Tin

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Tin is a chemical element with the symbol Sn and atomic number 50. (Wikipedia.org)






Conferences related to Tin

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2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications


2018 15th IEEE Annual Consumer Communications & Networking Conference (CCNC)

IEEE CCNC 2018 will present the latest developments and technical solutions in the areas of home networking, consumer networking, enabling technologies (such as middleware) and novel applications and services. The conference will include a peer-reviewed program of technical sessions, special sessions, business application sessions, tutorials, and demonstration sessions


2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)

Circuits and Systems, Computers, Information Technology, Communication Systems, Control and Instrumentation, Electrical Power Systems, Power Electronics, Signal Processing


2018 15th International Symposium on Wireless Communication Systems (ISWCS)

The aim of this symposium is to provide a forum for researchers and technologists to present new ideas and contributions in the form of technical papers, panel discussions, as well as real-world evaluation in the field of wireless communications, networking and signal processing.The symposium will bring together various wireless communication systems developers to discuss the current status, technical challenges, standards, fundamental issues, and future services and applications.

  • 2017 International Symposium on Wireless Communication Systems (ISWCS)

    This event will bring together experts from various research and industry fields of wireless communications, as well as representatives of standardization and regulatory bodies. In that context we foresee focusing on highly-innovative and state-of-the-art contributions in the form of original technical papers, demos or products and achievements shown at the accompanying exhibition.

  • 2016 International Symposium on Wireless Communication Systems (ISWCS)

    The Thirteen International Symposium on Wireless Communication Systems (ISWCS’16) will follow the over ten-year long traditionof that event which will bring together experts from various research and industry fields of wireless communications, as well as representatives of standardization and regulatory bodies. In that context we foresee focusing on highly-innovative and state-of-the-art contributions in the form of original technical papers, demos or products and achievements shown at the accompanying exhibition.

  • 2015 International Symposium on Wireless Communication Systems

    The aim of this symposium is to provide a forum for researchers and technologists to present new ideas and contributions in the form of technical papers, panel discussions as well as real-world evaluation of many ideas in wireless communications, networking and signal processing. This twelfth edition of the symposium will bring together various wireless communication systems developers to discuss the current status, technical challenges, standards, fundamental issues, and future services and applications. ISWCS’15 seeks to address and capture highly-innovative and state-of-the-art research from academia and the wireless industry, as well as standardization advances. The scope of the conference includes a wide range of technical challenges encompassing wireless communications, information theory, quality of service support, networking, signal processing, cross-layer design for improved performance, and future wireless broadband systems.

  • 2014 11th International Symposium on Wireless Communications Systems (ISWCS)

    Wireless communications are at the heart of a new field characterized by smart and flexible transceiver concepts, the convergence of systems and technologies, and the development of technologies with a user-centric focus. In this context, the objective of the ISWCS'2014 is to provide a recognized and dynamic forum for researchers and engineers from academia and industry to present and to discuss original ideas and contributions in all fields related to mobile wireless communication systems, and to capture highly-innovative and state-of-the-art research from academia, the wireless industry as well as standardization advances, and to present novel contributions in the form of tutorials, panel discussions, keynote speeches, technical papers, and posters. The scope of the conference includes a wide range of technical challenges encompassing wireless communications and networking, quality of service, signal processing, cross layer design, broadband access, and cooperative communication.

  • 2013 Tenth International Symposium on Wireless Communications Systems (ISWCS)

    wireless communications systems

  • 2012 9th International Symposium on Wireless Communication Systems (ISWCS 2012)

    The scope of the conference includes wireless communications, quality of service support, wireless networking, signal processing, cross layer air interface design and wireless broadband access.

  • 2011 8th International Symposium on Wireless Communication Systems (ISWCS 2011)

    ISWCS'11 seeks to address and capture highly innovative and state-of-the-art research from academia, the wireless industry and standardization bodies. The scope of the conference includes technical challenges encompassing wireless communications, quality of service support, wireless networking, signal processing, cross-layer air interface design, wireless broadband access and cooperative communication.

  • 2010 7th International Symposium on Wireless Communication Systems (ISWCS 2010)

    wireless and mobile communications, signal processing, networking, cognitive radio.

