Tin

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Tin is a chemical element with the symbol Sn and atomic number 50. (Wikipedia.org)






Conferences related to Tin

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2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.

  • 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    The theme is IMPACT-Leading Innovation. Advanced Packaging Technologies, Power Module and Green Packaging,3D Integration,LED & Optoelectronics Packaging,Interconnections & nanotechnology,Modeling, Simulation & Design.

  • 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    The theme is IMPACT-Leading Innovation which reflects the age of technology resolution. The appearance of smart phones and touch panels declare the innovation time and we highly welcome outstanding papers from all over the world to respond the theme and compete with elites overseas on the international stage.

  • 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    Advanced and Emerging Packaging Technology, Nanotechnology & Interconnection, Thermal Management, Advanced Materials, Process & , Advanced Sensor & Microsystems Technology, Modeling, Testing & Design, Electro Deposition and Electrochemical Processing Technology

  • 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    Advanced and Emerging Packaging Technology, Nanotechnology & Interconnection, Thermal Management, Advanced Materials, Process & , Advanced Sensor & Microsystems Technology, Modeling, Testing & Design, Electro Deposition and Electrochemical Processing Technology

  • 2008 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf. (IMPACT) & 10th Intl. Conf. on Electronic Materials & Packaging (EMAP)

    Expected to establish a Creative Collaboration, More Than Packaging program to bring together scientists, engineers and experts actively engaged in research and development on Microsystems, IC Packaging, Assembly, Materials and PCB to discuss the current progress and emerging technologies in the fields.


2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

EPTC aims to provide a good coverage of technological developments in allareas of electronic packaging from design to manufacturing and operation. It is a major forum for theexchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

    Advanced Electronics Packaging Technologies.

  • 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

    EPTC aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

  • 2009 11th Electronics Packaging Technology Conference - (EPTC 2009)

    To provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.


SICE 2012 - 51st Annual Conference of the Society of Instrument and Control Engineers of Japan

This conference covers a wide range of fields from measurement and control to system analysis and design, from theory to application and from software to hardware.


2006 IEEE Workshop on Microelectronics and Electron Devices (WMED)



Periodicals related to Tin

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Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.



Most published Xplore authors for Tin

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Xplore Articles related to Tin

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Monolithic tandem solar cell based on GaAlAs-GaAs system

L. Mayet; M. Gavand; B. Montegu; J. P. Boyeaux; A. Laugier IEEE Conference on Photovoltaic Specialists, 1990

Low and medium concentrations (10 to 50 suns) are a suitable way to improve the efficiency of solar cells without the expensive two-axis concentrators. The open circuit voltage, Voc, rapidly increases for the lower concentrations, while a good value of the fill factor is achieved when a large ratio of the dark current at Voc is from the diffusion current, ...


Fiber-optic pH sensors fabrication based on selective deposition of Neutral Red

Carlos R. Zamarreño; Miguel Hernáez; Ignacio R. Matías; Francisco J. Arregui 2009 IEEE Sensors, 2009

In this work, a novel application of the electric field directed layer-by- layer self assembly (EFDLA) selective deposition method for the fabrication of optical fiber pH sensors is presented. Here, indium tin oxide (ITO) coated optical fibers have been fabricated via a dip-coating deposition method. These fibers are used as electrodes in the EFDLA protocol in order to deposit selectively ...


A multiprocessor approach for meeting the processing requirements for OSI

M. R. Ito; L. Y. Takeuchi; G. W. Neufeld IEEE Journal on Selected Areas in Communications, 1993

To meet the increased communication processing requirements of high-speed networks, a multiprocessing network interface is considered for processing multiple layers of a communication protocol stack. In particular, the processing of the open systems interconnection (OSI) layers 2 to 6 on the network interface are considered. OSI processing is computationally expensive because of the inclusion of the transfer syntax conversion at ...


Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Shin-Yi Huang; Tao-Chih Chang; Ren-Shin Cheng; Jing-Yao Chang; Chia-Wen Fan; Chau-Jie Zhan; John H. Lau; Tai-Hong Chen; Wei-Chung Lo; Ming-Jer Kao 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011

In order to investigate the failure mechanism of microjoints within a chip stacking architecture, four chips with more than 3000 microbumps each were assembled on a Si interposer by Toray's FC-3000WS bonder at a peak temperature of 280°C without any flux. The defects such as missing bumps and deformation of microjoints induced by the undercut of Cu pillar have been ...


A digital imaging system with color constancy from a couple of images

K. Takebe; N. Ito; S. Nakauchi; S. Usui Systems, Man, and Cybernetics, 1999. IEEE SMC '99 Conference Proceedings. 1999 IEEE International Conference on, 1999

In this study, we propose a digital color imaging algorithm for estimating object colors by removing an illuminant color from an input scene to achieve color constancy. This method is for restoring surface spectral reflectance using a set of two images: a first image is taken under unknown illuminant, and a second one is taken under known illuminant in addition ...


More Xplore Articles

Educational Resources on Tin

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eLearning

Monolithic tandem solar cell based on GaAlAs-GaAs system

L. Mayet; M. Gavand; B. Montegu; J. P. Boyeaux; A. Laugier IEEE Conference on Photovoltaic Specialists, 1990

Low and medium concentrations (10 to 50 suns) are a suitable way to improve the efficiency of solar cells without the expensive two-axis concentrators. The open circuit voltage, Voc, rapidly increases for the lower concentrations, while a good value of the fill factor is achieved when a large ratio of the dark current at Voc is from the diffusion current, ...


Fiber-optic pH sensors fabrication based on selective deposition of Neutral Red

Carlos R. Zamarreño; Miguel Hernáez; Ignacio R. Matías; Francisco J. Arregui 2009 IEEE Sensors, 2009

In this work, a novel application of the electric field directed layer-by- layer self assembly (EFDLA) selective deposition method for the fabrication of optical fiber pH sensors is presented. Here, indium tin oxide (ITO) coated optical fibers have been fabricated via a dip-coating deposition method. These fibers are used as electrodes in the EFDLA protocol in order to deposit selectively ...


A multiprocessor approach for meeting the processing requirements for OSI

M. R. Ito; L. Y. Takeuchi; G. W. Neufeld IEEE Journal on Selected Areas in Communications, 1993

To meet the increased communication processing requirements of high-speed networks, a multiprocessing network interface is considered for processing multiple layers of a communication protocol stack. In particular, the processing of the open systems interconnection (OSI) layers 2 to 6 on the network interface are considered. OSI processing is computationally expensive because of the inclusion of the transfer syntax conversion at ...


Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Shin-Yi Huang; Tao-Chih Chang; Ren-Shin Cheng; Jing-Yao Chang; Chia-Wen Fan; Chau-Jie Zhan; John H. Lau; Tai-Hong Chen; Wei-Chung Lo; Ming-Jer Kao 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011

In order to investigate the failure mechanism of microjoints within a chip stacking architecture, four chips with more than 3000 microbumps each were assembled on a Si interposer by Toray's FC-3000WS bonder at a peak temperature of 280°C without any flux. The defects such as missing bumps and deformation of microjoints induced by the undercut of Cu pillar have been ...


A digital imaging system with color constancy from a couple of images

K. Takebe; N. Ito; S. Nakauchi; S. Usui Systems, Man, and Cybernetics, 1999. IEEE SMC '99 Conference Proceedings. 1999 IEEE International Conference on, 1999

In this study, we propose a digital color imaging algorithm for estimating object colors by removing an illuminant color from an input scene to achieve color constancy. This method is for restoring surface spectral reflectance using a set of two images: a first image is taken under unknown illuminant, and a second one is taken under known illuminant in addition ...


