Conferences related to Solids

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2018 13th European Microwave Integrated Circuits Conference (EuMIC)

The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.

  • 2017 12th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2016 11th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2014 9th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS

  • 2013 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2012 European Microwave Integrated Circuit Conference (EuMIC)

    Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.

  • 2011 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2010 European Microwave Integrated Circuits Conference (EuMIC)

    EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs

  • 2009 European Microwave Integrated Circuits Conference (EuMIC)

    The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2008 European Microwave Integrated Circuits Conference (EuMIC)

    The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2007 European Microwave Integrated Circuits Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)

  • GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 26th Signal Processing and Communications Applications Conference (SIU)

The general scope of the conference ranges from signal and image processing to telecommunication, and applications of signal processing methods in biomedical and communication problems.

  • 2017 25th Signal Processing and Communications Applications Conference (SIU)

    Signal Processing and Communication Applications (SIU) conference is the most prominent scientific meeting on signal processing in Turkey bringing together researchers working in signal processing and communication fields. Topics include but are not limited to the areas of research listed in the keywords.

  • 2016 24th Signal Processing and Communication Application Conference (SIU)

    Signal Processing Theory, Statistical Signal Processing, Nonlinear Signal Processing, Adaptive Signal Processing, Array and Multichannel Signal Processing, Signal Processing for Sensor Networks, Time-Frequency Analysis, Speech / Voice Processing and Recognition, Computer Vision, Pattern Recognition, Machine Learning for Signal Processing, Human-Machine Interaction, Brain-Computer Interaction, Signal-Image Acquisition and Generation, image Processing, video Processing, Image Printing and Presentation, Image / Video / Audio browsing and retrieval, Image / Video / Audio Watermarking, Multimedia Signal Processing, Biomedical Signal Processing and Image Processing, Bioinformatics, Biometric Signal-Image Processing and Recognition, Signal Processing for Security and Defense, Signal and Image Processing for Remote Sensing, Signal Processing Hardware, Signal Processing Education, Radar Signal Processing, Communication Theory, Communication Networks, Wireless Communications

  • 2015 23th Signal Processing and Communications Applications Conference (SIU)

    Signal Processing Theory Statistical Signal Processing Nonlinear Signal Processing Adaptive Signal Processing Array and Multichannel Signal Processing Signal Processing for Sensor Networks Time-Frequency Analysis Speech / Voice Processing and Recognition Computer Vision Pattern Recognition Machine Learning for Signal Processing Human-Machine Interaction Brain-Computer Interaction Signal-Image Acquisition and Generation image Processing video Processing Image Printing and Presentation Image / Video / Audio browsing and retrieval Image / Video / Audio Watermarking Multimedia Signal Processing Biomedical Signal Processing and Image Processing Bioinformatics Biometric Signal-Image Processing and Recognition Signal Processing for Security and Defense Signal and Image Processing for Remote Sensing Signal Processing Hardware Signal Processing Education Radar Signal Processing Communication Theory Communication Networks Wireless Communications

  • 2014 22nd Signal Processing and Communications Applications Conference (SIU)

    SIU will be held in Trabzon, Turkey at the Karadeniz Technical University Convention and Exhibition Centre on April 23, 2014. SIU is the largest and most comprehensive technical conference focused on signal processing and its applications in Turkey. Last year there were 500 hundred participants. The conference will feature renowned speakers, tutorials, and thematic workshops. Topics include but are not limited to: Signal Procesing, Image Processing, Communication, Computer Vision, Machine Learning, Biomedical Signal Processing,

  • 2013 21st Signal Processing and Communications Applications Conference (SIU)

    Conference will discuss state of the art solutions and research results on existing and future DSP and telecommunication systems, applications, and related standardization activities. Conference will also include invited lectures, tutorials and special sessions.

  • 2012 20th Signal Processing and Communications Applications Conference (SIU)

    Conference will discuss state of the art solutions and research results on existing and future DSP and telecommunication systems, applications, and related standardization activities. Conference will also include invited lectures, tutorials and special sessions.

