Nickel

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Nickel is a chemical element with the chemical symbol Ni and atomic number 28. (Wikipedia.org)






Conferences related to Nickel

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2012 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technologies and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in biomedical systems and life sciences. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions).

  • 2011 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technologies and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in biomedical systems and life sciences. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions).

  • 2010 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technology and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in biomedical systems and life science. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions).

  • 2009 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technology and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in bio-medical systems and life science. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions) thematically arrang

  • 2008 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technology and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in bio-medical systems and life science. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions) thematically arrang


2010 International Conference on Nanoscience and Nanotechnology (ICONN)

The aim of the conference is to bring together the Australian and International community working in the field of nanoscale science and technology to discuss new and exciting advances in the field. ICONN will cover nanostructure growth, synthesis, fabrication, characterisation, device design, modelling, testing and applications.


2009 International Conference on Energy and Environment Technology (ICEET)

The main topics are listed as follows: Energy efficency and management power generation technology power technology and application water,air pollution and protection



Periodicals related to Nickel

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.



Most published Xplore authors for Nickel

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Xplore Articles related to Nickel

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Life and capacity improvements in lead acid batteries through metal control additives

T. J. Clough; J. A. Wertz Sixteenth Annual Battery Conference on Applications and Advances. Proceedings of the Conference (Cat. No.01TH8533), 2001

Metal impurities can be particularly detrimental in valve regulated lead acid batteries (VRLA) operating on the oxygen recombination principal. A number of metal impurities can exert a deleterious effect on the performance of VRLA batteries by affecting one of more of the performance requirements of the VRLA batteries such as by increasing oxygen evolution at the positive electrode, increasing hydrogen ...


Monopulse estimation of target DOA in external noise fields with adaptive arrays

M. Valeri; S. Barbarossa; A. Farina; L. Timmoneri Proceedings of International Symposium on Phased Array Systems and Technology, 1996

This paper defines an algorithm for the estimation of the radar target direction of arrival (DOA) when electromagnetic interferences impinge on an adaptive planar array. First, the case of a fully adaptive array is considered and the target DOA is estimated via the maximum-likelihood principle. The performance of the derived algorithm is also found. Subsequently, the case of adaptivity applied ...


Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps

Kwang-Lung Lin; Yi-Cheng Liu IEEE Transactions on Advanced Packaging, 1999

A process for manufacturing Cu/electroless Ni/Sn-Pb solder bump is discussed in this paper. An attempt to replace zincation with a Cu film as an active layer for the electroless Ni (EN) deposition on Al electrode on Si wafer is presented. Cu/electroless Ni is applied as under bump metallurgy (UBM) for solder bump. The Cu film required repeated etches with nitric ...


Nanomechanical structures with an integrated carbon nanotube

H. Miyashita; T. Ono; M. Esashi TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003, 2003

In this paper, we report the fabrication method of a freestanding carbon nanotube (CNT) bridged between opposed silicon electrodes with a narrow gap (0.5/spl sim/5 /spl mu/m), which was fabricated by a silicon micromachining technique. After the metallization of nickel (Ni) or iron (Fe) as a catalyst for CNT growth, the CNT was grown between these electrodes with an application ...


Thermosonic gold wire bonding to laminate substrates with palladium surface finishes

R. W. Johnson; M. J. Palmer; M. J. Bozack; T. Isaacs-Smith IEEE Transactions on Electronics Packaging Manufacturing, 1999

As the laminate substrate industry moves from hot air solder level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium, and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlayer, were evaluated from two vendors. ...


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Educational Resources on Nickel

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eLearning

Life and capacity improvements in lead acid batteries through metal control additives

T. J. Clough; J. A. Wertz Sixteenth Annual Battery Conference on Applications and Advances. Proceedings of the Conference (Cat. No.01TH8533), 2001

Metal impurities can be particularly detrimental in valve regulated lead acid batteries (VRLA) operating on the oxygen recombination principal. A number of metal impurities can exert a deleterious effect on the performance of VRLA batteries by affecting one of more of the performance requirements of the VRLA batteries such as by increasing oxygen evolution at the positive electrode, increasing hydrogen ...


