Conferences related to Plastics

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2018 22nd International Conference on System Theory, Control and Computing (ICSTCC)

The International Conference on System Theory, Control and Computing ICSTCC 2018 aims at bringing together under a unique forum, scientists from academia and industry to discuss the state of the art and the new trends in system theory, control and computer engineering, and to present recent research results and prospects for development in this rapidly evolving area.

  • 2017 21st International Conference on System Theory, Control and Computing (ICSTCC)

    The International Conference on System Theory, Control and Computing ICSTCC 2017 aims at bringing together under a unique forum, scientists from academia and industry to discuss the state of the art and the new trends in system theory, control and computer engineering, and to present recent research results and prospects for development in this rapidly evolving area.

  • 2016 20th International Conference on System Theory, Control and Computing (ICSTCC)

    The main goal of this conference is to provide a multidisciplinary forum between researchers from industry and academia to discuss state-of-the-art topics in system theory, control and computing, and to present recent research results and prospects for development in this evolving area. The outcome of ICSTCC 2016 can be a better understanding of some leading research areas, as already System Theory, Control and Computing have demonstrated.

  • 2015 19th International Conference on System Theory, Control and Computing (ICSTCC)

    International Conference on System Theory, Control and Computing - ICSTCC 2015 - aims at bringing together, under a unique forum, scientists from Academia and Industry to discuss the state of the art and the new trends in System Theory, Control and Computer Engineering, and at promoting professional interactions and fellowships. ICSTCC 2015 will feature several kinds of presentations including invited plenary papers, contributed papers and invited sessions. The outcome of ICSTCC 2015 will be a better understanding of some leading research areas for which System Theory, Control and Computing are representative.The conference has reached its sixth edition and it represents the result of a merger of three different scientific events previously hosted by “Dunarea de Jos” University of Galati, “Gheorghe Asachi” Technical University of Iasi and University of Craiova.

  • 2014 18th International Conference on System Theory, Control and Computing (ICSTCC)

    The International Conference on System Theory, Control and Computing ICSTCC 2014 aims at bringing together under a unique forum, scientists from academia and industry to discuss the state of the art and the new trends in system theory, control and computer engineering, and to present recent research results and prospects for development in this rapidly evolving area.

  • 2013 17th International Conference on System Theory, Control and Computing (ICSTCC)

    The main goal of this conference is to provide amultidisciplinary forum between researchers from industry and academia to discuss state-of-the-art topics in system theory, control and computing, and to present recent research results and prospects for development in this evolving area.

  • 2012 16th International Conference on System Theory, Control and Computing (ICSTCC)

    The ICSTCC 2012 aims at bringing together, under a unique forum, scientists from Academia and Industry to discuss the state of the art and the new trends in System Theory, Control and Computing.

  • 2011 15th International Conference on System Theory, Control and Computing (ICSTCC)

    The ICSTCC 2011 aims at bringing together, under a unique forum, scientists from Academia and Industry to discuss the state of the art and the new trends in System Theory, Control and Computer Engineering. It will feature several kinds of presentations including invited and contributed papers, special sessions and poster sessions.


2018 26th Signal Processing and Communications Applications Conference (SIU)

The general scope of the conference ranges from signal and image processing to telecommunication, and applications of signal processing methods in biomedical and communication problems.

  • 2017 25th Signal Processing and Communications Applications Conference (SIU)

    Signal Processing and Communication Applications (SIU) conference is the most prominent scientific meeting on signal processing in Turkey bringing together researchers working in signal processing and communication fields. Topics include but are not limited to the areas of research listed in the keywords.

  • 2016 24th Signal Processing and Communication Application Conference (SIU)

    Signal Processing Theory, Statistical Signal Processing, Nonlinear Signal Processing, Adaptive Signal Processing, Array and Multichannel Signal Processing, Signal Processing for Sensor Networks, Time-Frequency Analysis, Speech / Voice Processing and Recognition, Computer Vision, Pattern Recognition, Machine Learning for Signal Processing, Human-Machine Interaction, Brain-Computer Interaction, Signal-Image Acquisition and Generation, image Processing, video Processing, Image Printing and Presentation, Image / Video / Audio browsing and retrieval, Image / Video / Audio Watermarking, Multimedia Signal Processing, Biomedical Signal Processing and Image Processing, Bioinformatics, Biometric Signal-Image Processing and Recognition, Signal Processing for Security and Defense, Signal and Image Processing for Remote Sensing, Signal Processing Hardware, Signal Processing Education, Radar Signal Processing, Communication Theory, Communication Networks, Wireless Communications

