Temperature

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Temperature is a physical property of matter that quantitatively expresses the common notions of hot and cold. (Wikipedia.org)






Conferences related to Temperature

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2014 IEEE Industry Applications Society Annual Meeting

The Annual Meeting is a gathering of experts who work and conduct researchin the industrial applications of electrical systems.

  • 2013 IEEE Industry Applications Society Annual Meeting

    The Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.

  • 2012 IEEE Industry Applications Society Annual Meeting

    The Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.

  • 2011 IEEE Industry Applications Society Annual Meeting

    The Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.

  • 2010 IEEE Industry Applications Society Annual Meeting

    The 2010 IAS Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.


2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

EuroSimE addresses the results of both fundamental researchand industrial application in the fields of thermal, mechanical and multiphysicssimulation and experiments in microelectronics and microsystems.


2013 21st International Conference on Geoinformatics

GIS in Regional Economic Development and Environmental Protection under Globalization


2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

EPTC aims to provide a good coverage of technological developments in allareas of electronic packaging from design to manufacturing and operation. It is a major forum for theexchange of knowledge and provides opportunities to network and meet leading experts in the field.


2012 IEEE International Symposium on Electrical Insulation (ISEI)

This conference is directed towards those who develop, test or use electrical insulation in electrical equipment.


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Periodicals related to Temperature

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Geoscience and Remote Sensing, IEEE Transactions on

Theory, concepts, and techniques of science and engineering as applied to sensing the earth, oceans, atmosphere, and space; and the processing, interpretation, and dissemination of this information.


Instrumentation and Measurement, IEEE Transactions on

Measurements and instrumentation utilizing electrical and electronic techniques.



Most published Xplore authors for Temperature

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Xplore Articles related to Temperature

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Study of NiZn ferrite absorption: Effect of relative density and microstructure

Luis Nuno; Antonio Barba; Juan V. Balbastre; Carolina Clausell; Ana Vines 2009 International Symposium on Electromagnetic Compatibility - EMC Europe, 2009

A study to optimize the reflectivity of ferrite absorbers is presented. The study considers the variation of the magnetic loss factor with the evolution of fired relative density and microstructure of ferrites made from a Zn-Ni-Cu ferrite powder, and from mixture of Zn-Ni and a Cu ferrite powder. From the results, an equation which relates the magnetic loss factor to ...


A two-electron group model theory for radio-frequency ionization of noble gases with turbulent flow

M. E. Talaat IEEE Transactions on Plasma Science, 1991

Equations are derived for predicting the current-voltage characteristic curves of axial RF discharges in noble gases, with turbulent flow. The electrons are considered to be made up of two Maxwellian groups: bulk and tail electrons. The bulk electrons are described by a temperature Tb, and have kinetic energies (1/2 mv2=eV) from 0 to eV l (eVl=the threshold energy of the ...


1.3 and 1.55 <formula formulatype="inline"><tex Notation="TeX">$\mu{\rm m}$</tex></formula> Thermally Regenerated Gratings in Hydrogenated Boron/Germanium Co-Doped Photosensitivity Fiber

Hang-Zhou Yang; Wu-Yi Chong; Xue-Guang Qiao; Mei-Jane Lim; Kok-Sing Lim; Md. Rajibul Islam; Norfizah M. Ali; Harith Ahmad IEEE Sensors Journal, 2014

In this paper, we have experimentally demonstrated thermal regeneration of gratings at 1310 and 1560 nm in the hydrogenated boron/germanium codoped photosensitivity fibers. Increase in effective index of the fiber and reduced grating period are observed in the regenerated fiber Bragg grating (RFBG). The experimental results show that the temperature sensitivity of regenerated gratings at 1310 and 1560 nm is ...


