Conferences related to Finite Element Analysis

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.

  • 2008 IEEE 58th Electronic Components and Technology Conference (ECTC 2008)

  • 2007 IEEE 57th Electronic Components and Technology Conference (ECTC 2007)

  • 2006 IEEE 56th Electronic Components and Technology Conference (ECTC 2006)

  • 2005 IEEE 55th Electronic Components and Technology Conference (ECTC 2005)


2017 IEEE Power & Energy Society General Meeting

The annual IEEE Power & Energy Society General Meeting will bring together over 2000 attendees for technical sessions, student program, awards ceremony, committee meetings, and tutorials.


2016 IEEE International Ultrasonics Symposium (IUS)

International Symposium dealing with recent developments on ultrasound, including ultrasound imaging, transducers, non destructuve testing and physical acoustics.

  • 2015 IEEE International Ultrasonics Symposium (IUS)

    Annual meeting of the UFFC Society that is being held regularly. It is focusing on ultrasonics.

  • 2013 IEEE International Ultrasonics Symposium (IUS)

    the joint IUS, ISAF, IFC, and EFTF conference is aimed at bringing the ultrasonics, ferroelectrics, Frequency Control and Time Forum communities around the world together more closely and through discussions on recent research and development of fundamentals, materials, devices, and applications .

  • 2012 IEEE International Ultrasonics Symposium

    The conference will bring together the community of ultrasonics around the world in the center of Europe for discussion and cooperation and to stimulate the research and development in the widespread field of ultrasonic theories and applications

  • 2011 IEEE International Ultrasonics Symposium (IUS)

    The Symposium is aimed at bringing the ultrasonics communities around the world together more closely and through discussions on recent research and development of ultrasonics theories and applications.

  • 2010 IEEE Ultrasonics Symposium (IUS)

    The conference will cover all high frequency Ultrasound application including medical.

  • 2009 IEEE International Ultrasonics Symposium

    Conference includes short courses on topics of current interest in ultrasonics. The next three days will include parallel oral and poster sessions covering 1) Medical Ultrasonics, 2) Sensors, NDE & Industrial Applications, 3) Physical Acoustics, 4) Microacoustics SAW, FBAR, MEMS, and 5) Transducers & Transducer Materials.


2015 IEEE International Conference on Plasma Sciences (ICOPS)

Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.

  • 2012 IEEE 39th International Conference on Plasma Sciences (ICOPS)

    Fully and partially ionized plasmas, microwave-plasma interaction, charged particle beams and sources; high energy density plasmas and applications, industrial and medical applications of plasmas; plasma diagnostics; pulsed power and other plasma applictions

  • 2011 IEEE 38th International Conference on Plasma Sciences (ICOPS)

    The ICOPS is the state of the art plasma science conference that covers all aspects of the general plasma science and its applications in various research fields.

  • 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS)

  • 2009 IEEE 36th International Conference on Plasma Sciences (ICOPS)

    The conference features an exciting technical program with reports from around the globe about new and innovative developments in the field of pulsed power, plasma science and engineering. Leading researchers gather to explore pulsed power plasmas, basic plasma physics, high-energy-density-plasmas, inertial confinement fusion, magnetic fusion, plasma diagnostics, microwave generation, lighting, micro and nano applications of plasmas, medical applications and plasma processing.

  • 2008 IEEE 35th International Conference on Plasma Sciences (ICOPS)

    The 35th IEEE International Conference on Plasma Science will feature an exciting technical program with reports from around the globe about new and innovative developments in the field of plasma science and engineering: 1. Basic processes in fully and partially ionized plasmas 2. Microwave generation and plasma interactions 3. Charged particle beams and sources 4. High energy density plasmas applications 5. Industrial, commercial and medical plasma applications 6. Plasma diagnostics 7. Pulsed power


2013 IEEE International Symposium on Robot and Human Interactive Communication (RO-MAN)

IEEE RO-MAN 2013 will focus on the up-to-date theories technologies and studies for HRI and the related issues such as artificial intelligence/emotion, human factors, social relationship, haptic interaction, application and evaluations, etc. Especially, Art & Technology issue is newly generated this year asrobotics tends to fuse with art. We truly welcome your papers on all aspects of human-robot interactive communication, and expect your great interest and participation.


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Periodicals related to Finite Element Analysis

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Industry Applications, IEEE Transactions on

The development and application of electric systems, apparatus, devices, and controls to the processes and equipment of industry and commerce; the promotion of safe, reliable, and economic installations; the encouragement of energy conservation; the creation of voluntary engineering standards and recommended practices.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.


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Most published Xplore authors for Finite Element Analysis

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Xplore Articles related to Finite Element Analysis

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Design and analysis of an outer-rotor parallel-hybrid-excited vernier machine

Wenlong Li; T. W. Ching; K. T. Chau Chinese Journal of Electrical Engineering, 2017

In this paper, an outer-rotor parallel-hybrid-excited vernier machine is proposed. In order to realize the parallel hybrid excitation, the homopolar configuration is adopted to artfully combine the permanent magnet (PM) flux path and the electromagnet flux path together. Firstly, the structure of the proposed machine is presented. Secondly, its operating principle is studied and discussed. Thirdly, its performance for flux ...


