Thermal expansion

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Thermal expansion is the tendency of matter to change in volume in response to a change in temperature. When a substance is heated, its particles begin moving more and thus usually maintain a greater average separation. (

Conferences related to Thermal expansion

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.

2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to practicing power electronics engineer.

2019 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges.

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Periodicals related to Thermal expansion

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.

Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.

Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission

Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.

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Xplore Articles related to Thermal expansion

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Pressure dependence of molar volume near the melting point in benzene

[{u'author_order': 1, u'affiliation': u'Department of Physics, Middle East Technical University, Ankara 06531, Turkey', u'full_name': u'H. Yurtseven'}, {u'author_order': 2, u'affiliation': u'Department of Physics Engineering, Hacettepe University, Beytepe, Ankara 06800, Turkey', u'full_name': u'T. \xdcnsal'}] Tsinghua Science and Technology, 2007

The pressure dependence of the molar volume was at constant temperatures close to the melting point in benzene. The molar volume of benzene was calculated using experimental data for the thermal expansivity for constant temperatures of 25°C, 28.5°C, 40°C, and 51°C at various pressures for both the solid and liquid phases. The predictions are in good agreement with the observed ...

Current Capabilities/needs and future possibilities of multi-Chip-modules Summary

[{u'author_order': 1, u'affiliation': u'University of Utah', u'authorUrl': u'', u'full_name': u'R.R. Johnson', u'id': 37068975400}] [1991] 49th Annual Device Research Conference Digest, 1991


An 8b 250MHz A/D converter

[{u'author_order': 1, u'affiliation': u'Hewlett-Packard Co., Santa Clara, CA, USA', u'full_name': u'B. Peetz'}, {u'author_order': 2, u'full_name': u'B. Hamilton'}, {u'author_order': 3, u'full_name': u'J. Kang'}] 1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986

An 8b converter, fabricated in a 5GHz, oxide-isolated bipolar process, will be reported. Full power bandwidth is 125MHz. The packaging used for the converter accomodates a power dissipation of 12W.

Development of a multichannel ultrasonic interferometer for the measurements under high pressures and its application to biomolecular studies

[{u'author_order': 1, u'affiliation': u'Inst. of Biol. Phys., Acad. of Sci., Pushchino, USSR', u'authorUrl': u'', u'full_name': u'A.P. Sarvazyan', u'id': 37300321900}, {u'author_order': 2, u'affiliation': u'Inst. of Biol. Phys., Acad. of Sci., Pushchino, USSR', u'authorUrl': u'', u'full_name': u'T.V. Chalikian', u'id': 38163077100}] IEEE 1988 Ultrasonics Symposium Proceedings., 1988

A description is given of a device that comprises four parallel fixed-path interferometric cells with a volume of 0.2 cc each. This device provides relative measurements of sound velocity with an error of about 10/sup -3/ to 10/sup -4/% in the pressure range of 1 to 2500 bar. The specific increments of the nonlinearity acoustic parameter B/A, for different biomolecular ...

Optimization design for CNC machine spindle system heat-dissipating structure

[{u'author_order': 1, u'affiliation': u'College of Mechanical Engineering, University of Shanghai for Science and Technology, China', u'authorUrl': u'', u'full_name': u'Haolin Li', u'id': 37657273700}, {u'author_order': 2, u'affiliation': u'College of Mechanical Engineering, University of Shanghai for Science and Technology, China', u'authorUrl': u'', u'full_name': u'Xingjuan Ying', u'id': 37896753500}, {u'author_order': 3, u'affiliation': u'Institute of Machine Tool, University Stuttgart, Holzgartenstrasse 17, 70174, Germany', u'authorUrl': u'', u'full_name': u'Uwe Heisel', u'id': 37891659900}] 2009 International Conference on Mechatronics and Automation, 2009

In this paper, the thermal characteristics of the CNC machine spindle system is simulated based on finite element method. The heat boundary conditions of the finite element model are calibrated by comparing with the experimental results. Furthermore, the spindle system thermal errors are calculated and reduced by two approaches: rational arrangement of the heat-dissipating rib plates and parametric optimization design ...

