Conferences related to Plastics

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


2019 56th ACM/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM//IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 16th International Symposium on Biomedical Imaging (ISBI)

The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging.ISBI 2019 will be the 16th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2019 meeting will continue this tradition of fostering cross fertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2018 IEEE 15th International Symposium on Biomedical Imaging (ISBI 2018)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2018 will be the 15th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2018 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2017 IEEE 14th International Symposium on Biomedical Imaging (ISBI 2017)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2017 will be the 14th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2017 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2016 IEEE 13th International Symposium on Biomedical Imaging (ISBI 2016)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forumfor the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2016 willbe the thirteenth meeting in this series. The previous meetings have played a leading role in facilitatinginteraction between researchers in medical and biological imaging. The 2016 meeting will continue thistradition of fostering crossfertilization among different imaging communities and contributing to an integrativeapproach to biomedical imaging across all scales of observation.

  • 2015 IEEE 12th International Symposium on Biomedical Imaging (ISBI 2015)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2015 will be the 12th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2014 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2014 IEEE 11th International Symposium on Biomedical Imaging (ISBI 2014)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2014 will be the eleventh meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2014 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2013 IEEE 10th International Symposium on Biomedical Imaging (ISBI 2013)

    To serve the biological, biomedical, bioengineering, bioimaging and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2012 IEEE 9th International Symposium on Biomedical Imaging (ISBI 2012)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2011 IEEE 8th International Symposium on Biomedical Imaging (ISBI 2011)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2010 IEEE 7th International Symposium on Biomedical Imaging (ISBI 2010)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2009 IEEE 6th International Symposium on Biomedical Imaging (ISBI 2009)

    Algorithmic, mathematical and computational aspects of biomedical imaging, from nano- to macroscale. Topics of interest include image formation and reconstruction, computational and statistical image processing and analysis, dynamic imaging, visualization, image quality assessment, and physical, biological and statistical modeling. Molecular, cellular, anatomical and functional imaging modalities and applications.

  • 2008 IEEE 5th International Symposium on Biomedical Imaging (ISBI 2008)

    Algorithmic, mathematical and computational aspects of biomedical imaging, from nano- to macroscale. Topics of interest include image formation and reconstruction, computational and statistical image processing and analysis, dynamic imaging, visualization, image quality assessment, and physical, biological and statistical modeling. Molecular, cellular, anatomical and functional imaging modalities and applications.

  • 2007 IEEE 4th International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2007)

  • 2006 IEEE 3rd International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2006)

  • 2004 2nd IEEE International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2004)

  • 2002 1st IEEE International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2002)


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Periodicals related to Plastics

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


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Most published Xplore authors for Plastics

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Xplore Articles related to Plastics

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Industrial CFRP large part fabrication with the innovative hephaistos-CA2 microwave processing system

[{u'author_order': 1, u'authorUrl': u'https://ieeexplore.ieee.org/author/37426179300', u'full_name': u'L. Feher', u'id': 37426179300}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37275550000', u'full_name': u'M. Thumm', u'id': 37275550000}] The 33rd IEEE International Conference on Plasma Science, 2006. ICOPS 2006. IEEE Conference Record - Abstracts., 2006

Summary form only given. A novel industrial microwave system HEPHAISTOS-CA2 (high electromagnetic power heating automated injected structures oven system) for curing of carbon fibre reinforced plastics (CFRP) has been developed at Forschungszentrum Karlsruhe (FZK). The system is based on the HEPHAISTOS-CA1 prototype system at FZK which has been evaluated for the application in composite manufacturing together with EADS Corporate Research ...


History of the Rubber and Plastics Committee

[{u'author_order': 1, u'authorUrl': u'https://ieeexplore.ieee.org/author/38078654000', u'full_name': u'Newell A. Williams', u'id': 38078654000}] IEEE Transactions on Industry Applications, 1984

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Numerical simulation of glass fiber reinforced polymer chimney under seismic loads

