Conferences related to Sandblasting

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2018 28th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

A: BREAKDOWN AND FLASHOVERA1. Vacuum breakdown and pre-breakdown phenomenaA2. Surface discharges and flashover phenomenaB: VACUUM ARCSB1. Switching in vacuum and related phenomenaB2. Interaction of vacuum arcs with magnetic fieldsB3. Vacuum arc physicsB4. Computer modeling and computer aided designB5. Pulsed power physics and technologyC: APPLICATIONSC1. Vacuum interrupters and their applicationsC2. Surface modification and related technologiesC3. Electron, ion, neutron, X-ray and other beam and light sources


2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2018 IEEE 27th International Symposium on Industrial Electronics (ISIE)

The conference will provide a forum for discussions and presentations of advancements in knowledge, new methods and technologies relevant to industrial electronics, along with their applications and future developments.


2018 IEEE 45th Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conferencesponsored by the IEEE Components, Packaging andManufacturing Technology (CPMT) Society. ECTCpapers comprise a wide spectrum of topics, including3D packaging, electronic components, materials,assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation


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Periodicals related to Sandblasting

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Nuclear Science, IEEE Transactions on

All aspects of the theory and applications of nuclear science and engineering, including instrumentation for the detection and measurement of ionizing radiation; particle accelerators and their controls; nuclear medicine and its application; effects of radiation on materials, components, and systems; reactor instrumentation and controls; and measurement of radiation in space.


Power Delivery, IEEE Transactions on

Research, development, design, application, construction, the installation and operation of apparatus, equipment, structures, materials, and systems for the safe, reliable, and economic delivery and control of electric energy for general industrial, commercial, public, and domestic consumption.


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Most published Xplore authors for Sandblasting

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Xplore Articles related to Sandblasting

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On-line measurement of free-form surfaces for manufacturing applications

[{u'author_order': 1, u'affiliation': u"State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China", u'full_name': u'Wei Shao'}, {u'author_order': 2, u'affiliation': u"State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China", u'full_name': u'Junjie Guo'}, {u'author_order': 3, u'affiliation': u"State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China", u'full_name': u'Enxiu Shi'}, {u'author_order': 4, u'affiliation': u"State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Shaanxi, China", u'full_name': u'Qinli Song'}] 2009 IEEE International Symposium on Industrial Electronics, None

Measurement of free-form surfaces is a requirement to assure quality and to reduce manufacturing costs and rework. An on-line measurement system combined coordinate measuring machine (CMM) and numerical controlled (NC) sandblast manufacturing equipment for large surface is presented in this paper. It uses transmission and position functions of NC machine and CMM's scan measuring function to make large surface measurement ...


Sandblaster low power DSP [parallel DSP arithmetic microarchitecture]

[{u'author_order': 1, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'J. Glossner'}, {u'author_order': 2, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'K. Chirca'}, {u'author_order': 3, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'M. Schulte'}, {u'author_order': 4, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'Haoran Wang'}, {u'author_order': 5, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'N. Nasimzada'}, {u'author_order': 6, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'D. Har'}, {u'author_order': 7, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'Shenghong Wang'}, {u'author_order': 8, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'A. J. Hoane'}, {u'author_order': 9, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'G. Nacer'}, {u'author_order': 10, u'affiliation': u'Sandbridge Technol. Inc., White Plains, NY, USA', u'full_name': u'M. Moudgill'}, {u'author_order': 11, u'full_name': u'S. Vassiliadis'}] Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571), None

General purpose processors have utilized complex and energy inefficient techniques to accelerate performance. In embedded DSP designs, power constraints have precluded general purpose microarchitectural techniques. Rather than minimize average execution time, embedded DSP processors require the worst case execution time to be minimized. Subsequently, very long instruction word (VLIW) processors have been employed, but architecturally visible side effects have imposed ...


Implementation of H.264 decoder on Sandblaster DSP

[{u'author_order': 1, u'affiliation': u'Sandbridge Technol., White Plains, NY, USA', u'full_name': u'Vaidyanathan Ramadurai'}, {u'author_order': 2, u'affiliation': u'Sandbridge Technol., White Plains, NY, USA', u'full_name': u'Sanjay Jinturkar'}, {u'author_order': 3, u'affiliation': u'Sandbridge Technol., White Plains, NY, USA', u'full_name': u'M. Moudgill'}, {u'author_order': 4, u'affiliation': u'Sandbridge Technol., White Plains, NY, USA', u'full_name': u'J. Glossner'}] 2005 IEEE International Conference on Multimedia and Expo, None

This paper presents the optimization techniques and results of implementing the H.264/AVC baseline profile decoder in software on the Sandblaster digital signal processor. It has been implemented in ANSI C and optimized to exploit the architectural features of the processor. The software implementation enables the reusability of the processor and lowers the development costs.


Synchronization on heterogeneous multiprocessor systems

[{u'author_order': 1, u'affiliation': u'Sandbridge Technologies Inc., Tarrytown, NY, USA', u'full_name': u'Mayan Moudgill'}, {u'author_order': 2, u'affiliation': u'Sandbridge Technologies Inc., Tarrytown, NY, USA', u'full_name': u'Vitaly Kalashnikov'}, {u'author_order': 3, u'affiliation': u'Sandbridge Technologies Inc., Tarrytown, NY, USA', u'full_name': u'Murugappan Senthilvelan'}, {u'author_order': 4, u'affiliation': u'Sandbridge Technologies Inc., Tarrytown, NY, USA', u'full_name': u'Umesh Srikantiah'}, {u'author_order': 5, u'affiliation': u'Sandbridge Technologies Inc., Tarrytown, NY, USA', u'full_name': u'Tak-po Li'}, {u'author_order': 6, u'affiliation': u'Sandbridge Technologies Inc., Tarrytown, NY, USA', u'full_name': u'Pablo Balzola'}, {u'author_order': 7, u'affiliation': u'Sandbridge Technologies Inc., Tarrytown, NY, USA', u'full_name': u'John Glossner'}] 2009 International Symposium on Systems, Architectures, Modeling, and Simulation, None

To meet the exponential increase in processing requirements of present day embedded system applications, system-on-chip (SoC) designs increasingly have multiple processing elements on the same die. The functionality of these processing elements varies considerably, and includes hardware accelerators for specific digital signal processing (DSP) kernels, high-performance DSP cores, and low-power application processors. While executing applications, these processing elements typically share ...


Easy-to-prepare assembly array of tungsten microelectrodes

[{u'author_order': 1, u'affiliation': u'Dept. of Eng. Synthesis, Univ. of Tokyo, Japan', u'full_name': u'H. Takahashi'}, {u'author_order': 2, u'affiliation': u'Dept. of Eng. Synthesis, Univ. of Tokyo, Japan', u'full_name': u'J. Suzurikawa'}, {u'author_order': 3, u'affiliation': u'Dept. of Eng. Synthesis, Univ. of Tokyo, Japan', u'full_name': u'M. Nakao'}, {u'author_order': 4, u'affiliation': u'Dept. of Eng. Synthesis, Univ. of Tokyo, Japan', u'full_name': u'F. Mase'}, {u'author_order': 5, u'full_name': u'K. Kaga'}] IEEE Transactions on Biomedical Engineering, 2005

This paper provides a detailed process flow for fabricating an easy-to- prepare, inexpensive, dense array of tungsten microelectrodes. We designed the process flow to minimize routine tasks by separating an initial preparation of a master mold from a routine preparation of substrate replication, array assembly and tip processing. Sandblast processing first produced a glass mold with a pattern of a ...


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