  • 2011 19th Signal Processing and Communications Applications Conference (SIU)

    Conference will bring together academia and industry professionals as well as students and researchers to present and discuss state of the art solutions and research results on existing and future DSP and telecommunication systems, applications, and related standardization activities. The Conference will also include invited lectures, tutorials and special sessions.

  • 2010 IEEE 18th Signal Processing and Communications Applications Conference (SIU)

    S1.Theory of Signal-Processing S2.Statistical Signal-Processing S3.Multimedia Signal-Processing S4.Biomedical Signal-Processing S5.Sensor Networks S6.Multirate Signal-Processing S7.Pattern Recognition S8.Computer Vision S9.Adaptive Filters S10.Image/Video/Speech Browsing, Retrieval S11.Speech/Audio Coding S12.Speech Processing S13.Human-Machine Interfaces S14.Surveillance Signal Processing S15.Bioinformatics S16.Self-Learning S17.Signal-Processing Education S18.Signal-Processing Systems S1

  • 2009 IEEE 17th Signal Processing and Communications Applications Conference (SIU)

    The scope of the conference is to cover recent topics in theory and applications of Signal Processing and Communications.

  • 2008 IEEE 16th Signal Processing and Communications Applications Conference (SIU)

    Signal Processing, Image Processing, Speech Processing, Pattern Recognition, Human Computer Interaction, Communication, Video and Speech indexing, Computer Vision, Biomedical Signal Processing

  • 2007 IEEE 15th Signal Processing and Communications Applications (SIU)

  • 2006 IEEE 14th Signal Processing and Communications Applications (SIU)

  • 2005 IEEE 13th Signal Processing and Communications Applications (SIU)

  • 2004 IEEE 12th Signal Processing and Communications Applications (SIU)


2018 IEEE 16th International Conference on Industrial Informatics (INDIN)

The aim of INDIN´18 is to bring together researchers and practitioners from industry and academia and provide them with a platform to report and discuss recent developments, deployments, technology trends and research results, as well as initiatives related to industrial informatics and their application.


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Periodicals related to Solids

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


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Most published Xplore authors for Solids

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Xplore Articles related to Solids

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A mixture approach with perturbation technique for microwave characterization of conducting polymers

[{u'author_order': 1, u'affiliation': u'Dept. de Genie Electrique et Genie Informatique, Ecole Polytech., Montreal, Que., Canada', u'full_name': u'Yonghong Hua'}, {u'author_order': 2, u'affiliation': u'Dept. de Genie Electrique et Genie Informatique, Ecole Polytech., Montreal, Que., Canada', u'full_name': u'C. Akyel'}] Proceedings 1995 Canadian Conference on Electrical and Computer Engineering, None

We proposed the idea of a mixture by which the conductivity of the material under test is reduced so that it is possible to employ the cavity perturbation technique. Two simple but more practical mixture formulas for extrapolating the complex permittivity of a separate material through the measurement results of mixture are proposed and both are verified by measurement results. ...


Altitude and Speed Sensor with Digital Compensation Technique

[{u'author_order': 1, u'affiliation': u"Sch. of Autom., Northwestern Polytech. Univ., Xi'an", u'full_name': u'Hongwei Jiang'}, {u'author_order': 2, u'affiliation': u"Sch. of Autom., Northwestern Polytech. Univ., Xi'an", u'full_name': u'Zhaohui Yuan'}, {u'author_order': 3, u'affiliation': u"Chinese Flight Test Establ., Xi'an", u'full_name': u'Xiaobing Guo'}] 2008 International Symposium on Intelligent Information Technology Application Workshops, None

Pressure measuring is the foundation of sensing and measuring technology of altitude and velocity. This subject is the study on sensing and measuring technology to silicon pizeo-resistance pressure for altitude and velocity measuring. For the error compensation of piezo-resistance sensor, digital compensation substitution of analog compensation is put forward in this research, by which to make the sensor output to ...


