Surface tension

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Surface tension is a property of the surface of a liquid that allows it to resist an external force. It is revealed, for example, in floating of some objects on the surface of water, even though they are denser than water, and in the ability of some insects and even reptiles to run on the water surface. This property is caused by cohesion of like molecules, and is responsible for many of the behaviors of liquids. (Wikipedia.org)






Conferences related to Surface tension

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2015 IEEE International Conference on Plasma Sciences (ICOPS)

Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.

  • 2012 IEEE 39th International Conference on Plasma Sciences (ICOPS)

    Fully and partially ionized plasmas, microwave-plasma interaction, charged particle beams and sources; high energy density plasmas and applications, industrial and medical applications of plasmas; plasma diagnostics; pulsed power and other plasma applictions

  • 2011 IEEE 38th International Conference on Plasma Sciences (ICOPS)

    The ICOPS is the state of the art plasma science conference that covers all aspects of the general plasma science and its applications in various research fields.

  • 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)

  • 2009 IEEE 36th International Conference on Plasma Sciences (ICOPS)

    The conference features an exciting technical program with reports from around the globe about new and innovative developments in the field of pulsed power, plasma science and engineering. Leading researchers gather to explore pulsed power plasmas, basic plasma physics, high-energy-density-plasmas, inertial confinement fusion, magnetic fusion, plasma diagnostics, microwave generation, lighting, micro and nano applications of plasmas, medical applications and plasma processing.


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2013 IEEE NEMS is the 8th annual International Conference on Nano/Micro Engineered and Molecular Systems which started in 2006. It covers Nano science and technology, Micro/nanofluidics and Bio chip, Micro/nano fabrication & metrology, Micro/Nano sensors, actuators and systemd, Flexible MEMS and printed electronics, Carbon Nanotube and Graphene based devices, etc.

  • 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanomaterials; Carbon Nanotube based Devices and Systems; Molecular Sensors, Actuators, and Systems; Nanobiology, Nano-bio-informatics, Nanomedicine; Microfluidics and Nanofluidics;Micro and Nano Heat Transfer.

  • 2011 IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanotechnology is an important emerging field. On the other hand, MEMS is indispensable in spanning nano devices into systems. It is evident that MEMS and Nanotechnology will soon merge together and this marriage will significantly impact many industries across the globe. This conference is the annual IEEE Nanotechnology Council meeting to bring together world-leading researchers in several advanced topics of MEMS and Nanotechnology to disseminate their latest research results and allow cross-disciplinary.

  • 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Micro and Nano Fabrication Micro/Nano Sensors and Actuators Nanophotonics Nanomaterials Microfluidics and Nanofluidics Micro and Nano Heat Transfer Nanobiology, Nano-bio-informatics, Nanomedicine Nanoscale Robotics, Assembly, and Automation Carbon Nanotube based Devices and Systems Micro/Nanoelectromechanical Systems (M/NEMS) Molecular Sensors, Actuators, and Systems

  • 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    IEEE-NEMS is a premier conference of the IEEE Nanotechnology Council to bring together world-leading researchers in the several focused topics of MEMS and Nanotechnology to disseminate their latest research results and allow cross-disciplinary exchange of knowledge to further advance both technological areas. MEMS is naturally continuing its downsizing into Nanoelectromechanical Systems but at the same time it is indispensable in constructing complete Nano devices and systems. It is foreseeable that MEMS an

  • 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    IEEE-NEMS is a premier conference of the IEEE Nanotechnology Council to bring together world-leading researchers in topics of MEMS and Nanotechnology to disseminate latest research results and allow cross-disciplinary exchange of knowledge to further advance both areas. It is foreseeable that MEMS and Nanotechnology will become highly complimentary technologies and impact the technological globe.


2010 International Symposium on Computer, Communication, Control and Automation (3CA)

Just like the name of the conference, the theme for this conference is Advancing Computing, Communication, Control, and Automation Technologies.


2006 Emerging Information Technology Conference (EITC)



Periodicals related to Surface tension

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Industry Applications, IEEE Transactions on

The development and application of electric systems, apparatus, devices, and controls to the processes and equipment of industry and commerce; the promotion of safe, reliable, and economic installations; the encouragement of energy conservation; the creation of voluntary engineering standards and recommended practices.


Plasma Science, IEEE Transactions on

Plasma science and engineering, including: magnetofluid dynamics and thermionics; plasma dynamics; gaseous electronics and arc technology; controlled thermonuclear fusion; electron, ion, and plasma sources; space plasmas; high-current relativistic electron beams; laser-plasma interactions; diagnostics; plasma chemistry and colloidal and solid-state plasmas.




Xplore Articles related to Surface tension

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Parametric investigation of a graphite foam evaporator in a thermosyphon with fluorinert and a silicon CMOS chip

Klett, J.W.; Trammell, M. Device and Materials Reliability, IEEE Transactions on, 2004

High thermal conductivity graphitic foam was utilized as the evaporator in a modified thermosyphon. The foam was soldered directly to the back of a silicon CMOS die and mounted in a standard PGA. Fluorinert FC-87 and FC-72 were evaluated as the working fluids of choice and a variety of variables on the foams were explored. It was found that the ...


