Conferences related to Polymer foams

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2019 IEEE 28th Symposium on Fusion Engineering (SOFE)

fusion engineering, physics and materials, plasma heating, vacuum technology, tritium processing, fueling, first walls, blankets and divertors


2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz2018)

Covering terahertz, far infrared and millimeter wave science, technology and applications


2018 48th European Microwave Conference (EuMC)

The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessionsand workshops are held on the full range of microwave technology from field theory, throughcomponents and subsystems to systems.

  • 2017 47th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2016 46th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology. The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2015 European Microwave Conference (EuMC 2015)

    The 45th European Microwave Conference (EuMC) represents the main event in the European Microwave Week 2015, the largest event in Europe dedicated to microwave components, systems and technology. It is the premier event to present the current status and future trends in the field of microwave, millimeter-wave and terahertz systems and technologies. A broad range of high frequency related topics, from materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.The European Microwave Conference provides many opportunities of networking and interaction with international experts in a wide variety of specialties, attracting delegates with academic as well as industrial backgrounds. In addition to scientific papers, contributions on industrial applications are also encouraged, covering the fields of instrumentation, medical, telecommunication, radar, space, automotive and defense systems.

  • 2014 44th European Microwave Conference (EuMC)

    EuMC is the premier European conference in the microwave field, which represent the ideal venue for prospective authors to present the status and trends in microwave and millimetre-wave systems and frequency related topics, from materials and technologies to integrated circuits, systems their aspects: theory, simulation, design and measurement including passive components, design of high frequency and high data rate photonics, highly stable and noiseless microwave wave sources, new linearisation techniques and the impact of new packaging technologies.

  • 2013 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre -wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in alltheir aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development

  • 2012 European Microwave Conference (EuMC)

    Microwave and millimeter wave: active/passive devices, antennas, electromagnetics, bio-interaction, circuits, manufacturing and measurement, MEMS, meta-materials, sensor networks, cognitive radio, 4G communications, space technology and applications.

  • 2011 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development app

  • 2010 European Microwave Conference (EuMC)

    The European Microwave Conference is the premier forum for presentation of the present status and future trends in the field of microwave, millimetre- and submillimetre-wave systems and technologies.

  • 2009 European Microwave Conference (EuMC)

    The 39th European Microwave Conference (EuMC), is the core of the European Microwave Week 2009, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2008 European Microwave Conference (EuMC)

    The 38th European Microwave Conference (EuMC) in Amsterdam, The Netherlands, from 27 to 31 October, is the core of the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2007 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging.

  • 2006 European Microwave Conference (EuMC)

  • 2005 European Microwave Conference (EuMC)

  • 2004 European Microwave Conference (EuMC)

  • 2003 European Microwave Conference (EuMC)

  • 1998 28th European Microwave Conference (EuMC)

  • 1997 27th European Microwave Conference (EuMC)


2018 European Conference on Antennas and Propagation (EuCAP)

Antennas & related topics e.g. theoretical methods, systems, wideband, multiband, UWBPropagation & related topics e.g. modelling/simulation, HF, body-area, urbanAntenna & RCS measurement techniques


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Periodicals related to Polymer foams

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


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Most published Xplore authors for Polymer foams

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Xplore Articles related to Polymer foams

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Fiber grating pressure sensor with enhanced sensitivity using a novel packaging polymer

[{u'author_order': 1, u'affiliation': u'Coll. of Sci., Naval Univ. of Eng., Wuhan, China', u'full_name': u'Wen Qing-zhen'}, {u'author_order': 2, u'affiliation': u'Coll. of Sci., Naval Univ. of Eng., Wuhan, China', u'full_name': u'Zhu Jin-hua'}, {u'author_order': 3, u'affiliation': u'Coll. of Sci., Naval Univ. of Eng., Wuhan, China', u'full_name': u'Hua Xin-Yuan'}] 2005 6th International Conference on Electronic Packaging Technology, None

A packaging polymer enhanced sensitivity of fiber Bragg grating pressure sensor was synthesized from hydroxyl terminated polypropylene oxide oligomers, toluene diisocyanate (TDI), 1,4 Butandiol as chain extender, foaming agent and foam stabilizer. The packaging polymer is a kind of microcellular elastic rubber, which is compressible. The testing results show that of Young's modulus, Poisson' ratio of the packaging polymer are ...


Development of closed-cell syntactic SiC-foam for Flow Channel Inserts

[{u'author_order': 1, u'affiliation': u'Mech. & Aerospace Engineering Department, University of California, Los Angeles (UCLA), U.S.A', u'full_name': u'S. Sharafat'}, {u'author_order': 2, u'affiliation': u'Mech. & Aerospace Engineering Department, University of California, Los Angeles (UCLA), U.S.A', u'full_name': u'A. Aoyama'}, {u'author_order': 3, u'affiliation': u'Mech. & Aerospace Engineering Department, University of California, Los Angeles (UCLA), U.S.A', u'full_name': u'N. Morley'}, {u'author_order': 4, u'affiliation': u'Mech. & Aerospace Engineering Department, University of California, Los Angeles (UCLA), U.S.A', u'full_name': u'N. Ghoniem'}, {u'author_order': 5, u'affiliation': u'Product Research and Development, Ultramet Inc., Pacoima, California, U.S.A', u'full_name': u'B. Williams'}, {u'author_order': 6, u'affiliation': u'Product Research and Development, Ultramet Inc., Pacoima, California, U.S.A', u'full_name': u'James Seline'}] 2009 23rd IEEE/NPSS Symposium on Fusion Engineering, None

Syntactic closed-cell SiC-foam is being developed as a potential material for Flow Channel Inserts (FCIs). Syntactic foams consist of hollow spheres embedded in a matrix material. Manufacturing of syntactic polymer-base foams is a well-established technology; however, fabrication of syntactic ceramic foams has not been widely demonstrated. For FCI applications the syntactic SiC-foam should consist of near-stochiometric SiC with a well ...


