Soldering

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Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a lower melting point than the workpiece. Soldering differs from welding in that the workpieces are not melted. (Wikipedia.org)






Conferences related to Soldering

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2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE)

Control Systems & ApplicationsPower ElectronicsSignal Processing & Computational IntelligenceRobotics & MechatronicsSensors, Actuators & System IntegrationElectrical Machines & DrivesFactory Automation & Industrial InformaticsEmerging Technologies

  • 2012 IEEE 21st International Symposium on Industrial Electronics (ISIE)

    IEEE-ISIE is the largest summer conference of the IEEE Industrial Electronics Society, which is an international forum for presentation and discussion of the state of art in Industrial Electronics and related areas.

  • 2011 IEEE 20th International Symposium on Industrial Electronics (ISIE)

    Industrial electronics, power electronics, power converters, electrical machines and drives, signal processing, computational intelligence, mechatronics, robotics, telecommuniction, power systems, renewable energy, factory automation, industrial informatics.

  • 2010 IEEE International Symposium on Industrial Electronics (ISIE 2010)

    Application of electronics and electrical sciences for the enhancement of industrial and manufacturing processes. Latest developments in intelligent and computer control systems, robotics, factory communications and automation, flexible manufacturing, data acquisition and signal processing, vision systems, and power electronics.

  • 2009 IEEE International Symposium on Industrial Electronics (ISIE 2009)

    The purpose of the IEEE international conference is to provide a forum for presentation and discussion of the state-of art of Industrial Electronics and related areas.

  • 2008 IEEE International Symposium on Industrial Electronics (ISIE 2008)

    The purpose of this IEEE international conference is to provide a forum for presentation and discussion of the state-of-art of Industrial Electronics and related areas

  • 2007 IEEE International Symposium on Industrial Electronics (ISIE 2007)


2013 36th International Spring Seminar on Electronics Technology (ISSE)

This international conference focusses on exchange of information between senior and young scientists from academic communities and electronic industries. Since 1977 the conference has been hosted by different Eureopean universities.

  • 2012 35th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2011 34th International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very widespread field of electronics and microelectronics technology and packaging.

  • 2010 33rd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging.

  • 2009 32nd International Spring Seminar on Electronics Technology (ISSE)

    The International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide -spread field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors and students, senio

  • 2008 31st International Spring Seminar on Electronics Technology (ISSE)

    he International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging. Based on a unique combination of oral and poster presentations as well as individual meetings, professors and students, senior an

  • 2007 30th International Spring Seminar on Electronics Technology (ISSE)

  • 2006 29th International Spring Seminar on Electronics Technology (ISSE)


2013 International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices (EDM)

EDM’2013 is a significant event aimed at development of scientific schools working on foreground areas of Russian science and technology. The main areas are research, design and implementation of micro- nanostructures, radio and telecommunication devices, power electronics and mechatronic systems which are now related to the development of scientific and technological progress. The conference aims to gather young specialists of the different universities of Russia, CIS and other countries. Invited Russian and foreign specialists will report about the development of science and technologies, perspectives of further development of modern electronics. This conference is focused primarily on the discussion of the fundamental theoretical and technological problems of designing and implementing products of micro- and nanoelectronics, simulation methods, and engineering experiments and physical interpretation of the results of these experiments.


2012 4th Electronic System-Integration Technology Conference (ESTC)

The premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.


2011 International Symposium on Advanced Packaging Materials (APM)

The Symposium aims to provide leading coverage of developments in all areas of semiconductor and packaging materials and processes.


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Periodicals related to Soldering

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Xplore Articles related to Soldering

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A model for assessing the shape of solder joints in the presence of board warpage and volume variation in area-array packages

T. B. Thompson; G. Subbarayan; R. James; F. P. Renken ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069), 2000

The goals of the present paper are to demonstrate a methodology for studying the effect of printed circuit board (PCB) warpage and volume variation on the final equilibrium configuration of area-array packages. Although the eventual goal is the development of a predictive methodology for the reliability impact of circuit board and component warpage, the present study is limited to an ...


Evaluation of soldering properties with various types of metallization

H. Shimokawa; M. Okamoto; K. Serizawa 2003 EcoDesign 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 2003

We have studied the soldering properties of Sn-Ag-Cu lead-free solders with various types of metallization. We investigated the effects of metallization thickness on soldering properties in a variety of lead-free metallization materials. When no oxide film has formed, the metallization thickness affects the wetting speed at the initial phase but has no effect on the ultimate wetting state. Better wetting ...