[{u'author_order': 1, u'affiliation': u'School of Science, Wuhan University of Technology, No.122 Luoshi Rd. 430070, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37528387400', u'full_name': u'Wang Yingjun', u'id': 37528387400}, {u'author_order': 2, u'affiliation': u'School of Science, Wuhan University of Technology, No.122 Luoshi Rd. 430070, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37540569300', u'full_name': u'Zheng Zixiong', u'id': 37540569300}, {u'author_order': 3, u'affiliation': u'School of Science, Wuhan University of Technology, No.122 Luoshi Rd. 430070, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37540569800', u'full_name': u'Sun Minqing', u'id': 37540569800}, {u'author_order': 4, u'affiliation': u'School of Science, Wuhan University of Technology, No.122 Luoshi Rd. 430070, China', u'authorUrl': u'https://ieeexplore.ieee.org/author/37540576800', u'full_name': u'Zhu Sirong', u'id': 37540576800}] 2010 International Conference On Computer Design and Applications, 2010

Due to their high corrosion and chemical resistance, glass fiber reinforced plastic (GFRP) materials are increasingly being used in the construction of industrial chimneys. In this paper, the finite element model of a 60 m high GFRP chimney with the diameter of 3 m is established using finite element software ANSYS. The cylindric chimney, steel supporting frames and the two ...


Plastics in aircraft electricity

[{u'author_order': 1, u'affiliation': u'E. I. duPont de Nemours and Company, Arlington, N. J.', u'full_name': u'E. B. Cooper'}] Electrical Engineering, 1944

SYNTHETIC organic plastics for electrical insulation represent one of the important contributions of the plastics industry to modern military and commercial aircraft. These materials for the most part are not used as substitutes for more suitable but scarce insulating materials, but have been selected because they possess superior mechanical and electrical properties.


Modeling the Electrical Conduction Behavior of Polymers

[{u'author_order': 1, u'full_name': u'Thomas Mertens'}, {u'author_order': 2, u'full_name': u'Frank Jenau'}] 2011 46th International Universities' Power Engineering Conference (UPEC), 2011

For the design of electrical insulation systems the knowledge of the spatial field distribution is essential in order to avoid electrical overstress. Therefore, a simulation model is required taking into account the electron emission and charge transport processes. First, this paper discusses the physical processes of charge emission, transport and trapping. At the cathode- polymer interface the relevant emission mechanisms ...


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Educational Resources on Plastics

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eLearning

No eLearning Articles are currently tagged "Plastics"

IEEE-USA E-Books

  • OLED Materials

    OLED performance is largely dependent upon OLED materials. This chapter describes the classification of OLED materials and typical OLED materials.OLED materials are divided into two types – vacuum evaporation type and solution type – from a process point of view. Vacuum evaporation materials are usually small molecular materials, while solution type materials contain polymers, dendrimers, and small molecular materials. In addition, materials are also divided into fluorescent materials, phosphorescent materials, and thermally activated delayed fluorescent (TADF) materials in terms of emission mechanisms. From the function point of view, OLED materials can be classified as hole injection material, hole transport material, emission material, host material in emissive layer, electron transport material, electron injection material, charge blocking material, etc.Anode and cathode materials are also important, so this chapter also describes anode and cathode materials.In addition, this chapter describes molecular orientations of organic materials because this also influences OLED characteristics.

  • Limited Visionary: Career-Limiting Belief #9

    Engineers are trained to do a job, but some have shortsightedness when thinking about how their individual tasks contribute to the whole enterprise. This chapter discusses some of the actions that clearly represent limiting belief #9. Successful people understand that they must look beyond their immediate organization. They understand that they must help coordinate every part of the organization that they impact and touch. They also know that they do not work in isolation. Adding this Gem to the Map of the World shifts the focus of attention, positively. It is important to find the cause-and-effect relationships of manager's actions beyond the immediate areas of involvement. Managers cannot be everywhere and cannot know everything. They are dependent upon communication with a wide variety of sources in order to understand if those who report to them are completing their work as expected.

  • Subordinate Clauses Used as Qualifiers

    The subordinate clauses typically used as qualifiers in technical writing are of two types:_that_and_which_clauses and adverb clauses. This chapter begins by looking at_that_and_which_clauses because (1) they are ubiquitous in technical writing; (2) the rule for punctuating that and which clauses can serve as a model for the punctuation of all other qualifiers; and (3) most of the other qualifiers, both clauses and phrases, can be recast as that or which clauses._That_and_which_clauses were qualifiers that modify nouns, adverb clauses are qualifiers that may modify a verb, an adjective, another adverb, or perhaps the entire core of the sentence. Finally the chapter presents general rule for punctuating the subordinate clauses.