Comparison of flux-switching machines with and without permanent magnets

Christopher H. T. Lee; K. T. Chau; C. C. Chan Chinese Journal of Electrical Engineering, 2015

In this paper, three advanced flux-switching (FS) machines, namely the radial- field flux-switching permanent-magnet (RF-FSPM) machine, the radial-field flux-switching DC-field (RF-FSDC) machine, and the axial-field FSDC (AF-FSDC) machine are quantitatively compared. Upon the installation of the high-energy- density PM materials, the RF-FSPM machine can definitely provide the superior torque performances as compared to its magnetless counterparts. However, the PM machines ...


A new model for the determination of copper losses in transformer windings with arbitrary conductor distribution under high frequency sinusoidal excitation

G. S. Dimitrakakis; E. C. Tatakis; E. J. Rikos 2007 European Conference on Power Electronics and Applications, 2007

Magnetic components (inductors and transformers), when present in power electronics converters, consist undoubtedly, along with the semiconductor switches, the main power loss contribution. This fact emerges the necessity of having some easily applicable tools for their effective resistance accurate calculation. The up to now widely used relative theoretical or empirical formulas have been extracted under assumptions or experimental conditions that ...


A comparison of adaptive strategies for mesh refinement based on `a posteriori' local error estimation procedures

P. Fernandes; P. Girdinio; P. Molfino; G. Molinari; M. Repetto IEEE Transactions on Magnetics, 1990

A comparative evaluation of the performance of adaptive meshing algorithms with different error estimators is presented. The algorithms are oriented toward electric and magnetic analysis applications. The performance of a selected set of algorithms that are based on an element-by-element h-refinement technique is assessed in some test cases in comparison with analytical results, in a uniform environment. Finally, the features ...


Cogging Torque Analysis of Magnetic Gear

Noboru Niguchi; Katsuhiro Hirata IEEE Transactions on Industrial Electronics, 2012

This paper describes the harmonic spectra of the cogging torque of a magnetic gear. The operating principle of this gear is described, and the transmission torque under operation in accordance with the gear ratio is mathematically formulated. In particular, the harmonic order of the cogging torque is described in detail. Moreover, the orders of the cogging torque of both rotors ...


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Educational Resources on Finite Element Analysis

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eLearning

Design and analysis of an outer-rotor parallel-hybrid-excited vernier machine

Wenlong Li; T. W. Ching; K. T. Chau Chinese Journal of Electrical Engineering, 2017

In this paper, an outer-rotor parallel-hybrid-excited vernier machine is proposed. In order to realize the parallel hybrid excitation, the homopolar configuration is adopted to artfully combine the permanent magnet (PM) flux path and the electromagnet flux path together. Firstly, the structure of the proposed machine is presented. Secondly, its operating principle is studied and discussed. Thirdly, its performance for flux ...


Comparison of flux-switching machines with and without permanent magnets

Christopher H. T. Lee; K. T. Chau; C. C. Chan Chinese Journal of Electrical Engineering, 2015

In this paper, three advanced flux-switching (FS) machines, namely the radial- field flux-switching permanent-magnet (RF-FSPM) machine, the radial-field flux-switching DC-field (RF-FSDC) machine, and the axial-field FSDC (AF-FSDC) machine are quantitatively compared. Upon the installation of the high-energy- density PM materials, the RF-FSPM machine can definitely provide the superior torque performances as compared to its magnetless counterparts. However, the PM machines ...


A new model for the determination of copper losses in transformer windings with arbitrary conductor distribution under high frequency sinusoidal excitation

G. S. Dimitrakakis; E. C. Tatakis; E. J. Rikos 2007 European Conference on Power Electronics and Applications, 2007

Magnetic components (inductors and transformers), when present in power electronics converters, consist undoubtedly, along with the semiconductor switches, the main power loss contribution. This fact emerges the necessity of having some easily applicable tools for their effective resistance accurate calculation. The up to now widely used relative theoretical or empirical formulas have been extracted under assumptions or experimental conditions that ...


A comparison of adaptive strategies for mesh refinement based on `a posteriori' local error estimation procedures

P. Fernandes; P. Girdinio; P. Molfino; G. Molinari; M. Repetto IEEE Transactions on Magnetics, 1990

A comparative evaluation of the performance of adaptive meshing algorithms with different error estimators is presented. The algorithms are oriented toward electric and magnetic analysis applications. The performance of a selected set of algorithms that are based on an element-by-element h-refinement technique is assessed in some test cases in comparison with analytical results, in a uniform environment. Finally, the features ...


Cogging Torque Analysis of Magnetic Gear

Noboru Niguchi; Katsuhiro Hirata IEEE Transactions on Industrial Electronics, 2012

This paper describes the harmonic spectra of the cogging torque of a magnetic gear. The operating principle of this gear is described, and the transmission torque under operation in accordance with the gear ratio is mathematically formulated. In particular, the harmonic order of the cogging torque is described in detail. Moreover, the orders of the cogging torque of both rotors ...


