Conferences related to Failure Analysis

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2016 Annual Reliability and Maintainability Symposium (RAMS)

Tutorials and original papers on reliability, maintainability, safety, risk management, and logistics


2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

    Premier components, packaging and technology

  • 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

    premier components, packaging and technology conference

  • 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

    ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

  • 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

    Advanced packaging, electronic components & RF, emerging technologies, materials & processing, manufacturing technology, interconnections, quality & reliability, modeling & simulation, optoelectronics.


2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2014 International Radar Conference (Radar)

Radar 2014 cover all aspects of radar systems for civil, security and defence application. Waveform design, beamforming, signal processing, Emerging applications and technologies, sub-systems technologies, Radar environment.

  • 2012 International Radar Conference (Radar)

    Radar Environment/Phenomenology, Radar Systems, Remote Sensing from Airborne/Spaceborne Systems, Waveform Design, Beamforming/Signal Processing, Emerging Applications, Advanced Sub-Systems, Computer Modelling, Simulation/Validation.

  • 2011 IEEE CIE International Conference on Radar (Radar)

    This series of successfully organized international conference on radar shows the very fruitful cooperation between IEEE AESS, IET/UK, SEE/France, EA/Australia CIE/China, and the academy societies of other countries , such as Germany, Russia, Japan, Korea and Poland. Radar 2011 is a forum of radar engineers and scientists from all over the world. The conference topics of Radar 2011 will cover all aspects of radar system for civil and defense applications.

  • 2009 International Radar Conference Radar "Surveillance for a Safer World" (RADAR 2009)

    The conference will focus on new research and developments in the field of radar techniques for both military and civil applications. Topics to be covered at Radar 2009 include: Radar Environment and Phenomenology Radar Systems Remote Sensing from Airborne or Spaceborne Systems Waveform Design, Beamforming and Signal Processing Emerging Radar Applications Emerging Technologies Advanced Sub-Systems Technologies Computer Modeling, Simulation and V


2013 14th International Conference on Electronic Packaging Technology (ICEPT)

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.


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Periodicals related to Failure Analysis

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Display Technology, Journal of

This publication covers the theory, design, fabrication, manufacturing and application of information displays and aspects of display technology that emphasize the progress in device engineering, device design, materials, electronics, physics and reliabilityaspects of displays and the application of displays.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Failure Analysis

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Xplore Articles related to Failure Analysis

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Mechanism analysis and harness measures of landslide induced by accumulation loading of highway foundation

Liang Zhang; Yanhe Li; Fuli Li 2010 International Conference on Mechanic Automation and Control Engineering, 2010

According to investigate the scenes of landslide damage of an accumulation loading of highway subgrades, and contact with design and supplementary geological exploratory profile, calculate the landslide stability in consideration of two kinds of loading conditions by transmitting coefficient method and analysize the mechanical mechanism of deformation and failure of landslide induced by accumulation loading of highway subgrades. Based on ...


Enhancing TCP splitting in satellite-terrestrial networks via ACK reservation

Jing Zhu; S. Roy; J. Kim Global Telecommunications Conference, 2003. GLOBECOM '03. IEEE, 2003

In this paper, we focus on the performance of TCP splitting in satellite- terrestrial hybrid networks. By simulation we show that long-time link outage has great negative impact on TCP throughput. To solve the problem, an ACK reservation scheme is proposed to speed up TCP recovery from link outage and analytical estimate of a key parameter of the scheme is ...


Fault accommodation for complete synchronization of complex neural networks

Zhanshan Wang; Fufei Chu; Hongjing Liang; Huaguang Zhang 2013 IEEE Symposium on Adaptive Dynamic Programming and Reinforcement Learning (ADPRL), 2013

This paper is concerned with the adaptive fault tolerant synchronization problem for a class of complex interconnected neural networks against sensor failure and coupling failure. As sensor and coupling failure may lead to performance degradation or even instability of the whole network, adaptive approach is proposed to adjust unknown coupling factors for the deteriorated network compensations, as well as to ...


