Conferences related to Resistors

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2019 IEEE International Electric Machines & Drives Conference (IEMDC)

The IEEE International Electric Machines and Drives Conference (IEMDC) has been established to be one of the major events in the field of electrical machines and drives. IEMDC is a refernce forum to disseminate and exchange state of art in the filed of the Electrical Machines and Drives. The 2018 edition started in 1997 and the 2019 edition will be 11th one.


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 16th IEEE International New Circuits and Systems Conference (NEWCAS)

NEWCAS2018 will encompass a wide range of special sessions and keynote talks given by prominent expertscovering key areas of research in microsystems in order to provide all attendees a unique forum for the exchange of ideas and results. The program of the conference will be tailored to reflect the wide spectrum of topics and research interest shared by researchers in this field.

  • 2017 15th IEEE International New Circuits and Systems Conference (NEWCAS)

    IEEE International NEWCAS Conference is tailored to reflect the wide spectrum of topics and research interests shared among the organizing entities. This collaboration will be oriented towards advanced research and development activities from academia, research institutions, and industry. Topics include, but are not limited to analog, mixed-signal, and digital integrated circuits and systems, radio-frequency circuits, computer architecture and memories, microsystems, sensors and actuators, test and verification, telecommunication, technology trends, power and energy circuits and systems, biomedical circuits, energy harvesting, computer-aided design tools, device modeling, and embedded portable devices.

  • 2016 14th IEEE International New Circuits and Systems Conference (NEWCAS)

    IEEE International NEWCAS Conference is tailored to reflect the wide spectrum of topics and research interests shared among the organizing entities. This collaboration will be oriented towards advanced research and development activities from academia, research institutions, and industry. Topics include, but are not limited to analog, mixed-signal, and digital integrated circuits and systems, radio-frequqncy circuits, computer architecture and memories, microsystems, sensors and actuators, test and verification, telecommunication, technology trends, power and energy circuits and systems, biomedical circuits, energy harvesting, computer-aided design tools, and embedded portable devices.

  • 2015 IEEE 13th International New Circuits and Systems Conference (NEWCAS)

    The program of the conference will be tailored to reflect the wide spectrum of topics and research interest shared among the organizing entities. This collaboration will be oriented towards advanced research in adaptive systems which constitutes the highlights of the NEWCAS conference, but also areas related to analog and digital signal processing, low power consumption, and circuits and systems designs. The topics include, but are not limited to: Computer architecture and memories, Analog circuit design, Digital and mixed-signal circuit design, RF circuit design, Microsystems, sensors and actuators, Test and verification, Telecom, microwaves and RF, Technology Trends, Data and signal processing, Neural networks and artificial vision, CAD and design tools, Low-Power circ. & syst. techniques, Imaging & image sensors, Embedded hand-held devices, Biomed. circuits & systems, Energy Harvesting / Scavenging

  • 2014 IEEE 12th International New Circuits and Systems Conference (NEWCAS)

    will encompass a wide range of special sessions and keynote talks given by prominent experts covering key areas of research in microsystems in order to provide all attendees a unique forum for the exchange of ideas and results. The program of the conference will be tailored to reflect the wide spectrum of topics and research interest shared by researchers in this field.

  • 2013 IEEE 11th International New Circuits and Systems Conference (NEWCAS)

    NEWCAS is a major international conference presenting design methodologies, techniques and experimental results in emerging electronics, circuits and systems topics. The NEWCAS conference deals with analog and digital signal processing, low power consumption, circuits and systems design.

  • 2012 IEEE 10th International New Circuits and Systems Conference (NEWCAS)

    The conference will include regular and special session on emerging electronic systems and design methods, plenary sessions on selected advanced aspects of the theory, design and applications of electronic systems, as well as tutorials given by experts on specific topics.

  • 2011 IEEE 9th International New Circuits and Systems Conference (NEWCAS)

    NEWCAS is a major international conference presenting design methodologies, techniques and experimental results in emerging electronics, circuits and systems topics. The NEWCAS conference deals with analog and digital signal processing, low power consumption, circuits and systems design.