Recent advances on electrical conductive adhesives (ECAs)

Yi Li; C. P. Wong 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004., 2004

First Page of the Article ![](/xploreAssets/images/absImages/01402732.png)


Reliability assessment of PBGA solder joints using the new creep constitutive relationship and modified energy-based life prediction model

X. Q. Shi; Q. J. Yang; Z. P. Wang; H. L. J. Pang; W. Zhou Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

In this study, a new creep constitutive relationship and a modified energy- based fatigue model are proposed. Compared to the commonly used hyperbolic- sine and two-regime power law relationships, the new relationship was found to be capable of covering the whole temperature range and stress regime. The modified energy-based fatigue model represents the cycling temperature and frequency effects well, which ...


Effects of Bi and Ni addition on wettability and melting point of Sn-0.3Ag-0.7Cu Low-Ag Pb-free solder

Y. Liu; F. L. Sun; T. L. Yan; W. G. Hu 2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008

Bi and Ni were added to Sn-0.3Ag-0.7Cu low-Ag solder, to fabricate new low-Ag solders, Sn-0.3Ag-0.7Cu-XBi (X= 1.0, 3.0, 4.5) and Sn-0.3Ag-0.7Cu-XNi (X=0.05, 0.10, 0.15). Melting point tests were carried out with DSC (differential scanning calorimetry) instrument. Wettability tests were conducted on a wetting balance instrument. Test results of the two new solders were compared with that of Sn-0.3Ag-0.7Cu respectively to ...


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Educational Resources on Soldering

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eLearning

A model for assessing the shape of solder joints in the presence of board warpage and volume variation in area-array packages

T. B. Thompson; G. Subbarayan; R. James; F. P. Renken ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069), 2000

The goals of the present paper are to demonstrate a methodology for studying the effect of printed circuit board (PCB) warpage and volume variation on the final equilibrium configuration of area-array packages. Although the eventual goal is the development of a predictive methodology for the reliability impact of circuit board and component warpage, the present study is limited to an ...


Evaluation of soldering properties with various types of metallization

H. Shimokawa; M. Okamoto; K. Serizawa 2003 EcoDesign 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 2003

We have studied the soldering properties of Sn-Ag-Cu lead-free solders with various types of metallization. We investigated the effects of metallization thickness on soldering properties in a variety of lead-free metallization materials. When no oxide film has formed, the metallization thickness affects the wetting speed at the initial phase but has no effect on the ultimate wetting state. Better wetting ...


Recent advances on electrical conductive adhesives (ECAs)

Yi Li; C. P. Wong 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004., 2004

First Page of the Article ![](/xploreAssets/images/absImages/01402732.png)


Reliability assessment of PBGA solder joints using the new creep constitutive relationship and modified energy-based life prediction model

X. Q. Shi; Q. J. Yang; Z. P. Wang; H. L. J. Pang; W. Zhou Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000

In this study, a new creep constitutive relationship and a modified energy- based fatigue model are proposed. Compared to the commonly used hyperbolic- sine and two-regime power law relationships, the new relationship was found to be capable of covering the whole temperature range and stress regime. The modified energy-based fatigue model represents the cycling temperature and frequency effects well, which ...


Effects of Bi and Ni addition on wettability and melting point of Sn-0.3Ag-0.7Cu Low-Ag Pb-free solder

Y. Liu; F. L. Sun; T. L. Yan; W. G. Hu 2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008

Bi and Ni were added to Sn-0.3Ag-0.7Cu low-Ag solder, to fabricate new low-Ag solders, Sn-0.3Ag-0.7Cu-XBi (X= 1.0, 3.0, 4.5) and Sn-0.3Ag-0.7Cu-XNi (X=0.05, 0.10, 0.15). Melting point tests were carried out with DSC (differential scanning calorimetry) instrument. Wettability tests were conducted on a wetting balance instrument. Test results of the two new solders were compared with that of Sn-0.3Ag-0.7Cu respectively to ...


More eLearning Resources

IEEE-USA E-Books

  • LeadFree Rework

    This chapter contains sections titled: Introduction Surface Mount Technology (SMT) Hand Soldering/Touch-Up BGA/CSP Rework BGA Socket Rework X-raying Through-Hole Hand-Soldering Rework Through-Hole Mini-Pot/Solder Fountain Rework Best Practices and Rework Equipment Calibrations Conclusions Future Work References

  • B: Personnel and Equipment Safety Considerations

    This appendix contains sections titled: General Safety Guidelines Equipment Protection Equipment Considerations Personnel Protective Equipment Accident Prevention Signs Tower Climbing Hand Tools Electrical Powered Tools Soldering Irons Ladders Hoisting or Moving Equipment Batteries Laser Safety Guidelines Safe Use of Lasers and LED in Optical Fiber Communication Systems Optical Fiber Communication System (OFCS) Service Groups (SGs) Electrostatic Discharge (ESD) Maximum Permissible Microwave Radio RF Exposure Protect Other Radio Users [FCC] PAUSE (Prevent all Unplanned Service Events) and Ask Yourself (Verizon and AT&T Operations) Protect Yourself (Bell System Operations) Parting Comment

