Silicon

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Silicon is the most common metalloid. (Wikipedia.org)






Conferences related to Silicon

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2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.


2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .


2014 IEEE 40th Photovoltaic Specialists Conference (PVSC)

The PVSC is a technical conference dedicated to the science and application of photovoltaics for solar electricity generation. Technical Program Areas: 1. Fundamentals and New Concepts for Future Technologies 2. Thin Film Polycrystalline Photovoltaics 3. III-V and Concentrator Technologies 4. Crystalline Silicon Technologies 5. Thin Film Silicon Based PV Technologies 6. Organic Photovoltaics 7. Space Technologies 8. Characterization and Measurement Methods 9. PV Modules and Manufacturing 10. PV Systems and Applications 11. PV Velocity Forum


2014 IEEE 45th Semiconductor Interface Specialists Conference (SISC)

The SISC provides a unique forum for device engineers, solid-state physicists, and materials scientists to discuss issues of common interest. Principal topics for discussion at SISC are semiconductor/insulator interfaces, the physics of insulating thin films, and the interaction among materials science, device physics, and state-of-the-art technology.


2013 14th International Conference on Ultimate Integration on Silicon (ULIS)

The aim of the ULIS Conference is to provide an open forum for the presentation and discussion of recent research in technology, physics, modelling, simulation and characterisation of advanced nanoscale silicon and silicon compatible devices in the More Moore, More than Moore and Beyond CMOS domains.

  • 2012 13th International Conference on Ultimate Integration on Silicon (ULIS)

    The aim of the ULIS Conference is to provide an open forum for the presentation and discussion of recent research in technology, physics, modelling, simulation and characterisation of advanced nanoscale silicon and silicon compatible devices in the More Moore, More than Moore and Beyond CMOS domains.

  • 2011 12th International Conference on Ultimate Integration on Silicon (ULIS)

    ULIS is an annual conference that regroups the European research community working on advanced silicon devices and nanodevices. It has been held annually since 2000. The aim of the ULIS Conference is to provide an open forum for the presentation and discussion of recent research in technology, physics, modelling, simulation and characterisation of advanced nanoscale silicon and silicon compatible devices in the More Moore, More than Moore and Beyond CMOS domains.

  • 2009 10th International Conference on Ultimate Integration on Silicon (ULIS)

    The aim of the ULIS Conference is to provide an open forum for the presentation and discussion of recent research in technology, physics, modeling, simulation and characterization of advanced nanoscale silicon and silicon compatible devices in the More Moore, More than Moore and Beyond CMOS domains.

  • 2008 9th International Conference on Ultimate Integration on Silicon (ULIS)

    The aim of the ULIS Conference is to provide an open forum for the presentation and discussion of recent research in technology, physics, modeling, simulation and characterization of advanced nanoscale silicon and silicon compatible devices for switches, memory and novel applications such as sensors and bioelectronics.


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Periodicals related to Silicon

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Lightwave Technology, Journal of

All aspects of optical guided-wave science, technology, and engineering in the areas of fiber and cable technologies; active and passive guided-wave componentry (light sources, detectors, repeaters, switches, fiber sensors, etc.); integrated optics and optoelectronics; systems and subsystems; new applications; and unique field trials.


Selected Topics in Quantum Electronics, IEEE Journal of

40% devoted to special issues published in J. Quantum Electronics. Other topics: solid-state lasers, fiber lasers, optical diagnostics for semi-conductor manufacturing, and ultraviolet lasers and applications.


Semiconductor Manufacturing, IEEE Transactions on

Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.


Solid-State Circuits, IEEE Journal of

The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...




Xplore Articles related to Silicon

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Options for shielding Tokamak Cooling Water electrical components against high magnetic fields

Kofi Korsah; Michael Smith; Seokho Kim; Charles Neumeyer 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

The Tokamak Cooling Water System (TCWS) Instrumentation and Control (I&C) components of ITER will be located in areas of relatively high magnetic fields. Previous tests on electrical and I&C components have indicated that shielding will be required to protect these components from such magnetic fields. To accomplish this, studies were performed by AREVA Federal Services (AFS) in support of the ...


SPHIR-a system for parallel hierarchical routing

V. K. Sagar; R. E. Massara Proceedings of the 32nd Midwest Symposium on Circuits and Systems,, 1989

The possibility of a routing accelerator for VLSI routing based on general- purpose processors and a general-purpose architecture which can be used to speed up other phases of the VLSI design cycle is investigated. Research into a novel technique for exploiting parallelism in the automatic routing process for hierarchical VLSI circuit design is presented. The routing tools are incorporated into ...


