Nickel

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Nickel is a chemical element with the chemical symbol Ni and atomic number 28. (Wikipedia.org)






Conferences related to Nickel

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2012 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technologies and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in biomedical systems and life sciences. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions).

  • 2011 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technologies and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in biomedical systems and life sciences. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions).

  • 2010 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technology and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in biomedical systems and life science. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions).

  • 2009 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technology and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in bio-medical systems and life science. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions) thematically arrang

  • 2008 International Symposium on Micro-NanoMechatronics and Human Science (MHS)

    The emphasis of this symposium is on fusions of several different fields and applications of micro-nano mechatronics technology and human sciences. The symposium focus will be on engineering issues related to broader spectra, ranging from basic applications in robots, actuators, sensors, semiconductors, automobiles, and machine tools to new applications in bio-medical systems and life science. The conference will feature Plenary, Invited, and Contributed papers (oral and poster sessions) thematically arrang


2010 International Conference on Nanoscience and Nanotechnology (ICONN)

The aim of the conference is to bring together the Australian and International community working in the field of nanoscale science and technology to discuss new and exciting advances in the field. ICONN will cover nanostructure growth, synthesis, fabrication, characterisation, device design, modelling, testing and applications.


2009 International Conference on Energy and Environment Technology (ICEET)

The main topics are listed as follows: Energy efficency and management power generation technology power technology and application water,air pollution and protection



Periodicals related to Nickel

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.



Most published Xplore authors for Nickel

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Xplore Articles related to Nickel

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Wetting interactions between the Ni-Cu-P deposit and In-Sn solders

Chun-Jen Chen; Kwang-Lung Lin IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1997

The interactions during wetting between an electroless Ni-Cu-P deposit and molten InSn solders were investigated with the aid of scanning electron microscope (SEM), X-ray diffractometer (XRD), and Auger electron spectroscope (AES). The intermetallics In3Ni 2 and In27Ni10 were formed at the interlayer for the Ni-Cu-P with 51In-49Sn and 80In-20Sn systems, in the temperature range of 250-300°C. In addition to these ...


Magnetic ferrites: New materials for modern applications

V. E. Legg; C. D. Owens Electrical Engineering, 1954

Ferrites are serving very effectively in the vanguard of communication developments. Their basic properties and methods of application are discussed which show how they have begun to revolutionize the design and manufacture of inductors and transformers.


Lifetime-optimal sensor deployment for wireless sensor networks with mobile sink

Huiyong Yuan; Jiansheng Xie; Nan Hu 2011 6th IEEE Joint International Information Technology and Artificial Intelligence Conference, 2011

The energy restriction of battery powered sensors is a big challenge for wireless sensor networks as it is difficult or in some cases not feasible to change the power supply of motes. Therefore, how to minimize the energy consumption while maintaining an extended network lifetime becomes the most critical issue. In this paper, a new sensor deployment method is proposed ...


Synthesis of microwave and microcontroller equipment for particle size measurement

G. N. Akhobadze 2014 International Conference on Actual Problems of Electron Devices Engineering (APEDE), 2014

The paper discusses problems of particle size measurement on the basis of utilizing microwave and microcontroller equipment. Results of theoretical studies of reflectance properties of dielectric particles and current- conducting ones during electromagnetic-wave sounding of them are presented. Experimental results of particle diameter measurement in relation to electromagnetic oscillation frequency and incidence angle and acceptance one for reflected signals are ...


Poly(n,n-dimethylpropargylamine): a /spl pi/-conjugated polymer as macromolecular ligand

M. V. Russo; A. Furlani; G. lucci; G. Polzonetti International Conference on Science and Technology of Synthetic Metals, 1994

Summary form only given. Complexes between transition metals ions and macromolecular ligands have been widely studied in the past, due to their interesting electrochemical and catalytic properties. Polymers with a /spl pi/-conjugated backbone, on the other hand, have some peculiar electrical properties that make them interesting materials for molecular electronics. Recently, we have prepared some complexes between Ni(II) and a ...


