Thermal conductivity

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In physics, thermal conductivity,, is the property of a material's ability to conduct heat. (Wikipedia.org)






Conferences related to Thermal conductivity

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2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.


2012 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC)

Hydropower Engineering, Thermal Power Engineering, Nuclear Power Engineering, New and Renewable Sources of Energy, Power Transmission and Distribution Techniques, Power Systems Management, Smart Grid, Best Practice.

  • 2011 Asia-Pacific Power and Energy Engineering Conference (APPEEC)

    Hydropower Engineering, Thermal Power Engineering, Nuclear Power Engineering, New and Renewable Sources of Energy, Power Transmission and Distribution Techniques, Power Systems Management, Smart Grid, Best Practice

  • 2010 Asia-Pacific Power and Energy Engineering Conference (APPEEC)

    Hydropower Engineering, Thermal Power Engineering, Nuclear Power Engineering, New and Renewable Sources of Energy, Power Transmission and Distribution Techniques, Power Systems Management, Smart Grid, Best Practice



Periodicals related to Thermal conductivity

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Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


Power Delivery, IEEE Transactions on

Research, development, design, application, construction, the installation and operation of apparatus, equipment, structures, materials, and systems for the safe, reliable, and economic delivery and control of electric energy for general industrial, commercial, public, and domestic consumption.



Most published Xplore authors for Thermal conductivity

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Xplore Articles related to Thermal conductivity

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Ground state and excitations at very low temperature in density wave systems

P. Monceau International Conference on Science and Technology of Synthetic Metals, 1994

First Page of the Article ![](/xploreAssets/images/absImages/00835601.png)


Recognition of heat-conductive filling agents of a thermoelectric refrigeration system with Focused Time — Delay Neural Network

Ivaylo Belovski; Sotir Sotirov; Anatoliy Aleksandrov; Nikolay Sotirov 2017 15th International Conference on Electrical Machines, Drives and Power Systems (ELMA), 2017

Neural Networks are an information processing paradigm that is inspired from the biological nervous systems, such as the human brain, which process information. In the system we use Focused Time-Delay Neural Network for recognizing heat-conductive filling agents It is composed of a large number of highly interconnected processing elements (neurons) working in symbiosis to solve many kinds of problems. In ...


Concept of novel CVD diamond high voltage, high power and study of ohmic contacts on diamond

G. Civrac; H. Schneider; P. Bergonzo; M. Nesladek; T. Camps 2007 European Conference on Power Electronics and Applications, 2007

Diamond exceptional electronic and thermal properties make it a very promising material for future applications in power electronics, especially for high voltage and/or high temperature applications. In this paper, the principle of high power, high voltage switches that take advantage of these properties are illustrated by simulations. Technological steps necessary to their fabrication have been developed. We present heavily B-doped ...


Single-walled carbon nanotue pirani vacuum gauge

Wei Li; Zhihui Wang; Jinwen Zhang 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, 2010

This paper presents the design, fabrication and synthesis of a carbon nanotube Pirani vacuum gauge which comprises 5-μm-long SWNTs as heater and Au/W as electrodes. Results show that the TCR of SWNTs is negative and about -0.004/°C. SWNTs Pirani vacuum gauge was demonstrated with a dynamic range of 2500Pa to 40Pa in air environment. The average sensitivity of SWNTs Pirani ...


High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka; Zengbin Wang; Tomonori Iizuka; Masahiro Kozako; Yoshimichi Ohki 2011 International Conference on Power and Energy Systems, 2011

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m*K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to ...


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Educational Resources on Thermal conductivity

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eLearning

Ground state and excitations at very low temperature in density wave systems

P. Monceau International Conference on Science and Technology of Synthetic Metals, 1994

First Page of the Article ![](/xploreAssets/images/absImages/00835601.png)


Recognition of heat-conductive filling agents of a thermoelectric refrigeration system with Focused Time — Delay Neural Network

Ivaylo Belovski; Sotir Sotirov; Anatoliy Aleksandrov; Nikolay Sotirov 2017 15th International Conference on Electrical Machines, Drives and Power Systems (ELMA), 2017

Neural Networks are an information processing paradigm that is inspired from the biological nervous systems, such as the human brain, which process information. In the system we use Focused Time-Delay Neural Network for recognizing heat-conductive filling agents It is composed of a large number of highly interconnected processing elements (neurons) working in symbiosis to solve many kinds of problems. In ...


Concept of novel CVD diamond high voltage, high power and study of ohmic contacts on diamond

G. Civrac; H. Schneider; P. Bergonzo; M. Nesladek; T. Camps 2007 European Conference on Power Electronics and Applications, 2007

Diamond exceptional electronic and thermal properties make it a very promising material for future applications in power electronics, especially for high voltage and/or high temperature applications. In this paper, the principle of high power, high voltage switches that take advantage of these properties are illustrated by simulations. Technological steps necessary to their fabrication have been developed. We present heavily B-doped ...