Coupling matrix filter synthesis based on reflection matrices

A. A. Muller; J-F. Favennec; E. Sanabria-Codesal 2015 Asia-Pacific Microwave Conference (APMC), 2015

The paper introduces the concept of reflection matrices in the coupling matrix filter reconfiguration. It is shown that reflection matrices are complementary to rotation matrices a useful concept that can be used alternatively to rotation matrices in the similarity transformations that are applied in order to transform the coupling matrix to a suitable form. A cross-coupled filter example is given ...


Comparison of DI and JI lateral IGBTs

Y. S. Huang; B. J. Baliga; S. Tandon; A. Reisman Proceedings of the 4th International Symposium on Power Semiconductor Devices and Ics, 1992

First Page of the Article ![](/xploreAssets/images/absImages/00991234.png)


Ultra-low-loss nano-taper coupler for silicon-on-insulator ridge waveguide

Minhao Pu; Liu Liu; Haiyan Ou; Kresten Yvind; Jørn M. Hvam 36th European Conference and Exhibition on Optical Communication, 2010

A nano-taper coupler is optimized specially for the transverse-magnetic mode for interfacing light between a silicon-on-insulator ridge waveguide and a single-mode fiber. An ultra-low coupling loss of ~0.36dB is achieved for the nano-taper coupler.


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Educational Resources on Silicon

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eLearning

Options for shielding Tokamak Cooling Water electrical components against high magnetic fields

Kofi Korsah; Michael Smith; Seokho Kim; Charles Neumeyer 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

The Tokamak Cooling Water System (TCWS) Instrumentation and Control (I&C) components of ITER will be located in areas of relatively high magnetic fields. Previous tests on electrical and I&C components have indicated that shielding will be required to protect these components from such magnetic fields. To accomplish this, studies were performed by AREVA Federal Services (AFS) in support of the ...


SPHIR-a system for parallel hierarchical routing

V. K. Sagar; R. E. Massara Proceedings of the 32nd Midwest Symposium on Circuits and Systems,, 1989

The possibility of a routing accelerator for VLSI routing based on general- purpose processors and a general-purpose architecture which can be used to speed up other phases of the VLSI design cycle is investigated. Research into a novel technique for exploiting parallelism in the automatic routing process for hierarchical VLSI circuit design is presented. The routing tools are incorporated into ...


Coupling matrix filter synthesis based on reflection matrices

A. A. Muller; J-F. Favennec; E. Sanabria-Codesal 2015 Asia-Pacific Microwave Conference (APMC), 2015

The paper introduces the concept of reflection matrices in the coupling matrix filter reconfiguration. It is shown that reflection matrices are complementary to rotation matrices a useful concept that can be used alternatively to rotation matrices in the similarity transformations that are applied in order to transform the coupling matrix to a suitable form. A cross-coupled filter example is given ...


Comparison of DI and JI lateral IGBTs

Y. S. Huang; B. J. Baliga; S. Tandon; A. Reisman Proceedings of the 4th International Symposium on Power Semiconductor Devices and Ics, 1992

First Page of the Article ![](/xploreAssets/images/absImages/00991234.png)


Ultra-low-loss nano-taper coupler for silicon-on-insulator ridge waveguide

Minhao Pu; Liu Liu; Haiyan Ou; Kresten Yvind; Jørn M. Hvam 36th European Conference and Exhibition on Optical Communication, 2010

A nano-taper coupler is optimized specially for the transverse-magnetic mode for interfacing light between a silicon-on-insulator ridge waveguide and a single-mode fiber. An ultra-low coupling loss of ~0.36dB is achieved for the nano-taper coupler.


More eLearning Resources

IEEE-USA E-Books

  • Appendix D: Physical Properties

    This appendix contains sections titled: Properties of Semiconductors Properties of Ge, Si, and GaAs Properties of SiO2 and Si3N4 Resistivity and Mobility Intrinsic Concentrations and Fermi Levels Depletion Nomograph Absorption Coefficients Silicon Oxidation Rates Ion-Implantation Ranges and Standard Deviations Impurity Diffusion Coefficients Impurity Energy Levels Solid Solubilities Properties of Metals and Silicides Energy gap vs. lattice constant

  • The Microelectronic Age

    The Microelectronics Revolution is a comprehensive guide to the silicon chip revolution and its impact on society. The distinguished contributors to this volume explain in turn the origins and nature of microelectronics, the characteristics of the burgeoning microchip industry and the increasing use of microprocessors in everyday products.The book details the impact of this new technology on society in separate chapters which take up automation on the factory floor, the word-processing revolution in the office, the consequences for employment, and the implications for industrial relations. A final section discusses the problems of a microelectronic age -- 'the information society.'With a discerning guide to further reading at the end of each chapter, this book forms a basis of management, trade union, and college courses on society and the new technology.

