Soldering

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Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a lower melting point than the workpiece. Soldering differs from welding in that the workpieces are not melted. (Wikipedia.org)






Conferences related to Soldering

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2018 13th European Microwave Integrated Circuits Conference (EuMIC)

The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.

  • 2017 12th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2016 11th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2014 9th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS

  • 2013 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2012 European Microwave Integrated Circuit Conference (EuMIC)

    Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.

  • 2011 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2010 European Microwave Integrated Circuits Conference (EuMIC)

    EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs

  • 2009 European Microwave Integrated Circuits Conference (EuMIC)

    The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2008 European Microwave Integrated Circuits Conference (EuMIC)

    The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2007 European Microwave Integrated Circuits Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)

  • GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 7th Electronic System-Integration Technology Conference (ESTC)

This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-art and future trends in electronics packaging and integration technologies.


2018 Asia-Pacific Microwave Conference (APMC)

The conference topics include microwave theory and techniques, and their related technologies and applications. They also include active devices and circuits, passive components, wireless systems, EMC and EMI, wireless power transfer and energy harvesting, antennas and propagation, and others.


2018 IEEE 45th Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


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Periodicals related to Soldering

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Soldering

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Xplore Articles related to Soldering

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Probabilistic effects in thermal cycling failures of high-I/O BGA assemblies

[{u'author_order': 1, u'affiliation': u'CALCE Electronic Products & Systems Consortium, Mechanical Engineering Department, University of Maryland, College Park, 20742, USA', u'full_name': u'S. London'}, {u'author_order': 2, u'affiliation': u'CALCE Electronic Products & Systems Consortium, Mechanical Engineering Department, University of Maryland, College Park, 20742, USA', u'full_name': u'D. Fricano'}, {u'author_order': 3, u'affiliation': u'CALCE Electronic Products & Systems Consortium, Mechanical Engineering Department, University of Maryland, College Park, 20742, USA', u'full_name': u'A. Dasgupta'}, {u'author_order': 4, u'affiliation': u'Instituto Nokia de Technologia, Taruma, CEP: 69048-660, Manaus-AM, Brazil', u'full_name': u'T. Reinikaininen'}, {u'author_order': 5, u'affiliation': u'Instituto Nokia de Technologia, Taruma, CEP: 69048-660, Manaus-AM, Brazil', u'full_name': u'G. Freitas'}, {u'author_order': 6, u'affiliation': u'Instituto Nokia de Technologia, Taruma, CEP: 69048-660, Manaus-AM, Brazil', u'full_name': u'C. Pagliosa'}] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, None

This paper presents a study of the probabilistic effects that act in addition to deterministic (mechanistic) effects to reduce the thermal cycling durability of ball grid array (BGA) interconnects as the component I/O count increases. The mechanistic drivers include increasing thermal expansion mismatch with increasing package size and increasing stress levels with decreasing solder joint size. The most critical joint ...


Fatigue life estimation of surface mount solder joints

[{u'author_order': 1, u'affiliation': u'Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong', u'full_name': u'D. J. Xie'}, {u'author_order': 2, u'affiliation': u'Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong', u'full_name': u'Y. C. Chan'}, {u'author_order': 3, u'full_name': u'J. K. L. Lai'}, {u'author_order': 4, u'full_name': u'I. K. Hui'}] IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996

A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The specimen used in the experiments is a quad flat pack (QFP)-solder-printed circuit board (PCB) assembly and the fabrication of solder joints makes use of conventional surface mount technology (SMT). Mechanical cycling and thermal shock testing can be conducted directly ...


Green mould compounds: Impact on second level interconnect reliability

[{u'author_order': 1, u'affiliation': u'imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'full_name': u'B. Vandevelde'}, {u'author_order': 2, u'affiliation': u'imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'full_name': u'M. Lofrano'}, {u'author_order': 3, u'affiliation': u'imec, Kapeldreef 75, B-3001 Leuven, Belgium', u'full_name': u'G. Willems'}] 2011 IEEE 13th Electronics Packaging Technology Conference, None

The change-over from conventional to so-called green moulding compounds has gradually taken place in the last five years. These green mould compound materials have a lower thermal expansion and higher elastic modulus. As a consequence of the modified thermal and mechanical properties, an impact on the thermo-mechanical behaviour of the package-board assembly is expected (so- called Package Board Interaction: PBI). ...


