

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Most published Xplore authors for Tin

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Xplore Articles related to Tin

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Internal tin-Nb/sub 3/Sn composite

[{u'author_order': 1, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37309760300', u'full_name': u'S. Hong', u'id': 37309760300}, {u'author_order': 2, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/38161889800', u'full_name': u'D. Geschwindner', u'id': 38161889800}, {u'author_order': 3, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37621405900', u'full_name': u'A. Mantone', u'id': 37621405900}, {u'author_order': 4, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/38161890100', u'full_name': u'W. Marancik', u'id': 38161890100}, {u'author_order': 5, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37379615500', u'full_name': u'R. Zhou', u'id': 37379615500}] IEEE Transactions on Magnetics, 1989

Investigations are conducted of Nb/sub 3/Sn multifilamentry composite fabrication by the internal-tin method. One method is to distribute tin around each filament uniformly, and the other approach is to distribute tin semiuniformly. The authors report the preliminary performance results for these two composites.<<ETX>>

Solid solutions of Niobium-tin for preparing Nb<inf>3</inf>Sn superconductors

[{u'author_order': 1, u'affiliation': u'University of Connecticut Storrs, Connecticut', u'authorUrl': u'https://ieeexplore.ieee.org/author/37324492800', u'full_name': u'J. Galligan', u'id': 37324492800}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37324478400', u'full_name': u'J. Tregilgas', u'id': 37324478400}] IEEE Transactions on Magnetics, 1975

Solid solution alloys of niobium with concentrations of Sn from 1 to 9 wt% have been prepared by quenching the solid solution from about 2100°C to room temperautre. These materials are relatively ductile and can be deformed, by swaging, into the desired shape, after which the material is reacted at about 800°c. The resulting structure is a mixture of Nb3Sn ...

Author Index

[] 2018 19th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing (SNPD), 2018

Author Index

Critical surface of multifilamentary Nb/sub 3/Sn wires

[{u'author_order': 1, u'affiliation': u'A.A. Bochvar All-Union Sci. Res. Inst. of Inorg. Mater., Moscow, Russia', u'authorUrl': u'https://ieeexplore.ieee.org/author/37268972100', u'full_name': u'N.I. Kozlenkova', u'id': 37268972100}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37324207600', u'full_name': u'E.Yu. Klimenko', u'id': 37324207600}, {u'author_order': 3, u'authorUrl': u'https://ieeexplore.ieee.org/author/37268970700', u'full_name': u'A.K. Shikov', u'id': 37268970700}] IEEE Transactions on Magnetics, 1994

Voltage-current characteristics (VCC) of multifilamentary Nb/sub 3/Sn wire at magnetic fields up to 8 T and temperatures up to 17 K are presented. the VCC are exponential in the studies interval of magnetic fields and temperatures. The dependences of J/sub c/(B,T) and J/sub 0/(B,T) were derived. The results obtained are explained by the presence of Nb/sub 3/Sn components that differ ...

Multifilamentary Nb-Nb<inf>3</inf>Sn composite by liquid infiltration method: Superconducting, metallurgical, and mechanical properties

[{u'author_order': 1, u'affiliation': u'Bell Laboratories, Murray Hill, NJ', u'authorUrl': u'https://ieeexplore.ieee.org/author/38666329100', u'full_name': u'M. Hong', u'id': 38666329100}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37304767900', u'full_name': u'G. Hull', u'id': 37304767900}, {u'author_order': 3, u'authorUrl': u'https://ieeexplore.ieee.org/author/37331919300', u'full_name': u'J. Holthuis', u'id': 37331919300}, {u'author_order': 4, u'authorUrl': u'https://ieeexplore.ieee.org/author/37268652900', u'full_name': u'W. Hassenzahl', u'id': 37268652900}, {u'author_order': 5, u'authorUrl': u'https://ieeexplore.ieee.org/author/37321266600', u'full_name': u'J. Ekin', u'id': 37321266600}] IEEE Transactions on Magnetics, 1983

A rapid solid-liquid reaction mechanism has been used to form A15 Nb3Sn in the liquid-infiltration processed Nb-Sn wire. Small, equiaxed A15 grains across the fine reacted filaments of 0.2-1.0 μm thickness were revealed with the transmission electron microscopy studies. A uniform Sn concentration near the stoichiometry was found in the A15 region. High inductive Tc's of 17.9K with sharp transition ...

