Soldering

View this topic in
Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a lower melting point than the workpiece. Soldering differs from welding in that the workpieces are not melted. (Wikipedia.org)






Conferences related to Soldering

Back to Top

2018 13th European Microwave Integrated Circuits Conference (EuMIC)

The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.

  • 2017 12th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2016 11th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2014 9th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS

  • 2013 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2012 European Microwave Integrated Circuit Conference (EuMIC)

    Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.

  • 2011 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2010 European Microwave Integrated Circuits Conference (EuMIC)

    EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs

  • 2009 European Microwave Integrated Circuits Conference (EuMIC)

    The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2008 European Microwave Integrated Circuits Conference (EuMIC)

    The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2007 European Microwave Integrated Circuits Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)

  • GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.


2018 Asia-Pacific Microwave Conference (APMC)

The conference topics include microwave theory and techniques, and their related technologies and applications. They also include active devices and circuits, passive components, wireless systems, EMC and EMI, wireless power transfer and energy harvesting, antennas and propagation, and others.


2018 IEEE 45th Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


More Conferences

Periodicals related to Soldering

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


More Periodicals


Xplore Articles related to Soldering

Back to Top

The experimental and numerical investigation on shear behaviour of solder ball in a wafer level chip scale package

[{u'author_order': 1, u'affiliation': u'Fairchild-ZJUT Microelectronic Packaging Joint Lab, Zhejiang University of Technology, Hangzhou, 310014, China', u'full_name': u'Ye Zhang'}, {u'author_order': 2, u'affiliation': u'Fairchild-ZJUT Microelectronic Packaging Joint Lab, Zhejiang University of Technology, Hangzhou, 310014, China', u'full_name': u'Yangjian Xu'}, {u'author_order': 3, u'affiliation': u'Fairchild Semiconductor, S. Portland, Maine, USA', u'full_name': u'Yong Liu'}, {u'author_order': 4, u'affiliation': u'Fairchild Semiconductor, S. Portland, Maine, USA', u'full_name': u'Andrew Schoenberg'}] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), None

The shear test under high strain rate is becoming a popular approach to investigate the fracture behaviour of a thermally attached solder ball under different strain rates. However, despite a substantial number of experimental tests being conducted recently, only a few numerical simulation works have been published. The lack of high performance computational analysis methods applicable to the evaluation of ...


Improvement of the solder joint strength in a SAC 305 solder ball to a ENIG substrate using LF hydrogen radical treatment

[{u'author_order': 1, u'affiliation': u'National Core Research Center (NCRC) for Hybrid Material Solution, Pusan 609-735, Korea', u'full_name': u'Seung jae Jo'}, {u'author_order': 2, u'affiliation': u'National Core Research Center (NCRC) for Hybrid Material Solution, Pusan 609-735, Korea', u'full_name': u'Ah ruem Lee'}, {u'author_order': 3, u'affiliation': u'Dept. of Material Science and Engineering, Pusan National University Pusan 609-735, Korea', u'full_name': u'Chung Yun Kang'}] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), None

Joint strength between solder ball and pad on the substrate is one of the major factors which have effects on the electronic device reliability. To improve the strength of the solder joint, the efforts evaluation surface cleaning, heat treatment and change of solder composition have been in progress. This paper discussed a solder ball joint strength improvement using low frequency ...


Reliability of Sn-3.5Ag solder joints in high temperature packaging applications

[{u'author_order': 1, u'affiliation': u'Oak Ridge National Laboratory, Bldg. 4508, MS-6083, 1 Bethel Valley Road, Oak Ridge, Tennessee-37831', u'full_name': u'Govindarajan Muralidharan'}, {u'author_order': 2, u'affiliation': u'Oak Ridge National Laboratory, Bldg. 4508, MS-6083, 1 Bethel Valley Road, Oak Ridge, Tennessee-37831', u'full_name': u'Kanth Kurumaddali'}, {u'author_order': 3, u'affiliation': u'Oak Ridge National Laboratory, Bldg. 4508, MS-6083, 1 Bethel Valley Road, Oak Ridge, Tennessee-37831', u'full_name': u'Andrew K. Kercher'}, {u'author_order': 4, u'affiliation': u'Powerex Inc, 173 Pavilion Lane, Youngwood, PA 15697', u'full_name': u'Scott G. Leslie'}] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), None

There is a significant need for next-generation, highperformance power electronic packages and systems with wide band gap devices that operate at high temperatures in automotive and electric grid applications. Sn-3.5Ag solder is a candidate for use in such packages with potential operating temperatures up to 200°C. However, there is a need to understand thermal cycling reliability of Sn-3.5Ag solders. The ...


