Conferences related to SDRAM

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2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.


2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R


2014 IEEE International Symposium on Circuits and Systems (ISCAS)

The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society and the world

  • 2013 IEEE International Symposium on Circuits and Systems (ISCAS)

    The Symposium will focus on circuits and systems employing nanodevices (both extremely scaled CMOS and non-CMOS devices) and circuit fabrics (mixture of standard CMOS and evolving nano-structure elements) and their implementation cost, switching speed, energy efficiency, and reliability. The ISCAS 2010 will include oral and poster sessions; tutorials given by experts in state-of-the-art topics; and special sessions, with the aim of complementing the regular program with topics of particular interest to the community that cut across and beyond disciplines traditionally represented at ISCAS.

  • 2012 IEEE International Symposium on Circuits and Systems - ISCAS 2012

    2012 International Symposium on Circuits and Systems (ISCAS 2012) aims at providing the world's premier forum of leading researchers in circuits and systems areas from academia and industries, especially focusing on Convergence of BINET (BioInfoNanoEnviro Tech.) which represents IT, NT and ET and leading Human Life Revolutions. Prospective authors are invited to submit papers of their original works emphasizing contributions beyond the present state of the art. We also welcome proposals on special tuto

  • 2011 IEEE International Symposium on Circuits and Systems (ISCAS)

    The IEEE International Symposium on Circuits and Systems (ISCAS) is the world's premier networking forum of leading researchers in the highly active fields of theory, design and implementation of circuits and systems.

  • 2010 IEEE International Symposium on Circuits and Systems - ISCAS 2010

    ISCAS is a unique conference dealing with circuits and systems. It's the yearly "rendez-vous" of leading researchers, coming both from academia and industry, in the highly active fields of theory, design and implementation of circuits and systems. The Symposium will focus on circuits and systems for high quality life and consumer technologies, including mobile communications, advanced multimedia systems, sensor networks and Nano-Bio Circuit Fabrics and Systems.

  • 2009 IEEE International Symposium on Circuits and Systems - ISCAS 2009

    Analog Signal Processing, Biomedical Circuits and Systems, Blind Signal Processing, Cellular Neural Networks and Array Computing, Circuits and Systems for Communications, Computer-Aided Network Design, Digital Signal Processing, Life-Science Systems and Applications, Multimedia Systems and Applications, Nanoelectronics and Gigascale Systems, Neural Systems and Applications, Nonlinear Circuits and Applications, Power Systems and Power Electronic Circuits, Sensory Systems, Visual Signal Processing and Communi

  • 2008 IEEE International Symposium on Circuits and Systems - ISCAS 2008


2013 IEEE 10th International Conference on ASIC (ASICON 2013)

I. Design Techniques[1] VLSI Design and Circuits[2] Analog, Mixed Signal and RF Circuits[3] Application-Specific SoCs[4] Circuits and Systems for Wireless Communications [5] Testing, Reliability, Fault-Tolerance[6] Advanced MemoryII. CAD Techniques[7] Circuits Simulation, Synthesis, Verification and Physical design[8] CAD for system, Design for Manufacturing and TestingIII. New Techniques, new processing, new devices and their applications[9] MEMS Techniques[10] Nanoelectronics and Gigascale systems[11] New Devices: Hetrojunction Devices, Fin FET, CNT MTJ Devices,, 3-D integration, etc..[12] Advanced Interconnection Technology, High K/Metal gate technology and other VLSL New Processing, New technologies .[13] VLSI application for Energy generation, conservation and control,IC Design, Analog Circuit, Mixed Signal & RF Circuits, SOC, Wireless Communication, IC Testing, Reliebility, CAD Techniques, Synthesis, Verification, Physical Design, DMF, Memory, MEMS, 3D IC, High K/


2013 IEEE 11th International Conference on Electronic Measurement & Instruments (ICEMI)

ICEMI is invited authors to submit original papers in any but not limited as following areas: Science Foundation of Instrument and Measurement Innovative Designing of Instrument and Test System Applications on Instrument and Testing Signal & Image Processing Sensor and Non-electric Measurement Communication and Network Test Systems Control Theory and Application Condition Monitoring, Fault Diagnosis and Prediction Other Relevant Theories and Technologies


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Periodicals related to SDRAM

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Computer Architecture Letters

Rigorously peer-reviewed forum for publishing early, high-impact results in the areas of uni- and multiprocessors computer systems, computer architecture workload characterization, performance evaluation and simulation techniques, and power-aware computing


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Most published Xplore authors for SDRAM

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Xplore Articles related to SDRAM

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An effective SDRAM power mode management scheme for performance and energy sensitive embedded systems

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan', u'full_name': u'Ning-Yaun Ker'}, {u'author_order': 2, u'affiliation': u'Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan', u'full_name': u'Chung-Ho Chen'}] Proceedings of the ASP-DAC Asia and South Pacific Design Automation Conference, 2003., 2003

We present an effective power mode management scheme used in SDRAM memory controllers. The scheme employs a bus utilization monitoring mechanism to initiate proper operations of SDRAM chips. Our approach reduces energy consumption by actively switching memories to low-power mode at low bus utilization. At higher bus utilization, the scheme switches memories to open page mode to reduce precharge energy ...


