Thermal expansion

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Thermal expansion is the tendency of matter to change in volume in response to a change in temperature. When a substance is heated, its particles begin moving more and thus usually maintain a greater average separation. (Wikipedia.org)






Conferences related to Thermal expansion

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2019 IEEE Pulsed Power & Plasma Science (PPPS)

Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.


2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO)

Nanotechnology

  • 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO)

    IEEE Nano is one of the largest nanotechnology conferences in the world, directly sponsored by the IEEE Nanotechnology Council. IEEE NANO 2017 will provide an international forum for inspiration, interactions and exchange of ideas in a wide variety of branches of nanotechnology and nanoscience, through feature tutorials, workshops, and track sessions; plenary and invited talks from the world most renowned scientists and engineers; exhibition of software, hardware, equipment, materials, services and literature. It is a must for students, educators, researchers, scientists and engineers engaged in a wide range of nanotechnology fields and related applications, including electronic materials, photonics, biotechnology, medicine, alternative energy, environment and electronic devices.

  • 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO)

    IEEE-NANO is the flagship IEEE Nanotechnology conference. The conference scope covers a wide range in nanoscience and technology. In particular, it covers nanofabrication, nanomanufacturing, nanomaerials, nanobiomedicine, nanoenergy, nanoplasmonics, nanoelectronics, nanosensors and nanoactuators, characterisation and modelling of nano structures and devices. Research in both experiments and simulation is reported. Industry is encouraged to present its research projects.

  • 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO)

    The conference scope is to bring together researchers, industry workers, entrepreneurs and funding agency leaders, in the general area of nanotechnology. IEEE NANO 2015 will provide a forum for the exchange of ideas, interaction, networking and collaboration for research and development in nanotechnology with special attention to the latest advances in nanotechnology

  • 2014 IEEE 14th International Conference on Nanotechnology (IEEE-NANO)

    NANO is the flagship IEEE conference in Nanotechnology, which makes it a must for students, educators, researchers, scientists and engineers alike, working at the interface of nanotechnology and the many fields of electronic materials, photonics, bio-and medical devices, alternative energy, environmental protection, and multiple areas of current and future electrical and electronic applications. In each of these areas, NANO is the conference where practitioners will see nanotechnologies at work in both their own and related fields, from basic research and theory to industrial applications.

  • 2013 IEEE 13th International Conference on Nanotechnology (IEEE-NANO)

    Nanoelectronics, nanomanufacturing, nanomaterials, nanodevice, nanofibration, nanofluidics, nano-bio-medicine, NEMS applications, nanocircuits, nanorobotics, nanomanipulation, nanosensors and actuators, nanophotonics, nanomagnetics, micro-to-nano-scale bridging

  • 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO)

    The conference scope covers a wide range in nanoscience and technology. In particular, it covers nanofabrication, nanomanufacturing, nanomaerials, nanobiomedicine, nanoenergy, nanoplasmonics, nanoelectronics, nanosensors and nanoactuators, characterisation and modelling of nano structures and devices. Research in both experiments and simulation is reported. Industry is encouraged to present its research projects.

  • 2011 10th Conference on Nanotechnology (IEEE-NANO)

    1. Nanomaterials and Nanostructures 2. Nanoelectronics and Nanodevices 3. Nanophotonics 4. Nano biotechnology and Nanomedicine 5. Nanorobotics and NEMS

  • 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO)

    All areas of nanotechnology within the areas of IEEE interest, as covered by the member societies of the Nanotechnology Council.

  • 2010 IEEE 10th Conference on Nanotechnology (IEEE-NANO)

    - More Moore, More than Moore and Beyond-CMOS - Nano-optics, Nano-Photonics, Plasmonics, Nano-optoelectronics - Nanofabrication, Nanolithography, Nano Manipulation, Nanotools - Nanomaterials and Nanostructures - Nanocarbon, Nanodiamond, Graphene and CNT Based Technologies - Nano-sensors and Nano Membranes - Modeling and Simulation - System Integration (Nano/Micro/Macro), NEMS, and Actuators - Molecular Electronics, Inorganic Nanowires, Nanocrystals, Quantum Dots

  • 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO)

    THE CONFERENCE FOCUSES ON THE APPLICATION OF NANOSCIENCE AND NANOTECHNOLOGY. SPECIFICALLY, BOTH ENGINEERING ISSUE RELATED TO NANOFABBRICATION , NANOELECTRONICS, SENSOR SYSTEMS WILL BE COVERED IN ADDITION FOUNDAMENTAL ISSUES SUCH AS MODELLING, SYNTHESIS, CARACTARIZATION ETC.