Single-walled carbon nanotue pirani vacuum gauge

Wei Li; Zhihui Wang; Jinwen Zhang 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, 2010

This paper presents the design, fabrication and synthesis of a carbon nanotube Pirani vacuum gauge which comprises 5-μm-long SWNTs as heater and Au/W as electrodes. Results show that the TCR of SWNTs is negative and about -0.004/°C. SWNTs Pirani vacuum gauge was demonstrated with a dynamic range of 2500Pa to 40Pa in air environment. The average sensitivity of SWNTs Pirani ...


High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka; Zengbin Wang; Tomonori Iizuka; Masahiro Kozako; Yoshimichi Ohki 2011 International Conference on Power and Energy Systems, 2011

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m*K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Conductive Materials

    This chapter contains sections titled: Historical Survey Classification of Conductive Properties Under the Band Theory Free-Electron Theory of Metals - Ohm's Law Ohm's Law - Alternate Derivation The Mean Time Between Electron-Lattice Interactions Mean Free Path Joule's Law The Debye Theory of Specific Heat The Temperature Dependence of the Resistivity of Metals Thermal Conductivity of Metals and the Wiedemann-Franz Law Conductivity of Semiconductors Maxwell's Equations for Conductive Media This chapter contains sections titled: References Problems

  • High Temperature Aluminum Nitride Packaging

    As is often the case, advances in electronics are dictated not by the IC devices themselves, but by the ability to package those devices. This is certainly the case for high temperature electronics. The limits of conventional packaging materials such as glass-epoxy circuit boards, plated copper traces and Sn-Pb solder are obvious at temperatures in excess of 300°C. Even standard ceramic packages based on Al2O3 are inadequate above 300°C. Novel materials and assembly techniques required for high temperature operation are presented in this paper. Factors such as thermal conductivity, expansion coefficients, oxidation and diffusion become more critical as operating temperatures increase, and therefore play major roles in determining package construction techniques. The evolution of high temperature package construction will be reviewed in light of these constraints. High temperature packages have been developed based on aluminum nitride (AIN) substrates and nickel metallization. Key features of the packages described in this paper are molded AIN bodies, directly bonded low temperature cofired ceramic (LTCC) frames and silver active braze seals, all of which contribute to producing hermetic packages at high temperatures. A discussion of interconnect metallurgies and attachment methods is included. Test data demonstrating the reliability of AIN high temperature packages will also be presented.

  • Qualitative Study of the Shock Layer in Special Cases

    This chapter contains sections titled: Negligible Bulk Viscosity, Shear Viscosity, and Thermal Conductivity, Negligible Shear Viscosity and Thermal Conductivity, Negligible Electrical Conductivity and Current Inertia, Negligible Bulk Viscosity and Shear Viscosity, Magnetic Field Parallel to Plane of Shock Wave, "Swith-on" and "Swith-off" Shocks, Interpretation of the Results

  • Phonon Transport in Si Nanostructures

    This chapter develops a Monte Carlo (MC) method for solving the phonon Boltzmann transport equation (BTE) to perform more accurate heat transfer simulations in nanoscale Si devices. In order to evaluate the thermal conductivity, one can adopted one particle MC method, which enables obtaining the statistical convergence efficiently. The chapter uses the MC simulator to analyze the quasi¿¿¿ballistic phonon transport effect on the heat conduction in Si. It considers that the MC method is a good tool for studying the mixture regime between the ballistic and diffusive nature for the phonon transport. The chapter shows the realistic dispersion relation of phonons in bulk Si calculated from the adiabatic bond charge model, whose accuracy was validated through comparison with experimental neutron scattering data. The thermal conductivity of Si nanowires (SiNWs) was also calculated using the MC simulator. In nanostructures, phonons are frequently scattered at boundaries, which significantly impedes heat conduction.

  • Bulk MOSFET

    This chapter focuses on the DC characteristics of bulk metal oxide semiconductor field???effect transistor (MOSFET), and presents a theoretical analysis of the subthreshold and post???threshold current characteristics as an aid to low???energy device design. In a short???channel bulk MOSFET, drain???induced barrier lowering (DIBL) near the source junction at the front interface significantly degrades the subthreshold swing (SS). Band???to???band tunneling often occurs in the gate???drain overlap region. It is sometimes called the gate???induced drain leakage (GIDL) current. For MOSFETs with a thin gate oxide, it has a significant influence on DC and AC operation. In the bulk MOSFET, the thermal conductivity of the substrate is not so high. According to simulations, the temperature near the drain junction quickly rises to 100?????C. Since self???heating effects degrade the surface mobility of carriers, they must be taken into account. In electrostatic???discharge (ESD) protection circuits, self???heating effects reduce the temperature margin for the second breakdown.



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