Platinum

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Platinum is a chemical element with the chemical symbol Pt and an atomic number of 78. (Wikipedia.org)






Conferences related to Platinum

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2014 IEEE 14th International Conference on Nanotechnology (IEEE-NANO)

NANO is the flagship IEEE conference in Nanotechnology, which makes it a must for students, educators, researchers, scientists and engineers alike, working at the interface of nanotechnology and the many fields of electronic materials, photonics, bio-and medical devices, alternative energy, environmental protection, and multiple areas of current and future electrical and electronic applications. In each of these areas, NANO is the conference where practitioners will see nanotechnologies at work in both their own and related fields, from basic research and theory to industrial applications.

  • 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO)

    The conference scope covers a wide range in nanoscience and technology. In particular, it covers nanofabrication, nanomanufacturing, nanomaerials, nanobiomedicine, nanoenergy, nanoplasmonics, nanoelectronics, nanosensors and nanoactuators, characterisation and modelling of nano structures and devices. Research in both experiments and simulation is reported. Industry is encouraged to present its research projects.

  • 2011 10th Conference on Nanotechnology (IEEE-NANO)

    1. Nanomaterials and Nanostructures 2. Nanoelectronics and Nanodevices 3. Nanophotonics 4. Nano biotechnology and Nanomedicine 5. Nanorobotics and NEMS

  • 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO)

    All areas of nanotechnology within the areas of IEEE interest, as covered by the member societies of the Nanotechnology Council.

  • 2010 IEEE 10th Conference on Nanotechnology (IEEE-NANO)

    - More Moore, More than Moore and Beyond-CMOS - Nano-optics, Nano-Photonics, Plasmonics, Nano-optoelectronics - Nanofabrication, Nanolithography, Nano Manipulation, Nanotools - Nanomaterials and Nanostructures - Nanocarbon, Nanodiamond, Graphene and CNT Based Technologies - Nano-sensors and Nano Membranes - Modeling and Simulation - System Integration (Nano/Micro/Macro), NEMS, and Actuators - Molecular Electronics, Inorganic Nanowires, Nanocrystals, Quantum Dots

  • 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO)

    THE CONFERENCE FOCUSES ON THE APPLICATION OF NANOSCIENCE AND NANOTECHNOLOGY. SPECIFICALLY, BOTH ENGINEERING ISSUE RELATED TO NANOFABBRICATION , NANOELECTRONICS, SENSOR SYSTEMS WILL BE COVERED IN ADDITION FOUNDAMENTAL ISSUES SUCH AS MODELLING, SYNTHESIS, CARACTARIZATION ETC.


2012 7th International Power Electronics and Motion Control Conference (IPEMC 2012)

1. Devices, Packaging and System Integration; 2. Power Converter and Their Control; 3. Power Quality Mitigation; 4. Electric Propulsion System; 5. Renewable Energy and Smart Grid Technology.

  • 2009 IEEE 6th International Power Electronics and Motion Control Conference (IPEMC 2009)

    The conference will include regular sessions on major aspects of the theory, analysis, design, and applications of power electronics and motion control, the following catalogs are the preferred, but not limited topics: power semiconductors and system integration, power converters and their control, FACTS and customer power, motor drive and motion control, renewable energy generation, other applications of power electronics.

  • 2006 5th International Power Electronics and Motion Control Conference (IPEMC 2006)



Periodicals related to Platinum

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Plasma Science, IEEE Transactions on

Plasma science and engineering, including: magnetofluid dynamics and thermionics; plasma dynamics; gaseous electronics and arc technology; controlled thermonuclear fusion; electron, ion, and plasma sources; space plasmas; high-current relativistic electron beams; laser-plasma interactions; diagnostics; plasma chemistry and colloidal and solid-state plasmas.


Potentials, IEEE

This award-winning magazine for technology professionals explores career strategies, the latest research and important technical developments. IEEE Potentials covers theories to practical applications and highlights technology's global impact.



Most published Xplore authors for Platinum

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Xplore Articles related to Platinum

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Platinum decoration of silicon direct wafer bonded interfaces

D. Valente; N. Batut; L. Ventura 2010 27th International Conference on Microelectronics Proceedings, 2010

In this paper we investigate the electrical properties of hydrophobic silicon wafer bonded interface. Platinum diffusion, commonly used to enhance fast bipolar P-i-N diodes, is performed to control its electrical properties. The control of the bonded interface properties is a necessary condition to integrate the wafer bonding technique as a new manufacturing process for structures such as bidirectional switch devices. ...


Ultraviolet, Optical, and Near-IR Microwave Kinetic Inductance Detector Materials Developments

P. Szypryt; B. A. Mazin; B. Bumble; H. G. Leduc; L. Baker IEEE Transactions on Applied Superconductivity, 2015

We have fabricated 2024 pixel microwave kinetic inductance detector (MKID) arrays in the ultraviolet/optical/ near-IR (UVOIR) regime that are currently in use in astronomical instruments. In order to make MKIDs desirable for novel instruments, larger arrays with nearly perfect yield need to be fabricated. As array size increases, however, the percent yield often decreases due to frequency collisions in the ...


Ocean outfall dilution and dispersion measurements with horizontal and vertical profiling sensors

J. Murray; W. Venezia OCEANS 82, 1982

Investigation and analysis of the dilution and dispersion of waste water from an ocean outfall on the continental shelf is presented based on experimental measurements made by towed and cast sensor systems. Details of an experiment conducted at the Boca Raton, Florida, ocean waste water outfall in mid- December 1980 are presented. A vertical plane in the near wake of ...


