Thermal conductivity

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In physics, thermal conductivity,, is the property of a material's ability to conduct heat. (Wikipedia.org)






Conferences related to Thermal conductivity

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2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.


2012 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC)

Hydropower Engineering, Thermal Power Engineering, Nuclear Power Engineering, New and Renewable Sources of Energy, Power Transmission and Distribution Techniques, Power Systems Management, Smart Grid, Best Practice.

  • 2011 Asia-Pacific Power and Energy Engineering Conference (APPEEC)

    Hydropower Engineering, Thermal Power Engineering, Nuclear Power Engineering, New and Renewable Sources of Energy, Power Transmission and Distribution Techniques, Power Systems Management, Smart Grid, Best Practice

  • 2010 Asia-Pacific Power and Energy Engineering Conference (APPEEC)

    Hydropower Engineering, Thermal Power Engineering, Nuclear Power Engineering, New and Renewable Sources of Energy, Power Transmission and Distribution Techniques, Power Systems Management, Smart Grid, Best Practice



Periodicals related to Thermal conductivity

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Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.



Most published Xplore authors for Thermal conductivity

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Xplore Articles related to Thermal conductivity

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Glass-ceramic on metal substrates for high performance packaging

E. A. Logan; D. Holland; J. S. Thorp; G. Partridge Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium, 1988

Several glass-ceramic on metal coatings have been evaluated to address the need for a high thermal conductivity substrate. The substrate materials have been chosen and processed to given them thermal expansion coefficients which are similar to that of silicon, thus avoiding the creation of stresses in the device during thermal cycling. The thermal expansion matching of the glass- ceramic to ...


Two-dimensional current density and temperature development in the return rail of an EM launcher with temperature-dependent properties

P. A. Drake; C. E. Rathmann IEEE Transactions on Magnetics, 1991

A method used to model the two-dimensional current and temperature development in the return rail of an electromagnetic launcher (EML) during launch, incorporating temperature-dependent electrical and thermal material properties, is presented. Due to these temperature dependencies and the nonlinearities they introduce, the derived equations must be solved numerically. Comparisons of the current and temperature responses are made with the results ...


Origin of local temperature variation during spike anneal and millisecond anneal

R. Beneyton; A. Colin; H. Bono; F. Cacho; M. Bidaud; B. Dumont; P. Morin; K. Barla 2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors, 2008

Local thermal variation occurring during light enhanced rapid thermal process (RTP) and millisecond anneals called "pattern effects" have various origin, with more or less impact as function of the used process. The main issues concern the variation of thermal conductivity and the variation of the light absorption by optical interference or diffraction effects. In this paper, a large panel of ...


Comparative thermal analysis of commercial and novel hybrid thermal greases

Przemysław Krystian Matkowski Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, 2014

Consumer electronics such as portable devices (laptops, smartphones) become smaller, thinner and more powerful. In such devices a passive cooling begins to play a dominant role in heat dissipation process. In passive cooling systems thermal resistance of thermal path between semiconductor junction and radiator should be progressively reduced. It can be done by application of efficient (high thermal conductivity) thermal ...


Observation of the thermal nonlinear optical effect in a microring resonator based on a small SU-8 polymer ridge optical waveguide

Liu Yang; Daoxin Dai; Jian-jun He; Sailing He 2009 Asia Communications and Photonics conference and Exhibition (ACP), 2009

The thermal nonlinear optical effect is observed in a microring resonator based on a small SU-8 polymer ridge optical waveguide. The resonant wavelength blue shifts almost linearly with a slope of about −0.8 pm/mW as the input power increases. The absorption mechanism is analyzed in detail.


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Educational Resources on Thermal conductivity

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eLearning

Glass-ceramic on metal substrates for high performance packaging

E. A. Logan; D. Holland; J. S. Thorp; G. Partridge Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium, 1988

Several glass-ceramic on metal coatings have been evaluated to address the need for a high thermal conductivity substrate. The substrate materials have been chosen and processed to given them thermal expansion coefficients which are similar to that of silicon, thus avoiding the creation of stresses in the device during thermal cycling. The thermal expansion matching of the glass- ceramic to ...


Two-dimensional current density and temperature development in the return rail of an EM launcher with temperature-dependent properties

P. A. Drake; C. E. Rathmann IEEE Transactions on Magnetics, 1991

A method used to model the two-dimensional current and temperature development in the return rail of an electromagnetic launcher (EML) during launch, incorporating temperature-dependent electrical and thermal material properties, is presented. Due to these temperature dependencies and the nonlinearities they introduce, the derived equations must be solved numerically. Comparisons of the current and temperature responses are made with the results ...


Origin of local temperature variation during spike anneal and millisecond anneal

R. Beneyton; A. Colin; H. Bono; F. Cacho; M. Bidaud; B. Dumont; P. Morin; K. Barla 2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors, 2008

Local thermal variation occurring during light enhanced rapid thermal process (RTP) and millisecond anneals called "pattern effects" have various origin, with more or less impact as function of the used process. The main issues concern the variation of thermal conductivity and the variation of the light absorption by optical interference or diffraction effects. In this paper, a large panel of ...