  • 2010 8th IEEE International NEWCAS Conference (NEWCAS)

    The conference will include regular and special session on emerging electronic systems and design methods, plenary sessions on selected advanced aspects of the theory, design and applications of electronic systems, as well as tutorials given by experts on specific topics.

  • 2009 Joint IEEE North-East Workshop on Circuits and Systems (NEWCAS) and TAISA Conference (NEWCAS-TAISA 2009)

    Advance in microelectronics in addition to signal analog processing, and their applications to telecommunications, artificial vision and biomedical. This include: system architectures, circuit (digital, analog and mixed) and system-level design, test and verification, data and signal processing, microsystems, memories and sensors and associated analog processing, mathematical methods and design tools.

  • 2008 Joint IEEE North-East Workshop on Circuits and Systems (NEWCAS) and TAISA Conference (NEWCAS-TAISA 2008)

    Advanced research in microelectronics and microsystems constitutes the highlights of the NEWCAS conferences in addition to topics regarding analog data and signal processing and their applications well-established in the TAISA conferences.

  • 2006 IEEE North-East Workshop on Circuits and Systems (NEWCAS 2006)

  • 2005 IEEE North-East Workshop on Circuits and Systems (NEWCAS 2005)

  • 2004 IEEE North-East Workshop on Circuits and Systems (NEWCAS 2004)


2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2018 Conference on Precision Electromagnetic Measurements (CPEM 2018)

CPEM is the most important scientific and technological conference in the domain of electromagnetic measurements at the highest accuracy levels. This conference covers the frequency range from DC to the optical region.2018 is expected to be a watershed year in the history of the international system of units (SI), with the adoption of the new definitions for the kilogram, the ampere, the kelvin and the mole. All the SI units will then be based on a set of seven defining constants. CPEM 2018 will provide a privileged opportunity to mark this milestone of the SI through a natural focus on quantum devices that relate electrical measurement standards to fundamental constants of physics. CPEM 2018 will also be the place to share knowledge on research in electromagnetic metrology focused on present and future challenges regarding industry and society in sectors such as Energy, ICT, quantum engineering, Industry 4.0, etc.


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Periodicals related to Resistors

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Xplore Articles related to Resistors

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A 4.1 unequal Wilkinson power divider

[{u'author_order': 1, u'affiliation': u'Sch. of Electr. Eng., Seoul Nat. Univ., South Korea', u'full_name': u'Jeng-Sik Lim'}, {u'author_order': 2, u'full_name': u'Sung-Won Lee'}, {u'author_order': 3, u'full_name': u'Chul-Soo Kim'}, {u'author_order': 4, u'full_name': u'Jun-Seek Park'}, {u'author_order': 5, u'full_name': u'Dal Ahn'}, {u'author_order': 6, u'full_name': u'Sangwook Nam'}] IEEE Microwave and Wireless Components Letters, 2001

This letter presents the design and measured performances of a microstrip 4:1 unequal Wilkinson power divider. The divider is designed using the conventional Wilkinson topology with the defected ground structure (DGS). The DGS on the ground plane provides an additional effective inductive component to the microstrip line. This enables the microstrip line to be realized with very high impedance of ...


Study of porous silicon gas sensor

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong', u'full_name': u'W. M. Kwok'}, {u'author_order': 2, u'full_name': u'Y. C. Bow'}, {u'author_order': 3, u'full_name': u'W. Y. Chan'}, {u'author_order': 4, u'full_name': u'M. C. Poon'}, {u'author_order': 5, u'full_name': u'P. G. Wan'}, {u'author_order': 6, u'full_name': u'H. Wong'}] Proceedings 1999 IEEE Hong Kong Electron Devices Meeting (Cat. No.99TH8458), None

Porous silicon (Si) and porous poly-Si organic and humidity vapor sensors have been studied. For aluminum (Al)/porous Si/p-Si/Al Schottky diode sensor, the sensitivity compared to air at room temperature in 2600 ppm acetone, methanol, 2-propanol and ethanol vapor are about 400, 500, 1000 and 4000% respectively. Sensitivity for 800-2600 ppm ethanol is 200 to 4000%. The sensor can be converted ...