An information architecture for future power systems and its reliability analysis

Zhaoxia Xie; G. Manimaran; V. Vittal; A. G. Phadke; V. Centeno IEEE Transactions on Power Systems, 2002

Analysis of 162 disturbances from 1979 to 1995 reported by the North American Electric Reliability Council (NERC) indicates the importance of information systems under the regulated and competitive environment. This paper points out the major deficiencies in current communication and information systems and proposes a new power system information architecture aimed at correcting these deficiencies. The proposed architecture includes automation ...


On the Power of Imperfect Broadcast

Matthias Fitzi; Stefan Wolf; Jurg Wullschleger 2006 IEEE International Symposium on Information Theory, 2006

A fundamental result in information-theoretic fault-tolerant distributed computing is that unconditionally secure broadcast (or Byzantine agreement) among three players is impossible if one player is misbehaving. In particular, imperfect broadcast with failure probability epsi is achievable if and only if epsi ges (3 - radic5)/2. In this paper, we examine to what extent the failure probability of imperfect broadcast can ...


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Educational Resources on Failure Analysis

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eLearning

Mechanism analysis and harness measures of landslide induced by accumulation loading of highway foundation

Liang Zhang; Yanhe Li; Fuli Li 2010 International Conference on Mechanic Automation and Control Engineering, 2010

According to investigate the scenes of landslide damage of an accumulation loading of highway subgrades, and contact with design and supplementary geological exploratory profile, calculate the landslide stability in consideration of two kinds of loading conditions by transmitting coefficient method and analysize the mechanical mechanism of deformation and failure of landslide induced by accumulation loading of highway subgrades. Based on ...


Enhancing TCP splitting in satellite-terrestrial networks via ACK reservation

Jing Zhu; S. Roy; J. Kim Global Telecommunications Conference, 2003. GLOBECOM '03. IEEE, 2003

In this paper, we focus on the performance of TCP splitting in satellite- terrestrial hybrid networks. By simulation we show that long-time link outage has great negative impact on TCP throughput. To solve the problem, an ACK reservation scheme is proposed to speed up TCP recovery from link outage and analytical estimate of a key parameter of the scheme is ...


Fault accommodation for complete synchronization of complex neural networks

Zhanshan Wang; Fufei Chu; Hongjing Liang; Huaguang Zhang 2013 IEEE Symposium on Adaptive Dynamic Programming and Reinforcement Learning (ADPRL), 2013

This paper is concerned with the adaptive fault tolerant synchronization problem for a class of complex interconnected neural networks against sensor failure and coupling failure. As sensor and coupling failure may lead to performance degradation or even instability of the whole network, adaptive approach is proposed to adjust unknown coupling factors for the deteriorated network compensations, as well as to ...


An information architecture for future power systems and its reliability analysis

Zhaoxia Xie; G. Manimaran; V. Vittal; A. G. Phadke; V. Centeno IEEE Transactions on Power Systems, 2002

Analysis of 162 disturbances from 1979 to 1995 reported by the North American Electric Reliability Council (NERC) indicates the importance of information systems under the regulated and competitive environment. This paper points out the major deficiencies in current communication and information systems and proposes a new power system information architecture aimed at correcting these deficiencies. The proposed architecture includes automation ...


On the Power of Imperfect Broadcast

Matthias Fitzi; Stefan Wolf; Jurg Wullschleger 2006 IEEE International Symposium on Information Theory, 2006

A fundamental result in information-theoretic fault-tolerant distributed computing is that unconditionally secure broadcast (or Byzantine agreement) among three players is impossible if one player is misbehaving. In particular, imperfect broadcast with failure probability epsi is achievable if and only if epsi ges (3 - radic5)/2. In this paper, we examine to what extent the failure probability of imperfect broadcast can ...


