Nickel

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Nickel is a chemical element with the chemical symbol Ni and atomic number 28. (Wikipedia.org)






Conferences related to Nickel

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2012 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technologies and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in biomedical systems and life sciences. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions).

  • 2011 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technologies and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in biomedical systems and life sciences. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions).

  • 2010 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technology and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in biomedical systems and life science. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions).

  • 2009 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technology and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in bio-medical systems and life science. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions) thematically arrang

  • 2008 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technology and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in bio-medical systems and life science. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions) thematically arrang


2010 International Conference on Industrial Electronics, Control and Robotics (IECR)

To provide an environment for interdisciplinary research interaction as well as for networking of scientists in Industrial Electronics, Control Technology and Robotics. To provide forums to exchange the latest research results and findings in the Electronics, Control Technology and Robotics and their industrial perspectives To emphasize the importance of this emerging technology and to find the ways for improving education and research in the above said area in our country.


2010 International Conference on Nanoscience and Nanotechnology (ICONN)

The aim of the conference is to bring together the Australian and International community working in the field of nanoscale science and technology to discuss new and exciting advances in the field. ICONN will cover nanostructure growth, synthesis, fabrication, characterisation, device design, modelling, testing and applications.


2009 EMC Europe Workshop Materials in Applications (EMC EUROPE WORKSHOP)

The scope of this Workshop encompasses progress in the development, analysis and application of materials in EMC applications, innovative use of materials in EMC design to reduce coupling and improve electromagnetic shielding, new measuring and test techniques and methodologies for characterizing new materials and their application in the EMC domain.


2009 International Conference on Energy and Environment Technology (ICEET)

The main topics are listed as follows: Energy efficency and management power generation technology power technology and application water,air pollution and protection


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Periodicals related to Nickel

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.




Xplore Articles related to Nickel

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Sound field separation in a mixed acoustic environment using a sparse array of higher order spherical microphones

Abdullah Fahim; Prasanga N. Samarasinghe; Thushara D. Abhayapala 2017 Hands-free Speech Communications and Microphone Arrays (HSCMA), 2017

In many acoustic environments, we frequently observe that sound fields caused by desired and undesired sources superimpose each other and form a mixed sound field in the region. Hence, in acoustic signal processing applications, such as sound field recording, speech dereverberation and noise suppression, it is of a great interest to separate the desired sound field from the undesired ones. ...


Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Shin-Yi Huang; Tao-Chih Chang; Ren-Shin Cheng; Jing-Yao Chang; Chia-Wen Fan; Chau-Jie Zhan; John H. Lau; Tai-Hong Chen; Wei-Chung Lo; Ming-Jer Kao 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011

In order to investigate the failure mechanism of microjoints within a chip stacking architecture, four chips with more than 3000 microbumps each were assembled on a Si interposer by Toray's FC-3000WS bonder at a peak temperature of 280°C without any flux. The defects such as missing bumps and deformation of microjoints induced by the undercut of Cu pillar have been ...


Test of a bond-correction formula for ultrasonic velocity measurement

G. Mozurkewich IEEE 1992 Ultrasonics Symposium Proceedings, 1992

A formula for the shift of a resonance frequency induced by a bond of nonvanishing thickness is tested. Experiments are performed on a solid rod of polycrystalline nickel that is machined into three segments, representing specimen, bond, and transducer. Acoustic waves are launched and detected magnetostrictively. Measured patterns of frequency shift vs. frequency for various lengths and diameters of the ...


Thermal Degradation of Electroplated Nickel Thermal Microactuators

J. K. Luo; Y. Q. Fu; J. A. Williams; W. I. Milne Journal of Microelectromechanical Systems, 2009

In this paper, the thermal degradation of laterally operating thermal actuators made from electroplated nickel has been studied. The actuators investigated delivered a maximum displacement of ca. 20 mum at an average temperature of ~ 450degC , which is much lower than that of typical silicon- based microactuators. However, the magnitude of the displacement strongly depended on the frequency and ...


An evaluation of load distribution method on multi-source P2P sensor data stream delivery system

Tomoya Kawakami; Yoshimasa Ishi; Tomoki Yoshihisa; Yuuichi Teranishi The International Conference on Information Networking 2014 (ICOIN2014), 2014

Due to the prevalence of sensors such as security cameras or environmental monitoring, sensor data stream delivery which means delivering the observed data continuously attracts great attention. Our researching team proposed methods to distribute communication loads in the case of delivering the sensor data stream that have different data delivery cycles. In the proposed methods, source nodes and destination nodes ...