Educational module for laboratory practice in the areas of instrumentation, automation, control and industrial communications. ECCI university

Luis Fernando Rico Riveros; Alexander Cortes Llanos; Victor Hugo Bernal Tristancho; Jhon Fredy Bayona Navarro 2016 Technologies Applied to Electronics Teaching (TAEE), 2016

This article presents the design and implementation of an educational module for carrying out laboratory practice in the areas of automation and industrial instrumentation. The main objective of this work is to describe the methodological design for the development of the module, which consists of five stages: proposal, design, practical experimentation, simulation and emulation of the prototype. The experimental results ...


Monitoring Roll Chock Temperature: A Wireless System for a Tandem Cold Mill

J. M. Lopera; A. Diaz; P. Baizan; J. L. Rendueles; J. M. Perez; L. Ema IEEE Industry Applications Magazine, 2012

Chock temperature control is an important issue in cold rolling mills. Traditional wired systems don't offer satisfactory results for practical use. Because of very low power consumption using Zigbee (IEEE 802.15.4) wireless technology, temperature sensors (up to 125 οC ) suitable for a tandem cold mill environment have been developed. The complete monitoring system includes repeaters, a base receiver with ...


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Educational Resources on Temperature

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eLearning

Study of NiZn ferrite absorption: Effect of relative density and microstructure

Luis Nuno; Antonio Barba; Juan V. Balbastre; Carolina Clausell; Ana Vines 2009 International Symposium on Electromagnetic Compatibility - EMC Europe, 2009

A study to optimize the reflectivity of ferrite absorbers is presented. The study considers the variation of the magnetic loss factor with the evolution of fired relative density and microstructure of ferrites made from a Zn-Ni-Cu ferrite powder, and from mixture of Zn-Ni and a Cu ferrite powder. From the results, an equation which relates the magnetic loss factor to ...


A two-electron group model theory for radio-frequency ionization of noble gases with turbulent flow

M. E. Talaat IEEE Transactions on Plasma Science, 1991

Equations are derived for predicting the current-voltage characteristic curves of axial RF discharges in noble gases, with turbulent flow. The electrons are considered to be made up of two Maxwellian groups: bulk and tail electrons. The bulk electrons are described by a temperature Tb, and have kinetic energies (1/2 mv2=eV) from 0 to eV l (eVl=the threshold energy of the ...


1.3 and 1.55 <formula formulatype="inline"><tex Notation="TeX">$\mu{\rm m}$</tex></formula> Thermally Regenerated Gratings in Hydrogenated Boron/Germanium Co-Doped Photosensitivity Fiber

Hang-Zhou Yang; Wu-Yi Chong; Xue-Guang Qiao; Mei-Jane Lim; Kok-Sing Lim; Md. Rajibul Islam; Norfizah M. Ali; Harith Ahmad IEEE Sensors Journal, 2014

In this paper, we have experimentally demonstrated thermal regeneration of gratings at 1310 and 1560 nm in the hydrogenated boron/germanium codoped photosensitivity fibers. Increase in effective index of the fiber and reduced grating period are observed in the regenerated fiber Bragg grating (RFBG). The experimental results show that the temperature sensitivity of regenerated gratings at 1310 and 1560 nm is ...


Educational module for laboratory practice in the areas of instrumentation, automation, control and industrial communications. ECCI university

Luis Fernando Rico Riveros; Alexander Cortes Llanos; Victor Hugo Bernal Tristancho; Jhon Fredy Bayona Navarro 2016 Technologies Applied to Electronics Teaching (TAEE), 2016

This article presents the design and implementation of an educational module for carrying out laboratory practice in the areas of automation and industrial instrumentation. The main objective of this work is to describe the methodological design for the development of the module, which consists of five stages: proposal, design, practical experimentation, simulation and emulation of the prototype. The experimental results ...


Monitoring Roll Chock Temperature: A Wireless System for a Tandem Cold Mill

J. M. Lopera; A. Diaz; P. Baizan; J. L. Rendueles; J. M. Perez; L. Ema IEEE Industry Applications Magazine, 2012

Chock temperature control is an important issue in cold rolling mills. Traditional wired systems don't offer satisfactory results for practical use. Because of very low power consumption using Zigbee (IEEE 802.15.4) wireless technology, temperature sensors (up to 125 οC ) suitable for a tandem cold mill environment have been developed. The complete monitoring system includes repeaters, a base receiver with ...