  • 2015 23th Signal Processing and Communications Applications Conference (SIU)

    Signal Processing Theory Statistical Signal Processing Nonlinear Signal Processing Adaptive Signal Processing Array and Multichannel Signal Processing Signal Processing for Sensor Networks Time-Frequency Analysis Speech / Voice Processing and Recognition Computer Vision Pattern Recognition Machine Learning for Signal Processing Human-Machine Interaction Brain-Computer Interaction Signal-Image Acquisition and Generation image Processing video Processing Image Printing and Presentation Image / Video / Audio browsing and retrieval Image / Video / Audio Watermarking Multimedia Signal Processing Biomedical Signal Processing and Image Processing Bioinformatics Biometric Signal-Image Processing and Recognition Signal Processing for Security and Defense Signal and Image Processing for Remote Sensing Signal Processing Hardware Signal Processing Education Radar Signal Processing Communication Theory Communication Networks Wireless Communications

  • 2014 22nd Signal Processing and Communications Applications Conference (SIU)

    SIU will be held in Trabzon, Turkey at the Karadeniz Technical University Convention and Exhibition Centre on April 23, 2014. SIU is the largest and most comprehensive technical conference focused on signal processing and its applications in Turkey. Last year there were 500 hundred participants. The conference will feature renowned speakers, tutorials, and thematic workshops. Topics include but are not limited to: Signal Procesing, Image Processing, Communication, Computer Vision, Machine Learning, Biomedical Signal Processing,

  • 2013 21st Signal Processing and Communications Applications Conference (SIU)

    Conference will discuss state of the art solutions and research results on existing and future DSP and telecommunication systems, applications, and related standardization activities. Conference will also include invited lectures, tutorials and special sessions.

  • 2012 20th Signal Processing and Communications Applications Conference (SIU)

    Conference will discuss state of the art solutions and research results on existing and future DSP and telecommunication systems, applications, and related standardization activities. Conference will also include invited lectures, tutorials and special sessions.

  • 2011 19th Signal Processing and Communications Applications Conference (SIU)

    Conference will bring together academia and industry professionals as well as students and researchers to present and discuss state of the art solutions and research results on existing and future DSP and telecommunication systems, applications, and related standardization activities. The Conference will also include invited lectures, tutorials and special sessions.

  • 2010 IEEE 18th Signal Processing and Communications Applications Conference (SIU)

    S1.Theory of Signal-Processing S2.Statistical Signal-Processing S3.Multimedia Signal-Processing S4.Biomedical Signal-Processing S5.Sensor Networks S6.Multirate Signal-Processing S7.Pattern Recognition S8.Computer Vision S9.Adaptive Filters S10.Image/Video/Speech Browsing, Retrieval S11.Speech/Audio Coding S12.Speech Processing S13.Human-Machine Interfaces S14.Surveillance Signal Processing S15.Bioinformatics S16.Self-Learning S17.Signal-Processing Education S18.Signal-Processing Systems S1

  • 2009 IEEE 17th Signal Processing and Communications Applications Conference (SIU)

    The scope of the conference is to cover recent topics in theory and applications of Signal Processing and Communications.

  • 2008 IEEE 16th Signal Processing and Communications Applications Conference (SIU)

    Signal Processing, Image Processing, Speech Processing, Pattern Recognition, Human Computer Interaction, Communication, Video and Speech indexing, Computer Vision, Biomedical Signal Processing

  • 2007 IEEE 15th Signal Processing and Communications Applications (SIU)

  • 2006 IEEE 14th Signal Processing and Communications Applications (SIU)

  • 2005 IEEE 13th Signal Processing and Communications Applications (SIU)

  • 2004 IEEE 12th Signal Processing and Communications Applications (SIU)


2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2018 53rd International Universities Power Engineering Conference (UPEC)

UPEC is a long-established international conference which provides a major forum for scientists, young researchers, PhD students and engineers worldwide to present, review and discuss the latest developments in Electrical Power Engineering and relevant technologies including energy storage and renewables

  • 2016 51st International Universities Power Engineering Conference (UPEC)

    UPEC is a long-established conference, which is very popular with young researchers, PhD students and engineers from the electrical power industry. The aim of the conference is to allow participants to exchange experiences and discuss the most up-to-date topics in Power Engineering. The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grid systems in developing countries require significant research input in the area. UPEC is an ideal forum to address some of these issues, and to network and meet with talented engineers and innovators in these areas.