More eLearning Resources

IEEE-USA E-Books

  • Finite-Element Method

    Due to the limitations of the reluctance method, engineers have long sought more accurate ways to calculate magnetic fields. This chapter is devoted to the finite-element method, the most general and accurate method for calculation of magnetic fields. The finite-element method can be derived using the basic principle of conservation of energy. The Law of Energy Conservation requires the functional to be zero. Besides the energy functional, the second main requirement of finite-element analysis is to discretize (break up) the volume analyzed into small pieces called finite elements. The most basic finite element is the triangle. Making a finite-element model consists of four steps; the four steps are often called preprocessing, because they must be accomplished in order for the matrix equation to be set up and solved for the magnetic vector potential distribution throughout an analyzed device.

  • The Finite Element Method

    This chapter contains sections titled: Introduction to the Finite Element Method Finite Element Analysis of Scalar Fields Finite Element Analysis of Vector Fields Finite Element Analysis in the Time Domain Absorbing Boundary Conditions Some Numerical Aspects Summary References Problems

  • No title

    In teaching an introduction to the finite element method at the undergraduate level, a prudent mix of theory and applications is often sought. In many cases, analysts use the finite element method to perform parametric studies on potential designs to size parts, weed out less desirable design scenarios, and predict system behavior under load. In this book, we discuss common pitfalls encountered by many finite element analysts, in particular, students encountering the method for the first time. We present a variety of simple problems in axial, bending, torsion, and shear loading that combine the students' knowledge of theoretical mechanics, numerical methods, and approximations particular to the finite element method itself. We also present case studies in which analyses are coupled with experiments to emphasize validation, illustrate where interpretations of numerical results can be misleading, and what can be done to allay such tendencies. Challenges in presenting the necessary mix f theory and applications in a typical undergraduate course are discussed. We also discuss a list of tips and rules of thumb for applying the method in practice. Table of Contents: Preface / Acknowledgments / Guilty Until Proven Innocent / Let's Get Started / Where We Begin to Go Wrong / It's Only a Model / Wisdom Is Doing It / Summary / Afterword / Bibliography / Authors' Biographies

  • Frontmatter

    The prelims comprise: Half Title Title Copyright Contents Preface

  • AntennaPlatform Interaction Modeling

    This chapter contains sections titled: Coupled Analysis Decoupled Analysis Summary References

  • Hybrid FETDFDTD Technique

    This chapter contains sections titled: FDTD Method PML Implementation in FDTD Near-to-Far-Field Transformation in FDTD Alternative FETD Formulation Equivalence Between FETD and FDTD Stable FETD-FDTD Interface Building Hybrid Meshes Wave-Equation Stabilization Validation Examples Summary References

  • Electromechanical Finite Elements

    For magnetic actuators and sensors, mechanical parameters usually influence performance more than any other nonelectromagnetic parameters. For example, armature mass directly affects the speed of response of a magnetic actuator. This chapter uses electromechanical finite elements to analyze the behavior of magnetic actuators and sensors. An electromagnetic finite-element formulation that is capable of analyzing all types of electromagnetic fields is described in the chapter. To allow nonrigid body motion, that is, deformations and stresses, structural finite elements can be used. Structural finite-element analysis is very commonly used to compute mechanical stresses and other mechanical parameters. The chapter shows examples where the motion is small enough such that no element reconnection is required. All results are obtained by time stepping using both nonlinear electromagnetic and structural-finite elements.

  • Color Plates

    The color illustrations for Chapters 1, 2, 4, 5, 6, 7, 9, 10 and 11 are included, as follows: Figure 1.1 Figure 2.3 Figures 4.8, 4.9, 4.14 Figures 5.19, 5.20, 5.21 Figures 6.2(a), 6.10, 6.24, 6.25, 6.26 Figures 7.11(a), 7.14(b), 7.16(a) Figure 9.16(a) Figures 10.9, 10.10, 10.13, 10.14(a) Figures 11.5, 11.6

  • Numerical and Practical Considerations

    This chapter contains sections titled: Choice of Simulation Technologies Frequency- Versus Time-Domain Simulation Tools Fast Frequency Sweep Numerical Convergence Domain Decomposition and Parallel Computing Verification and Validation of Predictions Summary References

  • Mechanically Induced Tin Whiskers

    This chapter discusses the pressure???induced whisker at separable interfaces as a key reliability issue of lead???free separable contacts and connectors. It shows theories of mechanically induced tin whiskers. Then, several case studies with pure tin and lead???free finishes were performed to evaluate pressure???induced tin whiskers. For electronics components, several factors affect the stress field of the finish: (i) thickness of the plating, (ii) structure of the ambient component material, and (iii) material microstructures. As a methodology for the assessment of pressure???induced tin whisker formation, the creep???based tin whisker formation model shows good results. Several connectors with tin or tin???rich alloy finishes were assessed by means of the nanoindentation technique. For the flexible printed circuit (FPC), mechanical properties of adhesives are key factors influencing tin whisker formation. Each mechanical property can be obtained by the indentation technique, and stress distribution can be estimated by finite element analysis (FEA).



Standards related to Finite Element Analysis

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