Conferences related to Resistors

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2019 IEEE International Electric Machines & Drives Conference (IEMDC)

The IEEE International Electric Machines and Drives Conference (IEMDC) has been established to be one of the major events in the field of electrical machines and drives. IEMDC is a refernce forum to disseminate and exchange state of art in the filed of the Electrical Machines and Drives. The 2018 edition started in 1997 and the 2019 edition will be 11th one.


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 16th IEEE International New Circuits and Systems Conference (NEWCAS)

NEWCAS2018 will encompass a wide range of special sessions and keynote talks given by prominent expertscovering key areas of research in microsystems in order to provide all attendees a unique forum for the exchange of ideas and results. The program of the conference will be tailored to reflect the wide spectrum of topics and research interest shared by researchers in this field.

  • 2017 15th IEEE International New Circuits and Systems Conference (NEWCAS)

    IEEE International NEWCAS Conference is tailored to reflect the wide spectrum of topics and research interests shared among the organizing entities. This collaboration will be oriented towards advanced research and development activities from academia, research institutions, and industry. Topics include, but are not limited to analog, mixed-signal, and digital integrated circuits and systems, radio-frequency circuits, computer architecture and memories, microsystems, sensors and actuators, test and verification, telecommunication, technology trends, power and energy circuits and systems, biomedical circuits, energy harvesting, computer-aided design tools, device modeling, and embedded portable devices.

  • 2016 14th IEEE International New Circuits and Systems Conference (NEWCAS)

    IEEE International NEWCAS Conference is tailored to reflect the wide spectrum of topics and research interests shared among the organizing entities. This collaboration will be oriented towards advanced research and development activities from academia, research institutions, and industry. Topics include, but are not limited to analog, mixed-signal, and digital integrated circuits and systems, radio-frequqncy circuits, computer architecture and memories, microsystems, sensors and actuators, test and verification, telecommunication, technology trends, power and energy circuits and systems, biomedical circuits, energy harvesting, computer-aided design tools, and embedded portable devices.

  • 2015 IEEE 13th International New Circuits and Systems Conference (NEWCAS)

    The program of the conference will be tailored to reflect the wide spectrum of topics and research interest shared among the organizing entities. This collaboration will be oriented towards advanced research in adaptive systems which constitutes the highlights of the NEWCAS conference, but also areas related to analog and digital signal processing, low power consumption, and circuits and systems designs. The topics include, but are not limited to: Computer architecture and memories, Analog circuit design, Digital and mixed-signal circuit design, RF circuit design, Microsystems, sensors and actuators, Test and verification, Telecom, microwaves and RF, Technology Trends, Data and signal processing, Neural networks and artificial vision, CAD and design tools, Low-Power circ. & syst. techniques, Imaging & image sensors, Embedded hand-held devices, Biomed. circuits & systems, Energy Harvesting / Scavenging

  • 2014 IEEE 12th International New Circuits and Systems Conference (NEWCAS)

    will encompass a wide range of special sessions and keynote talks given by prominent experts covering key areas of research in microsystems in order to provide all attendees a unique forum for the exchange of ideas and results. The program of the conference will be tailored to reflect the wide spectrum of topics and research interest shared by researchers in this field.

  • 2013 IEEE 11th International New Circuits and Systems Conference (NEWCAS)

    NEWCAS is a major international conference presenting design methodologies, techniques and experimental results in emerging electronics, circuits and systems topics. The NEWCAS conference deals with analog and digital signal processing, low power consumption, circuits and systems design.

  • 2012 IEEE 10th International New Circuits and Systems Conference (NEWCAS)

    The conference will include regular and special session on emerging electronic systems and design methods, plenary sessions on selected advanced aspects of the theory, design and applications of electronic systems, as well as tutorials given by experts on specific topics.

  • 2011 IEEE 9th International New Circuits and Systems Conference (NEWCAS)

    NEWCAS is a major international conference presenting design methodologies, techniques and experimental results in emerging electronics, circuits and systems topics. The NEWCAS conference deals with analog and digital signal processing, low power consumption, circuits and systems design.

  • 2010 8th IEEE International NEWCAS Conference (NEWCAS)

    The conference will include regular and special session on emerging electronic systems and design methods, plenary sessions on selected advanced aspects of the theory, design and applications of electronic systems, as well as tutorials given by experts on specific topics.

  • 2009 Joint IEEE North-East Workshop on Circuits and Systems (NEWCAS) and TAISA Conference (NEWCAS-TAISA 2009)

    Advance in microelectronics in addition to signal analog processing, and their applications to telecommunications, artificial vision and biomedical. This include: system architectures, circuit (digital, analog and mixed) and system-level design, test and verification, data and signal processing, microsystems, memories and sensors and associated analog processing, mathematical methods and design tools.

  • 2008 Joint IEEE North-East Workshop on Circuits and Systems (NEWCAS) and TAISA Conference (NEWCAS-TAISA 2008)

    Advanced research in microelectronics and microsystems constitutes the highlights of the NEWCAS conferences in addition to topics regarding analog data and signal processing and their applications well-established in the TAISA conferences.

