Conferences related to Finite Element Analysis

Back to Top

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)

  • 2005 IEEE 55th Electronic Components and Technology Conference (ECTC 2005)


2017 IEEE Power & Energy Society General Meeting

The annual IEEE Power & Energy Society General Meeting will bring together over 2000 attendees for technical sessions, student program, awards ceremony, committee meetings, and tutorials.

  • 2015 IEEE Power & Energy Society General Meeting

    The annual IEEE PES General Meeting will bring together over 2500 attendees for technical sessions, administrative sessions, super sessions, poster sessions, student programs, awards ceremonies, committee meetings, tutorials and more PLEASE NOTE: Abstracts are not accepted for the 2015 IEEE PES General Meeting, full papers only can be submitted to the submission site 24 October 2014 through 21 November 2014.  The site will be available from the PES home page www.ieee-pes.org

  • 2014 IEEE Power & Energy Society General Meeting

    The annual IEEE PES General Meeting will bring together over 2500 attendees for technical sessions, administrative sessions, super sessions, poster sessions, student programs, awards ceremonies, committee meetings, tutotials and more

  • 2013 IEEE Power & Energy Society General Meeting

    The annual IEEE Power & Energy Society General Meeting will bring together over 2000 attendees for technical sessions, student program, awards ceremony, committee meetings, and tutorials.

  • 2012 IEEE Power & Energy Society General Meeting

    The annual IEEE Power & Energy Society General Meeting will bring together over 2000 attendees for technical sessions, student program, awards ceremony, committee meetings, and tutorials.

  • 2011 IEEE Power & Energy Society General Meeting

    IEEE Power & Energy Annual Meeting --Papers --Awards --Plenary --Committee Meetings --Governing Board --Receptions --Tech tours --Tutorials --Companions Program

  • 2010 IEEE Power & Energy Society General Meeting

    IEEE Power & Energy Society Annual Meeting --Technical Sessions --Committee Meetings --Plenary Session --Gove Board Meeting --Awards Banquet --Tutorials --Student Activities --Social Events --Companions Program

  • 2009 IEEE Power & Energy Society General Meeting

    Paper and Panel sessions involving topics of interest to electric power engineers, technical committee meetings, administrative committee meetings, awards luncheon and plenary session.

  • 2008 IEEE Power & Energy Society General Meeting

    This meeting has paper and panel sessions on all areas of interest to electric power engineers.

  • 2007 IEEE Power Engineering Society General Meeting

  • 2006 IEEE Power Engineering Society General Meeting


2016 IEEE International Ultrasonics Symposium (IUS)

International Symposium dealing with recent developments on ultrasound, including ultrasound imaging, transducers, non destructuve testing and physical acoustics.

  • 2015 IEEE International Ultrasonics Symposium (IUS)

    Annual meeting of the UFFC Society that is being held regularly. It is focusing on ultrasonics.

  • 2013 IEEE International Ultrasonics Symposium (IUS)

    the joint IUS, ISAF, IFC, and EFTF conference is aimed at bringing the ultrasonics, ferroelectrics, Frequency Control and Time Forum communities around the world together more closely and through discussions on recent research and development of fundamentals, materials, devices, and applications .

  • 2012 IEEE International Ultrasonics Symposium

    The conference will bring together the community of ultrasonics around the world in the center of Europe for discussion and cooperation and to stimulate the research and development in the widespread field of ultrasonic theories and applications

  • 2011 IEEE International Ultrasonics Symposium (IUS)

    The Symposium is aimed at bringing the ultrasonics communities around the world together more closely and through discussions on recent research and development of ultrasonics theories and applications.

  • 2010 IEEE Ultrasonics Symposium (IUS)

    The conference will cover all high frequency Ultrasound application including medical.

  • 2009 IEEE International Ultrasonics Symposium

    Conference includes short courses on topics of current interest in ultrasonics. The next three days will include parallel oral and poster sessions covering 1) Medical Ultrasonics, 2) Sensors, NDE & Industrial Applications, 3) Physical Acoustics, 4) Microacoustics SAW, FBAR, MEMS, and 5) Transducers & Transducer Materials.


2015 IEEE International Conference on Plasma Sciences (ICOPS)

Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.

  • 2012 IEEE 39th International Conference on Plasma Sciences (ICOPS)

    Fully and partially ionized plasmas, microwave-plasma interaction, charged particle beams and sources; high energy density plasmas and applications, industrial and medical applications of plasmas; plasma diagnostics; pulsed power and other plasma applictions

  • 2011 IEEE 38th International Conference on Plasma Sciences (ICOPS)

    The ICOPS is the state of the art plasma science conference that covers all aspects of the general plasma science and its applications in various research fields.

  • 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)

  • 2009 IEEE 36th International Conference on Plasma Sciences (ICOPS)

    The conference features an exciting technical program with reports from around the globe about new and innovative developments in the field of pulsed power, plasma science and engineering. Leading researchers gather to explore pulsed power plasmas, basic plasma physics, high-energy-density-plasmas, inertial confinement fusion, magnetic fusion, plasma diagnostics, microwave generation, lighting, micro and nano applications of plasmas, medical applications and plasma processing.

