Surface tension

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Surface tension is a property of the surface of a liquid that allows it to resist an external force. It is revealed, for example, in floating of some objects on the surface of water, even though they are denser than water, and in the ability of some insects and even reptiles to run on the water surface. This property is caused by cohesion of like molecules, and is responsible for many of the behaviors of liquids. (Wikipedia.org)






Conferences related to Surface tension

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2018 10th International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC)

This conference provides an idea-exchange and discussion platform for researchers andpractitioners interested in Intelligent Human-Machine and Cybernetics and other topics.

  • 2017 9th International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC)

    This conference provides an idea-exchange and discussion platform for researchers andpractitioners interested in Intelligent Human-Machine and Cybernetics and other topics.

  • 2016 8th International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC)

    This conference provides an idea-exchange and discussion platform for researchers and practitioners interested in Intelligent Human-Machine and Cybernetics and other topics.

  • 2015 7th International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC)

    This conference provides an idea-exchange and discussion platform for researchers andpractitioners interested in Intelligent Human-Machine and Cybernetics and other topics.

  • 2014 6th International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC)

    This conference provides an idea-exchange and discussion platform for researchers and practitioners interested in Intelligent Human-Machine and Cybernetics and other topics.

  • 2013 5th International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC)

    This conference provides an idea-exchange and discussion platform for researchers and practitioners interested in Intelligent Human-Machine and Cybernetics and other topics.

  • 2012 4th International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC)

    This conference provides an idea-exchange and discussion platform for researchers and practitioners interested in Intelligent Human-Machine and Cybernetics and other topics.

  • 2011 International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC)

    This conference provides an idea-exchange and discussion platform for researchers and practitioners interested in Intelligent Human-Machine and Cybernetics and other topics.

  • 2010 2nd International Conference on Intelligent Human-Machine Systems and Cybernetics (IHMSC)

    The conference subjects include intelligent human machine systems, control theory and systems theory. Interdisciplinary research will be given a special emphasis. Sharing research and experiences and openly discussing problems will be strongly encouraged in all scientific sessions.


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.


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Periodicals related to Surface tension

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer Graphics and Applications, IEEE

IEEE Computer Graphics and Applications (CG&A) bridges the theory and practice of computer graphics. From specific algorithms to full system implementations, CG&A offers a strong combination of peer-reviewed feature articles and refereed departments, including news and product announcements. Special Applications sidebars relate research stories to commercial development. Cover stories focus on creative applications of the technology by an artist or ...


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Surface tension

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Xplore Articles related to Surface tension

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Calculation of Disjoining Pressure for Lubricant Films Via Molecular Simulation

[{u'author_order': 1, u'affiliation': u'Dept. of Chem. Eng., Carnegie Mellon Univ., Pittsburgh, PA', u'full_name': u'S. Izumisawa'}, {u'author_order': 2, u'full_name': u'M. S. Jhon'}] IEEE Transactions on Magnetics, 2006

Disjoining pressure of polymeric liquid films on solid wall and surface tension of the films suspended in vapor are examined via molecular dynamics simulations. The disjoining pressure is calculated from the augmented Young- Laplace equation, which is used to reproduce a fluid bridge between two walls in a simulation cell. Higher surface energy of the wall increases the disjoining pressure ...


Aging and recovery of HTV silicone and EPDM rubbers due to continuous wetting

[{u'author_order': 1, u'affiliation': u'Gifu Nat. Coll. of Technol., Japan', u'full_name': u'T. Tokoro'}, {u'author_order': 2, u'full_name': u'Y. Katayama'}, {u'author_order': 3, u'full_name': u'M. Kosaki'}, {u'author_order': 4, u'full_name': u'R. Hackam'}] Proceedings of 2001 International Symposium on Electrical Insulating Materials (ISEIM 2001). 2001 Asian Conference on Electrical Insulating Diagnosis (ACEID 2001). 33rd Symposium on Electrical and Ele, None

The present study is concerned with the aging of polymer materials by immersion in distilled water and their subsequent recovery in air. In this study, the changes in the specimen's weight, surface roughness, electrical conductivity and surface tension of liquids during aging are measured. During water immersion at 75°C and 98°C, the weights increased rapidly in first few days and ...


