Conferences related to Seals

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2013 IEEE Aerospace Conference

The international IEEE Aerospace Conference is organized to promote interdisciplinary understanding of aerospace systems, their underlying science and technology, and their applications to government and commercial endeavors. The annual, weeklong conference, set in a stimulating and thought -provoking environment, is designed for aerospace experts, academics, military personnel, and industry leaders.

  • 2012 IEEE Aerospace Conference

    The international IEEE Aerospace Conference is organized to promote interdisciplinary understanding of aerospace systems, their underlying science and technology, and their applications to government and commercial endeavors. The annual, weeklong conference, set in a stimulating and thought-provoking environment, is designed for aerospace experts, academics, military personnel, and industry leaders.

  • 2011 IEEE Aerospace Conference

    The international IEEE Aerospace Conference is organized to promote interdisciplinary understanding of aerospace systems, their underlying science and technology, and their applications to government and commercial endeavors.

  • 2010 IEEE Aerospace Conference

    The international IEEE Aerospace Conference is organized to promote interdisciplinary understanding of aerospace systems, their underlying science and technology, and their applications to government and commercial endeavors.


2012 19th International Conference on Mechatronics and Machine Vision in Practice (M2VIP)

Actuator and drive technology; aeronautical mechatronics; agricultural mechatronics; applied robotics including those manipulative, mobile, walking, flying, humanoid and bio-inspired; artificial and computational intelligence; medical robots.


2010 Annual Reliability and Maintainability Symposium (RAMS)

Tutorials and original papers on reliability, maintainability, safety, risk management and logistics.


2010 International Conference on Intelligent Computation Technology and Automation (ICICTA)

Advanced Computation Theory and Application;Control Theory and Application; Automation;Decision and Management


2009 ISECS International Colloquium on Computing, Communication, Control, and Management (CCCM 2009)

Just like the name of the Colloquium, the theme for this conference is Advancing Computing, Communication, Control,and Management Technologies. Only original high quality papers related to this theme are especially solicited, including theories, methodologies, and applications in Computing, Communication, Control, and Management. Topics covering industrial issues/applications and academic research will be welcome.



Periodicals related to Seals

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Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.




Xplore Articles related to Seals

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The dangers of process seals

P. S. Babiarz; V. Rowe; C. H. Samuels Fifty-First Annual Conference 2004 Petroleum and Chemical Industry Technical Conference, 2004., 2004

When designing a petrochemical facility, one must consider the possibility of primary seals failing. Where electrical devices are isolated from pressurized processes by primary (process) seals, failure of the primary seal can result in conduit or cable seals being subjected to the process pressure, with the result that explosive gas or vapor can be transmitted to safe areas. Conduit and ...


A new concept in microwave gas switching elements

R. S. Braden IRE Transactions on Electron Devices, 1958

First Page of the Article ![](/xploreAssets/images/absImages/01472384.png)


Directory of IEEE-AESS personnel

IEEE Aerospace and Electronic Systems Magazine, 2006

None


Product design of 200 kilowatt tunable x-band klystron

C. A. Arnold; J. P. Lengley IRE Transactions on Electron Devices, 1958

First Page of the Article ![](/xploreAssets/images/absImages/01472383.png)


The merits of open bath immersion cooling of datacom equipment

Phillip E. Tuma 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2010

This paper discusses the economic and environmental merits of passive 2-phase immersion in semi-open baths of dielectric fluid for cooling datacom equipment such as servers. The technique eliminates the need for hermetic connectors, pressure vessels, seals and clamshells typically associated with immersion cooling and the connectors, plumping, pumps and cold plates associated with more traditional liquid cooling techniques. A board ...


