Conferences related to SDRAM

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2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.


2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R


2014 IEEE International Symposium on Circuits and Systems (ISCAS)

The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society and the world

  • 2013 IEEE International Symposium on Circuits and Systems (ISCAS)

    The Symposium will focus on circuits and systems employing nanodevices (both extremely scaled CMOS and non-CMOS devices) and circuit fabrics (mixture of standard CMOS and evolving nano-structure elements) and their implementation cost, switching speed, energy efficiency, and reliability. The ISCAS 2010 will include oral and poster sessions; tutorials given by experts in state-of-the-art topics; and special sessions, with the aim of complementing the regular program with topics of particular interest to the community that cut across and beyond disciplines traditionally represented at ISCAS.

  • 2012 IEEE International Symposium on Circuits and Systems - ISCAS 2012

    2012 International Symposium on Circuits and Systems (ISCAS 2012) aims at providing the world's premier forum of leading researchers in circuits and systems areas from academia and industries, especially focusing on Convergence of BINET (BioInfoNanoEnviro Tech.) which represents IT, NT and ET and leading Human Life Revolutions. Prospective authors are invited to submit papers of their original works emphasizing contributions beyond the present state of the art. We also welcome proposals on special tuto

  • 2011 IEEE International Symposium on Circuits and Systems (ISCAS)

    The IEEE International Symposium on Circuits and Systems (ISCAS) is the world's premier networking forum of leading researchers in the highly active fields of theory, design and implementation of circuits and systems.

  • 2010 IEEE International Symposium on Circuits and Systems - ISCAS 2010

    ISCAS is a unique conference dealing with circuits and systems. It's the yearly "rendez-vous" of leading researchers, coming both from academia and industry, in the highly active fields of theory, design and implementation of circuits and systems. The Symposium will focus on circuits and systems for high quality life and consumer technologies, including mobile communications, advanced multimedia systems, sensor networks and Nano-Bio Circuit Fabrics and Systems.

  • 2009 IEEE International Symposium on Circuits and Systems - ISCAS 2009

    Analog Signal Processing, Biomedical Circuits and Systems, Blind Signal Processing, Cellular Neural Networks and Array Computing, Circuits and Systems for Communications, Computer-Aided Network Design, Digital Signal Processing, Life-Science Systems and Applications, Multimedia Systems and Applications, Nanoelectronics and Gigascale Systems, Neural Systems and Applications, Nonlinear Circuits and Applications, Power Systems and Power Electronic Circuits, Sensory Systems, Visual Signal Processing and Communi

  • 2008 IEEE International Symposium on Circuits and Systems - ISCAS 2008


2013 IEEE 10th International Conference on ASIC (ASICON 2013)

I. Design Techniques[1] VLSI Design and Circuits[2] Analog, Mixed Signal and RF Circuits[3] Application-Specific SoCs[4] Circuits and Systems for Wireless Communications [5] Testing, Reliability, Fault-Tolerance[6] Advanced MemoryII. CAD Techniques[7] Circuits Simulation, Synthesis, Verification and Physical design[8] CAD for system, Design for Manufacturing and TestingIII. New Techniques, new processing, new devices and their applications[9] MEMS Techniques[10] Nanoelectronics and Gigascale systems[11] New Devices: Hetrojunction Devices, Fin FET, CNT MTJ Devices,, 3-D integration, etc..[12] Advanced Interconnection Technology, High K/Metal gate technology and other VLSL New Processing, New technologies .[13] VLSI application for Energy generation, conservation and control,IC Design, Analog Circuit, Mixed Signal & RF Circuits, SOC, Wireless Communication, IC Testing, Reliebility, CAD Techniques, Synthesis, Verification, Physical Design, DMF, Memory, MEMS, 3D IC, High K/


2013 IEEE 11th International Conference on Electronic Measurement & Instruments (ICEMI)

ICEMI is invited authors to submit original papers in any but not limited as following areas: Science Foundation of Instrument and Measurement Innovative Designing of Instrument and Test System Applications on Instrument and Testing Signal & Image Processing Sensor and Non-electric Measurement Communication and Network Test Systems Control Theory and Application Condition Monitoring, Fault Diagnosis and Prediction Other Relevant Theories and Technologies


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Periodicals related to SDRAM

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Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Solid-State Circuits, IEEE Journal of

The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...




Xplore Articles related to SDRAM

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DRAM Architecture and Testing

B. F. Cockburn; F. Lombardi; F. J. Meyer IEEE Design & Test of Computers, 1999

First Page of the Article ![](/xploreAssets/images/absImages/00748801.png)


Near term solutions for 3D packaging of high performance DRAM

Vern Solberg; Wael Zohni 2011 IEEE 13th Electronics Packaging Technology Conference, 2011

The revolution in performance driven electronic systems continues to challenge the IC packaging industry. To enable the new generations of processors to reach their performance potential and to achieve greater memory density and bandwidth, many manufacturers have developed a number of two-die package interface formats. Effective 3D stacking of memory die elements can offer many benefits; improved performance, increased component ...


