Conferences related to Environmental Stress

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2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.

  • 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The conference will cover diverse topics ranging from biomedical engineering to healthcare technologies to medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions and oral and poster sessions of unsolicited contributions. All papers will be peer reviewed and accepted papers of up to 4 pages will appear in the Conference Proceedings and be indexed by IEEE Xplore and Medline/PubMed.

  • 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The conference program will consist of plenary lectures, symposia, workshops and invited sessions of the latest significant findings and developments in all the major fields of biomedical engineering. Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.

  • 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The Annual International Conference of the IEEE Engineering in Medicine and Biology Society covers a broad spectrum of topics from biomedical engineering and physics to medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions, oral and poster sessions of unsolicited contributions. All papers will be peer reviewed and accepted papers of up to 4 pages will appear in the Conference Proceedings and be indexed by PubMed and EI. Prop

  • 2012 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2011 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc.

  • 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc

  • 2009 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

    The annual conference of EMBS averages 2000 attendees from over 50 countries. The scope of the conference is general in nature to focus on the interdisciplinary fields of biomedical engineering. Themes included but not limited to are: Imaging, Biosignals, Biorobotics, Bioinstrumentation, Neural, Rehabilitation, Bioinformatics, Healthcare IT, Medical Devices, etc


2011 IEEE 2nd International Conference on Computing, Control and Industrial Engineering (CCIE 2011)

This conference provides an idea-exchange platform for the engineers and academia interested in the hottest issue such as intelligent design, computer-aided design and intelligent manufacturing to explore new technologies, exchange new ideas. The aim is to promote the research of computing, control and industrial engineering from theoretical and applicable viewpoint.

  • 2010 International Conference on Computing, Control and Industrial Engineering (CCIE 2010)

    This conference provides an idea-exchange and discussion platform for researchers and practitioners interested in control research directions, novel applications, Human-machine interaction in digital processes, production planning and control, applications, evaluation and tools.


2009 IEEE/WIC/ACM International Joint Conferences on Web Intelligence (WI) and Intelligent Agent Technologies (IAT)


OCEANS 2005



Periodicals related to Environmental Stress

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Reliability, IEEE Transactions on

Principles and practices of reliability, maintainability, and product liability pertaining to electrical and electronic equipment.



Most published Xplore authors for Environmental Stress

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Xplore Articles related to Environmental Stress

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Maximizing ROI by minimizing process variability

M. Arjunan Annual Reliability and Maintainability Symposium. 1991 Proceedings, 1991

There seems to be an apparent dilemma between the increasingly popular concepts of total quality management (TQM), and the environmental stress screening (ESS) concepts of reliability engineering. TQM tends to reduce the variability of the process and the defects in the process, while reliability engineering tends to induce the defects in the manufacturing process in the plant so they will ...


Reliability assessment under real world environmental stress

Jie Lan; Ming Yuan; Hong-Jie Yuan; Peng Lv 2017 Second International Conference on Reliability Systems Engineering (ICRSE), 2017

The traditional reliability assessment method only considers the product under the condition of constant environmental stress. However, the products are often actually exposed to the real world environmental stress. Aiming to solve this problem, the real world environmental stress of the typical geographical location is introduced, and the five-parameter polynomial fitting method is used to deal with its historical climate ...


Effects of corona discharge on the properties of fiber reinforced plastics used in composite insulator

Yiming Yao; Weining Bao; Yanfeng Gao; Chao Wu; Xidong Liang; Yingyan Liu 2016 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), 2016

Fiber reinforced plastics (FRP) have been widely used as composite insulator inner rod material due to its excellent mechanical properties. In practice, composite insulator suffers from many kinds of environmental, electrical and mechanical stresses, such as discharge, pollution and liquids ingress. Under normal circumstances, the FRP rod is covered with the silicone rubber sheath, so there is no discharge happened ...


Reliability improvement - a plan to achieve and measure reliability of aircraft equipment

J. E. Luckman Transactions of the American Institute of Electrical Engineers, Part II: Applications and Industry, 1955

ALL procurements and procurement specifications are made with an attempt to obtain equipments that are reliable. The present, classical method of attempting to achieve this is to require that the equipment operate satisfactorily when exposed to a level of environmental stress called for in the governing specification. Usually, these environmental conditions are applied singly, and all are not necessarily applied ...


