39 resources related to Metal foam
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IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.
The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
This Symposium covers essentially all aspects of electromagnetic compatibility such as: Electromagnetic Environment, Lightning, Intentional EMI & EMP, High Power Electromagnetics, ESD, UWB Transmission Lines, Cables, Crosstalk, Coupling, Shielding, Gasketing & Filtering, Grounding Measurement & Instrumentation, Emission and Immunity, Chambers & Cells, Antennas, Advanced Materials, Nanotechnology, NEMS & MEMS, Smart Sensors, Computational Electromagnetics, Model Validation Semiconductors, PCB, Electronic
Bioinformatics, Computational Biology, Biomedical Engineering, Biomaterials and biomedical optics, Biomedical imaging, image processing & visualization, Bioelectrical and neural engineering, Rehabilitation engineering and clinical engineering, Bio-signal processing and analysis
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
EMC standards; measurement technology; undesired sources; cable/grounding; filters/shielding; equipment EMC; systems EMC; antennas and propagation; spectrum utilization; electromagnetic pulses; lightning; radiation hazards; and Walsh functions
Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.
Liwen Jin; Kai Choong Leong Components and Packaging Technologies, IEEE Transactions on, 2006
This paper reports the results of an experimental investigation on the heat transfer performance of metal foam as a heat sink subjected to oscillating flow. The measured pressure drops, velocities, and surface temperatures of oscillating flow through aluminum 40 PPI foam are presented in detail. The calculated cycle-averaged local temperatures and Nusselt numbers for different kinetic Reynolds numbers were analyzed. ...
Dukhan, N.; Negron, J.M.G.; Feliciano, R.P. Telecommunications Energy Conference, 2004. INTELEC 2004. 26th Annual International, 2004
A one-dimensional heat transfer model for a thin piece of open-cell metal foam is presented. The model includes both the conduction in the ligaments, and the convection due to airflow in and around the pores of the foam. It uses the typical foam parameters provided by the manufacturers. Three aluminum foam samples having different relative surface areas, relative densities, ligament ...
Losito, O.; Barletta, D.; Dimiccoli, V. Electromagnetic Compatibility, IEEE Transactions on, 2010
The use of metal foam continues to grow in terms of research and application. Recently, new developments in the electromagnetic (EM) environment, such as shielding applications, have been proposed. A model of metal foam shielding is developed and discussed in this paper to characterize and simulate the EM shielding behavior. More specifically, the EM characterization has been considered, and experimental ...
Liu, X.; Gao, X.; Li, F.; Yu, H.; Ye, D. Magnetics, IEEE Transactions on, 2014
The paper mainly investigates the shear performance of a metal foam magnetorheological (MR) fluid damper. As for the damper, MR fluids are stored in metal foam, in the action of magnetic field, MR fluids are drawn out from the metal foam, and then fill the shear gap, thus, produce the MR effect. Based on previous research, as a sample, the ...
Dukhan, N.; Bodke, S. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on, 2010
Having a uniform temperature for electronics is part of thermal management in order to avoid hot spots and reduce thermal stresses in electronic systems. In many applications, thermal energy storage is required to receive, store, and subsequently release heat. The major disadvantage of phase change materials (PCMs) is their low thermal conductivities, which drastically slows the phase change process and ...
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