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Educational Resources on Nickel

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eLearning

Wetting interactions between the Ni-Cu-P deposit and In-Sn solders

Chun-Jen Chen; Kwang-Lung Lin IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1997

The interactions during wetting between an electroless Ni-Cu-P deposit and molten InSn solders were investigated with the aid of scanning electron microscope (SEM), X-ray diffractometer (XRD), and Auger electron spectroscope (AES). The intermetallics In3Ni 2 and In27Ni10 were formed at the interlayer for the Ni-Cu-P with 51In-49Sn and 80In-20Sn systems, in the temperature range of 250-300°C. In addition to these ...


Magnetic ferrites: New materials for modern applications

V. E. Legg; C. D. Owens Electrical Engineering, 1954

Ferrites are serving very effectively in the vanguard of communication developments. Their basic properties and methods of application are discussed which show how they have begun to revolutionize the design and manufacture of inductors and transformers.


Lifetime-optimal sensor deployment for wireless sensor networks with mobile sink

Huiyong Yuan; Jiansheng Xie; Nan Hu 2011 6th IEEE Joint International Information Technology and Artificial Intelligence Conference, 2011

The energy restriction of battery powered sensors is a big challenge for wireless sensor networks as it is difficult or in some cases not feasible to change the power supply of motes. Therefore, how to minimize the energy consumption while maintaining an extended network lifetime becomes the most critical issue. In this paper, a new sensor deployment method is proposed ...


Synthesis of microwave and microcontroller equipment for particle size measurement

G. N. Akhobadze 2014 International Conference on Actual Problems of Electron Devices Engineering (APEDE), 2014

The paper discusses problems of particle size measurement on the basis of utilizing microwave and microcontroller equipment. Results of theoretical studies of reflectance properties of dielectric particles and current- conducting ones during electromagnetic-wave sounding of them are presented. Experimental results of particle diameter measurement in relation to electromagnetic oscillation frequency and incidence angle and acceptance one for reflected signals are ...


Poly(n,n-dimethylpropargylamine): a /spl pi/-conjugated polymer as macromolecular ligand

M. V. Russo; A. Furlani; G. lucci; G. Polzonetti International Conference on Science and Technology of Synthetic Metals, 1994

Summary form only given. Complexes between transition metals ions and macromolecular ligands have been widely studied in the past, due to their interesting electrochemical and catalytic properties. Polymers with a /spl pi/-conjugated backbone, on the other hand, have some peculiar electrical properties that make them interesting materials for molecular electronics. Recently, we have prepared some complexes between Ni(II) and a ...


More eLearning Resources

IEEE.tv Videos

No IEEE.tv Videos are currently tagged "Nickel"

IEEE-USA E-Books

  • IronNickel Alloys

    This chapter contains sections titled: Binary Iron-Nickel Alloys Commercial Binary Alloys Iron-Nickel-Molybdenum Alloys Iron-Nickel-Chromium Alloys Iron-Nickel-Copper Alloys Iron-Cobalt-Nickel Alloys Other Iron-Nickel Alloys

  • Other High Permeability Materials

    This chapter contains sections titled: Cobalt Nickel Cobalt-Nickel Alloys Other Cobalt Alloys Other Nickel Alloys Heusler Alloys Other Manganese Alloys Other Alloys and Elements

  • HighTemperature Ohmic and Schottky Contacts to NType 6HSiC Using Nickel

    We report specific contact resistances measured at elevated temperatures for Ni ohmic contacts to 6H-SiC. The specific contact resistances were measured with the linear transmission line method at both room temperature and at 773 K and yielded values > 5 x 10-6 -cm2 at both temperatures. The trend shows a decreasing contact resistance at higher temperatures. The annealed metal film is a nickel silicide with substantial mixing of C throughout the silicide layer. Also reported are the results of I-V and C-V barrier height measurements for Ni Schottky contacts to 6H-SiC. Current-voltage barrier heights as high as 1.2 eV have been measured, and the contacts show good electrical and physical stability following long-term anneals at 573 K in a vacuum ambient of 10-6 torr. These ohmic and Schottky contacts have been developed by the CCDS in collaboration with the Air Force and the Westinghouse Electric Corporation, and transfer of our contact technology to the Westinghouse Science and Technology is now complete.