Day 1: Invited talk 1: IC qualification, testing & manufacturing using advanced package offerings & adequate process technologies

Mohamed Djadoudi 2014 9th International Design and Test Symposium (IDT), 2014

Today's customer demands and expectations require safe launch in mass production of a qualified & designed IC. The Qualification process, in general, is well known (established) in the semiconductor industry and mostly guided (driven) by well-defined standards and accepted by the semiconductor community and users. The actual summary outlines, in general, a set of information to be used as guideline ...


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Educational Resources on Environmental Stress

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eLearning

Maximizing ROI by minimizing process variability

M. Arjunan Annual Reliability and Maintainability Symposium. 1991 Proceedings, 1991

There seems to be an apparent dilemma between the increasingly popular concepts of total quality management (TQM), and the environmental stress screening (ESS) concepts of reliability engineering. TQM tends to reduce the variability of the process and the defects in the process, while reliability engineering tends to induce the defects in the manufacturing process in the plant so they will ...


Reliability assessment under real world environmental stress

Jie Lan; Ming Yuan; Hong-Jie Yuan; Peng Lv 2017 Second International Conference on Reliability Systems Engineering (ICRSE), 2017

The traditional reliability assessment method only considers the product under the condition of constant environmental stress. However, the products are often actually exposed to the real world environmental stress. Aiming to solve this problem, the real world environmental stress of the typical geographical location is introduced, and the five-parameter polynomial fitting method is used to deal with its historical climate ...


Effects of corona discharge on the properties of fiber reinforced plastics used in composite insulator

Yiming Yao; Weining Bao; Yanfeng Gao; Chao Wu; Xidong Liang; Yingyan Liu 2016 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), 2016

Fiber reinforced plastics (FRP) have been widely used as composite insulator inner rod material due to its excellent mechanical properties. In practice, composite insulator suffers from many kinds of environmental, electrical and mechanical stresses, such as discharge, pollution and liquids ingress. Under normal circumstances, the FRP rod is covered with the silicone rubber sheath, so there is no discharge happened ...


Reliability improvement - a plan to achieve and measure reliability of aircraft equipment

J. E. Luckman Transactions of the American Institute of Electrical Engineers, Part II: Applications and Industry, 1955

ALL procurements and procurement specifications are made with an attempt to obtain equipments that are reliable. The present, classical method of attempting to achieve this is to require that the equipment operate satisfactorily when exposed to a level of environmental stress called for in the governing specification. Usually, these environmental conditions are applied singly, and all are not necessarily applied ...


Day 1: Invited talk 1: IC qualification, testing & manufacturing using advanced package offerings & adequate process technologies

Mohamed Djadoudi 2014 9th International Design and Test Symposium (IDT), 2014

Today's customer demands and expectations require safe launch in mass production of a qualified & designed IC. The Qualification process, in general, is well known (established) in the semiconductor industry and mostly guided (driven) by well-defined standards and accepted by the semiconductor community and users. The actual summary outlines, in general, a set of information to be used as guideline ...


More eLearning Resources

IEEE-USA E-Books

  • Manufacturing AST with Telecommunication ProductsReprinted from Quality Improvement Using Environmental Stress Testing, in the AT&T Technical Journal, pp. 1023, with permission from the authors and the AT&T Technical Journal 1992.

    AT&T and other leading manufacturers have developed techniques that use environmental stress testing to enhance the quality and reliability of electronics assemblies. These techniques consist primarily of applying thermal, vibration, and voltage stresses to components or assemblies during design and manufacturing. Environmental stress testing is a tool that is used to accelerate the detection of product weaknesses. When coupled with corrective-action programs, this tool also enhances product quality and reliability. This chapter discusses applications of environmental stress testing in the electronics industry. It also reviews the results of environmental stress testing at AT&T's Little Rock Operations Center in Arkansas as applied primarily to the manufacture of circuit-card assemblies. Introduction EST During Product Design (Design AST) Production EST (AST) Production EST (AST) Studies at AT&T Results of the Thermal Cycling Studies Acknowledgments References

  • Developmental Insights into Evolving Systems: Roles of Diversity, Non-Selection, Self-Organization, Symbiosis