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Educational Resources on Nickel

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eLearning

Sound field separation in a mixed acoustic environment using a sparse array of higher order spherical microphones

Abdullah Fahim; Prasanga N. Samarasinghe; Thushara D. Abhayapala 2017 Hands-free Speech Communications and Microphone Arrays (HSCMA), 2017

In many acoustic environments, we frequently observe that sound fields caused by desired and undesired sources superimpose each other and form a mixed sound field in the region. Hence, in acoustic signal processing applications, such as sound field recording, speech dereverberation and noise suppression, it is of a great interest to separate the desired sound field from the undesired ones. ...


Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Shin-Yi Huang; Tao-Chih Chang; Ren-Shin Cheng; Jing-Yao Chang; Chia-Wen Fan; Chau-Jie Zhan; John H. Lau; Tai-Hong Chen; Wei-Chung Lo; Ming-Jer Kao 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011

In order to investigate the failure mechanism of microjoints within a chip stacking architecture, four chips with more than 3000 microbumps each were assembled on a Si interposer by Toray's FC-3000WS bonder at a peak temperature of 280°C without any flux. The defects such as missing bumps and deformation of microjoints induced by the undercut of Cu pillar have been ...


Test of a bond-correction formula for ultrasonic velocity measurement

G. Mozurkewich IEEE 1992 Ultrasonics Symposium Proceedings, 1992

A formula for the shift of a resonance frequency induced by a bond of nonvanishing thickness is tested. Experiments are performed on a solid rod of polycrystalline nickel that is machined into three segments, representing specimen, bond, and transducer. Acoustic waves are launched and detected magnetostrictively. Measured patterns of frequency shift vs. frequency for various lengths and diameters of the ...


Thermal Degradation of Electroplated Nickel Thermal Microactuators

J. K. Luo; Y. Q. Fu; J. A. Williams; W. I. Milne Journal of Microelectromechanical Systems, 2009

In this paper, the thermal degradation of laterally operating thermal actuators made from electroplated nickel has been studied. The actuators investigated delivered a maximum displacement of ca. 20 mum at an average temperature of ~ 450degC , which is much lower than that of typical silicon- based microactuators. However, the magnitude of the displacement strongly depended on the frequency and ...


An evaluation of load distribution method on multi-source P2P sensor data stream delivery system

Tomoya Kawakami; Yoshimasa Ishi; Tomoki Yoshihisa; Yuuichi Teranishi The International Conference on Information Networking 2014 (ICOIN2014), 2014

Due to the prevalence of sensors such as security cameras or environmental monitoring, sensor data stream delivery which means delivering the observed data continuously attracts great attention. Our researching team proposed methods to distribute communication loads in the case of delivering the sensor data stream that have different data delivery cycles. In the proposed methods, source nodes and destination nodes ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Hybrid A/D Converter for 200C Operation

    This paper describes the design and development of a high performance hybrid 12 bit analog to digital converter, which will operate reliably at 200°C. A product of this type was found to be necessary in areas such as geothermal probing, oil-well logging, jet engine and nuclear reactor monitoring, and other appl ications where the environments may reach temperatures of up to 200°C. This product represents an advancement in electronics as it proved the operation of integrated circuits at high temperature, as well as providing information about both the electrical and mechanical re1 iabil ity of hybrid circuits at 200°C. Because the circuit design of the A/D converter involved both digital and linear circuitry, this produced an opportunity to evaluate the performance of both technologies at 200°C. Initial mechanical failure modes led to researching more reliable methods of wire bonding and die attachment. The result of this work was a 12 bit A/D converter which will operate at 200°C with .05% linearity, 1% accuracy, 350 Sec conversion time, and only 455mW power consumption. This product also necessitated the development oof a unique three metal system in which aluminum wire bonding is done utilizing aluminum bonding pads, gold wire bonding to all gold areas, and employment of a nickel interface between gold and aluminum connections. This sytem totally eliminates the formation of intermetallics at the bonding interface which can lead to bond failure.