  • 2015 50th International Universities Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2014 49th International Universities Power Engineering Conference (UPEC)

    Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges. It also provides the opportunity to network and to meet the experts in these areas.

  • 2013 48th Universities' Power Engineering Conference (UPEC)

    The conference provides a major international focus for the presentation, discussion and exchange of information concerning new trends in Electrical Power Engineering. The conference is very popular with young researchers, PhD students and engineers from the electrical power industry. Given the major challenges now facing the electrical power industry, and the energy sector in general, this conference provides an ideal opportunity to address some of these challenges.

  • 2012 47th International Universities Power Engineering Conference (UPEC)

    A major international forum for the presentation, discussion and exchange of information concerning new trends in electrical power engineering. To become better informed about the latest developments in the field of power engineering.

  • 2010 45th International Universities Power Engineering Conference (UPEC)

    The global energy challenge, the ageing of electrical networks in industrial countries, and the extension of the grids in developing countries require significant research effort and the need for talented engineers and innovators is critical to the electrical energy industry. UPEC is an ideal forum to address such issues, and to network and meet experts in these areas

  • 2009 44th International Universities Power Engineering Conference (UPEC)

    UPEC has been long-established as a major annual international forum for the presentation, discussion and exchange of information concerning new trends in all areas of electric power engineering. Contributions from younger engineers and researchers are particularly encouraged at UPEC, where ideas can be aired freely and new relationships developed.

  • 2008 43rd International Universities Power Engineering Conference (UPEC)

    Its aim will be to provide a professional forum for engineers and research scientists from the universities, consultants, and in the manufacturing and supply industries opportunities to present their work and explore potential trends and recent developments, current practices in Power Engineering and related fields.

  • 2007 Universities Power Engineering Conference (UPEC)

  • 2006 International Universities Power Engineering Conference (UPEC)

  • 2004 International Universities Power Engineering Conference (UPEC)


2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


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Periodicals related to Plastics

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


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Most published Xplore authors for Plastics

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Xplore Articles related to Plastics

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Cerenkov fiber sampling calorimeters

[{u'author_order': 1, u'affiliation': u'Fairfield Univ., CT, USA', u'full_name': u'K. Arrington'}, {u'author_order': 2, u'affiliation': u'Fairfield Univ., CT, USA', u'full_name': u'D. Kefford'}, {u'author_order': 3, u'affiliation': u'Fairfield Univ., CT, USA', u'full_name': u'J. Kennedy'}, {u'author_order': 4, u'affiliation': u'Fairfield Univ., CT, USA', u'full_name': u'R. Pisani'}, {u'author_order': 5, u'affiliation': u'Fairfield Univ., CT, USA', u'full_name': u'C. Sanzeni'}, {u'author_order': 6, u'affiliation': u'Fairfield Univ., CT, USA', u'full_name': u'K. Segall'}, {u'author_order': 7, u'affiliation': u'Fairfield Univ., CT, USA', u'full_name': u'D. Wall'}, {u'author_order': 8, u'affiliation': u'Fairfield Univ., CT, USA', u'full_name': u'D. R. Winn'}, {u'author_order': 9, u'full_name': u'R. Carey'}, {u'author_order': 10, u'full_name': u'S. Dye'}, {u'author_order': 11, u'full_name': u'J. Miller'}, {u'author_order': 12, u'full_name': u'L. Sulak'}, {u'author_order': 13, u'full_name': u'W. Worstell'}, {u'author_order': 14, u'full_name': u'Y. Efremenko'}, {u'author_order': 15, u'full_name': u'Y. Kamyshkov'}, {u'author_order': 16, u'full_name': u'A. Savin'}, {u'author_order': 17, u'full_name': u'K. Shmakov'}, {u'author_order': 18, u'full_name': u'E. Tarkovsky'}] IEEE Transactions on Nuclear Science, 1994

Clear optical fibers were used as a Cerenkov sampling media in Pb (electromagnetic) and Cu (hadron) absorbers in spaghetti calorimeters, for high rate and high radiation dose experiments, such as the forward region of high energy colliders. The fiber axes were aligned close to the direction of the incident particles(1°-7°). The 7 λ deep hadron tower, contained 2.8% by volume ...