  • 2006 IEEE North-East Workshop on Circuits and Systems (NEWCAS 2006)

  • 2005 IEEE North-East Workshop on Circuits and Systems (NEWCAS 2005)

  • 2004 IEEE North-East Workshop on Circuits and Systems (NEWCAS 2004)


2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2018 Conference on Precision Electromagnetic Measurements (CPEM 2018)

CPEM is the most important scientific and technological conference in the domain of electromagnetic measurements at the highest accuracy levels. This conference covers the frequency range from DC to the optical region.2018 is expected to be a watershed year in the history of the international system of units (SI), with the adoption of the new definitions for the kilogram, the ampere, the kelvin and the mole. All the SI units will then be based on a set of seven defining constants. CPEM 2018 will provide a privileged opportunity to mark this milestone of the SI through a natural focus on quantum devices that relate electrical measurement standards to fundamental constants of physics. CPEM 2018 will also be the place to share knowledge on research in electromagnetic metrology focused on present and future challenges regarding industry and society in sectors such as Energy, ICT, quantum engineering, Industry 4.0, etc.


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Periodicals related to Resistors

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Resistors

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Xplore Articles related to Resistors

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IEEE Recommended Practice for the Specification and Design of Field Discharge Equipment for Synchronous Machines

[] IEEE P421.6/D2, April 2015, 2015

This document is intended to serve as basic reference for the specification and design of field discharge circuits for synchronous machines. It is also intended to provide detailed information about field discharge that complements standards IEEE 421.4.-2004 Guide for Preparation of Excitation System Specification and includes many aspects of the withdrawn standard ANSI/IEEE C37.18.1979 Standard Enclosed Field Discharge Circuit Breakers ...


A two-chip PCM CODEC for per-channel applications

[{u'author_order': 1, u'affiliation': u'National Semiconductor Corp., Santa Clara, CA, USA', u'full_name': u'J. Cecil'}, {u'author_order': 2, u'full_name': u'E. Chow'}, {u'author_order': 3, u'full_name': u'J. Flink'}, {u'author_order': 4, u'full_name': u'J. Solomon'}, {u'author_order': 5, u'full_name': u'C. Svala'}, {u'author_order': 6, u'full_name': u'T. Svenson'}] 1978 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1978

A two-chip IC PCM CODEC (coder/decoder) using CMOS and bipolar technologies will be discussed. The CODEC includes sample and holds, nonuniform A/D and D/A, precision reference and fast PCM buffers. Performance exceeds CCITT and D3 requirements.


Controlling secondary breakdown of bipolar power transistors

[{u'author_order': 1, u'affiliation': u'Consultant, Jalisco, Mexico', u'full_name': u'R. Widlar'}] 1981 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1981

An active ballasting technique used to fabricate an oxide passivated power transistor with f<inf>T</inf>of 50MHz and capable of continuously dissipating 250W with collector voltages above 200V will be reported. Saturation voltage at 10A is under 1V.


Practical Design of An Automotive Tail Light

[{u'author_order': 1, u'full_name': u'Ron Lenk'}, {u'author_order': 2, u'full_name': u'Carol Lenk'}] Practical Lighting Design with LEDs, None

An inexpensive automotive tail light is made from 5mm red light emitting diodes (LEDs). This chapter looks at 5mm red LEDs in surface mount, limiting the search to those with ratings of at least 8000 mcd. That will require about 20 devices. The chapter argues that the design issues with temperature compensation that are complex enough that one can just ...


A 14b PCM DAC

[{u'author_order': 1, u'affiliation': u'Signetics Corp., Sunnyvale, CA, USA', u'full_name': u'B. Mack'}, {u'author_order': 2, u'full_name': u'M. Horowitz'}, {u'author_order': 3, u'full_name': u'R. Blauschild'}] 1982 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1982

A 14b digital-to-analog converter, employing a fine/course slope technique, fabricated in standard monolithic bipolar technology, will be reported. System features a precision sample and hold amplifier and post package trim resulting in 0.003% nonlinearity. Conversion time is 20&#956;.


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Educational Resources on Resistors

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eLearning

No eLearning Articles are currently tagged "Resistors"

IEEE-USA E-Books

  • Practical Design of An Automotive Tail Light

    An inexpensive automotive tail light is made from 5mm red light emitting diodes (LEDs). This chapter looks at 5mm red LEDs in surface mount, limiting the search to those with ratings of at least 8000 mcd. That will require about 20 devices. The chapter argues that the design issues with temperature compensation that are complex enough that one can just do the design with 15 LEDs. After the issues and costs are explained, the customer agrees to this, since that's what they wanted anyway. The chapter documents the desired size of the tail light, as well as the desired mean time to failure (MTTF). It also mentions load dump. There are two ways of surviving load dump. The common way for most automotive electronics is to clamp the voltage coming out of the surge protection. The other way of handling load dump is what one is doing with the circuitry.

