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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 9th International IEEE/EMBS Conference on Neural Engineering (NER)

Neural Engineering

  • 2017 8th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural Engineering is an emerging core discipline,which coalesces neuroscience with engineering.Members of both the Neuroscience and Engineering Communities areencouraged to attend this highly multidisciplinarymeeting. The conference will highlight the emergingengineering innovations in the restoration andenhancement of impaired sensory, motor, andcognitive functions, novel engineering for deepeningknowledge of brain function, and advanced designand use of neurotechnologies

  • 2015 7th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural engineering deals with many aspects of basic and clinical problemsassociated with neural dysfunction including the representation of sensory and motor information, theelectrical stimulation of the neuromuscular system to control the muscle activation and movement, theanalysis and visualization of complex neural systems at multi -scale from the single -cell and to the systemlevels to understand the underlying mechanisms, the development of novel neural prostheses, implantsand wearable devices to restore and enhance the impaired sensory and motor systems and functions.

  • 2013 6th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural engineering deals with many aspects of basic and clinical problems associated with neural dysfunction including the representation of sensory and motor information, the electrical stimulation of the neuromuscular system to control the muscle activation and movement, the analysis and visualization of complex neural systems at multi-scale from the single-cell and to the system levels to understand the underlying mechanisms, the development of novel neural prostheses, implants and wearable devices to restore and enhance the impaired sensory and motor systems and functions.

  • 2011 5th International IEEE/EMBS Conference on Neural Engineering (NER)

    highlight the emerging field, Neural Engineering that unites engineering, physics, chemistry, mathematics, computer science with molecular, cellular, cognitive and behavioral neuroscience and encompasses such areas as replacing or restoring lost sensory and motor abilities, defining the organizing principles and underlying mechanisms of neural systems, neurorobotics, neuroelectronics, brain imaging and mapping, cognitive science and neuroscience.

  • 2009 4th International IEEE/EMBS Conference on Neural Engineering (NER)

    highlight the emerging field, Neural Engineering that unites engineering, physics, chemistry, mathematics, computer science with molecular, cellular, cognitive and behavioral neuroscience and encompasses such areas as replacing or restoring lost sensory and motor abilities, defining the organizing principles and underlying mechanisms of neural systems, neurorobotics, neuroelectronics, brain imaging and mapping, cognitive science and neuroscience.

  • 2007 3rd International IEEE/EMBS Conference on Neural Engineering

  • 2005 2nd International IEEE/EMBS Conference on Neural Engineering

  • 2003 1st International IEEE/EMBS Conference on Neural Engineering


2018 14th IEEE International Conference on Signal Processing (ICSP)

ICSP2018 includes sessions on all aspects of theory, design and applications of signal processing. Prospective authors are invited to propose papers in any of the following areas, but not limited to: A. Digital Signal Processing (DSP)B. Spectrum Estimation & ModelingC. TF Spectrum Analysis & WaveletD. Higher Order Spectral AnalysisE. Adaptive Filtering &SPF. Array Signal ProcessingG. Hardware Implementation for Signal ProcessingH Speech and Audio CodingI. Speech Synthesis & RecognitionJ. Image Processing & UnderstandingK. PDE for Image ProcessingL.Video compression &StreamingM. Computer Vision & VRN. Multimedia & Human-computer InteractionO. Statistic Learning & Pattern RecognitionP. AI & Neural NetworksQ. Communication Signal processingR. SP for Internet and Wireless CommunicationsS. Biometrics & AuthentificationT. SP for Bio-medical & Cognitive ScienceU


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 16th International Symposium on Modeling and Optimization in Mobile, Ad Hoc, and Wireless Networks (WiOpt)

WiOpt 2018 welcomes original papers related to modeling, performance evaluation, and optimization of wireless networks. The scope covers all types of wireless networks: cellular, ad hoc, content-driven, delay-tolerant, mesh, metropolitan, sensor, cognitive, vehicular, robotic, Internet of Things, virtualized, etc. The focus is on issues at and above the MAC layer, although cross-layer techniques encompassing the physical layer are equally welcome. We encourage both theoretical contributions and submissions relating to real world empirical measurements, experimental studies.


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Periodicals related to Rats

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Computational Biology and Bioinformatics, IEEE/ACM Transactions on

Specific topics of interest include, but are not limited to, sequence analysis, comparison and alignment methods; motif, gene and signal recognition; molecular evolution; phylogenetics and phylogenomics; determination or prediction of the structure of RNA and Protein in two and three dimensions; DNA twisting and folding; gene expression and gene regulatory networks; deduction of metabolic pathways; micro-array design and analysis; proteomics; ...


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


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