Conferences related to Plastics

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2012 IEEE International Symposium on Sustainable Systems and Technology (ISSST)

The symposium is a forum for exchange of knowledge related to systems approaches to sustainability in the context of technological change.

  • 2011 IEEE International Symposium on Sustainable Systems and Technology (ISSST)

    This conference was known between 1993 and 2008 as the IEEE International Symposium on Electronics and the Environment. The program includes sessions covering the spectrum of issues for assessing and managing products and services across their life cycle, and the design, management, and policy implications of sustainable engineered systems and technologies, including design for environment, design for sustainability, materials selection, energy management, end-of-life policy and reuse/recycling.

  • 2010 IEEE International Symposium on Sustainable Systems and Technology (ISSST)

    The program includes sessions covering the spectrum of issues for assessing and managing products and services across their life cycle, and the design, management, and policy implications of sustainable engineered systems and technologies, including design for environment, design for sustainability, materials selection, energy management, end-of-life policy and reuse/recycling, process integration, and institutional and policy implications of services and technology systems.

  • 2009 IEEE International Symposium on Sustainable Systems and Technology (ISSST) (Formerly known as ISEE)

    Conference will cover environmental and social implications of ICT technologies, including services. Areas of focus will include industrial ecology, design for environment, design for sustainability, emerging technologies, and sustainable ICT services

  • 2008 IEEE International Symposium on Electronics and the Environment (ISEE)

    Issues associated with sustainable environmental and health of engineered systems, with a focus on information and communication technology systems.

  • 2007 IEEE International Symposium on Electronics and the Environment (ISEE)

  • 2006 IEEE International Symposium on Electronics and the Environment (ISEE) in conjunction with Electronics Recycling Summit

  • 2005 IEEE International Symposium on Electronics and the Environment (ISEE)


2010 2nd International Conference on Information Engineering and Computer Science (ICIECS)

ICIECS2010 will be held on December 25-26, 2010 in Wuhan, China. This conference will bring together the top researchers from Asian Pacific nations, North America, Europe and around the world to exchange their research results and address open issues in Surveying and Mapping, Artificial Intelligence and Its Application, Image Processing and Digital Signal Processing, Computer Modeling and Simulation, and Software Engineering.


2010 International Conference on Electrical and Control Engineering (ICECE)

recent advances, new techniques and applications in the field of Electrical Engineering and Automation Control.


2002 11th International Plastic Optical Fibers Conference



Periodicals related to Plastics

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.




Xplore Articles related to Plastics

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Basic Study On Interstitial Applicators With A Single Ring Slot For Microwave Hyperthermia

M. Hyodo; M. Shimura; K. Ito; H. Kasai [1990] Proceedings of the Twelfth Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 1990

First Page of the Article ![](/xploreAssets/images/absImages/00691892.png)


A sparse representation approach to face matching across plastic surgery

Gaurav Aggarwal; Soma Biswas; Patrick J. Flynn; Kevin W. Bowyer 2012 IEEE Workshop on the Applications of Computer Vision (WACV), 2012

Plastic surgery procedures can significantly alter facial appearance, thereby posing a serious challenge even to the state-of-the-art face matching algorithms. In this paper, we propose a novel approach to address the challenges involved in automatic matching of faces across plastic surgery variations. In the proposed formulation, part-wise facial characterization is combined with the recently popular sparse representation approach to address ...


Weight storage elements for analog implementation of artificial neural networks

E. I. El-Masry; B. J. Maundy; E. Abu-Allam [1992] Proceedings of the 35th Midwest Symposium on Circuits and Systems, 1992

Novel switched-capacitor (SC) circuits for storing analog weight voltages for use in the CMOS VLSI realization of analog artificial neural networks (ANNs) are presented. The circuits are dynamic in operation requiring low clock rates and operate by compensating for the leakage currents that are always present in CMOS devices. In addition, weight voltages can be changed in a manner similar ...


