Surface tension

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Surface tension is a property of the surface of a liquid that allows it to resist an external force. It is revealed, for example, in floating of some objects on the surface of water, even though they are denser than water, and in the ability of some insects and even reptiles to run on the water surface. This property is caused by cohesion of like molecules, and is responsible for many of the behaviors of liquids. (Wikipedia.org)






Conferences related to Surface tension

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2015 IEEE International Conference on Plasma Sciences (ICOPS)

Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.

  • 2012 IEEE 39th International Conference on Plasma Sciences (ICOPS)

    Fully and partially ionized plasmas, microwave-plasma interaction, charged particle beams and sources; high energy density plasmas and applications, industrial and medical applications of plasmas; plasma diagnostics; pulsed power and other plasma applictions

  • 2011 IEEE 38th International Conference on Plasma Sciences (ICOPS)

    The ICOPS is the state of the art plasma science conference that covers all aspects of the general plasma science and its applications in various research fields.

  • 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)

  • 2009 IEEE 36th International Conference on Plasma Sciences (ICOPS)

    The conference features an exciting technical program with reports from around the globe about new and innovative developments in the field of pulsed power, plasma science and engineering. Leading researchers gather to explore pulsed power plasmas, basic plasma physics, high-energy-density-plasmas, inertial confinement fusion, magnetic fusion, plasma diagnostics, microwave generation, lighting, micro and nano applications of plasmas, medical applications and plasma processing.


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2013 IEEE NEMS is the 8th annual International Conference on Nano/Micro Engineered and Molecular Systems which started in 2006. It covers Nano science and technology, Micro/nanofluidics and Bio chip, Micro/nano fabrication & metrology, Micro/Nano sensors, actuators and systemd, Flexible MEMS and printed electronics, Carbon Nanotube and Graphene based devices, etc.

  • 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanomaterials; Carbon Nanotube based Devices and Systems; Molecular Sensors, Actuators, and Systems; Nanobiology, Nano-bio-informatics, Nanomedicine; Microfluidics and Nanofluidics;Micro and Nano Heat Transfer.

  • 2011 IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanotechnology is an important emerging field. On the other hand, MEMS is indispensable in spanning nano devices into systems. It is evident that MEMS and Nanotechnology will soon merge together and this marriage will significantly impact many industries across the globe. This conference is the annual IEEE Nanotechnology Council meeting to bring together world-leading researchers in several advanced topics of MEMS and Nanotechnology to disseminate their latest research results and allow cross-disciplinary.

  • 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Micro and Nano Fabrication Micro/Nano Sensors and Actuators Nanophotonics Nanomaterials Microfluidics and Nanofluidics Micro and Nano Heat Transfer Nanobiology, Nano-bio-informatics, Nanomedicine Nanoscale Robotics, Assembly, and Automation Carbon Nanotube based Devices and Systems Micro/Nanoelectromechanical Systems (M/NEMS) Molecular Sensors, Actuators, and Systems

  • 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    IEEE-NEMS is a premier conference of the IEEE Nanotechnology Council to bring together world-leading researchers in the several focused topics of MEMS and Nanotechnology to disseminate their latest research results and allow cross-disciplinary exchange of knowledge to further advance both technological areas. MEMS is naturally continuing its downsizing into Nanoelectromechanical Systems but at the same time it is indispensable in constructing complete Nano devices and systems. It is foreseeable that MEMS an

  • 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    IEEE-NEMS is a premier conference of the IEEE Nanotechnology Council to bring together world-leading researchers in topics of MEMS and Nanotechnology to disseminate latest research results and allow cross-disciplinary exchange of knowledge to further advance both areas. It is foreseeable that MEMS and Nanotechnology will become highly complimentary technologies and impact the technological globe.


2010 International Symposium on Computer, Communication, Control and Automation (3CA)

Just like the name of the conference, the theme for this conference is Advancing Computing, Communication, Control, and Automation Technologies.


2006 Emerging Information Technology Conference (EITC)



Periodicals related to Surface tension

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Industry Applications, IEEE Transactions on

The development and application of electric systems, apparatus, devices, and controls to the processes and equipment of industry and commerce; the promotion of safe, reliable, and economic installations; the encouragement of energy conservation; the creation of voluntary engineering standards and recommended practices.


Plasma Science, IEEE Transactions on

Plasma science and engineering, including: magnetofluid dynamics and thermionics; plasma dynamics; gaseous electronics and arc technology; controlled thermonuclear fusion; electron, ion, and plasma sources; space plasmas; high-current relativistic electron beams; laser-plasma interactions; diagnostics; plasma chemistry and colloidal and solid-state plasmas.




Xplore Articles related to Surface tension

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A sensitive liquid-cantilever diaphragm for pressure sensor

Nguyen Minh-Dung; Phan Hoang-Phuong; Matsumoto, K.; Shimoyama, I. Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013

An absolute pressure sensor based on liquid cantilever diaphragm is described in this paper. The diaphragm was fabricated by using liquid to bridge the gap between a piezo-resistive cantilever and the surrounding walls. Due to surface tension, the liquid filled the cantilever's gap while it did not leak through the gap. A cavity was designed under the diaphragm as a ...


Formation and curvature tuning of micro lens using surface tension and hydraulic pressure assisted molding process

Hsu, F.M.; Lee, C.; Fang, W. Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013

This study presents a novel concept for the formation of curvature micro lens and the lens-curvature tuning using the hydraulic pressure and surface tension assisted molding process. The liquid UV-curable polymer is defined by hydraulic pressure, surface tension, and molding, and then solidified by UV- light to form t he micro-lens. Merits of the process technology are: (1) initial lens ...


Self-alignment feasibility study and contact resistance improvement of electrically conductive adhesives (ECAs)

Jiali Wu; Kyoung-Sik Moon; Wong, C.P. Electronic Components and Technology Conference, 2001. Proceedings., 51st, 2001

With the driving force of "green" revolution in electronics industry, tremendous efforts have been put on looking for lead-free alternatives. Although lead-free alloys draw a lot of attention, their parasitic weaknesses, such as high processing temperature and surface tension, limit their application on thermally sensitive, flexible, non-solderable substrates and ultra-fine pitch size flip chip interconnection. Conventional electrically conductive adhesives (ECAs) ...


Thermocapillary actuation of droplets on chemically patterned surfaces by programmable microheater arrays

Darhuber, Anton A.; Valentino, Joseph P.; Troian, Sandra M.; Wagner, S. Microelectromechanical Systems, Journal of, 2003

We have designed a microfluidic device for the actuation of liquid droplets or continuous streams on a solid surface by means of integrated microheater arrays. The microheaters provide control of the surface temperature distribution with high spatial resolution. These temperature gradients locally alter the surface tension along droplets and thin films thus propelling the liquid toward the colder regions. In ...


Study on surface tension and adhesion for flip chip packaging

Shijian Luo; Harris, T.; Wong, C.P. Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on, 2001

In a flip chip package with underfill, adhesion of underfill to passivation and solder mask is critical to the reliability of the assembly. In this study, the three-liquid-probe method was used to investigate the surface properties of the solder mask and four different passivation materials, benzocyclobutene (BCB), polyimide (PI), silicon oxide (SiO2), and silicon nitride (Si3N4), after different preparation procedures. ...


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