Conferences related to Environmental Stress

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2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.

  • 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The conference will cover diverse topics ranging from biomedical engineering to healthcare technologies to medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions and oral and poster sessions of unsolicited contributions. All papers will be peer reviewed and accepted papers of up to 4 pages will appear in the Conference Proceedings and be indexed by IEEE Xplore and Medline/PubMed.

  • 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.

  • 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The Annual International Conference of the IEEE Engineering in Medicine and Biology Society covers a broad spectrum of topics from biomedical engineering and physics to medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions, oral and poster sessions of unsolicited contributions. All papers will be peer reviewed and accepted papers of up to 4 pages will appear in the Conference Proceedings and be indexed by PubMed and EI. Prop

  • 2012 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2011 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc.

  • 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2009 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc


2011 IEEE 2nd International Conference on Computing, Control and Industrial Engineering (CCIE 2011)

This conference provides an idea-exchange platform for the engineers and academia interested in the hottest issue such as intelligent design, computer-aided design and intelligent manufacturing to explore new technologies, exchange new ideas. The aim is to promote the research of computing, control and industrial engineering from theoretical and applicable viewpoint.

  • 2010 International Conference on Computing, Control and Industrial Engineering (CCIE 2010)

    This conference provides an idea-exchange and discussion platform for researchers and practitioners interested in control research directions, novel applications, Human-machine interaction in digital processes, production planning and control, applications, evaluation and tools.



Periodicals related to Environmental Stress

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Reliability, IEEE Transactions on

Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.




Xplore Articles related to Environmental Stress

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A PoF approach to addressing defect-related reliability

R. Bauernschub; P. Lall Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium, 1994

This paper discusses using a physics-of-failure (PoF) approach to assessing the defect-related reliability of microelectronic components. Currently, there is no unified approach to some critical questions: What defects, environmental and test or screen loads are the reliability drivers for the device? What magnitudes of defects should be allowed to pass the screens? What is the correlation between the defect magnitudes ...


Life issues, robustness consequences and reliability challenges for Very Deep Sub Micron technologies

Philippe Perdu 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2010

Reliability and robustness are strongly linked: aging amplifies robustness issues while environmental stress accelerates aging. As Very Deep Sub Micron (VDSM) technologies offer early wear out and intrinsically lower margins, lifetime and EMC become a coupled challenge that underlines the need of a complete and multidisciplinary approach joining EMC, reliability, device characterization and internal testing skills. Trends, proof of evidence ...


Effect of thermal and humidity ageing on space charge accumulation in epoxy resin

Supriyo Das; Nandini Gupta 2013 IEEE International Conference on Solid Dielectrics (ICSD), 2013

Insulation systems are subjected to environmental stresses such as temperature and moisture. These atmospheric stresses cause ageing of polymeric dielectric materials through change in material properties. Under application of DC field, ageing might affect the accumulation of space charge within the dielectric material. As we are aware, space charge accumulation in a material has an important role to play in ...


Environmental stress testing experiment using the Taguchi method

D. E. Pachucki IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995

Manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are highly desirable in today's marketplace. The application of environmental stress screening (ESS) is a method of achieving these improvements. ESS is the application of stresses applied beyond product specification limits in order to find latent product defects. Utilizing ESS achieves increased robustness and lower infant ...


The Glaze Resistor - It's Structure and Reliability

E. Melan; A. Mones IEEE Transactions on Component Parts, 1964

Described herein are certain features of the microstructure of the palladium- silver-glass glaze resistor. Experimental evidence given indicates PdO to be a controlling factor in the conduction process. The effect of process variables on resistivity, TCR, and drift behavior under environmental stress are also discussed


More Xplore Articles

Educational Resources on Environmental Stress

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eLearning

A PoF approach to addressing defect-related reliability

R. Bauernschub; P. Lall Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium, 1994

This paper discusses using a physics-of-failure (PoF) approach to assessing the defect-related reliability of microelectronic components. Currently, there is no unified approach to some critical questions: What defects, environmental and test or screen loads are the reliability drivers for the device? What magnitudes of defects should be allowed to pass the screens? What is the correlation between the defect magnitudes ...


