Conferences related to Failure Analysis

Back to Top

2016 Annual Reliability and Maintainability Symposium (RAMS)

Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics


2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.


2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2014 International Radar Conference (Radar)

Radar 2014 cover all aspects of radar systems for civil, security and defence application. Waveform design, beamforming, signal processing, Emerging applications and technologies, sub-systems technologies, Radar environment.

  • 2012 International Radar Conference (Radar)

    Radar Environment/Phenomenology, Radar Systems, Remote Sensing from Airborne/Spaceborne Systems, Waveform Design, Beamforming/Signal Processing, Emerging Applications, Advanced Sub-Systems, Computer Modelling, Simulation/Validation.

  • 2011 IEEE CIE International Conference on Radar (Radar)

    This series of successfully organized international conference on radar shows the very fruitful cooperation between IEEE AESS, IET/UK, SEE/France, EA/Australia CIE/China, and the academy societies of other countries , such as Germany, Russia, Japan, Korea and Poland. Radar 2011 is a forum of radar engineers and scientists from all over the world. The conference topics of Radar 2011 will cover all aspects of radar system for civil and defense applications.

  • 2009 International Radar Conference Radar "Surveillance for a Safer World" (RADAR 2009)

    The conference will focus on new research and developments in the field of radar techniques for both military and civil applications. Topics to be covered at Radar 2009 include: Radar Environment and Phenomenology Radar Systems Remote Sensing from Airborne or Spaceborne Systems Waveform Design, Beamforming and Signal Processing Emerging Radar Applications Emerging Technologies Advanced Sub-Systems Technologies Computer Modeling, Simulation and V


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


More Conferences

Periodicals related to Failure Analysis

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


More Periodicals

Most published Xplore authors for Failure Analysis

Back to Top

Xplore Articles related to Failure Analysis

Back to Top

Preliminary safety analysis of frontal collision avoidance systems

E. Miloudi; E. Koursi; Ching-Yao Chan; Wei-Bin Zhang Intelligent Transportation Systems, 2000. Proceedings. 2000 IEEE, 2000

Advanced vehicle control and safety systems (AVCSS) involve several safety critical functions such as vehicle longitudinal and lateral control. INRETS (French Institute of Research in the Transports and Their Safety) and California PATH (Partners for Advanced Transit and Highways) of University of California at Berkeley collaborated to set up a common approach for developing and validating a safe operational system. ...


Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections

Federica Maggioni; Herman Oprins; Eric Beyne; Ingrid De Wolf; Martine Baelmans Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on, 2014

Thermal aware design of integrated circuits is essential to avoid reliability issues and failures especially in 3D-technology where active dies are placed on top of each other and more heat is dissipated on the same area available for cooling compared to conventional 2D-packages. A certain number of parameters can be selected to reduce temperature and temperature gradient. This paper is ...


Microphonics in biopotential measurements with capacitive electrodes

Pablo S. Luna-Lozano; Ramon Pallas-Areny 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology, 2010

Biopotential measurements with capacitive electrodes do not need any direct contact between electrode and skin, which saves the time devoted to expose and prepare the contact area when measuring with conductive electrodes. However, mechanical vibrations resulting from physiological functions such as respiration and cardiac contraction can change the capacitance of the electrode and affect the recordings. This transformation of mechanical ...


Failure Prediction Models for Proactive Fault Tolerance within Storage Systems

Ben Eckart; Xin Chen; Xubin He; Stephen L. Scott 2008 IEEE International Symposium on Modeling, Analysis and Simulation of Computers and Telecommunication Systems, 2008

The increasingly large demand for data storage has spurred on the development of systems that rely on the aggregate performance of multiple hard drives. In many of these applications, reliability and availability are of utmost importance. It is therefore necessary to closely scrutinize a complex storage system's reliability characteristics. In this paper, we use Markov models to rigorously demonstrate the ...


Generating valid tests for static CMOS-circuits based on a delay model

M. Schafer; H. M. Lipp Circuits and Systems, 1988., IEEE International Symposium on, 1988

An approach to automatic test-pattern generation for static CMOS combinational circuits is described. Physical failures that occur in these devices will cause some conditions that are hard to test. Due to high impedance states, CMOS stuck-open faults require test pattern pairs (I, T) where I denotes an initialization pattern and pattern T performs the test. Test pairs of this type ...