Flip chip assembly with advanced RDL technology

[{u'author_order': 1, u'affiliation': u'Amkor Technol., Chandler, AZ, USA', u'full_name': u'Shengmin Wen'}, {u'author_order': 2, u'affiliation': u'Amkor Technol., Chandler, AZ, USA', u'full_name': u'KyungRok Park'}, {u'author_order': 3, u'affiliation': u'Texas Instrum. Inc., Dallas, TX, USA', u'full_name': u'Patrick Thompson'}, {u'author_order': 4, u'affiliation': u'Texas Instrum. Inc., Dallas, TX, USA', u'full_name': u'Dwayne Shirley'}, {u'author_order': 5, u'affiliation': u'Amkor Technol. Korea Inc., Gwangju, South Korea', u'full_name': u'JeongSeok Lee'}, {u'author_order': 6, u'affiliation': u'Amkor Technol. Korea Inc., Gwangju, South Korea', u'full_name': u'HyunJin Park'}] 2013 14th International Conference on Electronic Packaging Technology, None

With silicon node technology shrinking to beyond 14nm, die pad pitch becomes smaller and bumps become finer dimensioned so that I/O pads can be laid out. In many cases, flip chip assembly is required because of layout considerations, performance, and cost effectiveness. Often, the fine pitch layout poses great challenges to existing bumping and flip chip assembly capability. This paper ...


Increasing Value in Lead-Free Soldering with Nitrogen

[{u'author_order': 1, u'affiliation': u'BOC Group Inc, 575 Mountain Avenue, Murray Hill, Jersey 07974 USA. Tel: +1 908 665 2400', u'full_name': u'Hiew Pang Ling'}, {u'author_order': 2, u'affiliation': u'BOC Group Inc, 575 Mountain Avenue, Murray Hill, Jersey 07974 USA. Tel: +1 908 665 2400', u'full_name': u'Paul Stratton'}] 2006 7th International Conference on Electronic Packaging Technology, None

Many of the lead-free solder pastes on today's market claim either not to require the use of nitrogen inerting or to work equally well in air or nitrogen. There is a fine balance between a lead-free solder paste that performs well in air and one where the flux residue must be removed to avoid corrosion problems. Even the best pastes ...


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Educational Resources on Soldering

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eLearning

No eLearning Articles are currently tagged "Soldering"

IEEE-USA E-Books

  • Properties and Whisker Formation Behavior of Tin¿¿¿Based Alloy Finishes

    This chapter reviews the basic properties of tin¿¿¿based alloy finishes and the effect of various alloying elements on whisker formation. The focus is on whisker test data and potential mechanisms for whisker suppression or enhancement for each element. A close look based on experimental data at the mechanisms of spontaneous whisker formation or suppression in matte Sn¿¿¿Cu alloy finishes reveals how adding minor elements to the copper base material (lead frame) can significantly change the whisker formation propensity of the alloy finish. Significantly different tendencies of whisker formation from the same matte Sn¿¿¿Cu coating electrodeposited on two different copper lead frames, namely, copper¿¿¿iron and copper¿¿¿chromium, were found. The results of these examinations clarified the mechanisms of formation and suppression of whiskers grown from the Sn¿¿¿Cu coating, and they established a countermeasure against the spontaneous whisker formation through the selection of the copper lead¿¿¿frame material.

  • Board Reflow Processes and their Effect on Tin Whisker Growth

    This chapter reviews the potential affect that the board reflow process has on tin whisker growth. Investigations in this area have looked at grain orientations and grain size, solder paste volume, and solder peak temperature on tin whisker growth. The chapter discusses the results on tin whisker testing on soldered pure¿¿¿tin¿¿¿coated components after reflow. There has been work to understand the affect of reflow profile, reflow atmosphere, solder paste volume, and flux activity on tin whisker growth. For tin¿¿¿lead soldering, the lower soldering peak temperature reduced solder paste wetting up the component lead frame increasing the potential for tin whisker growth. Different flux activators were found to aid the oxidation of tin, which increased tin whisker growth after temperature and humidity testing. Increased contamination of the soldered components with chloride and sulfate also increased tin whisker growth after temperature and humidity testing.



Standards related to Soldering

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Jobs related to Soldering

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