  • 2008 IEEE 35th International Conference on Plasma Sciences (ICOPS)

    The 35th IEEE International Conference on Plasma Science will feature an exciting technical program with reports from around the globe about new and innovative developments in the field of plasma science and engineering: 1. Basic processes in fully and partially ionized plasmas 2. Microwave generation and plasma interactions 3. Charged particle beams and sources 4. High energy density plasmas applications 5. Industrial, commercial and medical plasma applications 6. Plasma diagnostics 7. Pulsed power


2013 IEEE International Symposium on Robot and Human Interactive Communication (RO-MAN)

IEEE RO-MAN 2013 will focus on the up-to-date theories technologies and studies for HRI and the related issues such as artificial intelligence/emotion, human factors, social relationship, haptic interaction, application and evaluations, etc. Especially, Art & Technology issue is newly generated this year asrobotics tends to fuse with art. We truly welcome your papers on all aspects of human-robot interactive communication, and expect your great interest and participation.


More Conferences

Periodicals related to Finite Element Analysis

Back to Top

Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Industry Applications, IEEE Transactions on

The development and application of electric systems, apparatus, devices, and controls to the processes and equipment of industry and commerce; the promotion of safe, reliable, and economic installations; the encouragement of energy conservation; the creation of voluntary engineering standards and recommended practices.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.


More Periodicals

Most published Xplore authors for Finite Element Analysis

Back to Top

Xplore Articles related to Finite Element Analysis

Back to Top

Calculation of stray magnetic field effects on the operation of the ITER electron cyclotron system

F. Li; S. Alberti; J. -Ph. Hogge; I. Gr. Pagonakis 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

In a multi-gyrotron system such as the one presently designed for the ITER ECH & ECCD system, stray magnetic fields can significantly alter the operational capabilities of the global system. A numerical study was carried out within the European Gyrotron Consortium (EGYC) to assess the importance of the different effects and their impact on the gyrotron operation. Using the Ariadne++ ...


A Multi-Solver Scheme Based on Combined Field Integral Equations for Electromagnetic Modeling of Highly Complex Objects

Jian Guan; Su Yan; Jian-Ming Jin IEEE Transactions on Antennas and Propagation, 2017

A combined field integral equation (CFIE)-based multisolver scheme is presented for electromagnetic modeling of objects with complex structures and materials. In this scheme, an object is decomposed into multiple bodies based on its material property and geometry. To model bodies with complicated materials, the finite element-boundary integral (FE-BI) method is applied. To model bodies with homogeneous or conducting materials, the ...


Characterization of magnetic levitation of high Tc superconductor by energy conversion between electromagnetic and mechanical energy

M. Yoshishige; M. Kyousuke Electrical Machines and Systems, 2001. ICEMS 2001. Proceedings of the Fifth International Conference on, 2001

The levitation of bulk high Tc superconductor (HTSC) has been, hitherto, analyzed as a distributed system by computer using the finite element method. The essence of the levitation is, however, the energy conversion between the mechanical energy to move the HTSC, which is converted to magnetic field energy due to the circulating current in the HTSC. To clarify this idea, ...


Torque optimization analysis with magnetic saturation models for induction machines

Dewei Xu; Dongqi Zhu; Xinjian Jiang Proceedings IPEMC 2000. Third International Power Electronics and Motion Control Conference (IEEE Cat. No.00EX435), 2000

A new model based on MT synchronous rotating frame of induction machines with magnetic saturation is developed. In this model, it is assumed that the saturated area mainly on the M-axis and the undersaturated magnetic path is kept when stator and rotor currents make balanced MMF. This assumption is proved by finite element analysis (FEA). The result is the suitable ...


PART: a partitioning tool for efficient use of distributed systems

J. Chen; V. E. Taylor Proceedings IEEE International Conference on Application-Specific Systems, Architectures and Processors, 1997

The interconnection of geographically distributed supercomputers via high- speed networks allows users to access the needed compute power for large- scale, complex applications. For efficient use of such systems, the variance in processor performance and network (i.e., interconnection network versus wide area network) performance must be considered. In this paper, we present a decomposition tool, called PART, for distributed systems. ...


More Xplore Articles

Educational Resources on Finite Element Analysis

Back to Top

eLearning

Calculation of stray magnetic field effects on the operation of the ITER electron cyclotron system

F. Li; S. Alberti; J. -Ph. Hogge; I. Gr. Pagonakis 2011 IEEE/NPSS 24th Symposium on Fusion Engineering, 2011

In a multi-gyrotron system such as the one presently designed for the ITER ECH & ECCD system, stray magnetic fields can significantly alter the operational capabilities of the global system. A numerical study was carried out within the European Gyrotron Consortium (EGYC) to assess the importance of the different effects and their impact on the gyrotron operation. Using the Ariadne++ ...


