Platinum

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Platinum is a chemical element with the chemical symbol Pt and an atomic number of 78. (Wikipedia.org)






Conferences related to Platinum

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2020 IEEE International Symposium on Applications of Ferroelectrics (ISAF)

Ferroelectric materials and applications


2019 9th International IEEE/EMBS Conference on Neural Engineering (NER)

Neural Engineering

  • 2017 8th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural Engineering is an emerging core discipline,which coalesces neuroscience with engineering.Members of both the Neuroscience and Engineering Communities areencouraged to attend this highly multidisciplinarymeeting. The conference will highlight the emergingengineering innovations in the restoration andenhancement of impaired sensory, motor, andcognitive functions, novel engineering for deepeningknowledge of brain function, and advanced designand use of neurotechnologies

  • 2015 7th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural engineering deals with many aspects of basic and clinical problemsassociated with neural dysfunction including the representation of sensory and motor information, theelectrical stimulation of the neuromuscular system to control the muscle activation and movement, theanalysis and visualization of complex neural systems at multi -scale from the single -cell and to the systemlevels to understand the underlying mechanisms, the development of novel neural prostheses, implantsand wearable devices to restore and enhance the impaired sensory and motor systems and functions.

  • 2013 6th International IEEE/EMBS Conference on Neural Engineering (NER)

    Neural engineering deals with many aspects of basic and clinical problems associated with neural dysfunction including the representation of sensory and motor information, the electrical stimulation of the neuromuscular system to control the muscle activation and movement, the analysis and visualization of complex neural systems at multi-scale from the single-cell and to the system levels to understand the underlying mechanisms, the development of novel neural prostheses, implants and wearable devices to restore and enhance the impaired sensory and motor systems and functions.

  • 2011 5th International IEEE/EMBS Conference on Neural Engineering (NER)

    highlight the emerging field, Neural Engineering that unites engineering, physics, chemistry, mathematics, computer science with molecular, cellular, cognitive and behavioral neuroscience and encompasses such areas as replacing or restoring lost sensory and motor abilities, defining the organizing principles and underlying mechanisms of neural systems, neurorobotics, neuroelectronics, brain imaging and mapping, cognitive science and neuroscience.

  • 2009 4th International IEEE/EMBS Conference on Neural Engineering (NER)

    highlight the emerging field, Neural Engineering that unites engineering, physics, chemistry, mathematics, computer science with molecular, cellular, cognitive and behavioral neuroscience and encompasses such areas as replacing or restoring lost sensory and motor abilities, defining the organizing principles and underlying mechanisms of neural systems, neurorobotics, neuroelectronics, brain imaging and mapping, cognitive science and neuroscience.

  • 2007 3rd International IEEE/EMBS Conference on Neural Engineering

  • 2005 2nd International IEEE/EMBS Conference on Neural Engineering

  • 2003 1st International IEEE/EMBS Conference on Neural Engineering


2018 13th European Microwave Integrated Circuits Conference (EuMIC)

The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.

  • 2017 12th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2016 11th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2014 9th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS

  • 2013 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2012 European Microwave Integrated Circuit Conference (EuMIC)

    Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.

  • 2011 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2010 European Microwave Integrated Circuits Conference (EuMIC)

    EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs

  • 2009 European Microwave Integrated Circuits Conference (EuMIC)

    The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2008 European Microwave Integrated Circuits Conference (EuMIC)

    The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2007 European Microwave Integrated Circuits Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)

  • GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 18th International Workshop on Junction Technology (IWJT)

IWJT is an open forum focused on the needs and interest of the community of a junction formation technology in semiconductors.


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Periodicals related to Platinum

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Platinum

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Xplore Articles related to Platinum

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A highly performed nonenzymatic glucose sensor using surfactant template assisted platinum nanoparticles

[{u'author_order': 1, u'affiliation': u'Department of Electronic Engineering, Micro/Nano Devices & packaging Lab., Kwangwoon University, 447-1, Wolgye-Dong, Nowon Gu, Seoul 139-701, Korea', u'full_name': u'M. F. Hossain'}, {u'author_order': 2, u'affiliation': u'Department of Electronic Engineering, Micro/Nano Devices & packaging Lab., Kwangwoon University, 447-1, Wolgye-Dong, Nowon Gu, Seoul 139-701, Korea', u'full_name': u'S. C. Barman'}, {u'author_order': 3, u'affiliation': u'Department of Electronic Engineering, Micro/Nano Devices & packaging Lab., Kwangwoon University, 447-1, Wolgye-Dong, Nowon Gu, Seoul 139-701, Korea', u'full_name': u'J. Y. Park'}] 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), None

In this work, we have successfully developed an enzyme free glucose sensor with highly performed electrodes, which was decorated with surfactant assisted platinum nanoparticles (PtNPs) on rectangular shaped thin Au film electrode. The PtNPs have been used for their outstanding catalytic activity for the redox reaction of H2O2. Diblock copolymer surfactant template was used to deposit platinum nanoparticles on the ...