  • 2008 8th IEEE Conference on Nanotechnology (IEEE-NANO)

    This conference is the sequel to meetings held in Maui (2001), Washington (2002), San Francisco (2003), Munich (2004), Nagoya (2005), Cinncinati (2006), and Hong Kong (2007). The conference focus will be on engineering and business issues related to nanoelectronics, circuits, architectures, sensor systems, integration, reliability and manufacturing in addition to fundamental issues such as modeling, growth/synthesis, and characterization. The conference will feature plenary, invited, and contributed papers

  • 2007 7th IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2006 6th IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2005 5th IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2004 4th IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2003 3rd IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2002 2nd IEEE Conference on Nanotechnology (IEEE-NANO)

  • 2001 1st IEEE Conference on Nanotechnology (IEEE-NANO)


2018 IEEE 45th Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


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Periodicals related to Thermal expansion

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Xplore Articles related to Thermal expansion

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Development of high reliability underfill material

[{u'author_order': 1, u'affiliation': u'Electr. Device Mater. Lab., Sumitomo bakelite Co. Ltd., Tochigi, Japan', u'full_name': u'M. Wada'}] 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225), None

As an encapsulant for flip chip packages, underfill materials play an important role for the purpose of protection from thermal stress and environmental stress. We have developed an excellent reliability underfill material based on the following concepts: (1) cured underfill material coefficient of thermal expansion (CTE) which is close to that of the solder ball; (2) excellent adhesion to plastic ...


Mechanism of Stress Memorization Technique (SMT) and Method to Maximize Its Effect

[{u'author_order': 1, u'affiliation': u'Globalfoundries, Technology Development Department, Singapore', u'full_name': u'S. M. Pandey'}, {u'author_order': 2, u'affiliation': u'Globalfoundries, Technology Development Department, Singapore', u'full_name': u'J. Liu'}, {u'author_order': 3, u'affiliation': u'Globalfoundries, Technology Development Department, Singapore', u'full_name': u'Z. S. Hooi'}, {u'author_order': 4, u'affiliation': u'Globalfoundries Dresden Module One LLC and Co. KG, Dresden, Germany', u'full_name': u'S. Flachowsky'}, {u'author_order': 5, u'affiliation': u'Globalfoundries Dresden Module One LLC and Co. KG, Dresden, Germany', u'full_name': u'T. Herrmann'}, {u'author_order': 6, u'affiliation': u'Globalfoundries, Technology Development Department, Singapore', u'full_name': u'W. Tao'}, {u'author_order': 7, u'affiliation': u'Globalfoundries, Technology Development Department, Singapore', u'full_name': u'F. Benistant'}, {u'author_order': 8, u'affiliation': u'Globalfoundries, Technology Development Department, Singapore', u'full_name': u'A. See'}, {u'author_order': 9, u'affiliation': u'Globalfoundries, Technology Development Department, Singapore', u'full_name': u'S. Chu'}, {u'author_order': 10, u'affiliation': u'Department of Electrical and Computer Engineering, National University of Singapore, Singapore', u'full_name': u'G. S. Samudra'}] IEEE Electron Device Letters, 2011

A simple and unified fundamental theory on the mechanism of stress memorization technique (SMT) is presented for the first time. This theory is based on the difference in thermal properties of the materials involved in SMT process, i.e., silicon (channel), polysilicon (gate), amorphous silicon (source/drain), SiO2 (gate oxide), as well as Si3N4 (SMT nitride stressor layer), which lead to deformations ...


Thermal and structural properties of elastic epoxy for high voltage

[{u'author_order': 1, u'affiliation': u'Sch. of Electr. Electron. & Inf. Eng., Wonkwang Univ., Ihksan, South Korea', u'full_name': u'K. Y. Lee'}, {u'author_order': 2, u'affiliation': u'Sch. of Electr. Electron. & Inf. Eng., Wonkwang Univ., Ihksan, South Korea', u'full_name': u'K. W. Lee'}, {u'author_order': 3, u'affiliation': u'Sch. of Electr. Electron. & Inf. Eng., Wonkwang Univ., Ihksan, South Korea', u'full_name': u'Y. S. Choi'}, {u'author_order': 4, u'affiliation': u'Sch. of Electr. Electron. & Inf. Eng., Wonkwang Univ., Ihksan, South Korea', u'full_name': u'D. H. Park'}] Conference Record of the Twenty-Sixth International Power Modulator Symposium, 2004 and 2004 High-Voltage Workshop., None

Elastic factors of elastic epoxy were investigated by TMA (thermomechanical analysis), DMTA (dynamic mechanical thermal analysis), and FESEM (field emission scanning electron microscope) as toughness investigation to improve brittleness of existing epoxy resin. We made of specimens with the contents of 0 phr, 20 phr and 35 phr. The ranges of measurement temperature of the TMA and DMTA were changed ...


Material properties influence performance, quality and cost - [a look back]

[{u'author_order': 1, u'full_name': u'Bernie Gollomp'}] IEEE Instrumentation & Measurement Magazine, 2009

The Industrial Revolution fostered the transformation from small, guild- governed enterprises to increasingly larger manufacturing enterprises. The Industrial Revolution was also influential in advancing and disseminating scientific and technical knowledge crucial to commercial growth. As manufacturing enterprises grew, they increasingly needed raw materials with known and assured properties. This paper discusses the influence of material properties such as elasticity, heat ...