Parallel implementation of a tightly coupled ablation prediction code using MPI

[{u'author_order': 1, u'affiliation': u'Department of Mechanical Engineering, University of Akron Akron, OH, USA, 44325-3903', u'full_name': u'Nathan Mullenix'}, {u'author_order': 2, u'affiliation': u'Department of Mechanical Engineering, University of Akron Akron, OH, USA, 44325-3903', u'full_name': u'Alex Povitsky'}] 2009 IEEE International Conference on Cluster Computing and Workshops, None

A parallel algorithm is developed for use with an ablation prediction code. The use of parallel computing is required due to the amount of computational time needed to simulate realistic physical times due to the small time steps demanded by explicit time schemes, and for the future use of the code to handle 3-D defects at the TPS surface. The ...


Linear independent moment invariant sets

[{u'author_order': 1, u'affiliation': u'College of Applied Sciences, Beijing University of Technology, 100124, China', u'full_name': u'Luhong Diao'}, {u'author_order': 2, u'affiliation': u'National Center of Intelligent Computing, Institute of Computing Technology, Chinese Academy of Science, Beijing 100080, China', u'full_name': u'Hua Li'}, {u'author_order': 3, u'affiliation': u'College of Applied Sciences, Beijing University of Technology, 100124, China', u'full_name': u'Sen Zhang'}, {u'author_order': 4, u'affiliation': u'College of Applied Sciences, Beijing University of Technology, 100124, China', u'full_name': u'Lei Liu'}] 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, None

This paper presented necessary and sufficient condition of moment invariants under general linear transformation. Based on this condition, arbitrary order and dimensional moment invariant sets can be constructed. Due to their linear independence, previous invariants are special cases of them.


The Design of a 960 MeV Electron Storage Ring to Provide Synchrotron Radiation for XUV and Soft X-Ray Spectroscopy

[{u'author_order': 1, u'affiliation': u'University of Wisconsin - Physical Sciences Laboratory Stoughton, Wisconsin', u'full_name': u'E. M. Rowe'}, {u'author_order': 2, u'affiliation': u'University of Wisconsin - Physical Sciences Laboratory Stoughton, Wisconsin', u'full_name': u'C. H. Pruett'}, {u'author_order': 3, u'affiliation': u'University of Wisconsin - Physical Sciences Laboratory Stoughton, Wisconsin', u'full_name': u'J. D. Steben'}, {u'author_order': 4, u'affiliation': u'University of Wisconsin - Physical Sciences Laboratory Stoughton, Wisconsin', u'full_name': u'W. R. Winter'}] IEEE Transactions on Nuclear Science, 1971

First Page of the Article ![](/xploreAssets/images/absImages/04326009.png)


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Educational Resources on Solids

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eLearning

No eLearning Articles are currently tagged "Solids"

IEEE-USA E-Books

  • Data Dissemination in Opportunistic Networks

    This chapter contains sections titled: * Introduction * Initial Ideas: PodNet * Social-Aware Schemes * Publish/Subscribe Schemes * Global Optimization * Infrastructure-Based Approaches * Approaches Inspired by Unstructured p2p Systems * Further Readings * References

  • The Quantum Leap

    No abstract.

  • Electrical Breakdown in Solids, Liquids, and Vacuum

    This chapter brings out the essential features of prebreakdown and electrical breakdown in solids, liquids, and vacuum. It discusses the various aspects of interaction among the insulators and with electrodes, especially from the viewpoint of insulation coordination. Electrical insulation is the key to reliability in pulsed power systems. The choice of insulators for use in pulsed power systems requires knowledge of breakdown mechanisms and performance under varying conditions as well as commercial availability. When breakdown occurs, solids are usually permanently damaged. The mechanisms leading to the electrical breakdown in solids is a complex phenomenon and varies according to the time duration of voltage application. The mechanisms may be categorized as intrinsic, thermal, or electromechanical breakdown, partial discharges, and electrical trees. The chapter presents a few examples of practical systems, where the causes responsible for lowering the insulation performance have been removed. The examples illustrated pertain to components that use either oil or water.

  • The Final Frontiers

    No abstract.