More eLearning Resources

IEEE.tv Videos

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Analog to Digital Traits
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
Larson Collection interview with William Alfred Fowler
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
AlGaN/GaN Plasmonic Terahertz Detectors
A Low Power High Performance PLL with Temperature Compensated VCO in 65nm CMOS: RFIC Interactive Forum
IMS 2011-100 Years of Superconductivity (1911-2011) - Existing and Emerging RF Applications of Superconductivity
A Precision 140MHz Relaxation Oscillator in 40nm CMOS with 28ppm/C Frequency Stability for Automotive SoC Applications: RFIC Interactive Forum 2017
Developing a Plasma Thruster in Costa Rica
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 1 of 7 - Gordon Donaldson: A Memory - part I - John Clarke
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15
Interaction of ferromagnetic and superconducting permanent magnets - superconducting levitation
High-current HTS cables for magnet applications - ASC-2014 Plenary series - 8 of 13 - Thursday 2014/8/14
From CAD to Test - Advances in Productivity Enhancement Techniques for Inertial Sensors Calibration and Testing - IEEE I&M Society Tutorial
One HTS Josephson Junction, An Array of Applications: Has anything come from HTS devices in the last 30 years?
Superconductors for the Future from the Perspective of the Past

IEEE-USA E-Books

  • Introduction to Biomedical Signals

    This chapter provides an introduction to biomedical signals and illustrates a few signals for gaining familiarity with their typical appearance and features. Physiological processes are complex phenomena, including nervous or hormonal stimulation and control. Most physiological processes are accompanied by or manifest themselves as signals that reflect their nature and activities. Such signals could be of many types, including biochemical in the form of hormones and neurotransmitters, electrical in the form of potential or current, and physical in the form of pressure or temperature. Diseases or defects in a biological system cause alterations in its normal physiological processes, leading to pathological processes that affect the performance, health, and general well-being of the system. A pathological process is typically associated with signals that are different in some aspects from the corresponding normal signals. If one possesses a good understanding of a system of interest, it becomes possible to observe the corresponding signals and assess the state of the system. The task is not difficult when the signal is simple and appears at the outer surface of the body.

  • Properties of Antennas

    The chapter tells readers how to use antennas by explaining their key properties. The elements of a link budget are given including path loss, polarization response, impedance mismatch loss, and noise temperature. Related topics of radar range/cross section, beam efficiency for radiometers, and antenna factor for EMC measurements are explained. Estimates of directivity from patterns bound gain. Analytical antenna models for estimates of directivity find later use. Vector effective height and reactance provide formulas for near field mutual coupling. Multipath produces fades in links and causes measurement errors.

  • Turbulent Jets in the Presence of a Flame Front (The Plume)

    This chapter contains sections titled: Possible Combustion Regimes, Distribution of Total Energy, Concentration, and Temperature in the Boundary Layer of a Jet, Physical Pattern of Combustion in a Turbulent Boundary Layer, Determination of the Combustion Temperature, Calculation of the Two- Dimensional Boundary Layer, Combustion Flame in the Main Region of a Jet, Combustion of a Homogeneous Gas in a Two-Dimensional Boundary Layer, Turbulent Jets with Diffusion Flame Fronts, Experimental Studies of Diffusion Flames

  • The Dynamics of Turbulence

    This chapter contains sections titled: Kinetic energy of the mean flow, Kinetic energy of the turbulence, Vorticity dynamics, The dynamics of temperature fluctuations

  • Practical Characteristics of LEDs

    The first thing to know about light emitting diodes (LEDs), and all diodes, is that they are current devices, not voltage devices. Power supplies for LEDs are typically designed to drive them with a constant current. For easy estimates, the forward voltage of a diode is a constant. Forward voltage depends on the temperature of the die, and this depends on how big the package is. The same diode in a bigger package will stay cooler, and thus have a higher forward voltage. Rectifier diodes and LEDs fall into the unintentional category. If they conduct in the reverse direction, there is an excellent chance that they have broken. Now with rectifier diodes, there is an easy solution. This chapter talks about quite a number of parameters for LEDs, as well as their temperature variations. Realizing how much the variation in some of these parameters influences performance, manufacturers offer binning.

