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2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.
This conference provides an idea-exchange platform for the engineers and academia interested in the hottest issue such as intelligent design, computer-aided design and intelligent manufacturing to explore new technologies, exchange new ideas. The aim is to promote the research of computing, control and industrial engineering from theoretical and applicable viewpoint.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.
J. C. Filippini; C. T. Meyer; M. El Kahel Conference on Electrical Insulation & Dielectric Phenomena - Annual Report 1982, 1982
In a previous communication  we have given a new idea to account for the propagation of water trees in polyethylene: the propagation of a channel of a water tree would be a fracture phenomenon similar to the propagation of a crack in a mechanically stressed material. Due to the presence of water in the channels, the parallel phenomenon would ...
N. Khan; D. Pinjala; M. K. Iyer; Liu Baomin; R. Mandal; Y. C. Mui 4th Electronics Packaging Technology Conference, 2002., 2002
Integrated circuit (IC) package manufacturing involves number of intricate process steps and is prone to defects, which will shorten product life. Hence early deduction of the defects is important for high production yield. One of the package screening tests is the burn-in test. As the IC package power drastically increased over the last decade, the design requirements of a burn- ...
Frank Proschan; Nozer D. Singpurwalla IEEE Transactions on Reliability, 1980
In a recent paper, the authors have proposed a new approach for making inferences from accelerated life tests. Their approach is appreciably different from those that have been considered in the past, and is motivated by what is actually done in practice. Prior information which is generally available to the engineer is incorporated by adopting a Bayesian point of view. ...
J. Moisel LEOS 2000. 2000 IEEE Annual Meeting Conference Proceedings. 13th Annual Meeting. IEEE Lasers and Electro-Optics Society 2000 Annual Meeting (Cat. No.00CH37080), 2000
Polymer waveguides are well suited for optical backplanes in avionic applications. The easy fabrication of complex waveguide structures is a major advantage over fiber based solutions. No critical behaviour of the polymers under environmental stress could be observed so far. However, the thermal stress has to be increased to allow extrapolation for longer lifecycles
Amr Haggag; Michael Phillips; J. K. Jerry Lee 2014 IEEE International Reliability Physics Symposium, 2014
As technology scales, the dominant die failure modes under voltage and environmental stress change to ones with higher acceleration factors suggesting industry standard electrical and environmental die qualification guidelines of stress tests are built with margin to cover mission life. Therefore running the full qualification helps demonstrate margin to the dominant failure modes yielding longer lifetime die.
Bioinformatics and Biomedical Technology (ICBBT), 2010 International Conference on, 2010
Log-phase cells of pathogenic Vibrio parahaemolyticus were incubated in warm seawater for starvation studies. The results showed that: the number of total bacteria, viable bacteria and culturable bacteria of V. parahaemolyticus all increased remarkably at the initial starvation stage; after reaching theirs peak at 15 d, both total bacterial number and viable bacterial number of V. parahaemolyticus fell slowly, while ...
Semiconductor Conference, 1999. CAS '99 Proceedings. 1999 International, 1999
The paper presents a method for the improvement of product reliability based on screening at the wafer fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish a mechanical screening procedure based on the correlation between the resistance to applied pressure of glass ...
Reliability and Maintainability Symposium (RAMS), 2013 Proceedings - Annual, 2013
This paper presents a case study depicting the use of a number of Reliability Tools following the: Define, Measure, Analyze, Improve, and Control (DMAIC) process to attain gains. A Failure Reporting Analysis and Corrective Action System (FRACAS) database is used to identify (hardware failure / program money) problems. A well-defined FRACAS database with a solidly defined root cause classification is ...
Transmission and Distribution Conference and Exposition, 2001 IEEE/PES, 2001
The aerospace, space and military industries have succeeded in using the discipline of reliability engineering to predict the mean-time-between-failure (MTBF) and the mean time to failure (MTTF) for complex electronic, optical and mechanical systems. As the power industry adopts new technologies to control and protect its assets, complex electronic and optical systems are becoming prevalent with the consequence that reliability ...
Reliability Physics Symposium, 1997. 35th Annual Proceedings., IEEE International, 1997
Via delamination, a novel electromigration failure mechanism, has been investigated and understood. The mass transport model, in conjunction with environmental, thermal, and mechanical stresses was proposed to explain this failure mechanism. Process enhancements, which include lowering the thin film stresses and strengthening the adhesion between the tungsten plug/metal stack and metal/inter-level dielectric interfaces, have effectively eliminated this reliability failure mode
Technology Discourse: Bio Fuels
Carl Selinger: Stuff you Don't Learn in Engineering School
Care Innovations: Toxics In Electronics (com legendas em portugues)
Care Innovations: Responsibility For Being Green (com legendas em portugues)
Larson Collection interview with Chauncey Starr
IEEE Medal of Honor Recipient (2008): Dr. Gordon Moore
Larson Collection interview with Alvin Weinberg
The 2010 IEEE Honors Ceremony
Production AST with Computers Using the Taguchi Method - Reprinted from Environmental Stress Testing Experiment Using the Taguchi Method, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No.1, pp. 39, with permission from the author and the IEEE, 1995.
Manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are highly desirable in today's marketplace. The application of environmental stress screening (ESS), i.e, Production AST, is a method of achieving these improvements. ESS is the application of stresses applied beyond product specification limits in order to find latent product defects. Utilizing ESS achieves increased robustness and lowers infant mortality. An experiment was performed to identify the significance or relevancy of the selected stresses for application in the printed wiring assembly (PWA) production process by using a statistically significant controlled method. The design of experiments statistical approach (analysis of variance) is applied, combined with the Taguchi two-level, seven- factor design method. This experiment concentrated on three stresses?-?temperature cycling, random vibration, and power cyling?-?and two diagnostic levels?-?a prom-based (programmable memory chip), power-on self test (POST), and a functional diagnostic test suite, contained on disk storage. This was not an optimization experiment. Once the significance to the production process is identified, future optimizing of temperature cycling, power cycling, and vibration screens will be conducted. Also, voltage margining was not included to reduce the complexity of the experiment- treatment factors and interactions. Experimental results and conclusions on the effectiveness of different stress regimens are presented in this chapter. Introduction Objectives Stress Overview Stress Screen Designs Experiment Overview The Taguchi Method Response Variable Results and Conclusions of the Taguchi Experiment Intra-Experiment Summary Taguchi Method Conclusion Terms Acknowledgments References
This chapter contains sections titled: Advantages of Liquid Environmental Stress Testing Liquid Environmental Stress Testing Facility Thermal Considerations in Liquid Environmental Stress Testing Conclusions References
A developmental view of evolving systems (ecological, social, economical, organizational) is examined to clarify 1) the role of selection processes versus collective, non-selective processes, 2) the origins of diversity and its role in system performance and robustness 3) the origin of explicit subsystem interactions (cooperation/symbiosis that enhance individual and system performance, 4) the preconditions necessary for further evolutionary development, and 5) the effect of environmental timescales with adaptation timescales. Three sequential stages of evolving systems (based on the work of Salthe) are proposed: a Immature stage dominated by highly decentralized, selective processes with chaotic local and global dynamics, a Mature stage dominated by non-selective, self-organizing processes with global robustness but locally chaotic dynamics, and a Senescent stage dominated by rigid interactions with global fragility. A simple model problem with many optimal and non-optimal solutions - an agent solution to a maze - illustrates the entire developmental history. Within the model, the agents evolve their capability from a random approach to an optimized performance by natural selection. As the agents develop improved capability, natural selection becomes rare, and an emergent collective solution is observed that is better than the performance of an average agent. As the collective, self-organizing structures are incorporated into individual capability within a stable environment, constraints arise in the agent's interactions, and the system loses diversity. The resulting Senescent system exhibits reduced randomness due to the rigid structures and ultimately becomes fragile. Depending on the degree environmental change, the Senescent system will either "die," or collapse under environmental stress to the Mature or Immature stage, or incorporate the constrain ts system-wide into a new hierarchical system. The current study adds to the literature on developmental systems by finding: Transitions between stages are dependent on the degree of sustained environmental stability and how exclusive cooperation (e.g., symbiosis) in a subsystem can originate, and how it results in a decline in diversity
Design and Production AST with Power SuppliesReprinted with editing from Use of Environmental Stress Screening in Development and Manufacturing of Switching Power Supplies, Proceedings of the IES ESSEH Meeting, pp. 6569, with permission from the author and the Institute of Environmental Sciences (IES) 1990.
This chapter contains sections titled: Background STRIFE in New Product Development (Design AST) ESS in Manufacturing (Production AST) Final Conclusions Acknowledgments
Manufacturing AST with Telecommunication ProductsReprinted from Quality Improvement Using Environmental Stress Testing, in the AT&T Technical Journal, pp. 1023, with permission from the authors and the AT&T Technical Journal 1992.
AT&T and other leading manufacturers have developed techniques that use environmental stress testing to enhance the quality and reliability of electronics assemblies. These techniques consist primarily of applying thermal, vibration, and voltage stresses to components or assemblies during design and manufacturing. Environmental stress testing is a tool that is used to accelerate the detection of product weaknesses. When coupled with corrective-action programs, this tool also enhances product quality and reliability. This chapter discusses applications of environmental stress testing in the electronics industry. It also reviews the results of environmental stress testing at AT&T's Little Rock Operations Center in Arkansas as applied primarily to the manufacture of circuit-card assemblies. Introduction EST During Product Design (Design AST) Production EST (AST) Production EST (AST) Studies at AT&T Results of the Thermal Cycling Studies Acknowledgments References
This chapter contains sections titled: Introduction to Benchmarking The AST Benchmarking Process Benchmarking PartnershipsÂ -Â Otis Elevator Company and United Technologies/3Com Corporation (U.S. Robotics) Benchmarking AST Survey Data Summary Acknowledgments References Appendix A Environmental Stress Screening QuestionnaireÂ -Â 1997 Appendix B Environmental Stress Screening QuestionnaireÂ -Â ;1996 & 1997 Results
This Standard defines environmental performance standards for personal computer products, including desktop computers, notebook computers, and computer monitors that are marketed to institutions, and includes key concepts and implementation procedures relating to reduction or elimination of environmentally sensitive materials, materials selection, design for end of life, life cycle extension, energy conservation, end of life management, corporate performance and packaging.
Test Engineering Technician II - Floor Support
Schweitzer Engineering Laboratories, Inc.