  • 2009 6th International Symposium on Wireless Communication Systems (ISWCS 2009)

    ISWCS 09 seeks to address highly-innovative research as well as wireless industry and standardization bodies contributions. The scope of the conference includes a wide range of technical challenges encompassing wireless communications and networking, quality of service support, cross-layer air interface design for improved performance, wireless broadband access, and cooperative networking.

  • 2008 IEEE International Symposium on Wireless Communication Systems (ISWCS 2008)

    Wireless communications is at the centre of a new and passionate era for telecommunications. The IEEE International Symposium on Wireless Communication Systems (ISWCS) positions itself as a recognised and dynamic forum for researchers and technologists to present and discuss original ideas in all fields related to wireless communication systems.

  • 2007 IEEE International Symposium on Wireless Communication Systems (ISWCS 2007)

    Identify and discuss the future technical challenges and business opportunities arising in the path towards the realization of ambient wireless communication networks. Together with the technical sessions, the symposium will feature tutorials and keynote presentations from leading wireless communication experts from industry, academia and regulatory and standardization bodies.

  • 2006 3rd International Symposium on Wireless Communication Systems (ISWCS 2006)

  • 2005 2nd International Symposium on Wireless Communication Systems (ISWCS 2005)

  • 2004 1st International Symposium on Wireless Communication Systems (ISWCS 2004)


2018 24th International Conference on Pattern Recognition (ICPR)

ICPR will be an international forum for discussions on recent advances in the fields of Pattern Recognition, Machine Learning and Computer Vision, and on applications of these technologies in various fields

  • 2016 23rd International Conference on Pattern Recognition (ICPR)

    ICPR'2016 will be an international forum for discussions on recent advances in the fields of Pattern Recognition, Machine Learning and Computer Vision, and on applications of these technologies in various fields.

  • 2014 22nd International Conference on Pattern Recognition (ICPR)

    ICPR 2014 will be an international forum for discussions on recent advances in the fields of Pattern Recognition; Machine Learning and Computer Vision; and on applications of these technologies in various fields.

  • 2012 21st International Conference on Pattern Recognition (ICPR)

    ICPR is the largest international conference which covers pattern recognition, computer vision, signal processing, and machine learning and their applications. This has been organized every two years by main sponsorship of IAPR, and has recently been with the technical sponsorship of IEEE-CS. The related research fields are also covered by many societies of IEEE including IEEE-CS, therefore the technical sponsorship of IEEE-CS will provide huge benefit to a lot of members of IEEE. Archiving into IEEE Xplore will also provide significant benefit to the all members of IEEE.

  • 2010 20th International Conference on Pattern Recognition (ICPR)

    ICPR 2010 will be an international forum for discussions on recent advances in the fields of Computer Vision; Pattern Recognition and Machine Learning; Signal, Speech, Image and Video Processing; Biometrics and Human Computer Interaction; Multimedia and Document Analysis, Processing and Retrieval; Medical Imaging and Visualization.

  • 2008 19th International Conferences on Pattern Recognition (ICPR)

    The ICPR 2008 will be an international forum for discussions on recent advances in the fields of Computer vision, Pattern recognition (theory, methods and algorithms), Image, speech and signal analysis, Multimedia and video analysis, Biometrics, Document analysis, and Bioinformatics and biomedical applications.

  • 2002 16th International Conference on Pattern Recognition


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Periodicals related to Tin

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Tin

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Xplore Articles related to Tin

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Internal tin-Nb/sub 3/Sn composite

[{u'author_order': 1, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'full_name': u'S. Hong'}, {u'author_order': 2, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'full_name': u'D. Geschwindner'}, {u'author_order': 3, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'full_name': u'A. Mantone'}, {u'author_order': 4, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'full_name': u'W. Marancik'}, {u'author_order': 5, u'affiliation': u'Oxford Supercond. Technol., Carteret, NJ, USA', u'full_name': u'R. Zhou'}] IEEE Transactions on Magnetics, 1989

Investigations are conducted of Nb/sub 3/Sn multifilamentry composite fabrication by the internal-tin method. One method is to distribute tin around each filament uniformly, and the other approach is to distribute tin semiuniformly. The authors report the preliminary performance results for these two composites.<<ETX>>


Solid solutions of Niobium-tin for preparing Nb<inf>3</inf>Sn superconductors

[{u'author_order': 1, u'affiliation': u'University of Connecticut Storrs, Connecticut', u'full_name': u'J. Galligan'}, {u'author_order': 2, u'full_name': u'J. Tregilgas'}] IEEE Transactions on Magnetics, 1975

Solid solution alloys of niobium with concentrations of Sn from 1 to 9 wt% have been prepared by quenching the solid solution from about 2100°C to room temperautre. These materials are relatively ductile and can be deformed, by swaging, into the desired shape, after which the material is reacted at about 800°c. The resulting structure is a mixture of Nb3Sn ...