  • Thermionic Integrated Micromodules: TIMMS

    "HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.

  • Jets in Finite Space

    The author's first monograph on turbulent jets, in 1936, dealt solely with a free submerged jet. Since that time, the theory of the turbulent jet has been developed in many published works both in the USSR and abroad: it has been enriched with a large amount of experimental material and has been applied in many new fields of engineering.In the last 10 years very substantial progress has been made, and it has now become possible to go beyond the free submerged jet and to solve the problem of a jet in a stream of fluid, to take into account the interaction between the jet and solid walls, to ascertain the relationship between the contour of the jet and the ratio of its density to the density of the surrounding medium, and to establish the characteristic features of a supersonic jet.This monograph contains the results of further research by the author and his colleagues, as well as a critical reappraisal of the more important theoretical and experimental data published by other investigators.The first section deals with the theory of a turbulent jet of incompressible fluid. It gives a systematic analysis of numerous experimental data on velocity profiles, temperature, and the impurity concentration, as well as the outlines of the turbulent mixing lone. The second section sets forth the theory of turbulent gas jets, including strongly preheated and supersonic jets. The theory of free turbulence in a gas, suitable in principle for any degree of compressibility, is revised, and the equations are derived for motion and heat exchange in the boundary layer of a jet at very high temperature. The third section solves several problems of the spreading of jets in finite and semifinite space, and the fourth section describes various applications of the theory of jets, many of whi ch are reported for the first time or have been significantly revised.

  • Board Reflow Processes and their Effect on Tin Whisker Growth

    This chapter reviews the potential affect that the board reflow process has on tin whisker growth. Investigations in this area have looked at grain orientations and grain size, solder paste volume, and solder peak temperature on tin whisker growth. The chapter discusses the results on tin whisker testing on soldered pure???tin???coated components after reflow. There has been work to understand the affect of reflow profile, reflow atmosphere, solder paste volume, and flux activity on tin whisker growth. For tin???lead soldering, the lower soldering peak temperature reduced solder paste wetting up the component lead frame increasing the potential for tin whisker growth. Different flux activators were found to aid the oxidation of tin, which increased tin whisker growth after temperature and humidity testing. Increased contamination of the soldered components with chloride and sulfate also increased tin whisker growth after temperature and humidity testing.

  • An Overview of HighTemperature Electronic Device Technologies and Potential Applications

    High-temperature electronics applications are found in combustion systems, well logging, industrial processes, air stagnation points in supersonic aircraft, vehicle brakes, nuclear reactors, and dense electronic packages. We summarize physical effects and materials issues important for reliable operation of semiconductor device technologies at high temperatures (>125°C). We review the high-temperature potential of Si, GaAs, other III-V compounds, and SiC. For completeness, we also comment on nitrides, diamond, and vacuum microelectronics. We conclude that Si on insulator (SOI) technology can be developd readily for small signal operation up to about 300°C. There is some ongoing work in this area. GaAs offers little advantage over Si because of poor device isolation and the lack of reliable contacts above 250°C. Other III-V compounds could be developed for operation to 600°C, using processes similar to those used for optoelectronics. There may be a market niche for III-V power devices above 200°C. There is considerable activity in semiconducting SiC, and device functionality has been demonstrated above 600°C. SiC is promising for operation above 300°C, and for power devices at frequencies from de to 10 GHz, but it faces numerous challenges to achieve manufacturable status. We attempt to match technologies with application areas.

  • Metallizations for Semiconductor Devices

    "HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.



Standards related to Temperature

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No standards are currently tagged "Temperature"