Surface tension

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Surface tension is a property of the surface of a liquid that allows it to resist an external force. It is revealed, for example, in floating of some objects on the surface of water, even though they are denser than water, and in the ability of some insects and even reptiles to run on the water surface. This property is caused by cohesion of like molecules, and is responsible for many of the behaviors of liquids. (Wikipedia.org)






Conferences related to Surface tension

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2015 IEEE International Conference on Plasma Sciences (ICOPS)

Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.

  • 2012 IEEE 39th International Conference on Plasma Sciences (ICOPS)

    Fully and partially ionized plasmas, microwave-plasma interaction, charged particle beams and sources; high energy density plasmas and applications, industrial and medical applications of plasmas; plasma diagnostics; pulsed power and other plasma applictions

  • 2011 IEEE 38th International Conference on Plasma Sciences (ICOPS)

    The ICOPS is the state of the art plasma science conference that covers all aspects of the general plasma science and its applications in various research fields.

  • 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)

  • 2009 IEEE 36th International Conference on Plasma Sciences (ICOPS)

    The conference features an exciting technical program with reports from around the globe about new and innovative developments in the field of pulsed power, plasma science and engineering. Leading researchers gather to explore pulsed power plasmas, basic plasma physics, high-energy-density-plasmas, inertial confinement fusion, magnetic fusion, plasma diagnostics, microwave generation, lighting, micro and nano applications of plasmas, medical applications and plasma processing.


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2013 IEEE NEMS is the 8th annual International Conference on Nano/Micro Engineered and Molecular Systems which started in 2006. It covers Nano science and technology, Micro/nanofluidics and Bio chip, Micro/nano fabrication & metrology, Micro/Nano sensors, actuators and systemd, Flexible MEMS and printed electronics, Carbon Nanotube and Graphene based devices, etc.

  • 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanomaterials; Carbon Nanotube based Devices and Systems; Molecular Sensors, Actuators, and Systems; Nanobiology, Nano-bio-informatics, Nanomedicine; Microfluidics and Nanofluidics;Micro and Nano Heat Transfer.

  • 2011 IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanotechnology is an important emerging field. On the other hand, MEMS is indispensable in spanning nano devices into systems. It is evident that MEMS and Nanotechnology will soon merge together and this marriage will significantly impact many industries across the globe. This conference is the annual IEEE Nanotechnology Council meeting to bring together world-leading researchers in several advanced topics of MEMS and Nanotechnology to disseminate their latest research results and allow cross-disciplinary.

  • 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Micro and Nano Fabrication Micro/Nano Sensors and Actuators Nanophotonics Nanomaterials Microfluidics and Nanofluidics Micro and Nano Heat Transfer Nanobiology, Nano-bio-informatics, Nanomedicine Nanoscale Robotics, Assembly, and Automation Carbon Nanotube based Devices and Systems Micro/Nanoelectromechanical Systems (M/NEMS) Molecular Sensors, Actuators, and Systems

  • 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    IEEE-NEMS is a premier conference of the IEEE Nanotechnology Council to bring together world-leading researchers in the several focused topics of MEMS and Nanotechnology to disseminate their latest research results and allow cross-disciplinary exchange of knowledge to further advance both technological areas. MEMS is naturally continuing its downsizing into Nanoelectromechanical Systems but at the same time it is indispensable in constructing complete Nano devices and systems. It is foreseeable that MEMS an

  • 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    IEEE-NEMS is a premier conference of the IEEE Nanotechnology Council to bring together world-leading researchers in topics of MEMS and Nanotechnology to disseminate latest research results and allow cross-disciplinary exchange of knowledge to further advance both areas. It is foreseeable that MEMS and Nanotechnology will become highly complimentary technologies and impact the technological globe.


2010 International Symposium on Computer, Communication, Control and Automation (3CA)

Just like the name of the conference, the theme for this conference is Advancing Computing, Communication, Control, and Automation Technologies.


2006 Emerging Information Technology Conference (EITC)



Periodicals related to Surface tension

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Industry Applications, IEEE Transactions on

The development and application of electric systems, apparatus, devices, and controls to the processes and equipment of industry and commerce; the promotion of safe, reliable, and economic installations; the encouragement of energy conservation; the creation of voluntary engineering standards and recommended practices.


Plasma Science, IEEE Transactions on

Plasma science and engineering, including: magnetofluid dynamics and thermionics; plasma dynamics; gaseous electronics and arc technology; controlled thermonuclear fusion; electron, ion, and plasma sources; space plasmas; high-current relativistic electron beams; laser-plasma interactions; diagnostics; plasma chemistry and colloidal and solid-state plasmas.




Xplore Articles related to Surface tension

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Instability of electrically stressed water droplets in oil

Berg, G.; Lundgaard, L.E.; Becidan, M.; Sigrnond, R.S. Dielectric Liquids, 2002. ICDL 2002. Proceedings of 2002 IEEE 14th International Conference on, 2002

The breakup of water droplets in an electric field has been studied in naphtenic oil as a function of water conductivity and surface tension of the droplets, and frequency and waveform of the applied voltage. The critical breakup field compares well to theoretical values for low voltage frequencies, but large deviations are found for frequencies above 100 Hz. Four different ...


Performance evaluation of maximum likelihood SAR segmentation for multi-temporal rice crop mapping

Davidson, G.; Ouchi, K.; Saito, G.; Ishitsuka, N.; Mohri, K.; Uratsuka, S. RADAR 2002, 2002

Optimal (maximum likelihood) processing for a SAR image comprised of discrete regions of constant radar cross section is now well known. This scheme considerably improves upon windowed and iterative schemes by merging regions on an individual pixel basis. In theory, rigorous expressions for 'false alarm rate' can be defined but they are perhaps too sensitive to the underlying assumptions of ...


To simulate the formation of TSSOP solder joint with SAC solder and assess on the effects of the stencil design and the misalignment on the joint shape

Zhao, X.J.; Caers, J.F.J.M. Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th, 2004

Robustness of solder interconnection highly depends on solder joint geometry which is largely governed by the surface tension of solder paste, the wettability of the solder paste on the component finish and on the solder land, and the geometry/dimension of the solder land on the substrate and the component lead. With the mandatory trends to launch Pb-free in most electronics ...


Single nano particle collecting by using ultrasonic humidifier

Jungsoon Kim; Jihee Jung; Minkun Bae; Moojoon Kim; Kanglyeol Ha; Mincheol Chu Ultrasonics Symposium (IUS), 2014 IEEE International, 2014

The single nano particle state was obtained by using a ultrasonic humidifier. To control the surface tension, the concentration of methanol changed in the suspension of TiO2 nano particle. The collecting effect was investigated by measuring the particle size distribution. As the surface tension was decreased by increasing the concentration of methanol, the particle size at the peak of distribution ...


Flexible Silicon Microneedles Array for Micro Fluid Transfer

Bin Ma; Zhiyin Gan; Sheng Liu Electronic Packaging Technology, 2005 6th International Conference on, 2005

This paper reports on a new method of using silicon micro needle in bio- medical application. The hollow micro needle array have been designed and fabricated from single crystal silicon for transdermal delivery. The machined micro needles are shank height of 150mum with 250mum center-to-center spacing. The needle size, density and shape are controlled by independent processing steps. Packaging technology ...


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