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Educational Resources on Seals

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eLearning

The dangers of process seals

P. S. Babiarz; V. Rowe; C. H. Samuels Fifty-First Annual Conference 2004 Petroleum and Chemical Industry Technical Conference, 2004., 2004

When designing a petrochemical facility, one must consider the possibility of primary seals failing. Where electrical devices are isolated from pressurized processes by primary (process) seals, failure of the primary seal can result in conduit or cable seals being subjected to the process pressure, with the result that explosive gas or vapor can be transmitted to safe areas. Conduit and ...


A new concept in microwave gas switching elements

R. S. Braden IRE Transactions on Electron Devices, 1958

First Page of the Article ![](/xploreAssets/images/absImages/01472384.png)


Directory of IEEE-AESS personnel

IEEE Aerospace and Electronic Systems Magazine, 2006

None


Product design of 200 kilowatt tunable x-band klystron

C. A. Arnold; J. P. Lengley IRE Transactions on Electron Devices, 1958

First Page of the Article ![](/xploreAssets/images/absImages/01472383.png)


The merits of open bath immersion cooling of datacom equipment

Phillip E. Tuma 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2010

This paper discusses the economic and environmental merits of passive 2-phase immersion in semi-open baths of dielectric fluid for cooling datacom equipment such as servers. The technique eliminates the need for hermetic connectors, pressure vessels, seals and clamshells typically associated with immersion cooling and the connectors, plumping, pumps and cold plates associated with more traditional liquid cooling techniques. A board ...


More eLearning Resources

IEEE.tv Videos

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IEEE-USA E-Books

  • Generator Maintenance Testing

    This chapter contains sections titled: Stator Core Mechanical Tests Stator Core Electrical Tests Stator Winding Mechanical Tests Water-Cooled Stator Winding Tests Stator Winding Electrical Tests Rotor Mechanical Testing Rotor Electrical Testing Hydrogen Seals Bearings Thermal Sensitivity Testing and Analysis Hydrogen Leak Detection References

  • Rotor Inspection

    This chapter contains sections titled: Rotor Cleanliness Retaining-Rings Fretting/Movement at Interference-Fit Surfaces of Wedges and Rings Centering (Balance) Rings Fan-Rings or Hubs Fan Blades Bearings and Journals Balance Weights and Bolts End Wedges and Damper Windings Other Wedges End-Windings and Main Leads Collector Rings Collector Ring Insulation Bore Copper and Radial (Vertical) Terminal Stud Connectors Brush-Spring Pressure and General Condition Brush-Rigging Shaft Voltage Discharge (Grounding) Brushes Rotor Winding Main Lead Hydrogen Sealing - Inner and Outer Circumferential Pole Slots (Body Flex Slots) Blocked Rotor Radial Vent Holes - Shifting of Winding and/or Insulation Couplings and Coupling Bolts Bearing Insulation Hydrogen Seals Rotor Body Zone Rings References

  • Description of Rotor Items

    This chapter contains sections titled: Rotor Cleanliness Retaining Rings' Visual Appearance (RR) Centering Rings' Visual Appearance (RR) Fan-Rings' Visual Appearance Fretting/Movement at Rings' Interference-Fit Surfaces Fan Blades Condition Bearing Journals Condition Balance Weights/Bolts Condition End-Wedges Condition (RR) Other Wedges (RR) End-Windings Condition (RR) Top Series Connections (SP) Bottom Series Connections (SP) Field-Pole Keys in Dovetail and Inter-Pole Blocking (SP) Insulation between Turns (SP) Starting-Bars (Damper Winding)Condition (SP) Bull-Ring Segments and Bracing to Starting-Bars Condition (SP) Collector Rings Condition Collector Insulation Condition Brush-Spring Pressure and General Condition Brush-Rig Condition Shaft-Voltage Discharge-Brush Condition Inner/Outer Hydrogen Seals (RR) Circumferential Pole Slots Condition (RR) This chapter contains sections titled: Note Reference