Flexible, Label-Free DNA Sensor Using Platinum Oxide as the Sensing Element

[{u'author_order': 1, u'affiliation': u'Centre for Nano Science and Engineering, Indian Institute of Science, Bangalore, India', u'full_name': u'Nivedita Basu'}, {u'author_order': 2, u'affiliation': u'Department of Neuroscience and Brain Technologies, Istituto Italiano di Tecnologia, Genova, Italy', u'full_name': u'Anil Krishna Konduri'}, {u'author_order': 3, u'affiliation': u'Indian Institute of Space Science and Technology, Trivandrum, Kerala, India', u'full_name': u'Palash Kumar Basu'}, {u'author_order': 4, u'affiliation': u'Nanomaterials for Biomedicals, Istituto Italiano di Tecnologia, Genova, Italy', u'full_name': u'Sandeep Keshavan'}, {u'author_order': 5, u'affiliation': u'Centre for Nano Science and Engineering, Indian Institute of Science, Bangalore, India', u'full_name': u'Manoj M. Varma'}, {u'author_order': 6, u'affiliation': u'Centre for Nano Science and Engineering, Indian Institute of Science, Bangalore, India', u'full_name': u'Navakanta Bhat'}] IEEE Sensors Journal, 2017

Platinum oxide thin film (100 nm) deposited using an optimized reactive ion sputtering process revealed p-type semiconducting behavior with a band-gap of 1.5 eV, resistivity of 0.16 Q-m, and activation energy of 0.22 eV. XPS spectra indicated the presence of PtO phase (32%) along with PtO2 phase (68%). The XRD spectra indicated the formation of α-PtO2 phase. arrays of simple, ...


SEM/SThM-hybrid-system: a new tool for advanced thermal analysis of electronic devices

[{u'author_order': 1, u'affiliation': u'Lehrstuhl fur Elektron., Bergische Univ. Wuppertal, Germany', u'full_name': u'A. Altes'}, {u'author_order': 2, u'full_name': u'I. Joachimsthaler'}, {u'author_order': 3, u'full_name': u'G. Zimmermann'}, {u'author_order': 4, u'full_name': u'R. Heiderhoff'}, {u'author_order': 5, u'full_name': u'L. J. Balk'}] Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614), None

A resistive probe based Scanning Thermal Microscope (SThM) was implemented in an analysis chamber of a Scanning Electron Microscope (SEM). By means of this hybrid-system thermal device, specific characteristics are detectable. Variable punctual heat sources can be simulated and the influence of ambient parameters can be investigated.


Perpendicular magnetic anisotropy of PdCo and PtCo based multilayers

[{u'author_order': 1, u'full_name': u'S. Tsunashima'}, {u'author_order': 2, u'full_name': u'K. Nakamura'}, {u'author_order': 3, u'full_name': u'S. Uchiyama'}] 1990 IEEE International Magnetics Conference (INTERMAG), None

First Page of the Article ![](/xploreAssets/images/absImages/00734904.png)


Forecast of Weak Electrical Signals in Dahlia pinnata by Neural Networks

[{u'author_order': 1, u'affiliation': u'Coll. of Life Sci., China Jiliang Univ., Hangzhou, China', u'full_name': u'Lanzhou Wang'}, {u'author_order': 2, u'affiliation': u'Coll. of Metrol. Technol. & Eng., China Jiliang Univ., Hangzhou, China', u'full_name': u'Jinli Ding'}] 2010 International Conference on Intelligent Computation Technology and Automation, None

Signals of electrics in Dahlia pinnata were tested by a touching test system of self-made double shields with platinum sensors and tested data of electrical signals denoised by the wavelet soft threshold and also using Gaussian radial base function (RBF) as the time series at a delayed input window chosen at 50. An intelligent RBF forecasting model was set up ...


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Educational Resources on Platinum

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eLearning

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IEEE-USA E-Books

  • Exploratory Studies on SiliconBased Oxide Fuel Cell Power Sources Incorporating Ultrathin Nanostructured Platinum and Cerium Oxide Films as Anode Components

  • Design and Fabrication of Flexible Piezoelectric Generators Based on ZnO Thin Films

    The piezoelectric transducer for vibration-energy harvesting is constructed of a piezoelectric layer, bottom electrode and a top electrode. In order to obtain an appropriate transducer for the low-frequency operating; environmentally-friendly and long-term, the flexible substrate, the piezoelectric layer, and the additional mass-loading have been investigated thoroughly. Firstly, flexible piezoelectric harvesters based on ZnO (Zinc Oxide) thin films for self-powering and broad bandwidth applications. The design and simulation of a piezoelectric cantilever plate was described by using commercial software ANSYS FEA (finite element analysis) to determine the optimum thickness of PET substrate, internal stress distribution, operation frequency and electric potential. A modified design of a flexible piezoelectric energy-harvesting system with a serial bimorph of ZnO piezoelectric thin film was presented to enhance significantly higher power generation. This high-output system was examined at 15 Hz. The maximum DC (direct current) voltage output voltage with loading was 3.18 V, and the maximum DC power remained at 2.89 ¿¿W/cm2. Secondly, this investigation fabricates double-sided piezoelectric transducers for harvesting vibration- power. The double-sided piezoelectric transducer is constructed by depositing piezoelectric thin films. The Ti (titanium) and Pt (platinum) layers were deposited using a dual-gun DC sputtering system between the piezoelectric thin film and the back side of the SUS304 substrate. The maximum open circuit voltage of the double-sided ZnO power transducer is approximately 18 V. After rectification and filtering through a 33 nF capacitor, a specific power output of 1.3 ¿¿W/cm2 is obtained from the double-sided ZnO transducer with a load resistance of 6 M?>



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