Conferences related to Seals

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 IEEE Milan PowerTech

PowerTech is the IEEE PES anchor conference in Europe and has been attended by hundreds of delegates from around the world. It will be an international forum with programme for individuals working in industry and academia, to network, exchange ideas, and discuss the results of their research and development work.

  • 2017 IEEE Manchester PowerTech

    this is IEEE PES anchor conference in Europe covering all areas of electrical power engineering

  • 2015 IEEE Eindhoven PowerTech

    This conference will continue the tradition of the PowerTech conferences held in odd years in Athens, Stockholm, Budapest, Porto, Bologna, St. Petersburg, Lausanne, Bucharest, Trondheim and Grenoble.PowerTech is the anchor conference of the IEEE Power Engineering Society in Europe. It is intended to provide a forum, in the European geographical area, for scientists and engineers interested in electric power engineering to exchange ideas, results of their scientific work, to learn from each other as well as to establish new friendships and rekindle existing ones. Student participation in Power Tech provides an important ingredient toward the event’s success: a special award, the Basil Papadias Award, is presented to the author of the best student paper at each edition. The Power Engineering Society of IEEE organized similar conferences in other parts of the world, such as PowerCon, in the Asia-Pacific region.

  • 2013 IEEE Grenoble PowerTech

    PowerTech is the anchor conference of the IEEE Power & Energy Society in Europe. It is intended to provide a forum for electric power engineering scientists and engineers to share ideas, results of their scientific work, to learn from each other as well as to establish new friendships and maintain existing ones.

  • 2011 IEEE Trondheim PowerTech

    PowerTech is the anchor conference of the IEEE Power & Energy Society in Europe. It is intended to provide a forum for electric power engineering scientists and engineers to share ideas, results of their scientific work and to learn from each other.

  • 2009 IEEE Bucharest Power Tech

    PowerTech is the anchor conference of the IEEE-PES in Europe. It is intended to provide a forum for scientists and engineers interested in electric power engineering to share ideas, results of their scientific work, to learn from each other as well as to establish new friendships and rekindle existing ones.

  • 2007 IEEE Power Tech

  • 2005 IEEE Russia Power Tech

  • 2003 Bologna Power Tech


2018 12th International Conference on Sensing Technology (ICST)

ICST 2018 is intended to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensing technology. ICST 2018 will include workshops, keynote addresses by eminent scientists as well as special, regular and poster sessions. All papers will be peer reviewed on the basis of a full length manuscript and acceptance will be based on quality, originality and relevance.

  • 2017 Eleventh International Conference on Sensing Technology (ICST)

    ICST 2017 is intended to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensing technology. ICST 2017 will include keynote addresses by eminent scientists as well as special, regular and poster sessions. All papers will be peer reviewed on the basis of a full length manuscript and acceptance will be based on quality, originality and relevance.

  • 2016 10th International Conference on Sensing Technology (ICST)

    ICST 2016 is intended to provide a common forum for researchers, scientists, engineers andpractitioners throughout the world to present their latest research findings, ideas, developmentsand applications in the area of sensing technology. ICST 2016 will include keynote addressesby eminent scientists as well as special, regular and poster sessions. All papers will be peerreviewed on the basis of a full length manuscript and acceptance will be based on quality,originality and relevance.

  • 2015 9th International Conference on Sensing Technology (ICST)

    ICST 2015 is intended to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensing technology. ICST 2015 will include keynote addresses by eminent scientists as well as special, regular and poster sessions. All papers will be peer reviewed on the basis of a full length manuscript and acceptance will be based on quality, originality and relevance.

  • 2013 Seventh International Conference on Sensing Technology (ICST)

    ICST 2013 is intended to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensing technology. ICST 2013 will include keynote addresses by eminent scientists as well as special, regular and poster sessions. All papers will be peer reviewed on the basis of a full length manuscript and acceptance will be based on quality, originality and relevance. Accepted papers will be published in the conference proceedings.

  • 2012 Sixth International Conference on Sensing Technology (ICST 2012)

    ICST 2012 is intended to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensors and sensing technology.

  • 2011 Fifth International Conference on Sensing Technology (ICST 2011)

    ICST 2011 is intended to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensing technology. ICST 2011 will include keynote addresses by eminent scientists as well as special, regular and poster sessions. All papers will be peer reviewed on the basis of a full length manuscript and acceptance will be based on quality, originality and relevance. Accepted papers w

  • 2008 3rd International Conference on Sensing Technology (ICST 2008)

    ICST 2008 is intended to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensing technology.