  • Morphology and Learning - A Case Study on Whiskers

    In many animal species, whiskers are an important sensory modality. Rats for example navigate, explore and recognize objects by actively whisking them, seals even use them to hunt in murky water. Whiskers also make an excellent model system for biologists due to their well defined anatomy. Recently, whiskers have also attracted an increasing interest by roboticists. We have built an artificial whisker system and mounted it on a robot. In this study, we investigate the role of whisker morphology on the behavior of a robot. For a robot to be able to navigate it has to react to obstacles appropriately yet in a flexible manner. For basic behaviors, associations between reflexes and stimuli can be learned using a model of classical conditioning, the distributed adaptive control (DAC) architecture. This model of associative learning is used to correlate whisker signals with collision signals from the robot's infrared sensors for whisker-based obstacle avoidance. The morphology of the whiskers is varied to test its influence on learning and behavior. We find that the performance of the robot is clearly influenced by its morphology. Furthermore, the weights learned under different morphologies vary according to the morphology. Finally, from the performance of the robot we can speculate about a suitable weight matrix for this task.

  • Rotor Inspection

    This chapter contains sections titled: Rotor Cleanliness Retaining Rings Fretting/Movement at Interference Fit Surfaces of Wedges and Rings Centering (Balance) Rings Fan Rings or Hubs Fan Blades Bearings and Journals Balance Weights and Bolts End Wedges and Damper Windings Other Wedges Windings - General Rotor Windings - Slot Region End Windings and Main Leads Collector Rings Collector Ring Insulation Bore Copper and Radial (Vertical) Terminal Stud Connectors Brush-Spring Pressure and General Condition Brush Rigging Shaft Voltage Discharge (Grounding) Brushes Rotor Winding Main Lead Hydrogen Sealing - Inner and Outer Circumferential Pole Slots (Body Flex Slots) Blocked Rotor Radial Vent Holes - Shifting of Winding and/or Insulation Couplings and Coupling Bolts Bearing Insulation Hydrogen Seals Rotor-Body Zone Rings Rotor Removal References

  • High Temperature Aluminum Nitride Packaging

    As is often the case, advances in electronics are dictated not by the IC devices themselves, but by the ability to package those devices. This is certainly the case for high temperature electronics. The limits of conventional packaging materials such as glass-epoxy circuit boards, plated copper traces and Sn-Pb solder are obvious at temperatures in excess of 300°C. Even standard ceramic packages based on Al2O3 are inadequate above 300°C. Novel materials and assembly techniques required for high temperature operation are presented in this paper. Factors such as thermal conductivity, expansion coefficients, oxidation and diffusion become more critical as operating temperatures increase, and therefore play major roles in determining package construction techniques. The evolution of high temperature package construction will be reviewed in light of these constraints. High temperature packages have been developed based on aluminum nitride (AIN) substrates and nickel metallization. Key features of the packages described in this paper are molded AIN bodies, directly bonded low temperature cofired ceramic (LTCC) frames and silver active braze seals, all of which contribute to producing hermetic packages at high temperatures. A discussion of interconnect metallurgies and attachment methods is included. Test data demonstrating the reliability of AIN high temperature packages will also be presented.

  • Engine Design III: Valves and Valve Gear. Gears and Auxiliary Systems

    This chapter contains sections titled: Poppet Valves, Valves And Ports for 2-Cycle Engines, Valve-Gear Design, Gearing, Superchargers and Scavenging Pumps, Manifolding, Ignition Systems, Injection Systems, Cooling Systems, Liquid, Cooling Systems, Air, Lubrication Systems, Auxiliaries, Gaskets And Seals, Over-All Design Criteria

  • Generator Maintenance Testing

    This chapter contains sections titled: Stator Core Mechanical Tests Stator Core Electrical Tests Stator Winding Mechanical Tests Water-Cooled Stator Winding Tests Stator Winding Electrical Tests Rotor Mechanical Testing Techniques Rotor Electrical Testing Hydrogen Seals Bearings Thermal Sensitivity Test and Analysis References



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