Thermal expansion

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Thermal expansion is the tendency of matter to change in volume in response to a change in temperature. When a substance is heated, its particles begin moving more and thus usually maintain a greater average separation. (Wikipedia.org)






Conferences related to Thermal expansion

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2019 IEEE Pulsed Power & Plasma Science (PPPS)

Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.


2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO)

Nanotechnology


2018 IEEE 45th Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


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Periodicals related to Thermal expansion

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Xplore Articles related to Thermal expansion

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Educational Resources on Thermal expansion

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eLearning

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IEEE.tv Videos

IMS 2011 Microapps - Tools for Creating FET and MMIC Thermal Profiles
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
Intel Joule 570x Developer Kit with Expansion Board: Mouser's Engineering Bench Talk
On the Characterization of Thermal Coupling Resistance in a Current Mirror: RFIC Industry Showcase 2016
IEEE @ SXSW 2015 - Lessons from Africa: Relationships Over Privacy
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
APEC 2011 Exhibitor Overview
ITRI: Technology Advances in Flexible Displays and Substrates
KeyTalk with Hamish Laird: The Gap Between Large Power Converters and Small Power Converters - APEC 2017
Winds of Change: Part 3 - Wind Energy in Developing Countries
Superconducting Detectors for Astrophysics and Cosmology - ASC-2014 Plenary series - 9 of 13 - Thursday 2014/8/14
Brooklyn 5G - 2015 - Hossein Moiin - Expanding the Human Possibilities with 5G
Global Impact of IEEE Standards on Smart Grid: Bill Ash
Stochastic Single Flux Quantum Neuromorphic Computing using Magnetically Tunable Josephson Junctions - Stephen Russek: 2016 International Conference on Rebooting Computing
Karen Bartleson - Standards Education 3 of 3 | IEEE-SA
Low-energy High-performance Computing based on Superconducting Technology
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15
Karen Bartleson - Standards Education 2 of 3 | IEEE-SA

IEEE-USA E-Books

No IEEE-USA E-Books are currently tagged "Thermal expansion"



Standards related to Thermal expansion

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Guide to Specifications for Gas-Insulated, Electric Power Substation Equipment

This guide covers the technical requirements for the design, fabrication, testing, installation, and in-service performance of gas-insulated substations(GIS). In line with the user functional one-line diagram, the supplier should furnish all components of the GIS such as circuit breakers(CB), disconnect switches(DS), maintenance ground switches (MGS), fast-acting ground switches(FGS), voltage transformers(VT), current transformers(CT), SF6-to-air bushings, SF6-to-cable terminations, surge arresters, all the ...


IEEE Recommended Practice for Electric Power Systems in Commercial Buildings



Jobs related to Thermal expansion

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