2018 13th European Microwave Integrated Circuits Conference (EuMIC)

The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.

  • 2017 12th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2016 11th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2014 9th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS

  • 2013 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2012 European Microwave Integrated Circuit Conference (EuMIC)

    Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.

  • 2011 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2010 European Microwave Integrated Circuits Conference (EuMIC)

    EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs

  • 2009 European Microwave Integrated Circuits Conference (EuMIC)

    The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2008 European Microwave Integrated Circuits Conference (EuMIC)

    The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2007 European Microwave Integrated Circuits Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)

  • GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium


2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


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Periodicals related to Seals

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


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Most published Xplore authors for Seals

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Xplore Articles related to Seals

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Gas-tight seals for bulk type bushings

[{u'author_order': 1, u'affiliation': u'Westinghouse Electric Corporation, Research and Development Center, Pittsburgh, Pennsylvania 15235, USA', u'full_name': u'James F. Quirk'}] 1979 EIC 14th Electrical/Electronics Insulation Conference, None

This paper describes the theory and the practice by which gas-tight seals are provided along the surface of conductors embedded in a filled, cured resin. In brief, the theory states that quality seals can be provided by designing the resin composition and mold shape such that the resin mass collapses onto the surface of the embedded conductor during manufacture of ...


Polymeric electro-optic Mach-Zehnder modulators with truncated Y-junctions

[{u'author_order': 1, u'affiliation': u'Dept. of Electron. & Tele-Commun. Eng., Jadavpur Univ., Calcutta, India', u'full_name': u'A. K. Das'}, {u'author_order': 2, u'affiliation': u'Dept. of Electron. & Tele-Commun. Eng., Jadavpur Univ., Calcutta, India', u'full_name': u'A. Kotal'}, {u'author_order': 3, u'affiliation': u'Dept. of Electron. & Tele-Commun. Eng., Jadavpur Univ., Calcutta, India', u'full_name': u'A. Das'}] 2006 IFIP International Conference on Wireless and Optical Communications Networks, None

We propose and demonstrate a Mach-Zehnder type electrooptic (EO) modulator with truncated structure of the Y-junctions. The length of the branching zone is reduced to ~3 times in the proposed structure compared with the normal Y-branch structure. The symmetric and asymmetric structures of the junction are studied to consider the fabrication tolerance. We used the simple laser writing process to ...


Miniaturized High-Altitude, High-Temperature Connectors

[{u'author_order': 1, u'affiliation': u'Amphenol Electronics Corp., Chicago, Ill.', u'full_name': u'C. Stuart'}, {u'author_order': 2, u'full_name': u'R. Dorrell'}] IRE Transactions on Component Parts, 1956

A new series of miniaturized multicontact connectors for high-temperature high-altitude conditions has been developed. The degree of performance achieved represents a considerable advance in the connector art. Both nonshielded and shielded contact designs have been incorporated in these connectors. Three exceptional features under extreme environmental conditions characterize these connectors: at altitudes in the order of 70,000 feet and temperatures of ...


Highly reliable, 65 nm-node Cu dual damascene interconnects with full porous-SiOCH (k=2.5) films for low-power ASICs

[{u'author_order': 1, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'M. Ueki'}, {u'author_order': 2, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'M. Narihiro'}, {u'author_order': 3, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'H. Ohtake'}, {u'author_order': 4, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'M. Tagami'}, {u'author_order': 5, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'M. Tada'}, {u'author_order': 6, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'F. Ito'}, {u'author_order': 7, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'Y. Harada'}, {u'author_order': 8, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'M. Abe'}, {u'author_order': 9, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'N. Inoue'}, {u'author_order': 10, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'K. Arai'}, {u'author_order': 11, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'T. Takeuchi'}, {u'author_order': 12, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'S. Saito'}, {u'author_order': 13, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'T. Onodera'}, {u'author_order': 14, u'affiliation': u'Syst. Devices Res. Labs, NEC Corp., Sagamihara, Japan', u'full_name': u'N. Furutake'}, {u'author_order': 15, u'full_name': u'M. Hiroi'}, {u'author_order': 16, u'full_name': u'M. Sekine'}, {u'author_order': 17, u'full_name': u'Y. Hayashi'}] Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004., None

Fully-scaled-down, 65nm-node Cu dual damascene interconnects (DDIs) with 180nm /200nm-pitched lines and 100nmφ-vias have been developed in full porous-SiOCH films (k=2.5). Two new techniques are introduced such as (1) a low thermal- budget process for securing the DDI via-yield without the Cu agglomeration, and (2) a "DD pore seal" covering all the side walls of the line-trenches and the vias ...


