Conferences related to Plastics

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 16th International Symposium on Biomedical Imaging (ISBI)

The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging.ISBI 2019 will be the 16th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2019 meeting will continue this tradition of fostering cross fertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.


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Periodicals related to Plastics

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


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Most published Xplore authors for Plastics

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Xplore Articles related to Plastics

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Industrial CFRP large part fabrication with the innovative hephaistos-CA2 microwave processing system

The 33rd IEEE International Conference on Plasma Science, 2006. ICOPS 2006. IEEE Conference Record - Abstracts., 2006

Summary form only given. A novel industrial microwave system HEPHAISTOS-CA2 (high electromagnetic power heating automated injected structures oven system) for curing of carbon fibre reinforced plastics (CFRP) has been developed at Forschungszentrum Karlsruhe (FZK). The system is based on the HEPHAISTOS-CA1 prototype system at FZK which has been evaluated for the application in composite manufacturing together with EADS Corporate Research ...


History of the Rubber and Plastics Committee

IEEE Transactions on Industry Applications, 1984

None


Numerical simulation of glass fiber reinforced polymer chimney under seismic loads

2010 International Conference On Computer Design and Applications, 2010

Due to their high corrosion and chemical resistance, glass fiber reinforced plastic (GFRP) materials are increasingly being used in the construction of industrial chimneys. In this paper, the finite element model of a 60 m high GFRP chimney with the diameter of 3 m is established using finite element software ANSYS. The cylindric chimney, steel supporting frames and the two ...


Plastics in aircraft electricity

Electrical Engineering, 1944

SYNTHETIC organic plastics for electrical insulation represent one of the important contributions of the plastics industry to modern military and commercial aircraft. These materials for the most part are not used as substitutes for more suitable but scarce insulating materials, but have been selected because they possess superior mechanical and electrical properties.


Modeling the Electrical Conduction Behavior of Polymers

2011 46th International Universities' Power Engineering Conference (UPEC), 2011

For the design of electrical insulation systems the knowledge of the spatial field distribution is essential in order to avoid electrical overstress. Therefore, a simulation model is required taking into account the electron emission and charge transport processes. First, this paper discusses the physical processes of charge emission, transport and trapping. At the cathode- polymer interface the relevant emission mechanisms ...


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Educational Resources on Plastics

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IEEE-USA E-Books

  • Industrial CFRP large part fabrication with the innovative hephaistos-CA2 microwave processing system

    Summary form only given. A novel industrial microwave system HEPHAISTOS-CA2 (high electromagnetic power heating automated injected structures oven system) for curing of carbon fibre reinforced plastics (CFRP) has been developed at Forschungszentrum Karlsruhe (FZK). The system is based on the HEPHAISTOS-CA1 prototype system at FZK which has been evaluated for the application in composite manufacturing together with EADS Corporate Research Centre and the Institute of Aircraft Design (University of Stuttgart). The system, which has been taken successfully in operation at the end of 2005 integrates advantageously the basic processing steps such as tooling, tempering of the resin and lay up, the impregnation of the fibres, pre-forming techniques as well as finally the process curing of the composite structures. The growth of composites applications is especially based in part on the greater design space provided by the anisotropic nature of fibre-reinforced laminates. In the same way the design degrees of freedom can be further expanded by the application of nano-particle modifications. It is a basic research field, to understand the structural enhancements obtained using the HEPHAISTOS-CA2 system and to optimize selectively these properties by specific nanomodifiers. Blending of nano-additives to get an optimized suite of properties can be applied to thermoplastics, thermosets, adhesives, elastomers, fibre precursors, sealants, coatings, foam, etc. to achieve new designable properties. The challenge in the next years will be the combination of novel industrial microwave processing technology with nano-scaled modifiers. Basic challenges such as functionalization and dispersion of nano particles have to be solved as well as the production insertion of nano-enhanced composite materials which will involve focused use of technology, high quality, speed, lower costs, and innovative business development for both the industry and the customers. The addition of very small amounts of nano-particles can have a significant effect on the material properties (e.g. ferrites, carbon-nanotubes (CNT), coated graphite etc.) and will enhance the material quality of large parts for aeronautical industries