Performance of a 2-layer radial hole effective media lens

D. Gray; N. Nikolic; J. Thornton 2016 IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC), 2016

The outer polyethylene layer of a 8λ0 radius 2-layer polyethylene/cross-linked polystyrene lens was implemented as a radial hole effective media that allows the entire lens to be milled from a single billet of cross-linked polystyrene, simplifying construction by avoiding layer fitting problems. Full wave simulations in a commercially available simulator showed that increasing the number of radial holes to 3000 ...


Nanodielectics: How does the presence of interfaces influence behaviour?

Toshikatsu Tanaka 2011 International Conference on Power and Energy Systems, 2011

Nanocomposites are composed of host and guest materials in general. They should be fabricated so that they may be endowed with superb performances of the guest filler materials, while keeping original performances of the host materials. In general, inorganic materials are excellent in optical, electrical, mechanical and thermal properties, while organic materials are superb in light weight, flexibility, and processability. ...


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Educational Resources on Plastics

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eLearning

Basic Study On Interstitial Applicators With A Single Ring Slot For Microwave Hyperthermia

M. Hyodo; M. Shimura; K. Ito; H. Kasai [1990] Proceedings of the Twelfth Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 1990

First Page of the Article ![](/xploreAssets/images/absImages/00691892.png)


A sparse representation approach to face matching across plastic surgery

Gaurav Aggarwal; Soma Biswas; Patrick J. Flynn; Kevin W. Bowyer 2012 IEEE Workshop on the Applications of Computer Vision (WACV), 2012

Plastic surgery procedures can significantly alter facial appearance, thereby posing a serious challenge even to the state-of-the-art face matching algorithms. In this paper, we propose a novel approach to address the challenges involved in automatic matching of faces across plastic surgery variations. In the proposed formulation, part-wise facial characterization is combined with the recently popular sparse representation approach to address ...


Weight storage elements for analog implementation of artificial neural networks

E. I. El-Masry; B. J. Maundy; E. Abu-Allam [1992] Proceedings of the 35th Midwest Symposium on Circuits and Systems, 1992

Novel switched-capacitor (SC) circuits for storing analog weight voltages for use in the CMOS VLSI realization of analog artificial neural networks (ANNs) are presented. The circuits are dynamic in operation requiring low clock rates and operate by compensating for the leakage currents that are always present in CMOS devices. In addition, weight voltages can be changed in a manner similar ...


Performance of a 2-layer radial hole effective media lens

D. Gray; N. Nikolic; J. Thornton 2016 IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC), 2016

The outer polyethylene layer of a 8λ0 radius 2-layer polyethylene/cross-linked polystyrene lens was implemented as a radial hole effective media that allows the entire lens to be milled from a single billet of cross-linked polystyrene, simplifying construction by avoiding layer fitting problems. Full wave simulations in a commercially available simulator showed that increasing the number of radial holes to 3000 ...


Nanodielectics: How does the presence of interfaces influence behaviour?

Toshikatsu Tanaka 2011 International Conference on Power and Energy Systems, 2011

Nanocomposites are composed of host and guest materials in general. They should be fabricated so that they may be endowed with superb performances of the guest filler materials, while keeping original performances of the host materials. In general, inorganic materials are excellent in optical, electrical, mechanical and thermal properties, while organic materials are superb in light weight, flexibility, and processability. ...


More eLearning Resources

IEEE-USA E-Books

  • Industry Activities

    This chapter contains sections titled: Introduction American National Standards Institute (ANSI) American Society for Testing and Materials (ASTM) Association of Edison Illuminating Companies (AEIC) Edison Electric Institute (EEI) Electric Power Research Institute (EPRI) Electrical Apparatus Service Association (EASA) Electrical Manufacturing and Coil Winding Association (EMCWA) Electronic Industries Association (EIA) Institut De Reserche D'Hydro-Québec (IREQ) The Institute for Interconnecting and Packaging Electronic Circuits (IPC) Institute of Electrical and Electronics Engineers (IEEE) Insulated Cable Engineers Association (ICEA) International Conference on Large High Voltage Electrical Systems (CIGRé) The International Electrotechnical Commission (IEC) National Electrical Manufacturers Association (NEMA) Society of Automotive Engineers (SAE) Society of Plastics Engineers (SPE) Society of the Plastics Industry (SPI) Underwriters Laboratories (UL) Conferences/Symposiums Publications

  • Plastics and Other Materials

    This chapter contains sections titled: Body fluid permeability Electric loss and dielectric constant Tissue and blood reactions Forming and repair

  • Will Composite Nanomaterials Replace Piezoelectric Thin Films for Energy Transduction Applications?