  • A Hybrid Silicon Carbide Differential Amplifier for 350C Operation

    An operational amplifier has been designed, fabricated, and tested at 350°C using silicon carbide MESFET pairs and thick film hybrid technology. The amplifier was successfully tested over the temperature range of 25-350°C. The gain of the amplifier was greater than 60 dB, the common-mode rejection ratio was greater than 55 dB, and the offset voltage varied from 139 to 159 mV over the entire temperature range. The results demonstrate the feasibility of high temperature circuit design and assembly using silicon carbide MESFET's and thick film hybrid technology.

  • Neoliberal Networks at the Periphery

    In Networking Peripheries, Anita Chan shows how digital cultures flourish beyond Silicon Valley and other celebrated centers of technological innovation and entrepreneurship. The evolving digital cultures in the Global South vividly demonstrate that there are more ways than one to imagine what digital practice and global connection could look like. To explore these alternative developments, Chan investigates the diverse initiatives being undertaken to "network" the nation in contemporary Peru, from attempts to promote the intellectual property of indigenous artisans to the national distribution of digital education technologies to open technology activism in rural and urban zones.Drawing on ethnographic accounts from government planners, regional free-software advocates, traditional artisans, rural educators, and others, Chan demonstrates how such developments unsettle dominant conceptions of information classes and innovations zones. Government efforts to turn rural artisans into a new creative class progress alongside technology activists' efforts to promote indigenous rights through information tactics; plans pressing for the state wide adoption of open source--based technologies advance while the One Laptop Per Child initiative aims to network rural classrooms by distributing laptops. As these cases show, the digital cultures and network politics emerging on the periphery do more than replicate the technological future imagined as universal from the center.

  • The Characterization of High Temperature Electronics for Future Aircraft Engine Digital Electronic Control Systems

    The characterization of high temperature electronics is presented including high temperature effects, semiconductors and barrier metallizations. Design solutions and material selections for mitigation of high temperature effects are indicated. The following semiconductor materials are considered as future high temperature candidates: - Silicon (Si) - Gallium arsenide (GaAs) - Gallium phosphide (GaP) - Silicon carbide (SiC) - Diamond like carbon (C) This characterization was originally prepared in accordance with the USAF Future Advance Controls Technology Study (FACTS).

  • GaAs Monolithic Phase/Frequency Discriminator

    A GaAs monolithic digital phase/frequency discinminator with a linear characteristic at the zero phase crossing has been developed at Hughes SCG. The maximum operating frequency of 480 MHz is about ten times faster than that of existing silicon devices. These devices are currently used in low noise phase-locked loops. We discuss the design, operation, and use of this device.

  • Overview

    This chapter describes the fundamentals of metal oxide semiconductor (MOS) device physics. It discusses the physics of bulk metal oxide semiconductor field???effect transistors (MOSFETs). The chapter introduces some important physics related to silicon???on???insulator metal oxide semiconductor field???effect transistors (SOI MOSFETs) and explores the theoretical basis of tunnel field???effect transistors (TFETs). It is obvious that we must minimize the subthreshold swing (SS) value of the MOS device in designing device parameters for low???power applications. However, there is still some controversy regarding the issue of whether the subthreshold issue is the substantial problem in overcoming the stand???by power issue. In many MOS devices, there is a simultaneous increase in the band???to???band tunneling (BTBT) current around the source and drain junctions because there must be shallow junctions in bulk devices or an extremely thin semiconductor layer in silicon???on???insulator (SOI) devices in order to suppress short???channel effects.

  • The Big Picture

    This chapter contains sections titled: What is a chip? What are the requirements of a successful chip design? What are the challenges in today's very deep submicron (VDSM), multimillion gate designs? What major process technologies are used in today's design environment? What are the goals of new chip design? What are the major approaches of today's very large scale integration (VLSI) circuit design practices? What is standard cell-based, application-specific integrated circuit (ASIC) design methodology? What is the system-on-chip (SoC) approach? What are the driving forces behind the SoC trend? What are the major tasks in developing a SoC chip from concept to silicon? What are the major costs of developing a chip?

  • Electron Diffraction

    This chapter contains sections titled: Overview Principles of Low-Energy Electron Diffraction LEED Equipment LEED Kinematics Surface Reconstruction Surface Lattices and Superstructures Silicon Reconstructions III-V Compound Semiconductor Reconstructions Reflection High-Energy Electron Diffraction Summary

  • Our Data, Ourselves

    In May 2012 I gave a talk at the renowned Xerox PARC Forum on some of the work described in this book, showing how a range of medical questions can be addressed through analysis of Internet data. After the talk, one of the people who came to ask questions identified himself as an engineer working for one of Silicon Valley's best-known companies. He asked me about our users' privacy, and I began to explain how we are careful to maintain that privacy, but he cut me short. "You don't understand," he said. "I see people in my company using this data all the time, but it's the first time I've seen it put to good use."



Standards related to Silicon

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No standards are currently tagged "Silicon"