Author Index

[] 2018 19th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing (SNPD), 2018

Author Index


Critical surface of multifilamentary Nb/sub 3/Sn wires

[{u'author_order': 1, u'affiliation': u'A.A. Bochvar All-Union Sci. Res. Inst. of Inorg. Mater., Moscow, Russia', u'full_name': u'N.I. Kozlenkova'}, {u'author_order': 2, u'full_name': u'E.Yu. Klimenko'}, {u'author_order': 3, u'full_name': u'A.K. Shikov'}] IEEE Transactions on Magnetics, 1994

Voltage-current characteristics (VCC) of multifilamentary Nb/sub 3/Sn wire at magnetic fields up to 8 T and temperatures up to 17 K are presented. the VCC are exponential in the studies interval of magnetic fields and temperatures. The dependences of J/sub c/(B,T) and J/sub 0/(B,T) were derived. The results obtained are explained by the presence of Nb/sub 3/Sn components that differ ...


Multifilamentary Nb-Nb<inf>3</inf>Sn composite by liquid infiltration method: Superconducting, metallurgical, and mechanical properties

[{u'author_order': 1, u'affiliation': u'Bell Laboratories, Murray Hill, NJ', u'full_name': u'M. Hong'}, {u'author_order': 2, u'full_name': u'G. Hull'}, {u'author_order': 3, u'full_name': u'J. Holthuis'}, {u'author_order': 4, u'full_name': u'W. Hassenzahl'}, {u'author_order': 5, u'full_name': u'J. Ekin'}] IEEE Transactions on Magnetics, 1983

A rapid solid-liquid reaction mechanism has been used to form A15 Nb3Sn in the liquid-infiltration processed Nb-Sn wire. Small, equiaxed A15 grains across the fine reacted filaments of 0.2-1.0 μm thickness were revealed with the transmission electron microscopy studies. A uniform Sn concentration near the stoichiometry was found in the A15 region. High inductive Tc's of 17.9K with sharp transition ...


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Educational Resources on Tin

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eLearning

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IEEE-USA E-Books

  • OLED Materials

    OLED performance is largely dependent upon OLED materials. This chapter describes the classification of OLED materials and typical OLED materials.OLED materials are divided into two types – vacuum evaporation type and solution type – from a process point of view. Vacuum evaporation materials are usually small molecular materials, while solution type materials contain polymers, dendrimers, and small molecular materials. In addition, materials are also divided into fluorescent materials, phosphorescent materials, and thermally activated delayed fluorescent (TADF) materials in terms of emission mechanisms. From the function point of view, OLED materials can be classified as hole injection material, hole transport material, emission material, host material in emissive layer, electron transport material, electron injection material, charge blocking material, etc.Anode and cathode materials are also important, so this chapter also describes anode and cathode materials.In addition, this chapter describes molecular orientations of organic materials because this also influences OLED characteristics.

  • Different Business Models

    This chapter contains sections titled: * Business Process Outsourcing * Information Technology Outsourcing * Global Software Engineering * Netsourcing and Application Service Provisioning * Software Sourcing * Open Source Software ]]>

  • Board Reflow Processes and their Effect on Tin Whisker Growth

    This chapter reviews the potential affect that the board reflow process has on tin whisker growth. Investigations in this area have looked at grain orientations and grain size, solder paste volume, and solder peak temperature on tin whisker growth. The chapter discusses the results on tin whisker testing on soldered pure‐tin‐coated components after reflow. There has been work to understand the affect of reflow profile, reflow atmosphere, solder paste volume, and flux activity on tin whisker growth. For tin‐lead soldering, the lower soldering peak temperature reduced solder paste wetting up the component lead frame increasing the potential for tin whisker growth. Different flux activators were found to aid the oxidation of tin, which increased tin whisker growth after temperature and humidity testing. Increased contamination of the soldered components with chloride and sulfate also increased tin whisker growth after temperature and humidity testing.

