Millimeter wave devices
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2014 IEEE 14th Topical Meeting on Silicon Monolithic Integrated Circuits in Rf Systems (SiRF)
IEEE Topical Meetings on Silicon Monolithic Integrated Circuits in RF Systems have been at the forefront of moving Silicon technologies into microwave and millimeter -wave applications a development now widely accepted, and of great importance. RF CMOS and Si/SiGe BiCMOS technologies are well established in commercial and increasingly also military applications. Invited tutorial talks from international experts will be presented in key topical areas. A student paper competition will be held, and prizes will
2014 39th International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz)
THz, Infrared and Millimeter-wave Science and Applications
2014 IEEE International Vacuum Electronics Conference (IVEC)
IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.
2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM
Premier international forum for bipolar/BiCMOS research.
Bulja, S.; Mirshekar-Syahkal, D.; James, R.; Day, S.E.; Fernandez, F.A. Microwave Theory and Techniques, IEEE Transactions on , 2010
Due to their large birefringence and moderately low loss, liquid crystals (LCs) are a promising dielectric media for development of a variety of reconfigurable millimeter-wave devices. In order to optimize the design of tunable millimeter-wave devices, accurate values of the dielectric and elastic constants, as well as the loss tangents of LCs, are needed. However, characterization of LCs at millimeter-wave ...
Lebed, B M; Voronkov, V D Microwave Conference, 1996. 26th European , 1996
The nearest decade development of radio-electronics will be to a great extent related with the mastering of millimeter and submillimeter wave band. This process is considerably stimulated by a great success in development of electronic components for millimeter and sub-millimeter wave bands. So, substantial progress has been achieved in the field of development and production of key components - sufficiently ...
Choudhury, D.; Foschaar, J.; Rensch, D.B. Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT , 1998
This paper presents a practical heatsink fabrication process for low-cost, high-power microwave and millimeter-wave devices. Using this process approach, a heatsink is developed on a very thin epilayer structure, without damaging the active layer of the device. The etch-stop layer between the wafer and the front-side power devices acts as a protective layer during the back-side fabrication process, and reduces ...
Meriakri, V.V.; Murmuzhev, B.A.; Parkhomenko, M.P.; Fernandes, H.C.C. Global Telecommunications Conference, 1999. GLOBECOM '99 , 1999
Dielectric waveguides rectangular cross section made of dielectrics, ferrites, and semiconductors are experimentally studied at frequencies 30-120 GHz. Devices (passive and active) based on these waveguides (attenuators, phase shifters, switches, dividers, couplers and etc.), also some systems using elaborated devices have been created. The advantages of the reported waveguides as follows: broad band, simple construction, low loss and price cost. ...
Choudhury, D.; Lawyer, P.H.; Foschaar, J.A.; Wetzel, M.D.; Rensch, D.B. Advanced Packaging, IEEE Transactions on , 2003
The development of commercial millimeter wave systems requires cost-effective, high-performance device/circuit assembly techniques. A solder-free thermosonic bonding approach is described here to integrate millimeter wave high-power devices with associated planar circuitry. The devices with integrated heatsink are attached to a metal block, and then ribbon bonded with planar millimeter- wave transmission line circuitry using the developed solder-free thermosonic bonding process. ...
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Edwards, Terry Millimeter-Wave Device and Circuit Technology , 2010
The main aim of this course is to provide the learner with a detailed understanding of millimeter-wave circuit technology. Strongly supported by diagrams and equations, the following aspects are included: some appropriate semiconductor materials; silicon, SiGe, GaAs, GaN, InP, etc.; some associated transistor and MMIC technologies; the increasing importance of CMOS chip technology (both "direct" CMOS and SiGe BiCMOS)' the ...
IMS 2014:Flip Chip Assembly for Sub-millimeter Wave Amplifier MMIC on Polyimide Substrate
Millimeter Wave Mobile Communications for 5G Cellular: It Will Work!
IMS 2012 Special Sessions: The Evolution of Some Key Active and Passive Microwave Components - Richard True
IMS 2011 Preview of International Microwave Symposium
GaN HEMTs and Schottky Diodes
5g Cellular: It Will Work!
The ALMA Array: An IMS 2013 Closing Keynote
26th Annual MTT-AP Symposium and Mini Show - Dr. AnhVu Pham
IMS 2011 Overview
Tech News on IEEE.tv
2011 IEEE Awards James H. Mulligan, Jr. Education Medal - Raj Mittra
No standards are currently tagged "Millimeter wave devices"
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Published monthly with the purpose of providing fast publication of original and significant contributions relevant to all aspects of microwave/millimeter-wave technology. Emphasis is on devices, components, circuits, guided-wave structures, systems and applications covering the frequency spectrum from microwave and beyond, including submillimeter-waves and infrared.
Microwave theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of microwaves.
The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...