  • Radiometry

    The radiometric calculations are a necessary part of the characterization of detectors and the prediction of signal and noise levels. The blackbody (BB) is an essential and unique source for detector testing. The chapter considers a simplified case for which one can easily write a fairly simple equation. It then shows how to extend the solution of that simple case to more general and realistic cases. The chapter talks about the spectral distribution of power and photon flux and shows how the energy and photons are distributed over the wavelengths of interest. The energy falling on a detector depends on the projected solid angle through which the source surrounds the detector. Before discussing projected solid angle, the chapter describes the simpler solid angle. It extends the incremental power transfer by using the expressions that one has developed for the spectral integral, the spatial integral, and the modulation factor.

  • Streamlined Life Cycle Assessment for Solid Waste Treatment Options

    This chapter begins with a general review of Life Cycle Assessment (LCA) applications for solid waste management (SWM) that adopts various types of system boundaries. It presents a comparative streamlined life cycle assessment (CSLCA) for two types of solid waste incineration technologies, fluidized bed incinerator (FBI) and mechanical grate incinerator (MGI), both of which are commonly used in East Asia and Europe for burning municipal solid waste (MSW). Both Eco-indicator 99 and ReCiPe assessment methods were selected for environmental impact assessment based on a suite of indicators leading to the improvement of reliability of the assessment. Through the use of life cycle inventory and impact assessment tools, the environmental impacts were collectively assessed for possible damage to human health, ecosystem integrity, and resources. Finally, a generalized numeric scheme was produced for the overall assessment of these two incinerators comparatively.

  • Teaching Design Patterns

    This chapter contains sections titled: * Introduction * The Design of Asteroids * Downloading and Executing Asteroids * Exercise 1: Observer Pattern Modeling * Exercise 2: Observer Pattern Programming * Exercise 3: Adapter Pattern Modeling * Exercise 4: Adapter Pattern Programming * Exercise 5: Strategy Pattern Modeling * Exercise 6: Strategy Pattern Programming * Experiences and Conclusion * References

  • The Ability to Network

    Networking is a word that a person will hear often in his/her career as an engineering professional. Many people think that networking is going to a social outing, collecting business cards, and trying to secure clients on the spot. That is not what it is. In fact, networking or building relationships is truly defined by what a person does after that first meeting. In this chapter, you will learn how to overcome personal obstacles to networking and build strong, lasting relationships. The chapter provides great tips on how to build strong relationships, including some secrets that the author learnt through his experience. The best way to build relationships is to focus on building personal associations or friendships. Whether it is a business relationship or not, take some time to get to genuinely know people. Another great way to build relationships with people is to give them value in whatever ways you can.

  • Switchgear and Motor Control Centers

    In industrial environments, electricity is provided to loads from load centers, including switchgear and motor control centers (MCCs). Both of these load centers are having hinged doors for easy internal access. Smaller electrical components can be housed in enclosures that are classified by NEMA Type, which defines the ability of the enclosure to resist environmental factors. Several important ratings apply to both switchgear and MCCs. A continuous current rating limits the temperature rise of the load center components, particularly the insulation. A short-circuit current rating determines both the interrupting capability of the circuit breakers and fuses, and the mechanical strength of the bracing and support systems. Arc flash hazard must be addressed to determine safe working procedures around energized equipment. NFPA standard 70E and IEEE standard 1584 address the arc flash hazard by providing guidance for performing calculations to determine the incident energy during an arc flash event.

  • Radiometry, Noise Temperature, and Interferometry

    This chapter first discusses radiometry, which is the passive detection of natural radiation from various media, targets, and objects. Included in this discussion are brightness, antenna temperature, radiative transfer, and emissivity. Next, the chapter discusses the effects of the receiving system on the system noise temperature and the minimum detectable temperature, and deals with the use of interferometry for mapping the brightness distribution. The fundamental quantity in radiometry is the brightness (B). The chapter considers the propagation of the brightness in a medium emitting electromagnetic radiation. All objects emit electromagnetic energy. A perfect absorber that absorbs electromagnetic energy at all wavelengths is called a blackbody. The brightness of the electromagnetic radiation from a blackbody depends only on its temperature and frequency. The chapter further describes how the noise temperature is emitted, propagated, absorbed, and scattered, and then reaches the antenna. Finally, it discusses what happens in the receiver.




Jobs related to Solids

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