Mass production

View this topic in
Mass production (also called flow production, repetitive flow production, series production, or serial production) is the production of large amounts of standardized products, including and especially on assembly lines. (Wikipedia.org)






Conferences related to Mass production

Back to Top

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 IEEE 13th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

IEEE CPE-POWERENG is one important conference of the IEEE Industrial Electronics Society devoted to the dissemination of new ideas, research and works in progress within the fields of power generation, transmission and distribution, power electronics, renewable energy integration, power systems electro-mechanical energy conversion, automation and EMI issues. IEEE CPE-POWERENG 2019 will be held in Sonderborg, Denmark, from April 23 to 25, 2019.

  • 2017 11th IEEE International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

    IEEE CPE-POWERENG is one important conference of the IEEE Industrial Electronics Society devoted to the dissemination of new ideas, research and works in progress within the fields of power generation, transmission and distribution, power electronics, renewable energy integration, power systems electro-mechanical energy conversion, automation and EMI issues. Topics: The scope of the conference will cover, but will not be limited to, the following topics:• Power Generation, Transmission and Distribution• Smartgrid Technologies & Applications• Power electronics and controllers for microgrids• Specific power electronics for high-power systems• Integration of Renewable Energy Sources• Energy storage systems • Power Electronics Controllers for Power Systems• Electro-Mechanical Energy Conversion• Power Electronic Systems and Applications• Power electronics for electric vehicles• Advanced Control methods for power systems• EMI Issues

  • 2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

    CPE-POWERENG’2016 will be a joint conference of the 10th edition of CPE (the International Conference on Compatibility and Power Electronics) and the 6th edition of POWERENG (International Conference on Power Engineering, Energy and Electrical Drives). Conference CPE-POWERENG 2016 will be an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of both power electronics and power engineering application in different systems.

  • 2015 9th International Conference on Compatibility and Power Electronics (CPE)

    In the field of electrical engineering, power electronics is being dynamically developed, finding its application in several industrial branches. Many production technologies became more efficient, when applying power electronics equipment. Power electronics and energy systems integration provide high standards of human friendly environment. The next generation of power electronics systems must change environmental factors, customer concerns and reliability.International Conference on Compatibility and Power Electronics is an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.The first conference of the International Conference-Workshop on Compatibility and Power Electronics series was first held in 1999. From its beginning the objective of CPE has been to offer a wide forum of discussion to power electronics specialists.

  • 2013 International Conference on Compatibility and Power Electronics (CPE)

    Conference-Workshop CPE 2013 will be an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.

  • 2011 7th International Conference-Workshop "Compatibility And Power Electronics" (CPE)

    Conference-Workshop CPE'2011 will be an International wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.

  • 2009 Compatibility and Power Electronics (CPE)

    Conference-Workshop CPE 2009 will be an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.

  • 2007 Compatibility in Power Electronics (CPE)

  • 2005 Compatibility in Power Electronics (CPE)


2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

The conference is the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 28th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

A: BREAKDOWN AND FLASHOVERA1. Vacuum breakdown and pre-breakdown phenomenaA2. Surface discharges and flashover phenomenaB: VACUUM ARCSB1. Switching in vacuum and related phenomenaB2. Interaction of vacuum arcs with magnetic fieldsB3. Vacuum arc physicsB4. Computer modeling and computer aided designB5. Pulsed power physics and technologyC: APPLICATIONSC1. Vacuum interrupters and their applicationsC2. Surface modification and related technologiesC3. Electron, ion, neutron, X-ray and other beam and light sources


More Conferences

Periodicals related to Mass production

Back to Top

Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


More Periodicals

Most published Xplore authors for Mass production

Back to Top

Xplore Articles related to Mass production

Back to Top

Yield analysis of a novel scheme for defect-tolerant memories

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA', u'full_name': u'I. Koren'}, {u'author_order': 2, u'full_name': u'Z. Koren'}] 1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon, None

The recent increases in the size of memory ICs have made designers realize that there exists a need for new defect-tolerance techniques, since the traditional methods are no longer effective. One such new technique, the Flexible Multi-Macro (FMM) technique has recently been suggested and implemented in a 1 Gb DRAM circuit. In this paper we present a yield analysis of ...