Development of a mold resin for molded transformers and its mechanical and insulating characteristics

[{u'author_order': 1, u'affiliation': u'Hitachi Ltd., Ibaraki, Japan', u'full_name': u'K. Fukushi'}, {u'author_order': 2, u'affiliation': u'Hitachi Ltd., Ibaraki, Japan', u'full_name': u'H. Takasaki'}, {u'author_order': 3, u'affiliation': u'Hitachi Ltd., Ibaraki, Japan', u'full_name': u'T. Koyama'}, {u'author_order': 4, u'affiliation': u'Hitachi Ltd., Ibaraki, Japan', u'full_name': u'T. Fujimori'}] [1991] Proceedings of the 3rd International Conference on Properties and Applications of Dielectric Materials, None

To obtain a low-thermal-expansion mold resin, various tests to obtain the most suitable coupling agent for the resin were carried out. As a result, the mixture of titanate and silane type coupling agents allowed an increase in filler content to higher than 60% in volume. The developed mold resin showed a thermal expansion coefficient as low as that of aluminum ...


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Educational Resources on Thermal expansion

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IEEE.tv Videos

IMS 2011 Microapps - Tools for Creating FET and MMIC Thermal Profiles
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
Intel Joule 570x Developer Kit with Expansion Board: Mouser's Engineering Bench Talk
On the Characterization of Thermal Coupling Resistance in a Current Mirror: RFIC Industry Showcase 2016
IEEE @ SXSW 2015 - Lessons from Africa: Relationships Over Privacy
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
APEC 2011 Exhibitor Overview
ITRI: Technology Advances in Flexible Displays and Substrates
KeyTalk with Hamish Laird: The Gap Between Large Power Converters and Small Power Converters - APEC 2017
Winds of Change: Part 3 - Wind Energy in Developing Countries
Superconducting Detectors for Astrophysics and Cosmology - ASC-2014 Plenary series - 9 of 13 - Thursday 2014/8/14
Brooklyn 5G - 2015 - Hossein Moiin - Expanding the Human Possibilities with 5G
Global Impact of IEEE Standards on Smart Grid: Bill Ash
Stochastic Single Flux Quantum Neuromorphic Computing using Magnetically Tunable Josephson Junctions - Stephen Russek: 2016 International Conference on Rebooting Computing
Karen Bartleson - Standards Education 3 of 3 | IEEE-SA
Low-energy High-performance Computing based on Superconducting Technology
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15
IEEE Standards Association: A World Without Standards - Lights Out

IEEE-USA E-Books

  • Approaches of Modeling and Simulation of Stresses in S Finishes

    This chapter discusses the constitutive model of Sn grain as the foundation of finite element method (FEM) modeling. It introduces the strain energy density (SED) as the failure criterion. The chapter presents a common technique in Sn finish FEM modeling and grain rotation. It provides two FEM examples to explore the impact of the grain orientation on whisker growth in Sn finishes. The first example focuses on the elastic behavior of three immediately adjacent grains without considering the effects of grains in longer distances, while the second example considered elastoplastic behavior of a much larger group of grains. In order to describe the geometric characteristics of the textural Sn finish on a Cu leadframe, a Voronoi diagram method is used to generate the grain pattern. The simplified plasticity model is useful if the SED criterion is adapted for Sn whisker growth.

  • Thermal Detectors: Mechanisms, Operation, and Performance

    This chapter discusses the mechanisms, operation, and performance of thermal detectors. Thermal detector mechanisms are easily understood and the responsivity easily predicted using only a coefficient that tells how the observable varies with temperature and the formulas of classical thermal engineering. The thermal detectors of importance today are highlighted; they include Golay cells, microbolometer arrays, thermopiles, and ferroelectric and pyroelectric detectors. The Golay cell was a very early, simple thermal detector. Infrared (IR) detection by bolometers and microbolometers depends on the change in electrical resistance of a material as the temperature of the material changes. An important class of thermal detectors depends on the Seebeck effect, the direct conversion of temperature differences between two junctions of dissimilar materials to electric voltages. Pyroelectic and ferroelectric detectors differ from the other thermal detectors in that they depend on a change of the detector temperature, as opposed to the temperature itself.



Standards related to Thermal expansion

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Guide to Specifications for Gas-Insulated, Electric Power Substation Equipment

This guide covers the technical requirements for the design, fabrication, testing, installation, and in-service performance of gas-insulated substations(GIS). In line with the user functional one-line diagram, the supplier should furnish all components of the GIS such as circuit breakers(CB), disconnect switches(DS), maintenance ground switches (MGS), fast-acting ground switches(FGS), voltage transformers(VT), current transformers(CT), SF6-to-air bushings, SF6-to-cable terminations, surge arresters, all the ...


IEEE Recommended Practice for Electric Power Systems in Commercial Buildings



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