Millimeter wave devices
594 resources related to Millimeter wave devices
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2015 IEEE MTT-S International Microwave Symposium (IMS2015)
The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh
2014 39th International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz)
THz, Infrared and Millimeter-wave Science and Applications
2014 IEEE International Vacuum Electronics Conference (IVEC)
Devices, technologies, circuits and microsystems based on Silicon and Silicon-Germanium materials.
The aim of the conferences is to bring together people involved in research and development of millimeter-wave components, equipment and systems, and to explore common areas.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Published monthly with the purpose of providing fast publication of original and significant contributions relevant to all aspects of microwave/millimeter-wave technology. Emphasis is on devices, components, circuits, guided-wave structures, systems and applications covering the frequency spectrum from microwave and beyond, including submillimeter-waves and infrared.
Microwave theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of microwaves.
The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...
Proceedings of the IEEE, 1963
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Son, J.S.; Cutkosky, M.R.; Howe, R.D. Intelligent Robots and Systems 95. 'Human Robot Interaction and Cooperative Robots', Proceedings. 1995 IEEE/RSJ International Conference on, 1995
This paper presents an experimental comparison of tactile array versus force- torque sensing for localizing contact during manipulation. The manipulation tasks involved rotating and translating objects using a planar two fingered manipulator. A pin and a box were selected as limiting cases of point and line contact against a cylindrical robot finger tip. Force-torque contact sensing results suffered from difficulties ...
Winkler, G.; Dotsch, H. Microwave Conference, 1979. 9th European, 1979
Hexagonal ferrites may show a renaissance as candidates for various microwave devices in the millimeter wavelength range if perfect and low-loss materials, either bulk crystals or epitaxial layers, can be grown. Use is made of the large anisotropy fields of compounds with uniaxial magnetic anisotropy. These intrinsic anisotropy fields together with the applied external field provide the condition for FMR ...
Brebels, S.; Mohammadpour-Aghdam, K.; De Raedt, W.; Vandenbosch, G. Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International, 2010
In this paper, an integrated aperture-coupled microstrip antenna for 60 GHz is introduced with the patch element on the inside of the micromachined air cavity. The patch is therefore protected from the outside environment. The coupling of patch and cavity resonance leads further to a compact yet wideband antenna solution. This antenna is a good candidate for realizing active integrated ...
David, T.; Arscott, S.; Munier, J.-M.; Decoopman, T.; Akalin, T.; Mounaix, P.; Melique, X.; Vanbesien, O.; Beaudin, G.; Lippens, D. Terahertz Electronics Proceedings, 2002. IEEE Tenth International Conference on, 2002
Fully integrated monolithic circuits incorporating InP-based heterostructure barrier varactor (HBV) frequency multipliers have been fabricated via epitaxial lift-off and transfer-substrate techniques onto a quartz substrate. We have obtained a maximum output power of 6 mW at 288 GHz corresponding to an overall efficiency of 6%. In addition we have observed a 45 GHz 3 dB bandwidth centered around 300 GHz ...
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