More eLearning Resources

IEEE.tv Videos

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IEEE-USA E-Books

  • System Quantification for Dependent Events

    This chapter contains sections titled: Dependent Failures Markov Model for Standby Redundancy Common-Cause Failure Analysis This chapter contains sections titled: References Problems

  • Organizing against Ethnoreligious Violence in Ahmedabad

    This chapter contains sections titled: The Context, St. Xavier's Programs, Evidence of Success, Signs of Failure, Analysis, Summary

  • High Temperature Applications for IC Plastic Encapsulated Packages

    Recently, the trend has been toward higher device operating temperatures. Manufacturers are no longer satisfied with the 0ï¿¿C-to-70ï¿¿ C commercial range, but want products that are rated to 110ï¿¿C or 125ï¿¿C or greater temperature. This desire is driven by many factors, a prime one being automotive needs, where the operating temperature under the hood may reach 200ï¿¿C in the near future. However, such changes must be balanced with need for good reliability and without jeopardizing rated product life. In the case of plastic packages, this concern extends to its elevated temperature stability, both of the device and of the package, especially with respect to the epoxy molding compound. Compounds have made enormous improvements in reliability behavior over the years, under both moist and dry conditions, but still have some inherent shortcomings. For one, epoxy molding compounds are required to meet the Underwriter's Laboratories Flammability Rating of 94V-0. To meet that rating, bromine and antimony are often incorporated as flame retardants. Unfortunately, these elements can act as catalysts to accelerate the intcrmetalllic growth between the gold ball bond and the aluminium bond pad on the silicon chip. The intermetallic growth itself is not detrimental, but the secondary effects of Kirkendall voiding and thermal stresses between the interrnetallic layers are. This phenomenon is typically seen during high temperature storage life reliability testing. Also, many epoxy cresol novalac- based corn pounds have glass transition temperatures of around 150ï¿¿C, but the biphenyl-based compounds recently introduced may range as low as 120ï¿¿C. The question then becomes whether accelerated tests run at very high temperatures accurately reflect field failures. Resin breakdown and other effects manifest at these temperatures may never be seen in the field, yet these tests are re lied upon to indicate good reliability. Another issue to be resolved is finding the upper operating or ambient temperature limit for commercial products in plastic packages, and how to predict reliability and product life. A possible resolution to this concern is multi-functional-based molding compounds. Their glass transition temperatures are typically greater than 190ï¿¿C, insuring that even accelerated tests or high ambient operating temperatures should not affect the composition or the compound. Since the molding compound itself cannot be eliminated from plastic packages, ohviously, additional measures can be tried to meet the criteria. To insure reliable, long-lived products may also require changes in device design, thermal management. and bond pad metallizations and assembly processing, as well as improvements to the molding compound, to reach the criteria of reliable operation at elevated temperatures. Many aspects must be considered to insure adequate reliability while meeting the customers' requirements. In this study, comparisons were made between different compound chernistries-vcrcsol novolac, biphenyl, and multifunctional- using the High Temperature Storage Life Test, at 175ï¿¿C and at 200ï¿¿C. Static Operating Life Testing at 175ï¿¿C was also performed on the multi-functional compound. Failure analysis was performed on a sample of the tested units. However, with the testing temperatures above the glass transition temperatures, over-testing may be an issue and must be considered.

  • Overview of the Failure Analysis Process for Electrical Components

    This chapter presents a person who is not a failure analysis expert with an overview of the failure analysis process. The focus is on an example of electrical components, although the process is applicable to a wide variety of problems. A list of tools necessary for a basic failure analysis lab is presented. A discussion of what you, as a failure analysis customer, can do to optimize the FMA process. Finally, some of the future challenges facing the failure analysis discipline are presented. Definition of Failure Analysis The Benefits of Performing Failure Analysis Overview of the Failure Analysis Process for Electrical Components Tools for Component Failure Analysis Personnel for Component Failure Analysis Challenges Facing Failure Analysts in the Future What the Customer Can Do to Optimize the Failure Analysis Process References

  • Non-Failure Analysis for Logic Programs

    We provide a method whereby, given mode and (upper approximation) type information, we can detect procedures and goals that can be guaranteed to not fail (i.e., to produce at least one solution or not terminate). The technique is based on an intuitively very simple notion, that of a (set of) tests "covering" the type of a set of variables. We show that the problem of determining a covering is undecidable in general, and give decidability and complexity results for the Herbrand and linear arithmetic constraint systems. We give sound algorithms for determining covering that are precise and efficient in practice. Based on this information, we show how to identify goals and procedures that can be guaranteed to not fail at runtime. Applications of such non-failure information include programming error detection, program transformations and parallel execution optimization, avoiding speculative parallelism and estimating lower bounds on the computational costs of goals, which can be used for granularity control. Finally, we report on an implementation of our method and show that better results are obtained than with previously proposed approaches.