Correction

None Proceedings of the IRE, 1949

None


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IEEE-USA E-Books

  • Generator Auxiliary Systems

    This chapter discusses the general nature of the five major auxiliary systems that may be in use in a particular generator: Lubricating‐oil system; hydrogen cooling system; seal‐oil system; stator cooling water system; and excitation system. In some plants, one may find an elaborate hydrogen cooling system panel where all hydrogen controls are located. The lubricating‐oil (lube‐oil) system provides oil for all of the turbine and generator bearings and also is the source of seal oil for the seal‐oil system. As a safety feature, there is often a second ac motor‐driven pump or a dc motor‐driven emergency seal‐oil pump provided. The excitation system also provides control and protective equipment that regulates the generator electrical output. The stator cooling water system (SCW) is used to provide a source of demineralized water to the generator stator winding for direct cooling of the stator winding and associated components.

  • Auxiliaries Inspection

    Some generator auxiliary systems are required to be in service even when the generator itself is not in operation. This chapter provides a description of the things that should be inspected and checked during a generator outage for inspection and maintenance. In general, stators and rotors of rotating exciters should undergo inspection procedures similar to those that apply to the main generator. Abnormal readings can help to identify components for inspection in the lube‐oil system for the purpose of determining what the cause of the abnormality is. Inspection of the hydrogen cooling system, seal‐oil system, and stator cooling water system is usually done at every major outage. The major components of the hydrogen cooling system, seal‐oil system, and stator cooling water system should all be checked for general condition and operational functionality.

  • Cooperative Principles by Nature

    Cooperation is the process of working and interacting together aiming to achieve individual or common goals. Cooperation is present in our daily life, and ultimately, it is the basis of our society. Cooperation arises not only among humans but it is a widespread phenomenon in nature. Human cooperation is governed by intricate rules and patterns of behavior, much morevi complex that the cooperation arising in other species. Cooperation in the animal kingdom, being somewhat simpler though highly efficient, has often served as an inspiration source for many developments in engineering. Many cooperative strategies in the animal world can be particularly useful when applied to a group of user-controlled nodes (i.e., mobile devices) such as those in a mobile cloud. This chapter considers, through several examples, cases of cooperation in Naturevii, and how these can be used to derive basic rules of cooperation. The goal of this chapter is to motivate the reader to identify and exploit cooperative strategies for mobile clouds by finding some connections between cooperation found in Natureviii and cooperation arising among a group of cooperative mobile users. This chapter also discusses game theoretical approaches particularly motivated by the influential work of Robert Axelrod.

  • Condenser Cooling System

    This chapter discusses the basic design and components of the condenser in a steam cycle. The function of the condenser cooling system is to remove the thermal energy from the exhaust steam and transfer this energy to some heat sink outside of the facility. One of the most common methods of removing the thermal energy in the form of heat from the condenser is to provide water flow from an outside water reservoir such as a river, bay, or estuary. This water flows through the tubes in the condenser and removes heat from the exhaust steam. Condensers operate in very low pressures to maximize the efficiency of the thermal process. The vacuum pump uses a water seal and pump assembly to pump air out of the condenser shell side while the air ejector uses steam flow and a venturi element to draw a vacuum on the shell of the condenser.



Standards related to Seals

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IEEE Recommended Practice for Installation, Application, Operation, and Maintenance of Dry-Type General Purpose Distribution and Power Transformers


Standard Requirements, Terminology, and Test Code for Bushings for DC Applications Rated 110 kV BIL and Above

This standard applies to outdoor and indoor power apparatus dc bushings of condenser type that have basic impulse insulation levels of 110 kV and above for use as components of oil-filled converter transformers and smoothing reactors, as well as air-to-air dc bushings. This standard does not apply to the following: a) High-voltage cable terminations (potheads) b) Bushings for instrument transformers ...



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