A unique solution for preventing clogging of flow channels by gas bubbles

Kohnle, J.; Waibel, G.; Cernosa, R.; Storz, M.; Ernst, H.; Sandmaier, H.; Strobelt, T.; Zengerle, R. Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on, 2002

A novel solution is presented that deals with the well known problem of clogging in microfluidic channels caused by gas bubbles. The presented approach involves the use of a single channel with different, parallel cross sections. In each of these cross-sections different capillary forces act on the fluid and on potentially present bubbles. The latter are drawn into one of ...


Notice of Retraction<BR>Effect of Rhamonlipid - Biosurfactant on the Cell Surface Properties of Two Pseudomonas Strains

Fei Hua; Hongqi Wang; Ying Xiong; Xuan Wang; Qian Wang; Yanling Sun; Xin Zhang; Shaowei Ning Bioinformatics and Biomedical Engineering, (iCBBE) 2011 5th International Conference on, 2011

Notice of Retraction After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE's Publication Principles. We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper. The presenting author of this paper ...


Control challenges in micro fluidic systems and nanoscale transport phenomena

Shapiro, B. Decision and Control, 2003. Proceedings. 42nd IEEE Conference on, 2003

Over the last three decades, the number of available micro devices, actuators, and sensors has grown in leaps and bounds. Moreover, newly emerging nano- technology and nano-sized patterning techniques are enabling even more capabilities in micro fluidic systems. The micro community is now moving from component creation to system design, optimization, and control. Hence there is a real opportunity for ...


Emerging challenges of underfill for flip chip application

Chen, T.; Jinlin Wang; Daoqiang Lu Electronic Components and Technology Conference, 2004. Proceedings. 54th, 2004

The emerging challenges of underfill technology development for future generations of flip chip applications are reviewed, including capillary underfill materials, underfill processes, and alternative underfill technology. The driving trends of silicon technologies such as copper damascene, low-k dielectrics, low power consumption, and packaging technologies, including shrinking flip chip bump pitch, diameter and gap height, lead-free interconnection, thin die, small form ...


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Educational Resources on Surface tension

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eLearning

Parametric investigation of a graphite foam evaporator in a thermosyphon with fluorinert and a silicon CMOS chip

Klett, J.W.; Trammell, M. Device and Materials Reliability, IEEE Transactions on, 2004

High thermal conductivity graphitic foam was utilized as the evaporator in a modified thermosyphon. The foam was soldered directly to the back of a silicon CMOS die and mounted in a standard PGA. Fluorinert FC-87 and FC-72 were evaluated as the working fluids of choice and a variety of variables on the foams were explored. It was found that the ...


A unique solution for preventing clogging of flow channels by gas bubbles

Kohnle, J.; Waibel, G.; Cernosa, R.; Storz, M.; Ernst, H.; Sandmaier, H.; Strobelt, T.; Zengerle, R. Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on, 2002

A novel solution is presented that deals with the well known problem of clogging in microfluidic channels caused by gas bubbles. The presented approach involves the use of a single channel with different, parallel cross sections. In each of these cross-sections different capillary forces act on the fluid and on potentially present bubbles. The latter are drawn into one of ...


Notice of Retraction<BR>Effect of Rhamonlipid - Biosurfactant on the Cell Surface Properties of Two Pseudomonas Strains

Fei Hua; Hongqi Wang; Ying Xiong; Xuan Wang; Qian Wang; Yanling Sun; Xin Zhang; Shaowei Ning Bioinformatics and Biomedical Engineering, (iCBBE) 2011 5th International Conference on, 2011

Notice of Retraction After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE's Publication Principles. We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper. The presenting author of this paper ...


Control challenges in micro fluidic systems and nanoscale transport phenomena

Shapiro, B. Decision and Control, 2003. Proceedings. 42nd IEEE Conference on, 2003

Over the last three decades, the number of available micro devices, actuators, and sensors has grown in leaps and bounds. Moreover, newly emerging nano- technology and nano-sized patterning techniques are enabling even more capabilities in micro fluidic systems. The micro community is now moving from component creation to system design, optimization, and control. Hence there is a real opportunity for ...


Emerging challenges of underfill for flip chip application

Chen, T.; Jinlin Wang; Daoqiang Lu Electronic Components and Technology Conference, 2004. Proceedings. 54th, 2004

The emerging challenges of underfill technology development for future generations of flip chip applications are reviewed, including capillary underfill materials, underfill processes, and alternative underfill technology. The driving trends of silicon technologies such as copper damascene, low-k dielectrics, low power consumption, and packaging technologies, including shrinking flip chip bump pitch, diameter and gap height, lead-free interconnection, thin die, small form ...


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