  • Interworking Security between EPS and Other Systems

    None

  • Major Driving Forces and Growth Mechanisms for Tin Whiskers

    This chapter focuses on describing the primary driving forces and mechanisms causing the growth of whiskers and hillocks. It devotes to describing how the growth of intermetallic phase (IMC) leads to stress in the Sn layer. It also discusses the impact of Sn whiskers on reliability and the importance of suppressing their formation. The chapter discusses results from simultaneously measuring the growth of the IMC between the Cu and Sn whiskers, the stress in the Sn layer, and the whisker density to understand how these different processes interact. It describes experimental studies that are designed to identify the other processes that play a role in whiskers forming, for example, plasticity, diffusion‐mediated creep, and prevention of surface diffusion by the Sn oxide. The chapter also describes results from real‐time studies of whisker growth in the scanning electron microscope/focused ion beam milling (SEM/FIB) that show how whiskers and hillocks evolve in time.

  • Characterization Techniques for Film Characteristics

    This chapter shows data regarding whisker phenomena that are characterized by the most recent transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) techniques. It introduces several examples of SEM image use in tin whisker analysis: observation of tin whisker shape, measurement of tin whisker length and kink angle, and confirmation that tin whiskers do indeed generate from the base metal. The chapter describes concrete examples of whisker analysis that use the techniques. The chapter also discusses general crystal orientation characterization techniques and then focuses on the principles of and advances in EBSD and its use in investigating the effects of crystal orientation on tin whisker formation. Many examples of characterization by using TEM, SEM, and EBSD techniques for tin and tin‐based alloy finishes show how to clarify the essential characteristics of the films so that the authors can deepen their understanding of whisker formation mechanisms.

  • New Technologies

    New technologies generate industrial innovations. This chapter describes several new technologies: non‐ITO transparent electrode, organic TFT, wet‐processed TFT, wet‐processed OLED, roll‐to‐roll equipment, and quantum dot. Most of these are compatible with wet processes and are flexible. This means that wet processes and flexible are strongly required and related to the generation change of organic electronics technologies because wet processes and flexible give new value to products and low cost.

  • Basic Performance Characteristics of Wearable Antennas over a Wide Frequency Range

    This chapter describes the basic performance characteristics of wearable antennas for body-centric wireless communications over a wide frequency range. It overviews frequency dependence of the communication channels between 3 MHz and 3 GHz for wearable antennas mounted on the human body. A static human body model which has a posture of standing in free space is employed in order to characterize various frequency channels. The chapter discusses the electric field distributions around the human body, received open voltage, and power transmission efficiency with ideal matching circuits. It describes the influence of a surrounding environment (namely a metal floor and a wall close to the human body) on the electric field distribution and received open voltages around the human body. The chapter demonstrates two different scenarios to apply the basic results to practical situations: a commercialized wall-mounted identification (ID) tag system and a human vital data acquisition system using a dual-mode antenna.

  • Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects

    This chapter focuses on development and validation of a surface‐defect counting procedure, which can be applied in research on the specific mechanisms responsible for stress relaxation and tin whisker formation in tin films. It describes how to quantify the stress relaxation that can be attributed to the separate types of defects, each with a lower reliability risk than tin whiskers, and how the data can be combined to quantify overall stress relaxation in a given film under a given set of conditions. The chapter explains what comparisons of such data from the same films under different conditions, or different films under the same stressing conditions. It reveals about the relationship between film microstructure, stressing conditions, and stress relaxation. The defect assessment methodology documented evolution of film microstructure and defect formation among the 18 different sample types, providing a method to quantify the complexity of stress relaxation in tin surface finishes.

  • OLED Devices

    While the fundamental device structure of OLEDs is simple in a sense, there are various types of OLED devices, which can be classified into various categories. From the point of view of emitting directions, OLED devices are classified as bottom emission, top emission, and both‐side emission (transparent). OLED devices are also classified into normal and inverted structures from the point of view of the stacking order of the electrodes.In addition, this chapter describes some useful technologies for practical OLED displays and lighting: white OLEDs, full‐color technologies, micro‐cavity structures, multi‐photon structures, and encapsulating technologies.



Standards related to Tin

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