  • History of the Rubber and Plastics Committee

    None

  • Numerical simulation of glass fiber reinforced polymer chimney under seismic loads

    Due to their high corrosion and chemical resistance, glass fiber reinforced plastic (GFRP) materials are increasingly being used in the construction of industrial chimneys. In this paper, the finite element model of a 60 m high GFRP chimney with the diameter of 3 m is established using finite element software ANSYS. The cylindric chimney, steel supporting frames and the two anchor cables are meshed using laminated composite shell element, beam element and link element, respectively. Since the seismic loads are major factors for the design of the chimney, so this study involves numerical simulation of the strength of the GFRP chimney suffering from the seismic loads in accordance with the response spectrum theory. The results show that the first-order natural frequency of the GFRP chimney is 3.62 Hz. The maximum axial stress of vertical segment of the GFRP chimney is 32.8 MPa which is less than 120 MPa that is the design strength of GFRP, indicating that the chimney is safe.

  • Plastics in aircraft electricity

    SYNTHETIC organic plastics for electrical insulation represent one of the important contributions of the plastics industry to modern military and commercial aircraft. These materials for the most part are not used as substitutes for more suitable but scarce insulating materials, but have been selected because they possess superior mechanical and electrical properties.

  • Modeling the Electrical Conduction Behavior of Polymers

    For the design of electrical insulation systems the knowledge of the spatial field distribution is essential in order to avoid electrical overstress. Therefore, a simulation model is required taking into account the electron emission and charge transport processes. First, this paper discusses the physical processes of charge emission, transport and trapping. At the cathode- polymer interface the relevant emission mechanisms are the field-relieved thermal Richardson-Schottky emission and the field emission by Fowler- Nordheim. The transport model is based on the continuity equation enhanced by activation processes. According to these mechanisms a physically motivated model is developed and an appropriate computation algorithm is implemented. By the use of the algorithm the time-dependent conduction behavior of polymers is simulated. Measurements of the electrical conduction behavior confirm the characteristic simulation results. Furthermore, the space charge distribution inside the insulation system is analyzed. The analysis elaborates the time dependent space charge distribution as well as the electric field and current density distribution. The major goal of the developed model and algorithm is the simulation of the electric field and space charge distribution aiming at a deeper understanding for the resulting conduction behavior of polymers in order to optimize the design process in an early stage.

  • Device Database Systems

    None

  • A service system design in plastic industry Guangdong Plastics Exchange's e-commerce service

    In this paper, we introduce the Guangdong Plastics Exchange's e-commerce application. The GDPE' e-commerce services include the B2B electronic transaction service, the Internet-based customer service, the logistics service, the goods charge financial service and the information service. The GDPE's innovation transaction model includes the trading method, the trading time, and the varieties of the transactions, the transaction settlement, the trading rules and the process of entering the GDPE's electronic market. We also give an example of transaction. Some functions of the logistics center are presented. At last, the GDPE's future view of e-commerce is introduced.

  • Experiences With Computer Graphics In The United Kingdom In The 1970's

    None

  • OLED Materials

    OLED performance is largely dependent upon OLED materials. This chapter describes the classification of OLED materials and typical OLED materials.OLED materials are divided into two types – vacuum evaporation type and solution type – from a process point of view. Vacuum evaporation materials are usually small molecular materials, while solution type materials contain polymers, dendrimers, and small molecular materials. In addition, materials are also divided into fluorescent materials, phosphorescent materials, and thermally activated delayed fluorescent (TADF) materials in terms of emission mechanisms. From the function point of view, OLED materials can be classified as hole injection material, hole transport material, emission material, host material in emissive layer, electron transport material, electron injection material, charge blocking material, etc.Anode and cathode materials are also important, so this chapter also describes anode and cathode materials.In addition, this chapter describes molecular orientations of organic materials because this also influences OLED characteristics.

  • The Atlas Computer Laboratory

    The paper discusses the Atlas Computer Laboratory. The Laboratory was, and in many ways still is, one of the major computer laboratories in the world. It was established to provide a service to British scientists at a time when powerful computers were not usually available. It provided both a service and a training ground for many of today's leaders in the computer field.



Standards related to Plastics

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No standards are currently tagged "Plastics"