Leaky lightguide/LED row-backlight, column-shutter display

[{u'author_order': 1, u'affiliation': u'Bellcore, Morristown, NJ, USA', u'full_name': u'T. J. Nelson'}, {u'author_order': 2, u'affiliation': u'Bellcore, Morristown, NJ, USA', u'full_name': u'M. Anandan'}, {u'author_order': 3, u'affiliation': u'Bellcore, Morristown, NJ, USA', u'full_name': u'J. W. Mann'}, {u'author_order': 4, u'full_name': u'E. Berry'}] IEEE Transactions on Electron Devices, 1991

The authors arrayed leaky fused-quartz lightguides, each illuminated by GaAlAs light-emitting diodes, to make a row-addressable backlight. It was much more efficient than a DC-plasma row-backlight that was also made. Test patterns were displayed by operating the backlight with a ferroelectric liquid-crystal shutter array, and gray-scale capability was demonstrated


Haptic perception of curvature through active touch

[{u'author_order': 1, u'affiliation': u'Univ.Lille Nord de France, F-59000, France', u'full_name': u'Tao Zeng'}, {u'author_order': 2, u'affiliation': u'Univ.Lille Nord de France, F-59000, France', u'full_name': u'Fr\xe9d\xe9ric Giraud'}, {u'author_order': 3, u'affiliation': u'Univ.Lille Nord de France, F-59000, France', u'full_name': u'Betty Lemaire-Semail'}, {u'author_order': 4, u'affiliation': u'Univ.Lille Nord de France, F-59000, France', u'full_name': u'Michel Amberg'}] 2011 IEEE World Haptics Conference, None

Haptic perception of curvature can be achieved by passive or active finger touch. In this study we proposed a new curvature perception haptic device that can independently orient, elevate and translate a flat plate. By exploring it with a finger through active touch, we can render a curved shape. According to the characteristics of this device, two curvature rendering motion ...


Surface characteristics of pluronic-based polyurethanes

[{u'author_order': 1, u'affiliation': u'¿Petru Poni¿ Institute of Macromolecular Chemistry, Aleea Gr. Ghica Voda 41 A, 700487, Iasi, ROMANIA', u'full_name': u'Daniela Filip'}, {u'author_order': 2, u'affiliation': u'¿Petru Poni¿ Institute of Macromolecular Chemistry, Aleea Gr. Ghica Voda 41 A, 700487, Iasi, ROMANIA', u'full_name': u'G. E. Ioanid'}, {u'author_order': 3, u'affiliation': u'¿Petru Poni¿ Institute of Macromolecular Chemistry, Aleea Gr. Ghica Voda 41 A, 700487, Iasi, ROMANIA', u'full_name': u'A. Ioanid'}, {u'author_order': 4, u'affiliation': u'¿Petru Poni¿ Institute of Macromolecular Chemistry, Aleea Gr. Ghica Voda 41 A, 700487, Iasi, ROMANIA', u'full_name': u'D. Macocinschi'}] 2008 IEEE 35th International Conference on Plasma Science, None

Amphiphile polymers find widespread applications because of their unique ability to self-assemble and modify interfacial properties. Smart polymers have very promising applications in the biomedical field as delivery systems of therapeutic agents, tissue engineering scaffolds, cell culture supports, bioseparation devices, sensor or actuators systems. Polyurethanes and polyurethane-ureas based on pluronic macrodiols have been prepared. The morphological and self- assembly characteristics ...


Leak detection and position method for pressure piping using Acoustic Emission

[{u'author_order': 1, u'affiliation': u'State Key Laboratory of Precision Measurement Technology and Instrument, Tianjin University, 300072, China', u'full_name': u'Liying Sun'}, {u'author_order': 2, u'affiliation': u'State Key Laboratory of Precision Measurement Technology and Instrument, Tianjin University, 300072, China', u'full_name': u'Yibo Li'}, {u'author_order': 3, u'affiliation': u'State Key Laboratory of Precision Measurement Technology and Instrument, Tianjin University, 300072, China', u'full_name': u'Tiegen Liu'}, {u'author_order': 4, u'affiliation': u'State Key Laboratory of Precision Measurement Technology and Instrument, Tianjin University, 300072, China', u'full_name': u'Shijiu Jin'}, {u'author_order': 5, u'affiliation': u'State Key Laboratory of Precision Measurement Technology and Instrument, Tianjin University, 300072, China', u'full_name': u'Wang Weikui'}] 2008 7th World Congress on Intelligent Control and Automation, None

Detection and position of defects in pipeline based on acoustic emission was investigated. The theory of AE pipeline detection and position method was analyzed and a serial of experiments were carried out. Parameters, such as pressure in the pipe, diameter of the leaking hole (leaking hole), and distance from transducers to the leaking hole, were adjusted to show its effects ...