Meshless Method Based on Weighted Least Square Method for Electrohydrodynamic Problems

[{u'author_order': 1, u'affiliation': u'Department of Adaptive Machine Systems, Osaka University, Suita, Japan', u'full_name': u'Gaku Yoshikawa'}, {u'author_order': 2, u'affiliation': u'Department of Adaptive Machine Systems, Osaka University, Suita, Japan', u'full_name': u'Shuhei Matsuzawa'}, {u'author_order': 3, u'affiliation': u'Department of Adaptive Machine Systems, Osaka University, Suita, Japan', u'full_name': u'Katsuhiro Hirata'}, {u'author_order': 4, u'affiliation': u'Department of Adaptive Machine Systems, Osaka University, Suita, Japan', u'full_name': u'Fumikazu Miyasaka'}] IEEE Transactions on Magnetics, 2015

This paper proposes a meshless method based on the weighted least square method for electrohydrodynamic problems. In this paper, the behavior of a water droplet in a uniform electric field is calculated by this method. The effectiveness of this analysis method is verified through comparison between the analyzed result and theoretical result of the electric potential around the droplet.


Dislocation configurations in strained single-heterostructure layers

[{u'author_order': 1, u'affiliation': u'Dept. of Electron. Eng., La Trobe Univ., Bundoora, Vic., Australia', u'full_name': u'M. Madebo'}, {u'author_order': 2, u'affiliation': u'Dept. of Electron. Eng., La Trobe Univ., Bundoora, Vic., Australia', u'full_name': u'B. F. Usher'}] COMMAD 2000 Proceedings. Conference on Optoelectronic and Microelectronic Materials and Devices, None

Detailed force-balance considerations can lead to a description of the dislocation configuration within a strained layer. Dislocation configurations are of interest because critical thicknesses of epitaxially grown layers depend on the evolution of the configuration of threading dislocations. Moreover, it promises to shed light on investigations of critical thickness criteria for Multiple Quantum Well (MQW) structures. This paper reports a ...


The continuous dipping criteria of the contact printing for the microarray manufacturing with a slot pin

[{u'author_order': 1, u'affiliation': u'State Key Laboratory of Tribology, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, 100084, China', u'full_name': u'Fei Liu'}, {u'author_order': 2, u'affiliation': u'State Key Laboratory of Tribology, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, 100084, China', u'full_name': u'Dan Wu'}, {u'author_order': 3, u'affiliation': u'State Key Laboratory of Tribology, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, 100084, China', u'full_name': u'Ken Chen'}, {u'author_order': 4, u'affiliation': u'State Key Laboratory of Tribology, Department of Precision Instruments and Mechanology, Tsinghua University, Beijing, 100084, China', u'full_name': u'Libin Song'}] Proceedings of the 30th Chinese Control Conference, None

Contact printing is a widely used method to build microarrays. In contact printing, a slot pin picks up some solution and spreads it to the surface of the substrate point by point. Because of the limited volume, it is inevitable that the slot pin fails to spread the solution after certain points. The number of continuous dipping points has a ...


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Educational Resources on Surface tension

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IEEE-USA E-Books

  • Fluid Statics

    This chapter contains sections titled: Forces on a Fluid Particle, Stress in a Fluid, Pressure in a Static Fluid, Pressure Forces on Solid Surfaces, Pressure Forces on Bodies Immersed in Fluids, Stratified Fluids, Surface Tension and Capillarity, Hydraulic Force Transmission, Problems, Bibliography



Standards related to Surface tension

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IEEE Guide for the Design and Installation of Cable Systems in Substations

This document is a guide for the design, installation, and protection of insulated wire and cable systems in substations with the objective of minimizing cable failures and their consequences. This guide is not an industry standard or a compliance standard.


IEEE Recommended Practice for Maintenance of DC Overhead Contact Systems for Transit Systems

This recommended practice provides overhead contact system maintenance practices and procedures including maintenance techniques, site inspection and test procedures, and maintenance tolerances, for heavy rail, light rail, and trolley bus systems.



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