Comparative thermal analysis of commercial and novel hybrid thermal greases

Przemysław Krystian Matkowski Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, 2014

Consumer electronics such as portable devices (laptops, smartphones) become smaller, thinner and more powerful. In such devices a passive cooling begins to play a dominant role in heat dissipation process. In passive cooling systems thermal resistance of thermal path between semiconductor junction and radiator should be progressively reduced. It can be done by application of efficient (high thermal conductivity) thermal ...


Observation of the thermal nonlinear optical effect in a microring resonator based on a small SU-8 polymer ridge optical waveguide

Liu Yang; Daoxin Dai; Jian-jun He; Sailing He 2009 Asia Communications and Photonics conference and Exhibition (ACP), 2009

The thermal nonlinear optical effect is observed in a microring resonator based on a small SU-8 polymer ridge optical waveguide. The resonant wavelength blue shifts almost linearly with a slope of about −0.8 pm/mW as the input power increases. The absorption mechanism is analyzed in detail.


More eLearning Resources

IEEE-USA E-Books

  • High Temperature Aluminum Nitride Packaging

    As is often the case, advances in electronics are dictated not by the IC devices themselves, but by the ability to package those devices. This is certainly the case for high temperature electronics. The limits of conventional packaging materials such as glass-epoxy circuit boards, plated copper traces and Sn-Pb solder are obvious at temperatures in excess of 300°C. Even standard ceramic packages based on Al2O3 are inadequate above 300°C. Novel materials and assembly techniques required for high temperature operation are presented in this paper. Factors such as thermal conductivity, expansion coefficients, oxidation and diffusion become more critical as operating temperatures increase, and therefore play major roles in determining package construction techniques. The evolution of high temperature package construction will be reviewed in light of these constraints. High temperature packages have been developed based on aluminum nitride (AIN) substrates and nickel metallization. Key features of the packages described in this paper are molded AIN bodies, directly bonded low temperature cofired ceramic (LTCC) frames and silver active braze seals, all of which contribute to producing hermetic packages at high temperatures. A discussion of interconnect metallurgies and attachment methods is included. Test data demonstrating the reliability of AIN high temperature packages will also be presented.

  • Qualitative Study of the Shock Layer in Special Cases

    This chapter contains sections titled: Negligible Bulk Viscosity, Shear Viscosity, and Thermal Conductivity, Negligible Shear Viscosity and Thermal Conductivity, Negligible Electrical Conductivity and Current Inertia, Negligible Bulk Viscosity and Shear Viscosity, Magnetic Field Parallel to Plane of Shock Wave, "Swith-on" and "Swith-off" Shocks, Interpretation of the Results

  • Phonon Transport in Si Nanostructures

    This chapter develops a Monte Carlo (MC) method for solving the phonon Boltzmann transport equation (BTE) to perform more accurate heat transfer simulations in nanoscale Si devices. In order to evaluate the thermal conductivity, one can adopted one particle MC method, which enables obtaining the statistical convergence efficiently. The chapter uses the MC simulator to analyze the quasi¿¿¿ballistic phonon transport effect on the heat conduction in Si. It considers that the MC method is a good tool for studying the mixture regime between the ballistic and diffusive nature for the phonon transport. The chapter shows the realistic dispersion relation of phonons in bulk Si calculated from the adiabatic bond charge model, whose accuracy was validated through comparison with experimental neutron scattering data. The thermal conductivity of Si nanowires (SiNWs) was also calculated using the MC simulator. In nanostructures, phonons are frequently scattered at boundaries, which significantly impedes heat conduction.

  • Bulk MOSFET

    This chapter focuses on the DC characteristics of bulk metal oxide semiconductor field???effect transistor (MOSFET), and presents a theoretical analysis of the subthreshold and post???threshold current characteristics as an aid to low???energy device design. In a short???channel bulk MOSFET, drain???induced barrier lowering (DIBL) near the source junction at the front interface significantly degrades the subthreshold swing (SS). Band???to???band tunneling often occurs in the gate???drain overlap region. It is sometimes called the gate???induced drain leakage (GIDL) current. For MOSFETs with a thin gate oxide, it has a significant influence on DC and AC operation. In the bulk MOSFET, the thermal conductivity of the substrate is not so high. According to simulations, the temperature near the drain junction quickly rises to 100?????C. Since self???heating effects degrade the surface mobility of carriers, they must be taken into account. In electrostatic???discharge (ESD) protection circuits, self???heating effects reduce the temperature margin for the second breakdown.

  • Conductive Materials

    This chapter contains sections titled: Historical Survey Classification of Conductive Properties Under the Band Theory Free-Electron Theory of Metals - Ohm's Law Ohm's Law - Alternate Derivation The Mean Time Between Electron-Lattice Interactions Mean Free Path Joule's Law The Debye Theory of Specific Heat The Temperature Dependence of the Resistivity of Metals Thermal Conductivity of Metals and the Wiedemann-Franz Law Conductivity of Semiconductors Maxwell's Equations for Conductive Media This chapter contains sections titled: References Problems



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