Conferences related to Solids

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2018 13th European Microwave Integrated Circuits Conference (EuMIC)

The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.

  • 2017 12th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2016 11th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2014 9th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS

  • 2013 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2012 European Microwave Integrated Circuit Conference (EuMIC)

    Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.

  • 2011 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2010 European Microwave Integrated Circuits Conference (EuMIC)

    EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs

  • 2009 European Microwave Integrated Circuits Conference (EuMIC)

    The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2008 European Microwave Integrated Circuits Conference (EuMIC)

    The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2007 European Microwave Integrated Circuits Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)

  • GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 26th Signal Processing and Communications Applications Conference (SIU)

The general scope of the conference ranges from signal and image processing to telecommunication, and applications of signal processing methods in biomedical and communication problems.

  • 2017 25th Signal Processing and Communications Applications Conference (SIU)

    Signal Processing and Communication Applications (SIU) conference is the most prominent scientific meeting on signal processing in Turkey bringing together researchers working in signal processing and communication fields. Topics include but are not limited to the areas of research listed in the keywords.

  • 2016 24th Signal Processing and Communication Application Conference (SIU)

    Signal Processing Theory, Statistical Signal Processing, Nonlinear Signal Processing, Adaptive Signal Processing, Array and Multichannel Signal Processing, Signal Processing for Sensor Networks, Time-Frequency Analysis, Speech / Voice Processing and Recognition, Computer Vision, Pattern Recognition, Machine Learning for Signal Processing, Human-Machine Interaction, Brain-Computer Interaction, Signal-Image Acquisition and Generation, image Processing, video Processing, Image Printing and Presentation, Image / Video / Audio browsing and retrieval, Image / Video / Audio Watermarking, Multimedia Signal Processing, Biomedical Signal Processing and Image Processing, Bioinformatics, Biometric Signal-Image Processing and Recognition, Signal Processing for Security and Defense, Signal and Image Processing for Remote Sensing, Signal Processing Hardware, Signal Processing Education, Radar Signal Processing, Communication Theory, Communication Networks, Wireless Communications

  • 2015 23th Signal Processing and Communications Applications Conference (SIU)

    Signal Processing Theory Statistical Signal Processing Nonlinear Signal Processing Adaptive Signal Processing Array and Multichannel Signal Processing Signal Processing for Sensor Networks Time-Frequency Analysis Speech / Voice Processing and Recognition Computer Vision Pattern Recognition Machine Learning for Signal Processing Human-Machine Interaction Brain-Computer Interaction Signal-Image Acquisition and Generation image Processing video Processing Image Printing and Presentation Image / Video / Audio browsing and retrieval Image / Video / Audio Watermarking Multimedia Signal Processing Biomedical Signal Processing and Image Processing Bioinformatics Biometric Signal-Image Processing and Recognition Signal Processing for Security and Defense Signal and Image Processing for Remote Sensing Signal Processing Hardware Signal Processing Education Radar Signal Processing Communication Theory Communication Networks Wireless Communications

  • 2014 22nd Signal Processing and Communications Applications Conference (SIU)

    SIU will be held in Trabzon, Turkey at the Karadeniz Technical University Convention and Exhibition Centre on April 23, 2014. SIU is the largest and most comprehensive technical conference focused on signal processing and its applications in Turkey. Last year there were 500 hundred participants. The conference will feature renowned speakers, tutorials, and thematic workshops. Topics include but are not limited to: Signal Procesing, Image Processing, Communication, Computer Vision, Machine Learning, Biomedical Signal Processing,

  • 2013 21st Signal Processing and Communications Applications Conference (SIU)

    Conference will discuss state of the art solutions and research results on existing and future DSP and telecommunication systems, applications, and related standardization activities. Conference will also include invited lectures, tutorials and special sessions.

  • 2012 20th Signal Processing and Communications Applications Conference (SIU)

    Conference will discuss state of the art solutions and research results on existing and future DSP and telecommunication systems, applications, and related standardization activities. Conference will also include invited lectures, tutorials and special sessions.

  • 2011 19th Signal Processing and Communications Applications Conference (SIU)

    Conference will bring together academia and industry professionals as well as students and researchers to present and discuss state of the art solutions and research results on existing and future DSP and telecommunication systems, applications, and related standardization activities. The Conference will also include invited lectures, tutorials and special sessions.