    A developmental view of evolving systems (ecological, social, economical, organizational) is examined to clarify 1) the role of selection processes versus collective, non-selective processes, 2) the origins of diversity and its role in system performance and robustness 3) the origin of explicit subsystem interactions (cooperation/symbiosis that enhance individual and system performance, 4) the preconditions necessary for further evolutionary development, and 5) the effect of environmental timescales with adaptation timescales. Three sequential stages of evolving systems (based on the work of Salthe) are proposed: a Immature stage dominated by highly decentralized, selective processes with chaotic local and global dynamics, a Mature stage dominated by non-selective, self-organizing processes with global robustness but locally chaotic dynamics, and a Senescent stage dominated by rigid interactions with global fragility. A simple model problem with many optimal and non-optimal solutions - an agent solution to a maze - illustrates the entire developmental history. Within the model, the agents evolve their capability from a random approach to an optimized performance by natural selection. As the agents develop improved capability, natural selection becomes rare, and an emergent collective solution is observed that is better than the performance of an average agent. As the collective, self-organizing structures are incorporated into individual capability within a stable environment, constraints arise in the agent's interactions, and the system loses diversity. The resulting Senescent system exhibits reduced randomness due to the rigid structures and ultimately becomes fragile. Depending on the degree environmental change, the Senescent system will either "die," or collapse under environmental stress to the Mature or Immature stage, or incorporate the constrain ts system-wide into a new hierarchical system. The current study adds to the literature on developmental systems by finding: Transitions between stages are dependent on the degree of sustained environmental stability and how exclusive cooperation (e.g., symbiosis) in a subsystem can originate, and how it results in a decline in diversity

  • Design and Production AST with Power SuppliesReprinted with editing from Use of Environmental Stress Screening in Development and Manufacturing of Switching Power Supplies, Proceedings of the IES ESSEH Meeting, pp. 6569, with permission from the author and the Institute of Environmental Sciences (IES) 1990.

    This chapter contains sections titled: Background STRIFE in New Product Development (Design AST) ESS in Manufacturing (Production AST) Final Conclusions Acknowledgments

  • Liquid Environmental Stress Testing (LEST)

    This chapter contains sections titled: Advantages of Liquid Environmental Stress Testing Liquid Environmental Stress Testing Facility Thermal Considerations in Liquid Environmental Stress Testing Conclusions References

  • Production AST with Computers Using the Taguchi Method - Reprinted from Environmental Stress Testing Experiment Using the Taguchi Method, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No.1, pp. 39, with permission from the author and the IEEE, 1995.

    Manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are highly desirable in today's marketplace. The application of environmental stress screening (ESS), i.e, Production AST, is a method of achieving these improvements. ESS is the application of stresses applied beyond product specification limits in order to find latent product defects. Utilizing ESS achieves increased robustness and lowers infant mortality. An experiment was performed to identify the significance or relevancy of the selected stresses for application in the printed wiring assembly (PWA) production process by using a statistically significant controlled method. The design of experiments statistical approach (analysis of variance) is applied, combined with the Taguchi two-level, seven- factor design method. This experiment concentrated on three stresses?-?temperature cycling, random vibration, and power cyling?-?and two diagnostic levels?-?a prom-based (programmable memory chip), power-on self test (POST), and a functional diagnostic test suite, contained on disk storage. This was not an optimization experiment. Once the significance to the production process is identified, future optimizing of temperature cycling, power cycling, and vibration screens will be conducted. Also, voltage margining was not included to reduce the complexity of the experiment- treatment factors and interactions. Experimental results and conclusions on the effectiveness of different stress regimens are presented in this chapter. Introduction Objectives Stress Overview Stress Screen Designs Experiment Overview The Taguchi Method Response Variable Results and Conclusions of the Taguchi Experiment Intra-Experiment Summary Taguchi Method Conclusion Terms Acknowledgments References

  • Benchmarking

    This chapter contains sections titled: Introduction to Benchmarking The AST Benchmarking Process Benchmarking Partnerships - Otis Elevator Company and United Technologies/3Com Corporation (U.S. Robotics) Benchmarking AST Survey Data Summary Acknowledgments References Appendix A Environmental Stress Screening Questionnaire - 1997 Appendix B Environmental Stress Screening Questionnaire - ;1996 & 1997 Results



Standards related to Environmental Stress

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IEEE Standard for Environmental Assessment of Personal Computer Products, including Laptop Personal Computers, Desktop Personal Computers, and Personal Computer Monitors

This Standard defines environmental performance standards for personal computer products, including desktop computers, notebook computers, and computer monitors that are marketed to institutions, and includes key concepts and implementation procedures relating to reduction or elimination of environmentally sensitive materials, materials selection, design for end of life, life cycle extension, energy conservation, end of life management, corporate performance and packaging.



Jobs related to Environmental Stress

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