113 resources related to Failure Analysis
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Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
Premier components, packaging and technology
reliability, physics, irps
2014 International Radar Conference (Radar)
Radar 2014 cover all aspects of radar systems for civil, security and defence application. Waveform design, beamforming, signal processing, Emerging applications and technologies, sub-systems technologies, Radar environment.
2013 14th International Conference on Electronic Packaging Technology (ICEPT)
ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.
Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.
Bracke, S.; Haller, S. Reliability and Maintainability Symposium (RAMS), 2012 Proceedings - Annual, 2012
Increasing functionality and complexity of technical products result in complex damage symptoms and failure modes within the customer use phase. Especially in automotive industry, complex damage symptoms are often the result of multiple failure modes. Therefore the importance of continuous field product observation and field data analysis is an important way for analyzing product reliability in the use phase. For ...
Ran Cao; Ying Chen; Rui Kang Prognostics and System Health Management (PHM), 2012 IEEE Conference on, 2012
Failure behavior is the state change process of product or part of a product which is relative to its environment, over time performance and can be detected from the outside. According to the different level of analysis, failure behavior analysis method can be divided into element failure behavior analysis method and system failure behavior analysis method. The formal reveals the ...
Bracke, S.; Haller, S. Reliability and Maintainability Symposium (RAMS), 2011 Proceedings - Annual, 2011
Increasing functionality and complexity of technical products is resulting in complex damage symptoms and causes during customer usage phase. Especially in the automobile industry, complex damage symptoms are often traceable to multiple damage causes. This increases the importance of structured field product observation and field data analysis. For the OEM, the goals are high levels of quality and reliability that ...
Xie Limei; Chen Ying; Kang Rui Prognostics and System Health Management Conference (PHM-Shenzhen), 2011, 2011
Failure Mode, Mechanism and Effect Analysis (FMMEA) is a reliability analysis method which is used to study possible failure modes, failure mechanisms of each component, and to identify the effects of various failure modes on the components and functions. This paper introduces how to implement FMMEA on the Single Board Computer in detail, including system definition, identification of potential failure ...
Cheng, Wu-Tung; Kuo, Feng-Ming Test Symposium (ATS), 2012 IEEE 21st Asian, 2012
Summary form only given. Software-based diagnosis of scan test failures has been an established method for localizing defects as part of the failure analysis process for digital semiconductor devices. Diagnosis software determines the defect type and location for each failing device based on the design description, scan test patterns, and tester fail data. This gives failure analysis engineers or engineers ...
Ozarin, Nathaniel Planning and Performing Failure Mode and Effects Analysis on Software, 2006
Failure Mode Effects Analyses (FMEA) have proven to be an effective method for improving the reliability of hardware systems but many still consider software FMEAs to be problematic. This course provides a proven methodology and a detailed example for planning and performing FMEAs on software. An introduction to Software FMEA and relation to Hardware FMEA will be provided along with ...
Ellis, Wayne Effects of Reliability Mechanisms On VLSI Circuit Functionality, 2004
This tutorial discusses examples of reliability mechanisms and how these can affect the normal operation of selected VLSI circuits. Large circuit-count ASIC chips use standard digital and analog circuits such as Logic gates, eSRAM, eDRAM and I/O circuits which must function properly under various voltage and thermal environments. These chips are subjected to Reliability Screens such as Burn In to ...
Ascher, Harold; Hansen, Christian Concepts and Models for Repairable Systems Reliability, 2009
Almost all systems of interest in reliability applications are designed to be repaired, rather than discarded, after their first failure. Nevertheless, most reliability texts overemphasize nonrepairable items (henceforth, "parts"); if repairable systems (henceforth, "systems") are addressed, they usually are assumed to be same-as-new after repair. Such renewal by repair is neither plausible, nor mathematically tractable, nor even desirable since reliability ...
Stout, Roger Power Electronics System Thermal Design: Thermal Runaway, 2007
This course will provide an in-depth presentation of specific and highly non- linear thermal failure mechanisms (thermal runaway). The course will discuss how it arises and how it may be analyzed. The focus will be within the particular context of power semiconductor devices, but it should also become evident how the concept may be applied more generally.
Keene, Samuel Design for Six Sigma, 2007
Six Sigma improves both product and process quality, eliminating defects using a suite of tools that span: statistical, analytical, and collaborative domains. The six sigma nomenclatures cross over different languages and cultures with improved understanding and exactness. Six Sigma improves our every day processes. The Six Sigma process has been extended to take the initiative in developing better designs that ...
This guide recommends procedures to be used to perform failure investigations of power circuit breakers. Although the procedure may be used for any circuit breaker, it is mainly focused on high-voltage ac power circuit breakers used on utility systems. Recommendations are also made for monitoring circuit breaker functions as a means of diagnosing their suitability for service condition.
Abstract: A procedure to be used to perform a failure analysis is recommended. The procedure is primarily focused on power transformers used on electrical utility systems, although it may be used for an investigation into any ac transformer failure. This document provides a methodology by which the most probable cause of any particular transformer failure may be determined. This document ...
This guide provides maintenance testing and failure analysis guidance for form-wound, squirrel cage, induction machinery rated up to 15 kV. The guide addresses the following machine systems: — Stator (winding and wore) — Rotor (winding and core) — Vibration and noise — Bearings and shafts — Structure, frame — Ventilation — Accessories
This guide will discuss the importance of failure analysis on cable, joints and terminations used in power systems rated 5kV through 46kV. Users shoudl review the definitions, and technical papers that are listed in the References and in the Bibliography to gain an understanding of failure analysis issues. Why a cable, joint, or termination fails is an important part of ...
Processes and methodologies for conducting reliability predictions for electronic systems and equipment.
Electrical Engineer, Failure Analysis APC
Lead Engineer – Materials Engineering CoE Eaton
Electrical Engineer Randstad
Wind Turbine Electrical Engineer (Renewables) Iberdrola USA
Electrical Engineer Eastman
*Electrical Engineer Alcoa Inc.
Engineer IV / Utility Designer IV City of Gainesville - Gainesville Regional Utilities
Display Electrical Engineer Apple
Display Electrical Engineer Apple
Electrical Engineer DuPont
Electrical Engineer-Renewable Energy-Power Conversion Specialist Volt Information Sciences
Reliability Engineer Bose Corporation
Specialist-Reliability Engineer Eaton
RF Electrical Engineer (Body and Security Electronics) Delphi Corporation
Display Electrical Engineer Apple
Electrical Engineer, Full-time Temporary (9 months) - Bend, Oregon USA Ballard Power Systems Inc.
Electrical Engineer Tesoro
Electrical Engineer Randstad
Senior Product Engineer Eaton
Sr Electrical Engineer Medtronic
Electrical Engineer ll BASF
Electrical Engineer Internap
Electrical Engineer Medtronic
Senior Electrical Engineer / VHDL Programmer Job Leidos