Monopulse estimation of target DOA in external noise fields with adaptive arrays

M. Valeri; S. Barbarossa; A. Farina; L. Timmoneri Proceedings of International Symposium on Phased Array Systems and Technology, 1996

This paper defines an algorithm for the estimation of the radar target direction of arrival (DOA) when electromagnetic interferences impinge on an adaptive planar array. First, the case of a fully adaptive array is considered and the target DOA is estimated via the maximum-likelihood principle. The performance of the derived algorithm is also found. Subsequently, the case of adaptivity applied ...


Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps

Kwang-Lung Lin; Yi-Cheng Liu IEEE Transactions on Advanced Packaging, 1999

A process for manufacturing Cu/electroless Ni/Sn-Pb solder bump is discussed in this paper. An attempt to replace zincation with a Cu film as an active layer for the electroless Ni (EN) deposition on Al electrode on Si wafer is presented. Cu/electroless Ni is applied as under bump metallurgy (UBM) for solder bump. The Cu film required repeated etches with nitric ...


Nanomechanical structures with an integrated carbon nanotube

H. Miyashita; T. Ono; M. Esashi TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003, 2003

In this paper, we report the fabrication method of a freestanding carbon nanotube (CNT) bridged between opposed silicon electrodes with a narrow gap (0.5/spl sim/5 /spl mu/m), which was fabricated by a silicon micromachining technique. After the metallization of nickel (Ni) or iron (Fe) as a catalyst for CNT growth, the CNT was grown between these electrodes with an application ...


Thermosonic gold wire bonding to laminate substrates with palladium surface finishes

R. W. Johnson; M. J. Palmer; M. J. Bozack; T. Isaacs-Smith IEEE Transactions on Electronics Packaging Manufacturing, 1999

As the laminate substrate industry moves from hot air solder level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium, and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlayer, were evaluated from two vendors. ...


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IEEE.tv Videos

No IEEE.tv Videos are currently tagged "Nickel"

IEEE-USA E-Books

  • High Temperature Aluminum Nitride Packaging

    As is often the case, advances in electronics are dictated not by the IC devices themselves, but by the ability to package those devices. This is certainly the case for high temperature electronics. The limits of conventional packaging materials such as glass-epoxy circuit boards, plated copper traces and Sn-Pb solder are obvious at temperatures in excess of 300°C. Even standard ceramic packages based on Al2O3 are inadequate above 300°C. Novel materials and assembly techniques required for high temperature operation are presented in this paper. Factors such as thermal conductivity, expansion coefficients, oxidation and diffusion become more critical as operating temperatures increase, and therefore play major roles in determining package construction techniques. The evolution of high temperature package construction will be reviewed in light of these constraints. High temperature packages have been developed based on aluminum nitride (AIN) substrates and nickel metallization. Key features of the packages described in this paper are molded AIN bodies, directly bonded low temperature cofired ceramic (LTCC) frames and silver active braze seals, all of which contribute to producing hermetic packages at high temperatures. A discussion of interconnect metallurgies and attachment methods is included. Test data demonstrating the reliability of AIN high temperature packages will also be presented.

  • IronNickel Alloys

    This chapter contains sections titled: Binary Iron-Nickel Alloys Commercial Binary Alloys Iron-Nickel-Molybdenum Alloys Iron-Nickel-Chromium Alloys Iron-Nickel-Copper Alloys Iron-Cobalt-Nickel Alloys Other Iron-Nickel Alloys