The formation of shallow low-resistance source—Drain regions for VLSI CMOS technologies

A. L. Butler; D. J. Foster IEEE Transactions on Electron Devices, 1985

As a result of MOS device scaling, very shallow source-drain structures are needed to minimize short-channel effects in 1-µm transistors. This can be readily achieved with highly doped arsenic regions for NMOS devices but is more difficult using boron for PMOS devices. In addition, shallow junctions suffer from inherently high sheet resistances due to dopant solid solubility limitations. This paper ...


Annealing effects on structural and electrical properties of micro heater conductor element

Norihan Abdul Hamid; Burhanuddin Yeop Majlis; Jumril Yunas; Arash Dehzangi RSM 2013 IEEE Regional Symposium on Micro and Nanoelectronics, 2013

This paper presents an analysis and investigation of the effect thermal anealing treatment on structural and electrical properties of micro heater conductor. Conventional micro fabrication process has given a higher resistance impact on the heater conductor properties. Higher conductor resistance obtains higher source for micro heater to be operated. Since the micro heater is used for micron-sized devices, only small ...


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Educational Resources on Platinum

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eLearning

Platinum decoration of silicon direct wafer bonded interfaces

D. Valente; N. Batut; L. Ventura 2010 27th International Conference on Microelectronics Proceedings, 2010

In this paper we investigate the electrical properties of hydrophobic silicon wafer bonded interface. Platinum diffusion, commonly used to enhance fast bipolar P-i-N diodes, is performed to control its electrical properties. The control of the bonded interface properties is a necessary condition to integrate the wafer bonding technique as a new manufacturing process for structures such as bidirectional switch devices. ...


Ultraviolet, Optical, and Near-IR Microwave Kinetic Inductance Detector Materials Developments

P. Szypryt; B. A. Mazin; B. Bumble; H. G. Leduc; L. Baker IEEE Transactions on Applied Superconductivity, 2015

We have fabricated 2024 pixel microwave kinetic inductance detector (MKID) arrays in the ultraviolet/optical/ near-IR (UVOIR) regime that are currently in use in astronomical instruments. In order to make MKIDs desirable for novel instruments, larger arrays with nearly perfect yield need to be fabricated. As array size increases, however, the percent yield often decreases due to frequency collisions in the ...


Ocean outfall dilution and dispersion measurements with horizontal and vertical profiling sensors

J. Murray; W. Venezia OCEANS 82, 1982

Investigation and analysis of the dilution and dispersion of waste water from an ocean outfall on the continental shelf is presented based on experimental measurements made by towed and cast sensor systems. Details of an experiment conducted at the Boca Raton, Florida, ocean waste water outfall in mid- December 1980 are presented. A vertical plane in the near wake of ...


The formation of shallow low-resistance source—Drain regions for VLSI CMOS technologies

A. L. Butler; D. J. Foster IEEE Transactions on Electron Devices, 1985

As a result of MOS device scaling, very shallow source-drain structures are needed to minimize short-channel effects in 1-µm transistors. This can be readily achieved with highly doped arsenic regions for NMOS devices but is more difficult using boron for PMOS devices. In addition, shallow junctions suffer from inherently high sheet resistances due to dopant solid solubility limitations. This paper ...


Annealing effects on structural and electrical properties of micro heater conductor element

Norihan Abdul Hamid; Burhanuddin Yeop Majlis; Jumril Yunas; Arash Dehzangi RSM 2013 IEEE Regional Symposium on Micro and Nanoelectronics, 2013

This paper presents an analysis and investigation of the effect thermal anealing treatment on structural and electrical properties of micro heater conductor. Conventional micro fabrication process has given a higher resistance impact on the heater conductor properties. Higher conductor resistance obtains higher source for micro heater to be operated. Since the micro heater is used for micron-sized devices, only small ...


More eLearning Resources

IEEE-USA E-Books

  • Exploratory Studies on SiliconBased Oxide Fuel Cell Power Sources Incorporating Ultrathin Nanostructured Platinum and Cerium Oxide Films as Anode Components

    This chapter contains sections titled: Introduction Experimental Results and discussion Conclusions

  • Design and Fabrication of Flexible Piezoelectric Generators Based on ZnO Thin Films

    The piezoelectric transducer for vibration-energy harvesting is constructed of a piezoelectric layer, bottom electrode and a top electrode. In order to obtain an appropriate transducer for the low-frequency operating; environmentally-friendly and long-term, the flexible substrate, the piezoelectric layer, and the additional mass-loading have been investigated thoroughly. Firstly, flexible piezoelectric harvesters based on ZnO (Zinc Oxide) thin films for self-powering and broad bandwidth applications. The design and simulation of a piezoelectric cantilever plate was described by using commercial software ANSYS FEA (finite element analysis) to determine the optimum thickness of PET substrate, internal stress distribution, operation frequency and electric potential. A modified design of a flexible piezoelectric energy-harvesting system with a serial bimorph of ZnO piezoelectric thin film was presented to enhance significantly higher power generation. This high-output system was examined at 15 Hz. The maximum DC (direct current) voltage output voltage with loading was 3.18 V, and the maximum DC power remained at 2.89 ??W/cm2. Secondly, this investigation fabricates double-sided piezoelectric transducers for harvesting vibration- power. The double-sided piezoelectric transducer is constructed by depositing piezoelectric thin films. The Ti (titanium) and Pt (platinum) layers were deposited using a dual-gun DC sputtering system between the piezoelectric thin film and the back side of the SUS304 substrate. The maximum open circuit voltage of the double-sided ZnO power transducer is approximately 18 V. After rectification and filtering through a 33 nF capacitor, a specific power output of 1.3 ??W/cm2 is obtained from the double-sided ZnO transducer with a load resistance of 6 M



Standards related to Platinum

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No standards are currently tagged "Platinum"


Jobs related to Platinum

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