96 resources related to Thermal expansion
- Topics related to Thermal expansion
- IEEE Organizations related to Thermal expansion
- Conferences related to Thermal expansion
- Periodicals related to Thermal expansion
- Most published Xplore authors for Thermal expansion
Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference
The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.
This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.
ECTC is the premier international conferencesponsored by the IEEE Components, Packaging andManufacturing Technology (CPMT) Society. ECTCpapers comprise a wide spectrum of topics, including3D packaging, electronic components, materials,assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.
No Xplore Articles are currently tagged "Thermal expansion"
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
Intel Joule 570x Developer Kit with Expansion Board: Mouser's Engineering Bench Talk
On the Characterization of Thermal Coupling Resistance in a Current Mirror: RFIC Industry Showcase 2016
IEEE @ SXSW 2015 - Lessons from Africa: Relationships Over Privacy
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
APEC 2011 Exhibitor Overview
ITRI: Technology Advances in Flexible Displays and Substrates
KeyTalk with Hamish Laird: The Gap Between Large Power Converters and Small Power Converters - APEC 2017
Winds of Change: Part 3 - Wind Energy in Developing Countries
Superconducting Detectors for Astrophysics and Cosmology - ASC-2014 Plenary series - 9 of 13 - Thursday 2014/8/14
Brooklyn 5G - 2015 - Hossein Moiin - Expanding the Human Possibilities with 5G
Global Impact of IEEE Standards on Smart Grid: Bill Ash
Stochastic Single Flux Quantum Neuromorphic Computing using Magnetically Tunable Josephson Junctions - Stephen Russek: 2016 International Conference on Rebooting Computing
Low-energy High-performance Computing based on Superconducting Technology
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15
Karen Bartleson - Standards Education 3 of 3 | IEEE-SA
Steve Mills - Standards Education 2 of 3 | IEEE-SA
This guide covers the technical requirements for the design, fabrication, testing, installation, and in-service performance of gas-insulated substations(GIS). In line with the user functional one-line diagram, the supplier should furnish all components of the GIS such as circuit breakers(CB), disconnect switches(DS), maintenance ground switches (MGS), fast-acting ground switches(FGS), voltage transformers(VT), current transformers(CT), SF6-to-air bushings, SF6-to-cable terminations, surge arresters, all the ...