More eLearning Resources

IEEE-USA E-Books

  • Tin Whiskers: Mitigation Strategies and Testing

    This chapter contains sections titled: Introduction Mitigation Strategies Tin Whisker Test Development Summary Acknowledgments References

  • Growing Crystals

    This chapter contains sections titled: Bismuth-Arsenic Using Zone Melting, Cadmium-Tin-Phosphide, Conclusion to Part III

  • Board Reflow Processes and their Effect on Tin Whisker Growth

    This chapter reviews the potential affect that the board reflow process has on tin whisker growth. Investigations in this area have looked at grain orientations and grain size, solder paste volume, and solder peak temperature on tin whisker growth. The chapter discusses the results on tin whisker testing on soldered pure???tin???coated components after reflow. There has been work to understand the affect of reflow profile, reflow atmosphere, solder paste volume, and flux activity on tin whisker growth. For tin???lead soldering, the lower soldering peak temperature reduced solder paste wetting up the component lead frame increasing the potential for tin whisker growth. Different flux activators were found to aid the oxidation of tin, which increased tin whisker growth after temperature and humidity testing. Increased contamination of the soldered components with chloride and sulfate also increased tin whisker growth after temperature and humidity testing.

  • Implementing RoHS and WEEECompliant Products

    This chapter contains sections titled: Introduction Are Your Products within the Scope of the EU ROHS? Ten Steps to ROHS Compliance Part Numbering Important for Differentiating Lead-Free from Tin-Lead Components and Boards A Standards-Based Approach to Materials Declaration Standards High-Reliability Requirements Business Impact of Supply Chain Conversion Summary References

  • Mechanically Induced Tin Whiskers

    This chapter discusses the pressure???induced whisker at separable interfaces as a key reliability issue of lead???free separable contacts and connectors. It shows theories of mechanically induced tin whiskers. Then, several case studies with pure tin and lead???free finishes were performed to evaluate pressure???induced tin whiskers. For electronics components, several factors affect the stress field of the finish: (i) thickness of the plating, (ii) structure of the ambient component material, and (iii) material microstructures. As a methodology for the assessment of pressure???induced tin whisker formation, the creep???based tin whisker formation model shows good results. Several connectors with tin or tin???rich alloy finishes were assessed by means of the nanoindentation technique. For the flexible printed circuit (FPC), mechanical properties of adhesives are key factors influencing tin whisker formation. Each mechanical property can be obtained by the indentation technique, and stress distribution can be estimated by finite element analysis (FEA).

  • Front Matter

    The prelims comprise: Half???Title Page Series Page Title Page Copyright Page Table of Contents List of Contributors Introduction

  • LeadFree Assembly ReliabilityGeneral

    This chapter contains sections titled: Introduction Basic Physical Properties of Solder Creep Deformation Thermal Fatigue Creep Rupture Isothermal (Mechanical) Fatigue Out-of-Plane Bending Impact/Shock Loading Effect of Rework on Reliability High-Temperature Operating Life (HTOL) Electrochemical Migration Tin Whiskering Tin Pest Summary Acknowledgments References

  • Overview of Whisker???Mitigation Strategies for High???Reliability Electronic Systems

    In practice, management of the risks associated with tin whiskering is not fundamentally different from managing risks associated with other failure modes that bedevil electronic systems. However, the underlying uncertainties and associated lack of predictability of the tin whiskering phenomenon create a challenging environment for risk management. In order to reduce failure risk presented by tin whiskers, electronic equipment manufacturers need to understand various mitigation strategies and their effectiveness at preventing whisker???related failures. Equipment manufacture mitigation strategies may include setting spacing limits, hot solder dipping, solder assembly and inspection, encapsulation, or application of an insulation coating layer. Appropriate supply chain management will vary depending upon the willingness of the supplier to implement special tin controls and level of complexity of the purchased item, that is, components, simple assemblies, major subassemblies, etc. Effective and efficient tin whisker risk mitigation requires each tier of the supply chain to play its proper role.

  • Review and Analysis of LeadFree Solder Material Properties

    This chapter contains sections titled: Introduction Tin-Lead Properties and Models Tin-Silver Properties and Creep Data Tin-Silver-Copper Properties and Creep Data Alloy Comparisons General Conclusions/Recommendations Appendix A: Tin-Silver Creep Data Appendix B: Tin-Silver-Copper Creep Data Acknowledgments References

  • Index

    **Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks** This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. * Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structu e, and the localization of elastic strain/strain energy density distribution * Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) * Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) * Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers _Mitigating Tin Whisker Risks: Theory and Practice _is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.



Standards related to Tin

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No standards are currently tagged "Tin"