Pipeline controller on dynamic memory access policy

[{u'author_order': 1, u'affiliation': u"Dept. Microelectronics of Xidian University, Xi'an, China", u'full_name': u'Peijun Ma'}, {u'author_order': 2, u'affiliation': u"Dept. Microelectronics of Xidian University, Xi'an, China", u'full_name': u'Yujia Peng'}, {u'author_order': 3, u'affiliation': u"Dept. Microelectronics of Xidian University, Xi'an, China", u'full_name': u'Qing Guang'}, {u'author_order': 4, u'affiliation': u"Dept. Microelectronics of Xidian University, Xi'an, China", u'full_name': u'Kang Li'}, {u'author_order': 5, u'affiliation': u"Dept. Microelectronics of Xidian University, Xi'an, China", u'full_name': u'Jiangyi Shi'}] 2011 International Conference on Electronics, Communications and Control (ICECC), 2011

This paper presents a novel pipeline memory controller based on multi-core network processing. This pipeline controller includes six level pipeline operations which can reduce access latency and provide bank and row address relationship of two adjacent instructions in advance. The controller would take a dynamic memory access policy according to the address relationship got from the pipelines operations. The traditional ...


Assembly process development of stacked multi-chip leadframe package

[{u'author_order': 1, u'affiliation': u'Agere Syst. Singapore, Singapore', u'full_name': u'Y.F. Yao'}, {u'author_order': 2, u'affiliation': u'Agere Syst. Singapore, Singapore', u'full_name': u'B. Njoman'}, {u'author_order': 3, u'affiliation': u'Agere Syst. Singapore, Singapore', u'full_name': u'K.H. Chua'}, {u'author_order': 4, u'full_name': u'T.Y. Lin'}] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004

Driven by customer requirements and the need for cost reduction, high density stacked multi-chip package (MCP) based on leadframe type has been developed in Agere Systems. This MCP integrates one SoC chip with two stacked SDRAM chips. The paper focuses on the assembly process development and finite element analysis of high density multi-chip package based on leadframe. All the experiments ...


DeviceNet master research based on embedded system

[{u'author_order': 1, u'affiliation': u'Department of Computer Science and Information Engineering, Shanghai Institute of Technology, China', u'full_name': u'Mei Liu'}, {u'author_order': 2, u'affiliation': u'Software Engineering Institute, East China Normal University, Shanghai, China', u'full_name': u'Fu Song'}] The 2nd International Conference on Information Science and Engineering, 2010

Analyzing several commonly used DeviceNet networks, this thesis proposes the master application system based on embedded system. The system's embedded platform is made up of ARM9 and WindowsCE.Net, it implements the driver program of the DeviceNet communication interface, the application program of network management and scanner. The system built for modern breeding environment monitor successfully; thereby an easy, high reliable ...


OC-48 generic frame mapping device for WAN accessing

[{u'author_order': 1, u'affiliation': u'Dept. of Opt. Commun. & Networking Technol., CCL/ITRI, Hsingchu, Taiwan', u'full_name': u'Po-Chun Chiang'}, {u'author_order': 2, u'affiliation': u'Dept. of Opt. Commun. & Networking Technol., CCL/ITRI, Hsingchu, Taiwan', u'full_name': u'Chih-Feng Cheng'}] The 2004 IEEE Asia-Pacific Conference on Circuits and Systems, 2004. Proceedings., 2004

For the transmit quality and convenience of the storage area network (SAN) or local area network (LAN) in the wide area network (WAN), we designed a generic frame mapping (GFM) device to carry the SAN or LAN data onto the SDH/SONET network. The SAN devices which contain the fiber channel or the gigabit Ethernet interface can connect with our GFM ...


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Educational Resources on SDRAM

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eLearning

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IEEE.tv Videos

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IEEE-USA E-Books

  • Content‐and Entertainment‐Centric Software

    iCLouds and MyClouds, Resolution expectations, Resolution, displays and the human visual system, Frame rate expectations, Memory expectations over time, Memory options, Gaming in the Cloud and Gaming and TV integration, Solid state storage, Flash (Nor and Nand), SRAM and SDRAM, The SIM Card, Compact Flash, Smart Media, Multi Media Cards, Memory Stick, SD (Secure Digital) Cards, xD Picture Cards, USB Flash Drives/Portable hard drives



Standards related to SDRAM

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Jobs related to SDRAM

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