  • HighTemperature Ohmic and Schottky Contacts to NType 6HSiC Using Nickel

    We report specific contact resistances measured at elevated temperatures for Ni ohmic contacts to 6H-SiC. The specific contact resistances were measured with the linear transmission line method at both room temperature and at 773 K and yielded values > 5 x 10-6 -cm2 at both temperatures. The trend shows a decreasing contact resistance at higher temperatures. The annealed metal film is a nickel silicide with substantial mixing of C throughout the silicide layer. Also reported are the results of I-V and C-V barrier height measurements for Ni Schottky contacts to 6H-SiC. Current-voltage barrier heights as high as 1.2 eV have been measured, and the contacts show good electrical and physical stability following long-term anneals at 573 K in a vacuum ambient of 10-6 torr. These ohmic and Schottky contacts have been developed by the CCDS in collaboration with the Air Force and the Westinghouse Electric Corporation, and transfer of our contact technology to the Westinghouse Science and Technology is now complete.

  • Hybrid/Electric Vehicle Battery Manufacturing: The State-of-the-Art

    The increasing demand for alternative and sustainable energy sources to replace gasoline powered engines has intrigued the development of battery technologies for hybrid and electric vehicles. This has brought both challenges and opportunities. Not only are new battery designs with advanced features needed, but also a high manufacturing capacity to satisfy the increasing market is required. This chapter summarizes the recent advances in automotive battery technologies and their manufacturing processes, as well as environmental and recycling issues. It reviews the main aspects in technology and manufacturing processes for electric vehicle batteries, such as Nickel- metal hydride (NiMH) and lithium (Li)-ion batteries. The chapter outlines the typical requirements for automobile batteries. It illustrates different types of electric vehicles, and introduces the development of vehicle battery technology. The chapter summarizes the recent advances in automotive battery technologies and their manufacturing processes, as well as environmental and recycling issues.

  • Hybrid A/D Converter for 200C Operation

    This paper describes the design and development of a high performance hybrid 12 bit analog to digital converter, which will operate reliably at 200°C. A product of this type was found to be necessary in areas such as geothermal probing, oil-well logging, jet engine and nuclear reactor monitoring, and other appl ications where the environments may reach temperatures of up to 200°C. This product represents an advancement in electronics as it proved the operation of integrated circuits at high temperature, as well as providing information about both the electrical and mechanical re1 iabil ity of hybrid circuits at 200°C. Because the circuit design of the A/D converter involved both digital and linear circuitry, this produced an opportunity to evaluate the performance of both technologies at 200°C. Initial mechanical failure modes led to researching more reliable methods of wire bonding and die attachment. The result of this work was a 12 bit A/D converter which will operate at 200°C with .05% linearity, 1% accuracy, 350 Sec conversion time, and only 455mW power consumption. This product also necessitated the development oof a unique three metal system in which aluminum wire bonding is done utilizing aluminum bonding pads, gold wire bonding to all gold areas, and employment of a nickel interface between gold and aluminum connections. This sytem totally eliminates the formation of intermetallics at the bonding interface which can lead to bond failure.

  • Battery Charging

    This chapter contains sections titled: History of Battery-Charging Technology Basic Functions of Battery Chargers Battery Characteristics Pertinent in Charging Lead-Acid Battery Charging Charger Design for Long Battery Life Smart Chargers for New Nickel-Cadmium, Nickel-Metal Hydride, and Lithium Batteries Smart Batteries for Smart Chargers Self-Discharge Rate of Nickel and Lithium Cells Recoverable Energy Solar Panel Battery Chargers This chapter contains sections titled: References

  • Core Laminations and Their Insulation

    This chapter covers a class of materials known as ferromagnetics. They are very strongly magnetic and include iron, nickel, cobalt, and some alloys. For motor and generator applications, there are two ways to obtain a magnetic field with ferromagnetic materials. It can be created either by electric currents, as in electromagnets, or by permanent magnets. We focus on the materials, processes, and insulation of electromagnets.

  • Other High Permeability Materials

    This chapter contains sections titled: Cobalt Nickel Cobalt-Nickel Alloys Other Cobalt Alloys Other Nickel Alloys Heusler Alloys Other Manganese Alloys Other Alloys and Elements



Standards related to Nickel

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Jobs related to Nickel

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