  • LeadFree Solder Paste Technology

    This chapter contains sections titled: Introduction Materials Rheology Applications Reflow Soldering Microstructures of Reflowed Joints Challenges of Lead-Free Reflow Soldering Summary References

  • Building Wheels

    This chapter contains sections titled: Wheel Design, Get Spokes of Correct Length, Check the Rim Drilling Pattern, Rotate Hub and Install Outside Spokes, Tighten and True the WheelRelieve Torsional Stress in Spokes, File or Grind Spoke Ends, Tying and Soldering or Gluing, Wheels for Heavy Riders

  • LeadFree Reflow and Rework

    This chapter contains sections titled: Introduction Printability of Lead-Free Solder Pastes Soak Versus Ramp Temperature Profiles Effect of Peak Temperature Versus Reflow Performance Effect of Reflow Atmosphere on Solderability of Lead-Free Solder Convection Versus IR Reflow Ovens Reflow Temperature Delta on Boards and Components Visual Inspection of Lead-Free Soldered Joints Automated Optical Inspection (AOI) X-ray Inspection of Lead-Free Soldered Joints Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow Lead-Free Rework of BGA/CSP Soldered Joints Lead-Free Hand-Soldering Rework In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints Yield Data Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints Conclusions Future Work Acknowledgments References

  • Board Reflow Processes and their Effect on Tin Whisker Growth

    This chapter reviews the potential affect that the board reflow process has on tin whisker growth. Investigations in this area have looked at grain orientations and grain size, solder paste volume, and solder peak temperature on tin whisker growth. The chapter discusses the results on tin whisker testing on soldered pure???tin???coated components after reflow. There has been work to understand the affect of reflow profile, reflow atmosphere, solder paste volume, and flux activity on tin whisker growth. For tin???lead soldering, the lower soldering peak temperature reduced solder paste wetting up the component lead frame increasing the potential for tin whisker growth. Different flux activators were found to aid the oxidation of tin, which increased tin whisker growth after temperature and humidity testing. Increased contamination of the soldered components with chloride and sulfate also increased tin whisker growth after temperature and humidity testing.

  • LeadFree Wave Soldering

    This chapter contains sections titled: Wave-Soldering Process Boundaries Soldering Temperatures on the Chip and Main Soldering Waves Alloys for Lead-Free Wave Soldering Function of Nitrogen in Wave Soldering Effect of PCB Design on Wave Solder Joint Formation Standards Related to Wave Soldering Conclusions Future Work Acknowledgments References

  • Transitions

    This chapter describes transitions between different types of transmission lines. The majority of these transitions are between microstrip and one of the other planar transmission line mediums, for example the authors consider transitions between microstrip and slotline, stripline, and coplanar waveguide (CPW). The chapter also considers transitions to coaxial line and rectangular waveguide. Transitions necessarily introduce discontinuities as the electric and magnetic field orientations are changed. This results in electric and magnetic energy storage and this necessarily introduces frequency dependence and limits bandwidth, primarily setting the upper frequency limit of transitions. At millimeter¿¿¿waves the principal external transmission medium prior to microstrip is rectangular waveguide and so a waveguide¿¿¿to¿¿¿microstrip transition is required. To suit millimeter¿¿¿wave conditions, a step is implemented in the waveguide widths so that the additional substrate with the radiating patch can be automatically positioned across the ledges of the step and fixed in place by soldering or similar.

  • Introduction to MODSIM

    Computer simulations, either in-house prepared or commercially available, have been effectively used in electromagnetics (EMs). Key issues are model validation, code verification, and calibration (VV&C) and physical interpretation of the numbers obtained. The four critical words are mathematics, physics, experience, and practice. A good EM modeling and simulation (EM-MODSIM) course should cover them all. When not measuring or soldering, engineers continuously deal with models when analyzing, designing, and implementing. The two phases in modeling are utilization and creation. Maxwell's well-known equations establish the physics of electrical engineering (EE), well define the interaction of electromagnetic waves with matter, and form the basis for a real understanding of EE problems and their solutions. Well-known and widely used EM-MODSIM models are finite element model (FEM), method of moments (MoM), parabolic equation (PE), finite-difference time- domain (FDTD), and transmission line matrix (TLM). Guided wave problems are important in teaching EM.

  • LeadFree Surface Mount Technology

    This chapter contains sections titled: Introduction No-Clean and Water-Soluble Lead-Free Pastes Solder Paste Handling Board and Stencil Design Screen Printing and Printability of Lead-Free Solder Pastes Paste Inspection Component Placement (Paste Tackiness) Reflow Soldering and the Reflow Profile Effect of Nitrogen versus Air Atmosphere during Lead-Free Reflow Head-in-Pillow Component Soldering Defect Visual Inspection of Solder Joint Automated Optical Inspection (AOI) X-ray Inspection ICT/Functional Testing Conclusions Future Work Acknowledgments References



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