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IEEE-USA E-Books

  • Example Applications

    **This is the third revised edition of the established and trusted _RFID Handbook_; the most comprehensive introduction to radio frequency identification (RFID) available.** This essential new edition contains information on electronic product code (EPC) and the EPC global network, and explains near-field communication (NFC) in depth. It includes revisions on chapters devoted to the physical principles of RFID systems and microprocessors, and supplies up-to-date details on relevant standards and regulations. The text explores schematic circuits of simple transponders and readers, and includes new material on active and passive transponders, ISO/IEC 18000 family, ISO/IEC 15691 and 15692. It also describes the technical limits of RFID systems. A unique resource offering a complete overview of the large and varied world of RFID, Klaus Finkenzeller's volume is useful for end-users of the technology as well as practitioners in auto ID and IT designers of RFI products. Computer and electronics engineers in security system development, microchip designers, and materials handling specialists benefit from this book, as do automation, industrial and transport engineers. Clear and thorough explanations also make this an excellent introduction to the topic for graduate level students in electronics and industrial engineering design.

  • Differentiation Features of RFID Systems

    **This is the third revised edition of the established and trusted _RFID Handbook_; the most comprehensive introduction to radio frequency identification (RFID) available.** This essential new edition contains information on electronic product code (EPC) and the EPC global network, and explains near-field communication (NFC) in depth. It includes revisions on chapters devoted to the physical principles of RFID systems and microprocessors, and supplies up-to-date details on relevant standards and regulations. The text explores schematic circuits of simple transponders and readers, and includes new material on active and passive transponders, ISO/IEC 18000 family, ISO/IEC 15691 and 15692. It also describes the technical limits of RFID systems. A unique resource offering a complete overview of the large and varied world of RFID, Klaus Finkenzeller's volume is useful for end-users of the technology as well as practitioners in auto ID and IT designers of RFI products. Computer and electronics engineers in security system development, microchip designers, and materials handling specialists benefit from this book, as do automation, industrial and transport engineers. Clear and thorough explanations also make this an excellent introduction to the topic for graduate level students in electronics and industrial engineering design.

  • Global Change, Sustainability, and Adaptive Management Strategies for Solid Waste Management

    Integrated solid waste management (ISWM) is deemed a long-standing strategy in dealing with a part of the collective impact of these global changes. The concept of systems engineering can simultaneously address more internal and external factors that influence the decision-making process for ISWM, from planning to design and to operation. This chapter reinvents the wheel of ISWM and discusses the holistic concepts and strategies with respect to recent impacts of global changes from sustainability science and sustainable engineering perspectives. It leads to further magnifying the importance of ISWM in which waste collection, recycling, treatment, recovery, and disposal are handled together at different scales with respect to pollution prevention, material conservation, energy recovery, and ecosystem conservation. The status of SWM worldwide has been highlighted by several international organizations.

  • Subordinate Clauses Used as Qualifiers

    The subordinate clauses typically used as qualifiers in technical writing are of two types: _that_ and _which_ clauses and adverb clauses. This chapter begins by looking at _that_ and _which_ clauses because (1) they are ubiquitous in technical writing; (2) the rule for punctuating that and which clauses can serve as a model for the punctuation of all other qualifiers; and (3) most of the other qualifiers, both clauses and phrases, can be recast as that or which clauses. _That_ and _which_ clauses were qualifiers that modify nouns, adverb clauses are qualifiers that may modify a verb, an adjective, another adverb, or perhaps the entire core of the sentence. Finally the chapter presents general rule for punctuating the subordinate clauses.

  • Self-Organization

    This chapter presents the principles of Self-Organization, and focuses on Adaptive Resonance Theory (ART) and Self-Organizing Map (SOM) neural networks. It investigates the theoretic basis of formulations of these neural networks, and illustrates a few examples. The structures of these networks and their learning algorithms are also thoroughly explored in the chapter. The ART architecture is a specifically designed neural network to overcome the stability-plasticity dilemma. It is described using nonlinear differential equations. In addition to ART and SOM, there are two other fixed approaches that could be considered fundamental, namely, Neural Gas and the Hierarchical Feature Map. While both are strongly related to the SOM in terms of the learning mechanism, they each have spawned a range of newer architectures are introduced in the chapter. The chapter explains other popular architectures to have emerged based on similar principles of Self-Organization, drawing a distinction between static and dynamic architectures.