A Multi-Solver Scheme Based on Combined Field Integral Equations for Electromagnetic Modeling of Highly Complex Objects

Jian Guan; Su Yan; Jian-Ming Jin IEEE Transactions on Antennas and Propagation, 2017

A combined field integral equation (CFIE)-based multisolver scheme is presented for electromagnetic modeling of objects with complex structures and materials. In this scheme, an object is decomposed into multiple bodies based on its material property and geometry. To model bodies with complicated materials, the finite element-boundary integral (FE-BI) method is applied. To model bodies with homogeneous or conducting materials, the ...


Characterization of magnetic levitation of high Tc superconductor by energy conversion between electromagnetic and mechanical energy

M. Yoshishige; M. Kyousuke Electrical Machines and Systems, 2001. ICEMS 2001. Proceedings of the Fifth International Conference on, 2001

The levitation of bulk high Tc superconductor (HTSC) has been, hitherto, analyzed as a distributed system by computer using the finite element method. The essence of the levitation is, however, the energy conversion between the mechanical energy to move the HTSC, which is converted to magnetic field energy due to the circulating current in the HTSC. To clarify this idea, ...


Torque optimization analysis with magnetic saturation models for induction machines

Dewei Xu; Dongqi Zhu; Xinjian Jiang Proceedings IPEMC 2000. Third International Power Electronics and Motion Control Conference (IEEE Cat. No.00EX435), 2000

A new model based on MT synchronous rotating frame of induction machines with magnetic saturation is developed. In this model, it is assumed that the saturated area mainly on the M-axis and the undersaturated magnetic path is kept when stator and rotor currents make balanced MMF. This assumption is proved by finite element analysis (FEA). The result is the suitable ...


PART: a partitioning tool for efficient use of distributed systems

J. Chen; V. E. Taylor Proceedings IEEE International Conference on Application-Specific Systems, Architectures and Processors, 1997

The interconnection of geographically distributed supercomputers via high- speed networks allows users to access the needed compute power for large- scale, complex applications. For efficient use of such systems, the variance in processor performance and network (i.e., interconnection network versus wide area network) performance must be considered. In this paper, we present a decomposition tool, called PART, for distributed systems. ...


More eLearning Resources

IEEE-USA E-Books

  • Axisymmetric Antenna Modeling

    This chapter contains sections titled: Method of Analysis Application Examples Summary References

  • Infinite PhasedArray Modeling

    This chapter contains sections titled: Frequency-Domain Modeling Time-Domain Modeling Approximation to Finite Arrays Summary References

  • Finite PhasedArray Modeling

    This chapter contains sections titled: Frequency-Domain Modeling Time-Domain Modeling Summary References

  • Finite Element Analysis of Grid-Connected IG with the Steinmetz Connection

    This chapter contains sections titled: Introduction Steinmetz Connection and Symmetrical Components Analysis Machine Model Finite Element Analysis Computational Aspects Case Study Summary References

  • AntennaPlatform Interaction Modeling

    This chapter contains sections titled: Coupled Analysis Decoupled Analysis Summary References

  • Antenna Source Modeling and Parameter Calculation

    This chapter contains sections titled: Antenna Feed Modeling Plane-Wave Excitation Far-Field Pattern Computation Near-Field Visualization Summary References

  • Numerical and Practical Considerations

    This chapter contains sections titled: Choice of Simulation Technologies Frequency- Versus Time-Domain Simulation Tools Fast Frequency Sweep Numerical Convergence Domain Decomposition and Parallel Computing Verification and Validation of Predictions Summary References

  • Frontmatter

    The prelims comprise: Half Title Title Copyright Contents Preface

  • No title

    In teaching an introduction to the finite element method at the undergraduate level, a prudent mix of theory and applications is often sought. In many cases, analysts use the finite element method to perform parametric studies on potential designs to size parts, weed out less desirable design scenarios, and predict system behavior under load. In this book, we discuss common pitfalls encountered by many finite element analysts, in particular, students encountering the method for the first time. We present a variety of simple problems in axial, bending, torsion, and shear loading that combine the students' knowledge of theoretical mechanics, numerical methods, and approximations particular to the finite element method itself. We also present case studies in which analyses are coupled with experiments to emphasize validation, illustrate where interpretations of numerical results can be misleading, and what can be done to allay such tendencies. Challenges in presenting the necessary mix f theory and applications in a typical undergraduate course are discussed. We also discuss a list of tips and rules of thumb for applying the method in practice. Table of Contents: Preface / Acknowledgments / Guilty Until Proven Innocent / Let's Get Started / Where We Begin to Go Wrong / It's Only a Model / Wisdom Is Doing It / Summary / Afterword / Bibliography / Authors' Biographies

  • Modeling of Complex Structures

    This chapter contains sections titled: Thin-Material Layers and Sheets Thin Wires and Slots Lumped-Circuit Elements Distributed Feed Network System-Level Coupling Example Summary References



Standards related to Finite Element Analysis

Back to Top

No standards are currently tagged "Finite Element Analysis"


Jobs related to Finite Element Analysis

Back to Top