  • 2010 IEEE 18th Signal Processing and Communications Applications Conference (SIU)

    S1.Theory of Signal-Processing S2.Statistical Signal-Processing S3.Multimedia Signal-Processing S4.Biomedical Signal-Processing S5.Sensor Networks S6.Multirate Signal-Processing S7.Pattern Recognition S8.Computer Vision S9.Adaptive Filters S10.Image/Video/Speech Browsing, Retrieval S11.Speech/Audio Coding S12.Speech Processing S13.Human-Machine Interfaces S14.Surveillance Signal Processing S15.Bioinformatics S16.Self-Learning S17.Signal-Processing Education S18.Signal-Processing Systems S1

  • 2009 IEEE 17th Signal Processing and Communications Applications Conference (SIU)

    The scope of the conference is to cover recent topics in theory and applications of Signal Processing and Communications.

  • 2008 IEEE 16th Signal Processing and Communications Applications Conference (SIU)

    Signal Processing, Image Processing, Speech Processing, Pattern Recognition, Human Computer Interaction, Communication, Video and Speech indexing, Computer Vision, Biomedical Signal Processing

  • 2007 IEEE 15th Signal Processing and Communications Applications (SIU)

  • 2006 IEEE 14th Signal Processing and Communications Applications (SIU)

  • 2005 IEEE 13th Signal Processing and Communications Applications (SIU)

  • 2004 IEEE 12th Signal Processing and Communications Applications (SIU)


2018 IEEE 16th International Conference on Industrial Informatics (INDIN)

The aim of INDIN´18 is to bring together researchers and practitioners from industry and academia and provide them with a platform to report and discuss recent developments, deployments, technology trends and research results, as well as initiatives related to industrial informatics and their application.


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Periodicals related to Solids

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


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Xplore Articles related to Solids

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Image Credits

[{u'author_order': 1, u'affiliation': u'University of Illinois', u'full_name': u'Lillian Hoddeson'}, {u'author_order': 2, u'affiliation': u'University of Illinois at Urbana-Champaign', u'full_name': u'Peter Garrett'}] The Man Who Saw Tomorrow: The Life and Inventions of Stanford R. Ovshinsky, None

None


Fundamental Concepts of Grounding

[{u'author_order': 1, u'full_name': u'Jinliang He'}, {u'author_order': 2, u'full_name': u'Rong Zeng'}, {u'author_order': 3, u'full_name': u'Bo Zhang'}] Methodology and Technology for Power System Grounding, None

This chapter introduces the fundamental concepts of grounding, including conduction mechanism of soil, function of grounding device, grounding resistance, and allowable potential difference for body safety.


Discussion on “high-potential underground transmission.” New York October 9, 1908

[] Proceedings of the American Institute of Electrical Engineers, 1909

President Ferguson: The subject for discussion this evening, gentlemen, is not only interesting from a scientific standpoint, but is of great importance commercially, because of its possible influence upon the investment and methods of operation of our large lighting and power systems.


Self starting synchronous motors

[{u'author_order': 1, u'full_name': u'Carl J. Fechheimer'}] Proceedings of the American Institute of Electrical Engineers, 1912

The following treatment of the starting of synchronous motors is intended to apply to polyphase motors and has been worked out for those of the revolving field type, but can doubtless be so modified as to apply to motors of the revolving armature type as well. The analytical treatment of the subject applies to motors with definite pole construction. The ...


Low-gas-pressure cable

[{u'author_order': 1, u'affiliation': u'General Electric Company, Schenectady, N. Y.', u'full_name': u'G. B. Shanklin'}] Electrical Engineering, 1939

DURING the past several years the company with which the writer is associated has been conducting an extensive research and engineering study of the possibilities of high-voltage cable utilizing gas as a pressure medium. The purpose has been to develop a practical cable system of this type and determine its best field of usefulness from an engineering and economic standpoint. ...


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Educational Resources on Solids

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No eLearning Articles are currently tagged "Solids"

IEEE-USA E-Books

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  • Fundamental Concepts of Grounding

    This chapter introduces the fundamental concepts of grounding, including conduction mechanism of soil, function of grounding device, grounding resistance, and allowable potential difference for body safety.