    Semiconducting piezoelectric nanowires (NWs) show significant potential for application in electronic and electromechanical sensors and energy harvesters. In particular, these nanostructures can be used to build composite piezoelectric materials that could offer several advantages when integrated vertically. First, NWs of various lengths opens the possibility to fabricate composite layers thicker than standard thin films (<4 ??m). Second, low???temperature fabrication process make this technology compatible with CMOS devices and with different substrates, such as Si, polymers, plastics, metal foils, and even paper. Third, properties such as piezoelectricity, flexibility, and dielectric constant can be improved in NWs, thereby improving the performance of NW???containing composite materials. Finally, FEM simulations show that composites can provide better performance compared to piezoelectric thin films of the same thickness, and that performance can be improved by operating in compression or flexion modes by the right choice of the dielectric matrix and NW density.

  • Microelectronics Packaging Materials and Applications

    This chapter contains sections titled: Introduction Some Important Packaging Material Properties Ceramics in Packaging Plastics in Packaging Metals in Packaging Materials Used in Multichip Module Packaging Summary This chapter contains sections titled: Exercises References

  • Thermosetting Molding Compounds

    This chapter contains sections titled: Introduction Thermosetting Plastics Consumed in Electrical/Electronic Applications Polymerization and Polycondensation Reinforcements and Fillers, Antioxidants, Ultraviolet Stabilizers Compression Molding Transfer Molding Injection Molding Standard Tests Relative Costs of Thermosetting Compounds Development Programs Market Trends Ranking of Thermosetting Compounds by Key Properties Federal Specification MIL-M-14 Principal Thermosetting Compounds for Electrical/Electronic Uses

  • No title

    The process of heating and reshaping plastics sheet and film materials has been in use since the beginning of the plastics industry. This process is known as thermoforming. Today this process is used for industrial products including signage, housings, and hot tubs. It also produces much of the packaging in use today including blister packs, egg cartons, and food storage containers. This process has many advantages over other methods of producing these products, but it has some limitations. This book has a twofold purpose. It is designed to be used as a text book for a course on thermoforming. It is also intended to be an application guide for professionals in the field of thermoforming including manufacturing, process and quality engineers, and managers. This book is focused on process application rather than theory. It refers to real products and processes with the intent of understanding the real issues faced in this industry. In addition to materials and processes, part and tool d sign are covered. Quality control is critical to any operation and this is also covered in this text. Two areas of focus in today's industry include Lean operations and environmental issues. Both of these topics are also included. Table of Contents: Introduction / Plastics Materials / Thermoforming Process Overview / The Forming Process / Part Design Mold / Tool Design / Quality Control Issues / Lean Operations / Environmental Issues

  • Thermoplastic Molding Compounds

    This chapter contains sections titled: Introduction Definitions of Terms Relating to Plastics Plastics Industry Engineering Thermoplastics Polymerization Reinforcements and Fillers Flame Retardants Antioxidants Ultraviolet Stabilizers Injection Molding Standard Tests Maximum Service Temperature of Thermoplastic Polymers Relative Costs of Thermoplastic Polymers Alloys Liquid Crystal Polymers (LCPS) Conducting Polymers Development Programs Market Trends Summary of Rankings of Thermoplastic Polymers Principal Thermoplastic Polymers for Electrical/Electronic Uses

  • Nonenergy Uses of Hydrogen: Metallic H<subscript>2</subscript>, Biodegradable Plastics, and H<subscript>2</subscript>Tofu

    This chapter contains sections titled: A Hydrogen Space Gun, Hydrogen for Clean Steel Production, Atomic, Solid and Metallic Hydrogen, Hyperbaric Hydrogen to Fight Cancer, Is Intelligent Life Out There? The Cosmic Waterhole



Standards related to Plastics

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No standards are currently tagged "Plastics"