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Educational Resources on Thermal expansion

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No eLearning Articles are currently tagged "Thermal expansion" Videos

IMS 2011 Microapps - Tools for Creating FET and MMIC Thermal Profiles
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
Intel Joule 570x Developer Kit with Expansion Board: Mouser's Engineering Bench Talk
On the Characterization of Thermal Coupling Resistance in a Current Mirror: RFIC Industry Showcase 2016
IEEE @ SXSW 2015 - Lessons from Africa: Relationships Over Privacy
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
APEC 2011 Exhibitor Overview
ITRI: Technology Advances in Flexible Displays and Substrates
Big Data Meets Big Compute - 2018 IEEE Industry Summit on the Future of Computing
KeyTalk with Hamish Laird: The Gap Between Large Power Converters and Small Power Converters - APEC 2017
Winds of Change: Part 3 - Wind Energy in Developing Countries
Hertz-Class Brillouin Lasing with Nanokelvin Thermal Sensing - William Loh - Closing Ceremony, IPC 2018
Superconducting Detectors for Astrophysics and Cosmology - ASC-2014 Plenary series - 9 of 13 - Thursday 2014/8/14
Brooklyn 5G - 2015 - Hossein Moiin - Expanding the Human Possibilities with 5G
Global Impact of IEEE Standards on Smart Grid: Bill Ash
Stochastic Single Flux Quantum Neuromorphic Computing using Magnetically Tunable Josephson Junctions - Stephen Russek: 2016 International Conference on Rebooting Computing
Low-energy High-performance Computing based on Superconducting Technology
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15


  • Thermal Detectors: Mechanisms, Operation, and Performance

    This chapter discusses the mechanisms, operation, and performance of thermal detectors. Thermal detector mechanisms are easily understood and the responsivity easily predicted using only a coefficient that tells how the observable varies with temperature and the formulas of classical thermal engineering. The thermal detectors of importance today are highlighted; they include Golay cells, microbolometer arrays, thermopiles, and ferroelectric and pyroelectric detectors. The Golay cell was a very early, simple thermal detector. Infrared (IR) detection by bolometers and microbolometers depends on the change in electrical resistance of a material as the temperature of the material changes. An important class of thermal detectors depends on the Seebeck effect, the direct conversion of temperature differences between two junctions of dissimilar materials to electric voltages. Pyroelectic and ferroelectric detectors differ from the other thermal detectors in that they depend on a change of the detector temperature, as opposed to the temperature itself.

  • Approaches of Modeling and Simulation of Stresses in S Finishes

    This chapter discusses the constitutive model of Sn grain as the foundation of finite element method (FEM) modeling. It introduces the strain energy density (SED) as the failure criterion. The chapter presents a common technique in Sn finish FEM modeling and grain rotation. It provides two FEM examples to explore the impact of the grain orientation on whisker growth in Sn finishes. The first example focuses on the elastic behavior of three immediately adjacent grains without considering the effects of grains in longer distances, while the second example considered elastoplastic behavior of a much larger group of grains. In order to describe the geometric characteristics of the textural Sn finish on a Cu leadframe, a Voronoi diagram method is used to generate the grain pattern. The simplified plasticity model is useful if the SED criterion is adapted for Sn whisker growth.

Standards related to Thermal expansion

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Guide to Specifications for Gas-Insulated, Electric Power Substation Equipment

This guide covers the technical requirements for the design, fabrication, testing, installation, and in-service performance of gas-insulated substations(GIS). In line with the user functional one-line diagram, the supplier should furnish all components of the GIS such as circuit breakers(CB), disconnect switches(DS), maintenance ground switches (MGS), fast-acting ground switches(FGS), voltage transformers(VT), current transformers(CT), SF6-to-air bushings, SF6-to-cable terminations, surge arresters, all the ...

IEEE Recommended Practice for Electric Power Systems in Commercial Buildings

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