Leon Chua's memristor [Recognitions]

[{u'author_order': 1, u'full_name': u'Guanrong Chen'}] IEEE Circuits and Systems Magazine, 2008

Recounts Leon Chua's discovery of the memristor and the example Chua set for younger generations of scientists and engineers.


Current sharing in multiphase boost ZVS active-clamping converters

[{u'author_order': 1, u'affiliation': u'Universidad Politecnica De Cartagena, Dpto. de Tecnología Electrónica, Cartagena, España', u'full_name': u'Esther de Jodar'}, {u'author_order': 2, u'affiliation': u'Universidad Politecnica De Cartagena, Dpto. de Tecnología Electrónica, Cartagena, España', u'full_name': u'Jose Villarejo'}, {u'author_order': 3, u'affiliation': u'Universidad Politecnica De Cartagena, Dpto. de Tecnología Electrónica, Cartagena, España', u'full_name': u'Jacinto Jimenez'}, {u'author_order': 4, u'affiliation': u'Universidad De Murcia. Facultad de Informática. Dpto. de Informática y Sistemas', u'full_name': u'Miguel Moreno'}] 2009 13th European Conference on Power Electronics and Applications, None

Power stages can be connected in parallel to increase the output power. Whenever, it requires current sharing among phases, to optimize the design. A method to achieve the desired current sharing is with equalizing resistors, what it means power losses, or connecting converters with high impedance. In this work has been studied that input impedance of active clamp boost converters ...


Thin-film NTC resistor based on SrNb<sub>x</sub>Ti<sub>1-x</sub>O <sub>3</sub>

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong', u'full_name': u'P. T. Lai'}, {u'author_order': 2, u'full_name': u'Bin Li'}, {u'author_order': 3, u'full_name': u'G. Q. Li'}] Proceedings 1999 IEEE Hong Kong Electron Devices Meeting (Cat. No.99TH8458), None

A novel strontium titanate-niobate (SrNbxTi1-x O3) thin-film NTC (negative temperature coefficient) resistor is fabricated on a SiO2/Si substrate by rf sputtering technique. The resistance-temperature characteristics reveal that SrNbxTi1-xO3 thin-film resistor has a high sensitivity within 30°C~400°C. Specifically, there is a turning point at 320°C, above which the resistance sharply decreases due to ionic conduction. The a.c characteristics are also investigated


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Educational Resources on Resistors

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No eLearning Articles are currently tagged "Resistors"

IEEE-USA E-Books

  • Practical Thermal Management of LEDs

    This chapter starts¿¿¿off by giving an easily understood analytical method for calculating thermals. It then turns to an in¿¿¿depth look at the environment in which LEDs operate, and a variety of methods for keeping them cool. The chapter looks at reducing the resistance of the thermal conduction path. This is typically done with a heat sink, a piece of metal attached either directly or indirectly to the LEDs. A thermal resistance that can be minimized is the convection. Convection in air is moderately effective at cooling, but it can be dramatically enhanced by a fan. Fans and blowers work by forcing air to move across the hot surface. One more area that one should consider for reduction of thermal resistance is the thermal radiation. The chapter also considers some thermal management of the ballast. The ballasts are fairly immune to high temperatures.

  • Introduction

    None

  • Practical AC Drive Circuitry For LEDs

    This chapter addresses AC drive circuitry for LEDs. When LED light needs to run off the electrical grid, AC drive circuitry is used. AC power conversion is considerably more complicated than DC. The chapter discusses one of the important safety techniques to be used in the lab: isolating the system from AC line with an isolation transformer. Isolation is also very useful for products for the same reason, although it's not done the same way. The chapter discusses how to select the values of the components. One of the things that make design of AC ballasts much harder than DC is electromagnetic interference (EMI). Governments require that devices that attach to the AC line not produce more than a specific amount of electrical noise. And switch¿¿¿mode power supplies, since they switch at high frequency, generate a lot of noise. The chapter describes how to get AC converter to pass EMI.