  • The Manufacture of Transponders and Contactless Smart Cards

    **This is the third revised edition of the established and trusted _RFID Handbook_; the most comprehensive introduction to radio frequency identification (RFID) available.** This essential new edition contains information on electronic product code (EPC) and the EPC global network, and explains near-field communication (NFC) in depth. It includes revisions on chapters devoted to the physical principles of RFID systems and microprocessors, and supplies up-to-date details on relevant standards and regulations. The text explores schematic circuits of simple transponders and readers, and includes new material on active and passive transponders, ISO/IEC 18000 family, ISO/IEC 15691 and 15692. It also describes the technical limits of RFID systems. A unique resource offering a complete overview of the large and varied world of RFID, Klaus Finkenzeller's volume is useful for end-users of the technology as well as practitioners in auto ID and IT designers of RFI products. Computer and electronics engineers in security system development, microchip designers, and materials handling specialists benefit from this book, as do automation, industrial and transport engineers. Clear and thorough explanations also make this an excellent introduction to the topic for graduate level students in electronics and industrial engineering design.

  • Smart Materials for Chipless RFID Sensors

    This chapter explores smart sensing materials for microwave sensing applications. It first discusses a comparative analysis of various nonconductive, semiconductive, and high conductive materials in the context of their microwave sensing properties. The chapter then reviews various smart materials for microwave sensing applications and explores their microwave characteristics in the influence of physical parameters such as temperature, humidity, pressure, strain, gas, pH, and light. These materials are investigated for microwave sensing materials in the chipless radio‐frequency identification (RFID) platform. A number of materials including polymer shows sensitivity to pH variation of product. A number of conducting polymers also show noticeable changes in conductivity with pH. Various materials such as glass microfiber‐reinforced polytetrafluoroethylene (PTFE) composite, polyester‐based stretchable fabric, Nickel‐Titanium (Nitinol) alloy can be used as strain and crack sensors for structural health monitoring. The stepped impedance resonator (SIR) was designed and fabricated for the light sensing experiments.

  • Limited Visionary: Career-Limiting Belief #9

    Engineers are trained to do a job, but some have shortsightedness when thinking about how their individual tasks contribute to the whole enterprise. This chapter discusses some of the actions that clearly represent limiting belief #9. Successful people understand that they must look beyond their immediate organization. They understand that they must help coordinate every part of the organization that they impact and touch. They also know that they do not work in isolation. Adding this Gem to the Map of the World shifts the focus of attention, positively. It is important to find the cause-and-effect relationships of manager's actions beyond the immediate areas of involvement. Managers cannot be everywhere and cannot know everything. They are dependent upon communication with a wide variety of sources in order to understand if those who report to them are completing their work as expected.

  • Chipless RFID Sensor for Real‐Time Environment Monitoring

    This chapter proposes a chipless radio‐frequency identification (RFID) sensor for environment monitoring. It integrates smart humidity sensing materials with radar cross‐section (RCS) scatterers to incorporate environment sensing in frequency spectral analysis. Chipless RFID sensor development is carried out into two phases. The aim of the first phase is to perform RF characterization of two humidity sensing polymers Kapton and polyvinyl alcohol (PVA) to compare their humidity sensitivity. In this phase, the chapter identifies a number of RF sensing parameters for calibrating humidity in real environments. In the second phase, a chipless RFID humidity sensor is developed based on RCS scatterer. Detailed experimentation is carried out to verify humidity sensor performance. The measured sensor response is analyzed to exploit calibration curve for unknown humidity measurement. Finally, the chapter discusses the effect of hysteresis, repeatability, and time response.

  • Biomaterials for Tissue Engineering

    Biomaterials are used to provide structural support during the tissue and organ fabrication process and are designed to simulate properties of the mammalian extracellular matrix. In this chapter, we provide a broad overview of biomaterials as they apply to tissue engineering. We provide a working definition of biomaterials and discuss biomaterial classification schemes and biomaterial platforms. During the course of this chapter, we also study biomaterial properties, including tensile properties, degradation kinetics, biocompatibility and biomimetic properties.



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