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Educational Resources on Tin

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No eLearning Articles are currently tagged "Tin"


  • OLED Materials

    OLED performance is largely dependent upon OLED materials. This chapter describes the classification of OLED materials and typical OLED materials.OLED materials are divided into two types – vacuum evaporation type and solution type – from a process point of view. Vacuum evaporation materials are usually small molecular materials, while solution type materials contain polymers, dendrimers, and small molecular materials. In addition, materials are also divided into fluorescent materials, phosphorescent materials, and thermally activated delayed fluorescent (TADF) materials in terms of emission mechanisms. From the function point of view, OLED materials can be classified as hole injection material, hole transport material, emission material, host material in emissive layer, electron transport material, electron injection material, charge blocking material, etc.Anode and cathode materials are also important, so this chapter also describes anode and cathode materials.In addition, this chapter describes molecular orientations of organic materials because this also influences OLED characteristics.

  • Resonant Games


  • Different Business Models

    This chapter contains sections titled: * Business Process Outsourcing * Information Technology Outsourcing * Global Software Engineering * Netsourcing and Application Service Provisioning * Software Sourcing * Open Source Software ]]>

  • Appendix I: Interviews

    We have greatly benefitted from oral history interviews with Stanford Ovshinsky, as well as with his family, friends, colleagues, and former staff. LH denotes Lillian Hoddeson, and PG denotes Peter Garrett. Transcripts and voice files of the interviews listed below are in the possession of Hoddeson and will be added to the Ovshinsky papers.

  • Board Reflow Processes and their Effect on Tin Whisker Growth

    This chapter reviews the potential affect that the board reflow process has on tin whisker growth. Investigations in this area have looked at grain orientations and grain size, solder paste volume, and solder peak temperature on tin whisker growth. The chapter discusses the results on tin whisker testing on soldered pure‐tin‐coated components after reflow. There has been work to understand the affect of reflow profile, reflow atmosphere, solder paste volume, and flux activity on tin whisker growth. For tin‐lead soldering, the lower soldering peak temperature reduced solder paste wetting up the component lead frame increasing the potential for tin whisker growth. Different flux activators were found to aid the oxidation of tin, which increased tin whisker growth after temperature and humidity testing. Increased contamination of the soldered components with chloride and sulfate also increased tin whisker growth after temperature and humidity testing.

  • Interworking Security between EPS and Other Systems


  • Major Driving Forces and Growth Mechanisms for Tin Whiskers

    This chapter focuses on describing the primary driving forces and mechanisms causing the growth of whiskers and hillocks. It devotes to describing how the growth of intermetallic phase (IMC) leads to stress in the Sn layer. It also discusses the impact of Sn whiskers on reliability and the importance of suppressing their formation. The chapter discusses results from simultaneously measuring the growth of the IMC between the Cu and Sn whiskers, the stress in the Sn layer, and the whisker density to understand how these different processes interact. It describes experimental studies that are designed to identify the other processes that play a role in whiskers forming, for example, plasticity, diffusion‐mediated creep, and prevention of surface diffusion by the Sn oxide. The chapter also describes results from real‐time studies of whisker growth in the scanning electron microscope/focused ion beam milling (SEM/FIB) that show how whiskers and hillocks evolve in time.

  • Characterization Techniques for Film Characteristics

    This chapter shows data regarding whisker phenomena that are characterized by the most recent transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) techniques. It introduces several examples of SEM image use in tin whisker analysis: observation of tin whisker shape, measurement of tin whisker length and kink angle, and confirmation that tin whiskers do indeed generate from the base metal. The chapter describes concrete examples of whisker analysis that use the techniques. The chapter also discusses general crystal orientation characterization techniques and then focuses on the principles of and advances in EBSD and its use in investigating the effects of crystal orientation on tin whisker formation. Many examples of characterization by using TEM, SEM, and EBSD techniques for tin and tin‐based alloy finishes show how to clarify the essential characteristics of the films so that the authors can deepen their understanding of whisker formation mechanisms.

  • New Technologies

    New technologies generate industrial innovations. This chapter describes several new technologies: non‐ITO transparent electrode, organic TFT, wet‐processed TFT, wet‐processed OLED, roll‐to‐roll equipment, and quantum dot. Most of these are compatible with wet processes and are flexible. This means that wet processes and flexible are strongly required and related to the generation change of organic electronics technologies because wet processes and flexible give new value to products and low cost.

  • Basic Performance Characteristics of Wearable Antennas over a Wide Frequency Range

    This chapter describes the basic performance characteristics of wearable antennas for body-centric wireless communications over a wide frequency range. It overviews frequency dependence of the communication channels between 3 MHz and 3 GHz for wearable antennas mounted on the human body. A static human body model which has a posture of standing in free space is employed in order to characterize various frequency channels. The chapter discusses the electric field distributions around the human body, received open voltage, and power transmission efficiency with ideal matching circuits. It describes the influence of a surrounding environment (namely a metal floor and a wall close to the human body) on the electric field distribution and received open voltages around the human body. The chapter demonstrates two different scenarios to apply the basic results to practical situations: a commercialized wall-mounted identification (ID) tag system and a human vital data acquisition system using a dual-mode antenna.

Standards related to Tin

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