Micro tube insertion into indium, copper and other materials for 3D applications

[{u'author_order': 1, u'affiliation': u'CEA - LETI, MINATEC, 17, rue des Martyrs - 38054 Grenoble Cedex 9, France', u'full_name': u'B. Goubault de Brugi\xe8re'}, {u'author_order': 2, u'affiliation': u'CEA - LETI, MINATEC, 17, rue des Martyrs - 38054 Grenoble Cedex 9, France', u'full_name': u'F. Marion'}, {u'author_order': 3, u'affiliation': u'CEA - LETI, MINATEC, 17, rue des Martyrs - 38054 Grenoble Cedex 9, France', u'full_name': u'M. Fendler'}, {u'author_order': 4, u'affiliation': u'CEA - LETI, MINATEC, 17, rue des Martyrs - 38054 Grenoble Cedex 9, France', u'full_name': u'V. Mandrillon'}, {u'author_order': 5, u'affiliation': u'LETAM -CNRS/UPVM/ENIM, Ile du Saulcy, Metz, France', u'full_name': u'A. Hazotte'}, {u'author_order': 6, u'affiliation': u'CEA - LETI, MINATEC, 17, rue des Martyrs - 38054 Grenoble Cedex 9, France', u'full_name': u'M. Volpert'}, {u'author_order': 7, u'affiliation': u'CEA - LETI, MINATEC, 17, rue des Martyrs - 38054 Grenoble Cedex 9, France', u'full_name': u'H. Ribot'}] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), None

The viability of inter-strata low pitch vertical interconnection technologies is mandatory for 3D applications. In order to increase the connection complexity and to reach a 10μm or even smaller interconnection pitch, a new room-temperature insertion technology has been proposed and developed using micro tubes as inserts [1]. In the present work, we study the load required to obtain a full ...


Trends in lead frame technology for plastic packaging

[{u'author_order': 1, u'affiliation': u'Olin Metals Res. Lab., New Haven, CT, USA', u'full_name': u'D. Mahulikar'}] Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, None

Lead frames make up the largest portion of the materials costs in plastic packages; especially Quad Flat Packages (QFP's). For stamping lead frames the costs can be up to 60% of total while for etched lead frames it can run up to 75% of total. Additionally, from performance perspectives lead-frames are a critical component of the packaging system. Lead frames ...


More Xplore Articles

Educational Resources on Soldering

Back to Top

eLearning

No eLearning Articles are currently tagged "Soldering"

IEEE-USA E-Books

  • Board Reflow Processes and their Effect on Tin Whisker Growth

    This chapter reviews the potential affect that the board reflow process has on tin whisker growth. Investigations in this area have looked at grain orientations and grain size, solder paste volume, and solder peak temperature on tin whisker growth. The chapter discusses the results on tin whisker testing on soldered pure¿¿¿tin¿¿¿coated components after reflow. There has been work to understand the affect of reflow profile, reflow atmosphere, solder paste volume, and flux activity on tin whisker growth. For tin¿¿¿lead soldering, the lower soldering peak temperature reduced solder paste wetting up the component lead frame increasing the potential for tin whisker growth. Different flux activators were found to aid the oxidation of tin, which increased tin whisker growth after temperature and humidity testing. Increased contamination of the soldered components with chloride and sulfate also increased tin whisker growth after temperature and humidity testing.

  • Properties and Whisker Formation Behavior of Tin¿¿¿Based Alloy Finishes

    This chapter reviews the basic properties of tin¿¿¿based alloy finishes and the effect of various alloying elements on whisker formation. The focus is on whisker test data and potential mechanisms for whisker suppression or enhancement for each element. A close look based on experimental data at the mechanisms of spontaneous whisker formation or suppression in matte Sn¿¿¿Cu alloy finishes reveals how adding minor elements to the copper base material (lead frame) can significantly change the whisker formation propensity of the alloy finish. Significantly different tendencies of whisker formation from the same matte Sn¿¿¿Cu coating electrodeposited on two different copper lead frames, namely, copper¿¿¿iron and copper¿¿¿chromium, were found. The results of these examinations clarified the mechanisms of formation and suppression of whiskers grown from the Sn¿¿¿Cu coating, and they established a countermeasure against the spontaneous whisker formation through the selection of the copper lead¿¿¿frame material.



Standards related to Soldering

Back to Top

No standards are currently tagged "Soldering"


Jobs related to Soldering

Back to Top