  • LeadFree Assembly Reliability: iNEMI Evaluation and Results

    This chapter contains sections titled: Reliability Team Goals Reliability Test Matrix Component-Paste-Board Finish Combinations Components Test Vehicles Pre-Test/Post-Assembly Information CTE Determination: Component and Boards Thermal Cycling Conditions Failure Criteria Thermal Cycle Relative Performance Failure Data, Analysis Packages Weibull Analyses Post-Cycling Failure Analysis Bend Testing Electrochemical Migration Testing [36, 37] iNEMI Team Conclusions Overall Summary, Conclusions ASTM Test Methods References

  • ElectromigrationInduced Failure Analysis

    This chapter contains sections titled: Electromigration in VLSI Interconnection Metallizations: Overview Models of IC Reliability Modeling of Electromigration Due to Repetitive Pulsed Currents Electromigration in Copper Interconnections Failure Analysis of VLSI Interconnection Components Computer-Aided Failure Analysis Exercises References

  • Internet Fault Tree Analysis for Reliability Estimation

    This chapter contains sections titled: Objectives Introduction Fault Tree Analysis Model of FTA for Internet Services Event Failure Analysis Fault Tree for Analyzing Internet Service Failures Predicting Failure Rates with Fault Correction Summary This chapter contains sections titled: References

  • Risk Evaluation of Wide Area Measurement and Control System

    As a monitoring, control, and protection system in a smart transmission grid, the wide area measurement and control system (WAMCS), based on a synchronized phasor measurement unit (PMU), is gradually becoming an important guarantee for security and stability of power systems. However, like any other physical system, WAMCS can fail. This chapter addresses the models and methods in the risk evaluation of WAMCS. After a brief introductory section, the hierarchical structure and failure analysis technique of WAMCS are discussed. The risk evaluation methods of PMUs, regional communication networks, and backbone communication networks are then illustrated. Finally, the chapter presents the numerical results for the risk indices of the substructures and WAMCS.

  • Qualitative Aspects of System Analysis

    This chapter contains sections titled: Introduction Cut Sets and Path Sets Common-Cause Failure Analysis Fault-Tree Linking Along an Accident Sequence Noncoherent Fault Trees This chapter contains sections titled: References Problems



Standards related to Failure Analysis

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IEEE Guide for Diagnostics and Failure Investigation of Power Circuit Breakers

This guide recommends procedures to be used to perform failure investigations of power circuit breakers. Although the procedure may be used for any circuit breaker, it is mainly focused on high-voltage ac power circuit breakers used on utility systems. Recommendations are also made for monitoring circuit breaker functions as a means of diagnosing their suitability for service condition.


IEEE Guide for Failure Investigation, Documentation, and Analysis for Power Transformers and Shunt Reactors

Abstract: A procedure to be used to perform a failure analysis is recommended. The procedure is primarily focused on power transformers used on electrical utility systems, although it may be used for an investigation into any ac transformer failure. This document provides a methodology by which the most probable cause of any particular transformer failure may be determined. This document ...


IEEE Guide for Induction Machinery Maintenance Testing and Failure Analysis

This guide provides maintenance testing and failure analysis guidance for form-wound, squirrel cage, induction machinery rated up to 15 kV. The guide addresses the following machine systems: — Stator (winding and wore) — Rotor (winding and core) — Vibration and noise — Bearings and shafts — Structure, frame — Ventilation — Accessories


IEEE Guide for Investigating and Analyzing Power Cable, Joint, and Termination Failures on Systems Rated 5 kV Through 46 kV

This guide will discuss the importance of failure analysis on cable, joints and terminations used in power systems rated 5kV through 46kV. Users shoudl review the definitions, and technical papers that are listed in the References and in the Bibliography to gain an understanding of failure analysis issues. Why a cable, joint, or termination fails is an important part of ...


IEEE Guide for Selecting and Using Reliability Predictions Based on IEEE 1413

Processes and methodologies for conducting reliability predictions for electronic systems and equipment.


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