  • The Manufacture of Transponders and Contactless Smart Cards

    None

  • 2 Do You Need to Be Intelligent to Play Games?

    Shall we play a game? You choose: Chess, Super Mario Bros., or Angry Birds. I'm giving you a choice because I don't know whether you are familiar with all three of them. I talked about Chess in the previous chapter: the Western's world's arguably most famous board game, played by physically moving pieces such as pawns, kings, and queens on a board with alternating black and white squares. By moving these pieces so that they threaten and capture your opponent's pieces, you can ultimately win over your opponent by surrounding her king. It has changed little since it was invented millennia ago.

  • Design and Fabrication of Electrospun PVDF Piezo-Energy Harvesters

    Nanogenerators capable of converting energy from mechanical sources to electricity with high effective efficiency using low-cost, nonsemiconducting, organic nanomaterials are attractive for many applications, including energy harvesters. In this work, near-field electrospinning is used to direct-write poly(vinylidene fluoride) (PVDF) nanofibers with in situ mechanical stretch and electrical poling characteristics to produce piezoelectric properties. Under mechanical stretching, nanogenerators have shown repeatable and consistent electrical outputs with energy conversion efficiency an order of magnitude higher than those made of PVDF thin films. The early onset of the nonlinear domain wall motions behavior has been identified as one mechanism responsible for the apparent high piezoelectricity in nanofibers, rendering them potentially advantageous for sensing and actuation applications.

  • Chipless RFID Sensor for Real‐Time Environment Monitoring

    This chapter proposes a chipless radio‐frequency identification (RFID) sensor for environment monitoring. It integrates smart humidity sensing materials with radar cross‐section (RCS) scatterers to incorporate environment sensing in frequency spectral analysis. Chipless RFID sensor development is carried out into two phases. The aim of the first phase is to perform RF characterization of two humidity sensing polymers Kapton and polyvinyl alcohol (PVA) to compare their humidity sensitivity. In this phase, the chapter identifies a number of RF sensing parameters for calibrating humidity in real environments. In the second phase, a chipless RFID humidity sensor is developed based on RCS scatterer. Detailed experimentation is carried out to verify humidity sensor performance. The measured sensor response is analyzed to exploit calibration curve for unknown humidity measurement. Finally, the chapter discusses the effect of hysteresis, repeatability, and time response.

  • Example Applications

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  • Self-Organization

    This chapter presents the principles of Self-Organization, and focuses on Adaptive Resonance Theory (ART) and Self-Organizing Map (SOM) neural networks. It investigates the theoretic basis of formulations of these neural networks, and illustrates a few examples. The structures of these networks and their learning algorithms are also thoroughly explored in the chapter. The ART architecture is a specifically designed neural network to overcome the stability-plasticity dilemma. It is described using nonlinear differential equations. In addition to ART and SOM, there are two other fixed approaches that could be considered fundamental, namely, Neural Gas and the Hierarchical Feature Map. While both are strongly related to the SOM in terms of the learning mechanism, they each have spawned a range of newer architectures are introduced in the chapter. The chapter explains other popular architectures to have emerged based on similar principles of Self-Organization, drawing a distinction between static and dynamic architectures.

  • Smart Materials for Chipless RFID Sensors

    This chapter explores smart sensing materials for microwave sensing applications. It first discusses a comparative analysis of various nonconductive, semiconductive, and high conductive materials in the context of their microwave sensing properties. The chapter then reviews various smart materials for microwave sensing applications and explores their microwave characteristics in the influence of physical parameters such as temperature, humidity, pressure, strain, gas, pH, and light. These materials are investigated for microwave sensing materials in the chipless radio‐frequency identification (RFID) platform. A number of materials including polymer shows sensitivity to pH variation of product. A number of conducting polymers also show noticeable changes in conductivity with pH. Various materials such as glass microfiber‐reinforced polytetrafluoroethylene (PTFE) composite, polyester‐based stretchable fabric, Nickel‐Titanium (Nitinol) alloy can be used as strain and crack sensors for structural health monitoring. The stepped impedance resonator (SIR) was designed and fabricated for the light sensing experiments.



Standards related to Plastics

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No standards are currently tagged "Plastics"