  • Grounding, Insulation Monitoring Design, and Verification

    The shipboard ungrounded electrical distribution system has capacitive ground through system‐level capacitance. High‐resistance grounding (HRG) is recommended for systems where power interruption resulting from single line‐to‐ground fault tripping is detrimental to the process. IEC requirements for a ground detection system include a system‐level insulation monitoring system that goes beyond the requirements for a ground detection system. IEEE Standard 32 specifies standing time ratings for neutral grounding resistors (NGRs) with permissible temperature rises above 30◦C ambient. The maximum ground fault current allowed by the NGR must exceed the total capacitance to ground charging current of the system. Phaseback is used for voltage stabilizing ground reference (VSGR) by monitoring the voltage on each phase with respect to ground and electromagnetically reacting to any voltage imbalance in the system and then stabilizing the ground reference of the system.

  • An Introduction to Identification

    This chapter contains sections titled: * What Is Identification? * Identification: A Simple Example * Description of the Stochastic Behavior of Estimators * Basic Steps in the Identification Process * A Statistical Approach to the Estimation Problem * Exercises

  • Unbalanced Operation and Single-Phase Induction Machines

    The extension of symmetrical components to analyze unbalanced conditions, such as an open&hyphen;circuited stator phase, is generally achieved by revolving field theory. This chapter explains unbalanced applied stator voltages, unbalanced stator impedances, open&hyphen;circuited stator phase, and unbalanced rotor resistors of the three&hyphen;phase induction machine. It discusses single&hyphen;phase induction motors. The chapter also illustrates several unbalanced and fault modes of synchronous machine operation.

  • Sub-1V Voltage Reference Circuit

    This chapter introduces the design problem of voltage reference circuits that work for power supply with less than 1V. This chapter also presents various sub-1V voltage reference circuit.

  • Microstrip Passive Elements

    Passive elements in microstrip circuits are generally realized using either transmission line segments or surface mount components. It first describes lumped element components that can be realized by patterning microstrip or obtained as discrete components, such as surface¿¿¿mount components, that can be soldered to a microstrip circuit. Termination refers to the termination of a transmission line in a short circuit, an open circuit or a load. ¿¿¿¿¿type microwave attenuators are used in broadband power¿¿¿leveling loops where the microwave output power is maintained constant over a wide range of frequencies. Other passive elements discussed in the chapter are micro¿¿¿strip stubs, hybrids, couplers, power combiners, dividers, baluns, and integrated components. The two most commonly used power combiners or dividers are the Wilkinson combiner and the Chireix combiner. Above a few gigahertz or so it is necessary to use transmission line baluns and the best of these is the Marchund balun.

  • Circuit Analysis for PEEC Methods

    This chapter introduces the circuit techniques relevant to the theme of the book and the Maxwell's equations are represented in terms of equivalent circuits. It presents the circuit solution techniques that are clearly oriented toward electromagnetic (EM) and relevant circuits (Ckt) problems. The chapter starts with the technical discussion of some circuit analysis concepts that are necessary for the general partial element equivalent circuit (PEEC) approach. The time integration of the modified nodal analysis (MNA) equations for a full¿¿¿wave PEEC circuit is even more challenging than for conventional circuits and quasistatic PEEC circuits. One of the most important laws for MNA circuit analysis is Kirchhoff's current law (KCL) and another one is Kirchhoff's voltage law (KVL). The chapter also considers the case where frequency¿¿¿dependent models are available, which would like to be converted into models that are suitable for both time and frequency domain solvers.

  • Digital Design Building Blocks and More Advanced Combinational Circuits

    This chapter contains sections titled: * Combinational Circuits with More than One Output * Decoders and Encoders * Multiplexers and Demultiplexers (MUXes and DEMUXes) * Signed and Unsigned Binary Numbers * Arithmetic Circuits: Half-Adders (HA) and Full-Adders (FA) * Carry Look Ahead (CLA) or Fast Carry Generation * Some Short-Hand Notation for Large Logic Blocks * Summary * Further Reading * Problems 548




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