Electrical-insulation behavior of cellular polymer foams in comparison to their piezoelectret properties

[{u'author_order': 1, u'affiliation': u'Department of Physics and Astronomy, Faculty of Science, University of Potsdam, Karl-Liebknecht-Strasse 24-25, 14476 Potsdam-Golm, Germany', u'full_name': u'Xunlin Qiu'}, {u'author_order': 2, u'affiliation': u'Department of Physics and Astronomy, Faculty of Science, University of Potsdam, Karl-Liebknecht-Strasse 24-25, 14476 Potsdam-Golm, Germany', u'full_name': u'Werner Wirges'}, {u'author_order': 3, u'affiliation': u'Department of Physics and Astronomy, Faculty of Science, University of Potsdam, Karl-Liebknecht-Strasse 24-25, 14476 Potsdam-Golm, Germany', u'full_name': u'Reimund Gerhard'}, {u'author_order': 4, u'affiliation': u'Electrical Insulation Research Center, Institute of Materials Science, Electrical and Computer Engineering, University of Connecticut, North Eagleville Road 97, CT 06269 Storrs, USA', u'full_name': u'Ming Ren'}, {u'author_order': 5, u'affiliation': u'Electrical Insulation Research Center, Institute of Materials Science, Electrical and Computer Engineering, University of Connecticut, North Eagleville Road 97, CT 06269 Storrs, USA', u'full_name': u'Mattewos Tefferi'}, {u'author_order': 6, u'affiliation': u'Electrical Insulation Research Center, Institute of Materials Science, Electrical and Computer Engineering, University of Connecticut, North Eagleville Road 97, CT 06269 Storrs, USA', u'full_name': u'Yang Cao'}] 2016 IEEE International Conference on High Voltage Engineering and Application (ICHVE), None

Polymer foams are widely used in daily life for thermal insulation, shock and sound absorption, packaging, etc. A more recent development is the emergence of so-called ferroelectrets (or piezoelectrets). They are completely non-polar polymer foams that exhibit piezoelectricity after internal charging of the cavities by means of a series of dielectric barrier discharges (DBDs). The internally charged cavities are considered ...


Novel heat durable electromechanical film: processing for electromechanical and electret applications

[{u'author_order': 1, u'affiliation': u'VTT Tech. Res. Centre of Finland, Tampere', u'full_name': u'E. Saarimaki'}, {u'author_order': 2, u'affiliation': u'VTT Tech. Res. Centre of Finland, Tampere', u'full_name': u'M. Paajanen'}, {u'author_order': 3, u'affiliation': u'VTT Tech. Res. Centre of Finland, Tampere', u'full_name': u'A. Savijarvi'}, {u'author_order': 4, u'affiliation': u'VTT Tech. Res. Centre of Finland, Tampere', u'full_name': u'H. Minkkinen'}, {u'author_order': 5, u'full_name': u'M. Wegener'}, {u'author_order': 6, u'full_name': u'O. Voronina'}, {u'author_order': 7, u'full_name': u'R. Schulze'}, {u'author_order': 8, u'full_name': u'W. Wirges'}, {u'author_order': 9, u'full_name': u'R. Gerhard-Multhaupt'}] IEEE Transactions on Dielectrics and Electrical Insulation, 2006

New ferroelectrets were developed on the basis of foams from cyclo-olefin polymers and copolymers. The results obtained on the cyclo-olefin polymer foam demonstrate a significant improvement of the service temperature for ferroelectret transducer materials. Suitable compounding and preparation led to cyclo-olefin ferroelectrets with an electromechanical activity of around 15 pC/N, which is thermally stable at least up to 110degC. The ...


Tissue engineering scaffolds for controlled protein and plasmid delivery

[{u'author_order': 1, u'affiliation': u'Dept. of Chem., Northwestern Univ., Evanston, IL, USA', u'full_name': u'L. D. Shea'}, {u'author_order': 2, u'affiliation': u'Dept. of Chem., Northwestern Univ., Evanston, IL, USA', u'full_name': u'K. J. Whittlesey'}, {u'author_order': 3, u'affiliation': u'Dept. of Chem., Northwestern Univ., Evanston, IL, USA', u'full_name': u'T. Segura'}, {u'author_order': 4, u'affiliation': u'Dept. of Chem., Northwestern Univ., Evanston, IL, USA', u'full_name': u'J. Jang'}, {u'author_order': 5, u'affiliation': u'Dept. of Chem., Northwestern Univ., Evanston, IL, USA', u'full_name': u'Y. Yang'}] Proceedings of the Second Joint 24th Annual Conference and the Annual Fall Meeting of the Biomedical Engineering Society] [Engineering in Medicine and Biology, None

Tissue engineering approaches employ polymer scaffolds to supports, promote, and direct tissue formation by progenitor cells, which are either present in the surrounding tissue or transplanted with the polymer. We hypothesize that scaffolds capable of delivering tissue-inductive factors, or genes encoding for these factors, at the correct time and location, and in the appropriate concentration could enhance the effectiveness of ...


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