Life issues, robustness consequences and reliability challenges for Very Deep Sub Micron technologies

Philippe Perdu 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2010

Reliability and robustness are strongly linked: aging amplifies robustness issues while environmental stress accelerates aging. As Very Deep Sub Micron (VDSM) technologies offer early wear out and intrinsically lower margins, lifetime and EMC become a coupled challenge that underlines the need of a complete and multidisciplinary approach joining EMC, reliability, device characterization and internal testing skills. Trends, proof of evidence ...


Effect of thermal and humidity ageing on space charge accumulation in epoxy resin

Supriyo Das; Nandini Gupta 2013 IEEE International Conference on Solid Dielectrics (ICSD), 2013

Insulation systems are subjected to environmental stresses such as temperature and moisture. These atmospheric stresses cause ageing of polymeric dielectric materials through change in material properties. Under application of DC field, ageing might affect the accumulation of space charge within the dielectric material. As we are aware, space charge accumulation in a material has an important role to play in ...


Environmental stress testing experiment using the Taguchi method

D. E. Pachucki IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995

Manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are highly desirable in today's marketplace. The application of environmental stress screening (ESS) is a method of achieving these improvements. ESS is the application of stresses applied beyond product specification limits in order to find latent product defects. Utilizing ESS achieves increased robustness and lower infant ...


The Glaze Resistor - It's Structure and Reliability

E. Melan; A. Mones IEEE Transactions on Component Parts, 1964

Described herein are certain features of the microstructure of the palladium- silver-glass glaze resistor. Experimental evidence given indicates PdO to be a controlling factor in the conduction process. The effect of process variables on resistivity, TCR, and drift behavior under environmental stress are also discussed


More eLearning Resources

IEEE-USA E-Books

  • Benchmarking

    This chapter contains sections titled: Introduction to Benchmarking The AST Benchmarking Process Benchmarking Partnerships - Otis Elevator Company and United Technologies/3Com Corporation (U.S. Robotics) Benchmarking AST Survey Data Summary Acknowledgments References Appendix A Environmental Stress Screening Questionnaire - 1997 Appendix B Environmental Stress Screening Questionnaire - ;1996 & 1997 Results

  • Developmental Insights into Evolving Systems: Roles of Diversity, Non-Selection, Self-Organization, Symbiosis

    A developmental view of evolving systems (ecological, social, economical, organizational) is examined to clarify 1) the role of selection processes versus collective, non-selective processes, 2) the origins of diversity and its role in system performance and robustness 3) the origin of explicit subsystem interactions (cooperation/symbiosis that enhance individual and system performance, 4) the preconditions necessary for further evolutionary development, and 5) the effect of environmental timescales with adaptation timescales. Three sequential stages of evolving systems (based on the work of Salthe) are proposed: a Immature stage dominated by highly decentralized, selective processes with chaotic local and global dynamics, a Mature stage dominated by non-selective, self-organizing processes with global robustness but locally chaotic dynamics, and a Senescent stage dominated by rigid interactions with global fragility. A simple model problem with many optimal and non-optimal solutions - an agent solution to a maze - illustrates the entire developmental history. Within the model, the agents evolve their capability from a random approach to an optimized performance by natural selection. As the agents develop improved capability, natural selection becomes rare, and an emergent collective solution is observed that is better than the performance of an average agent. As the collective, self-organizing structures are incorporated into individual capability within a stable environment, constraints arise in the agent's interactions, and the system loses diversity. The resulting Senescent system exhibits reduced randomness due to the rigid structures and ultimately becomes fragile. Depending on the degree environmental change, the Senescent system will either "die," or collapse under environmental stress to the Mature or Immature stage, or incorporate the constrain ts system-wide into a new hierarchical system. The current study adds to the literature on developmental systems by finding: Transitions between stages are dependent on the degree of sustained environmental stability and how exclusive cooperation (e.g., symbiosis) in a subsystem can originate, and how it results in a decline in diversity