Design and implementation of parallel multi-access memory interface

Yukun Song; Ling Sun; Duoli Zhang; Gaoming Du; Yanhui Yang 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2014

In Multi-processor Systems on Chip (MPSoC), data interacts frequently between processors and off-chip memory. Higher bandwidth utilization of memory interface (MI) is needed urgently by parallel multi-tasks in MPSoC. Referring to the multi-process time-shared scheduling algorithm of CPU, this paper discusses a parallel multi-access technique on user side which applies to MPSoC. This technique utilizes the bandwidth distinction between both ...


Memory Interfaces: Past, Present, and Future

Chulwoo Kim; Hyun-Woo Lee; Junyoung Song IEEE Solid-State Circuits Magazine, 2016

Over the last few decades, the bandwidth of dynamic random-access memory (DRAM) has increased significantly through innovative architectures and circuit-level techniques to overcome the well-known "memory wall" problem. We can understand the past challenges of DRAM input/output (I/O) by investigating the technologies utilized for DRAM I/O in the transition from single-data-rate (SDR) synchronous DRAM (SDRAM)to double-data-rate (DDR) SDRAM. Recently developed ...


A MPEG4 programmable codec DSP with an embedded pre/post-processing engine

S. Kurohmaru; M. Matsuo; H. Nakajima; Y. Kohashi; T. Yonezawa; T. Moriiwa; M. Ohashi; M. Toujima; T. Nakamura; M. Hamada; T. Hashimoto; H. Fujimoto; Y. Iizuka; J. Michiyama; H. Komori Proceedings of the IEEE 1999 Custom Integrated Circuits Conference (Cat. No.99CH36327), 1999

We have developed a programmable DSP for MPEG4, H.263, H.261 and wavelet based sub-band codec algorithms. This DSP has the capability of processing these algorithms in real-time and has excellent flexibility, so that it can, for instance, perform video codec at 15 CIF frames/sec or video/speech (G.723.1) codec at 30 QCIF frames/sec. This chip includes a video pre/post-processing engine and ...


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Educational Resources on SDRAM

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eLearning

DRAM Architecture and Testing

B. F. Cockburn; F. Lombardi; F. J. Meyer IEEE Design & Test of Computers, 1999

First Page of the Article ![](/xploreAssets/images/absImages/00748801.png)


Near term solutions for 3D packaging of high performance DRAM

Vern Solberg; Wael Zohni 2011 IEEE 13th Electronics Packaging Technology Conference, 2011

The revolution in performance driven electronic systems continues to challenge the IC packaging industry. To enable the new generations of processors to reach their performance potential and to achieve greater memory density and bandwidth, many manufacturers have developed a number of two-die package interface formats. Effective 3D stacking of memory die elements can offer many benefits; improved performance, increased component ...


Design and implementation of parallel multi-access memory interface

Yukun Song; Ling Sun; Duoli Zhang; Gaoming Du; Yanhui Yang 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2014

In Multi-processor Systems on Chip (MPSoC), data interacts frequently between processors and off-chip memory. Higher bandwidth utilization of memory interface (MI) is needed urgently by parallel multi-tasks in MPSoC. Referring to the multi-process time-shared scheduling algorithm of CPU, this paper discusses a parallel multi-access technique on user side which applies to MPSoC. This technique utilizes the bandwidth distinction between both ...


Memory Interfaces: Past, Present, and Future

Chulwoo Kim; Hyun-Woo Lee; Junyoung Song IEEE Solid-State Circuits Magazine, 2016

Over the last few decades, the bandwidth of dynamic random-access memory (DRAM) has increased significantly through innovative architectures and circuit-level techniques to overcome the well-known "memory wall" problem. We can understand the past challenges of DRAM input/output (I/O) by investigating the technologies utilized for DRAM I/O in the transition from single-data-rate (SDR) synchronous DRAM (SDRAM)to double-data-rate (DDR) SDRAM. Recently developed ...


A MPEG4 programmable codec DSP with an embedded pre/post-processing engine

S. Kurohmaru; M. Matsuo; H. Nakajima; Y. Kohashi; T. Yonezawa; T. Moriiwa; M. Ohashi; M. Toujima; T. Nakamura; M. Hamada; T. Hashimoto; H. Fujimoto; Y. Iizuka; J. Michiyama; H. Komori Proceedings of the IEEE 1999 Custom Integrated Circuits Conference (Cat. No.99CH36327), 1999

We have developed a programmable DSP for MPEG4, H.263, H.261 and wavelet based sub-band codec algorithms. This DSP has the capability of processing these algorithms in real-time and has excellent flexibility, so that it can, for instance, perform video codec at 15 CIF frames/sec or video/speech (G.723.1) codec at 30 QCIF frames/sec. This chip includes a video pre/post-processing engine and ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Content‐and Entertainment‐Centric Software

    iCLouds and MyClouds, Resolution expectations, Resolution, displays and the human visual system, Frame rate expectations, Memory expectations over time, Memory options, Gaming in the Cloud and Gaming and TV integration, Solid state storage, Flash (Nor and Nand), SRAM and SDRAM, The SIM Card, Compact Flash, Smart Media, Multi Media Cards, Memory Stick, SD (Secure Digital) Cards, xD Picture Cards, USB Flash Drives/Portable hard drives



Standards related to SDRAM

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Jobs related to SDRAM

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