  • Superposition and the Extra Element Theorem

    When dealing with more than one input, the superposition theorem occupies the top of the list as its extension naturally leads to the Extra Element Theorem (EET). By first introducing superposition theorem in a simple and graphical way, this chapter paves the way towards the EET understanding in a hopefully simple and intelligible manner. In a linear circuit involving more than one individual source, superposition theorem states that the response, a current or a voltage, in a branch is the algebraic sum of the responses obtained from each of the individual sources while the other sources are turned off. SPICE is an excellent resource to verify calculations either obtained by hand or from a mathematical solver. The chapter also summarizes the different forms of EET and how people can combine time constants to form the numerator (zero) and the denominator (pole) of the transfer function under study.

  • Actual Frequency Discriminator Implementations

    This chapter contains sections titled: * Quadricorrelator, Low-Frequency Implementation * Frequency Ratio Calculating Circuit for Wide-Bandwidth Use * Dividing the Frequency and Resultant Implementation * Marriage of Both Frequency and Phaselock Loops * Comments on Spurs' Numerical Influence on the VCO * Frequency Compression

  • Techniques for Solving DC Circuits

    In this chapter, the authors develop their analysis of circuits while working exclusively with constant quantities (voltages, currents, powers, etc.), so as to enable the reader to solve these kinds of circuit. Circuits that operate with constant quantities are by tradition called direct current (DC) circuits. While computer programmes solve circuits simply by just assembling Kirchhoff and constitutive equations in a mechanical way, electrical engineers use specialised solving techniques for DC circuits. The easiest and more common of these are discussed in the following sections. In particular: Basic usage of combined Kirchhoff-constitutive equations (KCE), Nodal analysis, and Mesh analysis. If the constitutive equations are known, all voltages and currents can be obtained by integrating the latter into Kirchhoff's equations and reducing the set of equations even more by making use of the nodal analysis technique.

  • The Uses of Electrostatics

    This chapter shows where actual use of electrostatic analysis is involved in actual structures. It begins with a section on basic circuit theory, because this is a discipline based on electrostatic (and magnetostatic) approximations whose use is implied in the functioning of the various structures. The chapter provides a brief introduction to transmission line theory that is presented in handbook format, with only the necessary equations, with no supporting derivations. Although vacuum tubes and cathode ray tubes have been phased out by solid-state devices, some electron beam devices, such as the scanning electron microscope (SEM), remain in use. A very high electric field can be obtained by the combination of a very sharp thin tip of metal and the use of high potentials.

  • Marx Generators and Marx‐Like Circuits

    The simplest and most widely used high‐voltage impulse generator is the device Erwin Marx introduced in 1925 for testing high‐voltage components and equipment for the emerging power industry. This chapter discusses the principles of operation and overall performance of Marx generators. For instruction, the design formulas for simple Marx generators based on their equivalent circuits are given in considerable detail. A fully erected Marx generator is essentially a capacitive discharge. Thus, the load voltage depends not only on the characteristics of the Marx but also on the characteristics of the load. The chapter highlights some aspects in the discussion of modified Marx configurations. It reviews the importance of overvoltages to Marx operation, as well as advanced triggering techniques. The chapter also discusses various aspects of Marx generators such as electrical insulation, delay time and jitter, and the selection of components.

  • Practical AC Drive Circuitry For LEDs

    This chapter addresses AC drive circuitry for LEDs. When LED light needs to run off the electrical grid, AC drive circuitry is used. AC power conversion is considerably more complicated than DC. The chapter discusses one of the important safety techniques to be used in the lab: isolating the system from AC line with an isolation transformer. Isolation is also very useful for products for the same reason, although it's not done the same way. The chapter discusses how to select the values of the components. One of the things that make design of AC ballasts much harder than DC is electromagnetic interference (EMI). Governments require that devices that attach to the AC line not produce more than a specific amount of electrical noise. And switch‐mode power supplies, since they switch at high frequency, generate a lot of noise. The chapter describes how to get AC converter to pass EMI.

  • Practical Thermal Management of LEDs

    This chapter starts‐off by giving an easily understood analytical method for calculating thermals. It then turns to an in‐depth look at the environment in which LEDs operate, and a variety of methods for keeping them cool. The chapter looks at reducing the resistance of the thermal conduction path. This is typically done with a heat sink, a piece of metal attached either directly or indirectly to the LEDs. A thermal resistance that can be minimized is the convection. Convection in air is moderately effective at cooling, but it can be dramatically enhanced by a fan. Fans and blowers work by forcing air to move across the hot surface. One more area that one should consider for reduction of thermal resistance is the thermal radiation. The chapter also considers some thermal management of the ballast. The ballasts are fairly immune to high temperatures.

  • How to Design Resistive Circuits

    This chapter contains sections titled: * Design of a Resistive Thevenin Source * Design of a Coupling Circuit * Design of a Pi Attenuator * Problems

  • Passive Components

    Passive components (resistors, capacitors, inductors, transformers) are of different relevance for the various applications of microelectronics. While digital CMOS can virtually sustain without any passives, their quality is crucial for the performance of radio-frequency (RF) transceivers, they outnumber the active devices and occupy much of the chip area in such integrated RF systems. In analog applications passive components with excellent linearity and minimum temperature coefficient are required. Besides those desired passive components there are also unwanted ones, i.e. the parasitics that are a consequence of device integration, which likewise need to be considered in a successful design of an integrated circuit.




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