  • Core Laminations and Their Insulation

    This chapter covers a class of materials known as ferromagnetics. They are very strongly magnetic and include iron, nickel, cobalt, and some alloys. For motor and generator applications, there are two ways to obtain a magnetic field with ferromagnetic materials. It can be created either by electric currents, as in electromagnets, or by permanent magnets. We focus on the materials, processes, and insulation of electromagnets.

  • Battery Charging

    This chapter contains sections titled: History of Battery-Charging Technology Basic Functions of Battery Chargers Battery Characteristics Pertinent in Charging Lead-Acid Battery Charging Charger Design for Long Battery Life Smart Chargers for New Nickel-Cadmium, Nickel-Metal Hydride, and Lithium Batteries Smart Batteries for Smart Chargers Self-Discharge Rate of Nickel and Lithium Cells Recoverable Energy Solar Panel Battery Chargers This chapter contains sections titled: References

  • IronNickel Alloys

    This chapter contains sections titled: Binary Iron-Nickel Alloys Commercial Binary Alloys Iron-Nickel-Molybdenum Alloys Iron-Nickel-Chromium Alloys Iron-Nickel-Copper Alloys Iron-Cobalt-Nickel Alloys Other Iron-Nickel Alloys

  • High Temperature Aluminum Nitride Packaging

    As is often the case, advances in electronics are dictated not by the IC devices themselves, but by the ability to package those devices. This is certainly the case for high temperature electronics. The limits of conventional packaging materials such as glass-epoxy circuit boards, plated copper traces and Sn-Pb solder are obvious at temperatures in excess of 300°C. Even standard ceramic packages based on Al2O3 are inadequate above 300°C. Novel materials and assembly techniques required for high temperature operation are presented in this paper. Factors such as thermal conductivity, expansion coefficients, oxidation and diffusion become more critical as operating temperatures increase, and therefore play major roles in determining package construction techniques. The evolution of high temperature package construction will be reviewed in light of these constraints. High temperature packages have been developed based on aluminum nitride (AIN) substrates and nickel metallization. Key features of the packages described in this paper are molded AIN bodies, directly bonded low temperature cofired ceramic (LTCC) frames and silver active braze seals, all of which contribute to producing hermetic packages at high temperatures. A discussion of interconnect metallurgies and attachment methods is included. Test data demonstrating the reliability of AIN high temperature packages will also be presented.

  • Other High Permeability Materials

    This chapter contains sections titled: Cobalt Nickel Cobalt-Nickel Alloys Other Cobalt Alloys Other Nickel Alloys Heusler Alloys Other Manganese Alloys Other Alloys and Elements

  • HighTemperature Ohmic and Schottky Contacts to NType 6HSiC Using Nickel

    We report specific contact resistances measured at elevated temperatures for Ni ohmic contacts to 6H-SiC. The specific contact resistances were measured with the linear transmission line method at both room temperature and at 773 K and yielded values > 5 x 10-6 -cm2 at both temperatures. The trend shows a decreasing contact resistance at higher temperatures. The annealed metal film is a nickel silicide with substantial mixing of C throughout the silicide layer. Also reported are the results of I-V and C-V barrier height measurements for Ni Schottky contacts to 6H-SiC. Current-voltage barrier heights as high as 1.2 eV have been measured, and the contacts show good electrical and physical stability following long-term anneals at 573 K in a vacuum ambient of 10-6 torr. These ohmic and Schottky contacts have been developed by the CCDS in collaboration with the Air Force and the Westinghouse Electric Corporation, and transfer of our contact technology to the Westinghouse Science and Technology is now complete.

  • Hybrid/Electric Vehicle Battery Manufacturing: The State-of-the-Art

    The increasing demand for alternative and sustainable energy sources to replace gasoline powered engines has intrigued the development of battery technologies for hybrid and electric vehicles. This has brought both challenges and opportunities. Not only are new battery designs with advanced features needed, but also a high manufacturing capacity to satisfy the increasing market is required. This chapter summarizes the recent advances in automotive battery technologies and their manufacturing processes, as well as environmental and recycling issues. It reviews the main aspects in technology and manufacturing processes for electric vehicle batteries, such as Nickel- metal hydride (NiMH) and lithium (Li)-ion batteries. The chapter outlines the typical requirements for automobile batteries. It illustrates different types of electric vehicles, and introduces the development of vehicle battery technology. The chapter summarizes the recent advances in automotive battery technologies and their manufacturing processes, as well as environmental and recycling issues.



Standards related to Nickel

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