  • Electrical Breakdown in Solids, Liquids, and Vacuum

    This chapter brings out the essential features of prebreakdown and electrical breakdown in solids, liquids, and vacuum. It discusses the various aspects of interaction among the insulators and with electrodes, especially from the viewpoint of insulation coordination. Electrical insulation is the key to reliability in pulsed power systems. The choice of insulators for use in pulsed power systems requires knowledge of breakdown mechanisms and performance under varying conditions as well as commercial availability. When breakdown occurs, solids are usually permanently damaged. The mechanisms leading to the electrical breakdown in solids is a complex phenomenon and varies according to the time duration of voltage application. The mechanisms may be categorized as intrinsic, thermal, or electromechanical breakdown, partial discharges, and electrical trees. The chapter presents a few examples of practical systems, where the causes responsible for lowering the insulation performance have been removed. The examples illustrated pertain to components that use either oil or water.

  • 5 Looking Again in a Different Way

    Indeterminacy is the condition of measuring. — Myra Hird (2012, 462) The etymology of the word “fact” is tricky as well as enlightening: it may mean fabricated thus false, or fabricated thus solid. It is the second path we invite you to follow. Cogitamus not cogito. — Bruno Latour (n.d., 1)

  • 2 Understanding Energy Poverty in the World

    Energy poverty is a multidimensional problem, if only because humans use energy for several purposes. The main uses of energy are lighting and appliances, cooking, heating, and transportation. Of these, we focus on two aspects of energy use that are directly related to everyday life and best reflect the idea of energy access as a basic necessity: access to electricity and clean cooking fuels in households. Transportation fuels are less of an issue for the very poor, as they do not own mechanized vehicles; heating is unnecessary for most of the year in many developing countries. Because the problem of energy poverty is more prevalent in the countryside of the nonindustrialized world, we train our analytical lens on rural areas in developing countries.

  • Impact of Planar EBGs on Signal Integrity in High‐Speed Digital Boards

    This chapter investigates the electromagnetic phenomena involved in the propagation of a signal on a microstrip over an electromagnetic bandgap (EBG) structure, when an interconnect is referenced to the shaped (or patterned) layer. In a real board where the EBG structure is employed in the stack‐up of a multilayer printed circuit board (PCB), some traces will be referenced to the EBG patterned plane. The basic planar EBG geometry is realized by a suitably designed patterned plane on top of a continuous one, creating a cavity. The chapter talks about the coupling between the electromagnetic field associated with the transmitted signal and the field inside the cavity over a large frequency range. Peaks and notches of the embedded planar EBG cavity transfer function correspond to notches and high values of the single‐ended trace transfer function. The chapter also investigates the relationship between the power plane impedance profile and the transfer function of the microstrip line.

  • Planar EBGs: Fundamentals and Design

    This chapter introduces a complete procedure for the analysis of planar electromagnetic bandgap (EBG) structures based on the concept of total inductance. The planar EBG is made by a sequence of patches connected by narrow bridges, thus altering the ideal solid plane pair geometry usually employed for power delivery purposes and signal/power return. The chapter focuses on the comprehensive electromagnetic characterization of planar EBGs, concentrating on the simple yet effective EBG made by a sequence of square patches and straight bridges. It provides accurate evaluation of the bandgap lower limit fLowand also provides a more precise evaluation of the bandgap upper limit fHighquantifying the effect of the parameters altering its analytical calculation. The EBG structures discussed in the chapter deal with patterned planes laid out on the outer stack‐up layers of a multilayer printed circuit board (PCB). The problems related to this type of layout are also discussed.

  • 9 Games not Gamification

    Creating a game that resonates means keeping these principles that we've outlined in mind throughout the design process. And it means doing so in a serious way, not just checking a box that you've “created a strong narrative” or “made space for imagination.” With that in mind, the principles that we have outlined are summarized below:

  • Fundamentals of Radiation Effects

    Chapter 3 introduces fundamentals of radiation effects by neutrons and charged particles with their LET (Linear Energy Transfer) and average range in Si.

  • Forensic Radio Surveys for Cell Site Analysis

    Cell site analysis is designed to enable an investigator to determine whether calls made at or around the time of an incident or offence used cells that are located near the location of that offence. Forensic radio surveys are designed to provide solid evidence to back up the assumptions made by investigators and cell site analysts. Forensic radio survey equipment captures details of the cells that can be detected at a location and can indicate which cells would be selected for use by a phone being used at those locations. Forensic radio surveys add empirical rigour to an area of investigation that would otherwise fall prey to assumptions and wishful thinking. Cell site analysis, based on a combination of call detail record (CDR), cell location details and forensic radio survey results, can provide compelling evidence to support the allegations made by investigators.




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