  • Liquid Environmental Stress Testing (LEST)

    This chapter contains sections titled: Advantages of Liquid Environmental Stress Testing Liquid Environmental Stress Testing Facility Thermal Considerations in Liquid Environmental Stress Testing Conclusions References

  • Manufacturing AST with Telecommunication ProductsReprinted from Quality Improvement Using Environmental Stress Testing, in the AT&T Technical Journal, pp. 1023, with permission from the authors and the AT&T Technical Journal 1992.

    AT&T and other leading manufacturers have developed techniques that use environmental stress testing to enhance the quality and reliability of electronics assemblies. These techniques consist primarily of applying thermal, vibration, and voltage stresses to components or assemblies during design and manufacturing. Environmental stress testing is a tool that is used to accelerate the detection of product weaknesses. When coupled with corrective-action programs, this tool also enhances product quality and reliability. This chapter discusses applications of environmental stress testing in the electronics industry. It also reviews the results of environmental stress testing at AT&T's Little Rock Operations Center in Arkansas as applied primarily to the manufacture of circuit-card assemblies. Introduction EST During Product Design (Design AST) Production EST (AST) Production EST (AST) Studies at AT&T Results of the Thermal Cycling Studies Acknowledgments References

  • Production AST with Computers Using the Taguchi Method - Reprinted from Environmental Stress Testing Experiment Using the Taguchi Method, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No.1, pp. 39, with permission from the author and the IEEE, 1995.

    Manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are highly desirable in today's marketplace. The application of environmental stress screening (ESS), i.e, Production AST, is a method of achieving these improvements. ESS is the application of stresses applied beyond product specification limits in order to find latent product defects. Utilizing ESS achieves increased robustness and lowers infant mortality. An experiment was performed to identify the significance or relevancy of the selected stresses for application in the printed wiring assembly (PWA) production process by using a statistically significant controlled method. The design of experiments statistical approach (analysis of variance) is applied, combined with the Taguchi two-level, seven- factor design method. This experiment concentrated on three stresses?-?temperature cycling, random vibration, and power cyling?-?and two diagnostic levels?-?a prom-based (programmable memory chip), power-on self test (POST), and a functional diagnostic test suite, contained on disk storage. This was not an optimization experiment. Once the significance to the production process is identified, future optimizing of temperature cycling, power cycling, and vibration screens will be conducted. Also, voltage margining was not included to reduce the complexity of the experiment- treatment factors and interactions. Experimental results and conclusions on the effectiveness of different stress regimens are presented in this chapter. Introduction Objectives Stress Overview Stress Screen Designs Experiment Overview The Taguchi Method Response Variable Results and Conclusions of the Taguchi Experiment Intra-Experiment Summary Taguchi Method Conclusion Terms Acknowledgments References

  • Design and Production AST with Power SuppliesReprinted with editing from Use of Environmental Stress Screening in Development and Manufacturing of Switching Power Supplies, Proceedings of the IES ESSEH Meeting, pp. 6569, with permission from the author and the Institute of Environmental Sciences (IES) 1990.

    This chapter contains sections titled: Background STRIFE in New Product Development (Design AST) ESS in Manufacturing (Production AST) Final Conclusions Acknowledgments



Standards related to Environmental Stress

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IEEE Standard for Environmental Assessment of Personal Computer Products, including Laptop Personal Computers, Desktop Personal Computers, and Personal Computer Monitors

This Standard defines environmental performance standards for personal computer products, including desktop computers, notebook computers, and computer monitors that are marketed to institutions, and includes key concepts and implementation procedures relating to reduction or elimination of environmentally sensitive materials, materials selection, design for end of life, life cycle extension, energy conservation, end of life management, corporate performance and packaging.



Jobs related to Environmental Stress

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