More Xplore Articles

Educational Resources on Failure Analysis

Back to Top

eLearning

Preliminary safety analysis of frontal collision avoidance systems

E. Miloudi; E. Koursi; Ching-Yao Chan; Wei-Bin Zhang Intelligent Transportation Systems, 2000. Proceedings. 2000 IEEE, 2000

Advanced vehicle control and safety systems (AVCSS) involve several safety critical functions such as vehicle longitudinal and lateral control. INRETS (French Institute of Research in the Transports and Their Safety) and California PATH (Partners for Advanced Transit and Highways) of University of California at Berkeley collaborated to set up a common approach for developing and validating a safe operational system. ...


Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections

Federica Maggioni; Herman Oprins; Eric Beyne; Ingrid De Wolf; Martine Baelmans Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on, 2014

Thermal aware design of integrated circuits is essential to avoid reliability issues and failures especially in 3D-technology where active dies are placed on top of each other and more heat is dissipated on the same area available for cooling compared to conventional 2D-packages. A certain number of parameters can be selected to reduce temperature and temperature gradient. This paper is ...


Microphonics in biopotential measurements with capacitive electrodes

Pablo S. Luna-Lozano; Ramon Pallas-Areny 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology, 2010

Biopotential measurements with capacitive electrodes do not need any direct contact between electrode and skin, which saves the time devoted to expose and prepare the contact area when measuring with conductive electrodes. However, mechanical vibrations resulting from physiological functions such as respiration and cardiac contraction can change the capacitance of the electrode and affect the recordings. This transformation of mechanical ...


Failure Prediction Models for Proactive Fault Tolerance within Storage Systems

Ben Eckart; Xin Chen; Xubin He; Stephen L. Scott 2008 IEEE International Symposium on Modeling, Analysis and Simulation of Computers and Telecommunication Systems, 2008

The increasingly large demand for data storage has spurred on the development of systems that rely on the aggregate performance of multiple hard drives. In many of these applications, reliability and availability are of utmost importance. It is therefore necessary to closely scrutinize a complex storage system's reliability characteristics. In this paper, we use Markov models to rigorously demonstrate the ...


Generating valid tests for static CMOS-circuits based on a delay model

M. Schafer; H. M. Lipp Circuits and Systems, 1988., IEEE International Symposium on, 1988

An approach to automatic test-pattern generation for static CMOS combinational circuits is described. Physical failures that occur in these devices will cause some conditions that are hard to test. Due to high impedance states, CMOS stuck-open faults require test pattern pairs (I, T) where I denotes an initialization pattern and pattern T performs the test. Test pairs of this type ...


More eLearning Resources

IEEE.tv Videos

No IEEE.tv Videos are currently tagged "Failure Analysis"

IEEE-USA E-Books

No IEEE-USA E-Books are currently tagged "Failure Analysis"



Standards related to Failure Analysis

Back to Top

IEEE Guide for Diagnostics and Failure Investigation of Power Circuit Breakers

This guide recommends procedures to be used to perform failure investigations of power circuit breakers. Although the procedure may be used for any circuit breaker, it is mainly focused on high-voltage ac power circuit breakers used on utility systems. Recommendations are also made for monitoring circuit breaker functions as a means of diagnosing their suitability for service condition.


IEEE Guide for Failure Investigation, Documentation, and Analysis for Power Transformers and Shunt Reactors

Abstract: A procedure to be used to perform a failure analysis is recommended. The procedure is primarily focused on power transformers used on electrical utility systems, although it may be used for an investigation into any ac transformer failure. This document provides a methodology by which the most probable cause of any particular transformer failure may be determined. This document ...


IEEE Guide for Induction Machinery Maintenance Testing and Failure Analysis

This guide provides maintenance testing and failure analysis guidance for form-wound, squirrel cage, induction machinery rated up to 15 kV. The guide addresses the following machine systems: — Stator (winding and wore) — Rotor (winding and core) — Vibration and noise — Bearings and shafts — Structure, frame — Ventilation — Accessories


IEEE Guide for Investigating and Analyzing Power Cable, Joint, and Termination Failures on Systems Rated 5 kV Through 46 kV

This guide will discuss the importance of failure analysis on cable, joints and terminations used in power systems rated 5kV through 46kV. Users shoudl review the definitions, and technical papers that are listed in the References and in the Bibliography to gain an understanding of failure analysis issues. Why a cable, joint, or termination fails is an important part of ...


IEEE Guide for Selecting and Using Reliability Predictions Based on IEEE 1413

Processes and methodologies for conducting reliability predictions for electronic systems and equipment.


More Standards