  • Hybrid/Electric Vehicle Battery Manufacturing: The State-of-the-Art

    The increasing demand for alternative and sustainable energy sources to replace gasoline powered engines has intrigued the development of battery technologies for hybrid and electric vehicles. This has brought both challenges and opportunities. Not only are new battery designs with advanced features needed, but also a high manufacturing capacity to satisfy the increasing market is required. This chapter summarizes the recent advances in automotive battery technologies and their manufacturing processes, as well as environmental and recycling issues. It reviews the main aspects in technology and manufacturing processes for electric vehicle batteries, such as Nickel- metal hydride (NiMH) and lithium (Li)-ion batteries. The chapter outlines the typical requirements for automobile batteries. It illustrates different types of electric vehicles, and introduces the development of vehicle battery technology. The chapter summarizes the recent advances in automotive battery technologies and their manufacturing processes, as well as environmental and recycling issues.

  • High Temperature Aluminum Nitride Packaging

    As is often the case, advances in electronics are dictated not by the IC devices themselves, but by the ability to package those devices. This is certainly the case for high temperature electronics. The limits of conventional packaging materials such as glass-epoxy circuit boards, plated copper traces and Sn-Pb solder are obvious at temperatures in excess of 300°C. Even standard ceramic packages based on Al2O3 are inadequate above 300°C. Novel materials and assembly techniques required for high temperature operation are presented in this paper. Factors such as thermal conductivity, expansion coefficients, oxidation and diffusion become more critical as operating temperatures increase, and therefore play major roles in determining package construction techniques. The evolution of high temperature package construction will be reviewed in light of these constraints. High temperature packages have been developed based on aluminum nitride (AIN) substrates and nickel metallization. Key features of the packages described in this paper are molded AIN bodies, directly bonded low temperature cofired ceramic (LTCC) frames and silver active braze seals, all of which contribute to producing hermetic packages at high temperatures. A discussion of interconnect metallurgies and attachment methods is included. Test data demonstrating the reliability of AIN high temperature packages will also be presented.

  • Battery Charging

    This chapter contains sections titled: History of Battery-Charging Technology Basic Functions of Battery Chargers Battery Characteristics Pertinent in Charging Lead-Acid Battery Charging Charger Design for Long Battery Life Smart Chargers for New Nickel-Cadmium, Nickel-Metal Hydride, and Lithium Batteries Smart Batteries for Smart Chargers Self-Discharge Rate of Nickel and Lithium Cells Recoverable Energy Solar Panel Battery Chargers This chapter contains sections titled: References

  • Core Laminations and Their Insulation

    This chapter covers a class of materials known as ferromagnetics. They are very strongly magnetic and include iron, nickel, cobalt, and some alloys. For motor and generator applications, there are two ways to obtain a magnetic field with ferromagnetic materials. It can be created either by electric currents, as in electromagnets, or by permanent magnets. We focus on the materials, processes, and insulation of electromagnets.

  • Hybrid A/D Converter for 200C Operation

    This paper describes the design and development of a high performance hybrid 12 bit analog to digital converter, which will operate reliably at 200°C. A product of this type was found to be necessary in areas such as geothermal probing, oil-well logging, jet engine and nuclear reactor monitoring, and other appl ications where the environments may reach temperatures of up to 200°C. This product represents an advancement in electronics as it proved the operation of integrated circuits at high temperature, as well as providing information about both the electrical and mechanical re1 iabil ity of hybrid circuits at 200°C. Because the circuit design of the A/D converter involved both digital and linear circuitry, this produced an opportunity to evaluate the performance of both technologies at 200°C. Initial mechanical failure modes led to researching more reliable methods of wire bonding and die attachment. The result of this work was a 12 bit A/D converter which will operate at 200°C with .05% linearity, 1% accuracy, 350 Sec conversion time, and only 455mW power consumption. This product also necessitated the development oof a unique three metal system in which aluminum wire bonding is done utilizing aluminum bonding pads, gold wire bonding to all gold areas, and employment of a nickel interface between gold and aluminum connections. This sytem totally eliminates the formation of intermetallics at the bonding interface which can lead to bond failure.



Standards related to Nickel

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Jobs related to Nickel

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