Towards a World Without Test Escapes: The Use of Volume Diagnosis to Improve Test Quality

[{u'author_order': 1, u'affiliation': u'NXP Semiconductors, Gerstweg 2, FD3, 6534AE Nijmegen, The Netherlands', u'full_name': u'Stefan Eichenberger'}, {u'author_order': 2, u'affiliation': u'NXP Semiconductors, Prof. Holstlaan, HTC-37, 5656AA Eindhoven, The Netherlands', u'full_name': u'Jeroen Geuzebroek'}, {u'author_order': 3, u'affiliation': u'NXP Semiconductors, Prof. Holstlaan, HTC-37, 5656AA Eindhoven, The Netherlands', u'full_name': u'Camelia Hora'}, {u'author_order': 4, u'affiliation': u'NXP Semiconductors, Prof. Holstlaan, HTC-37, 5656AA Eindhoven, The Netherlands', u'full_name': u'Bram Kruseman'}, {u'author_order': 5, u'affiliation': u'NXP Semiconductors, Prof. Holstlaan, HTC-37, 5656AA Eindhoven, The Netherlands', u'full_name': u'Ananta Majhi'}] 2008 IEEE International Test Conference, None

With test quality being an imperative, this paper presents a methodology on how to apply volume scan diagnosis - known from the field of yield learning - to the domain of test quality learning. Volume diagnosis allows to drastically accelerate the learning cycle. We give guidelines on how to improve test pattern generation strategies and try to answer which defects ...


Plastic-Type OPLEAF as High Density Fiber Array for Minimized Lateral Device Spacing Optical ICs

[{u'author_order': 1, u'affiliation': u'Namiki Precision Jewel Co. Ltd., Tokyo', u'full_name': u'T. Sonobe'}, {u'author_order': 2, u'affiliation': u'Namiki Precision Jewel Co. Ltd., Tokyo', u'full_name': u'N. Hiroi'}, {u'author_order': 3, u'full_name': u'M. Takenaka'}, {u'author_order': 4, u'full_name': u'Y. Nakano'}, {u'author_order': 5, u'full_name': u'H. Fujita'}] IEEE/LEOS International Conference on Optical MEMS and Their Applications Conference, 2006., None

We have developed an OPLEAF that serves as the interface between optical fibers and a high density optical IC. Improved from our previous report in which a plastic type of OPLEAF has fabricated for cheap and mass production


How far the production system of Korean automobile companies transferred to the ‘Lean’ production system?

[{u'author_order': 1, u'affiliation': u'School of Business Administration, University of Ulsan, 680-749 Korea', u'full_name': u'Jong-Yeol Kang'}] 2007 International Forum on Strategic Technology, None

The production system of world automobile industry is in the transition from traditional mass production system to the dasialeanpsila production system as the world automobile market and production environment has been changing. This paper reviews the development process of the production system of Korean automobile industry and identifies major characteristics of it in order to recognize Korean automobile industry having ...


Double K-Shell Vacancy Sharing in Ion-Atom Collisions

[{u'author_order': 1, u'affiliation': u'Atomic Energy of Canada Limited, Chalk River, Ontario, Canada KOJ 1JO', u'full_name': u'W. N. Lennard'}, {u'author_order': 2, u'affiliation': u'Atomic Energy of Canada Limited, Chalk River, Ontario, Canada KOJ 1JO', u'full_name': u'I. V. Mitchell'}] IEEE Transactions on Nuclear Science, 1979

Data are presented for the two-electron one-photon (Kaa) decay mode of double K vacancies distributed between two collision partners. The data were generated from a variety of asymmetric heavy ion-atom systems. We propose a model for KK-vacancy sharing that predicts a double K-vacancy ratio RKK = exp(-4XK) R2K, where RK is the familiar single K-vacancy ratio. This prediction is consistent ...


More Xplore Articles

Educational Resources on Mass production

Back to Top

eLearning

No eLearning Articles are currently tagged "Mass production"

IEEE.tv Videos

ITEC 2014: Urban Mass Transit Systems: Current Status and Future Trends
Advances in MgB2 - ASC-2014 Plenary series - 7 of 13 - Wednesday 2014/8/13
IMS 2011 Microapps - Improved Microwave Device Characterization and Qualification Using Affordable Microwave Microprobing Techniques for High-Yield Production of Microwave Components
MicroApps: Streamlining Radio Communication Link Design from Specifcation to Production (AWR)
IEEE Entrepreneurship @ #CollisionConf: Carbon Robotics
Injury Evaluation of Human-Robot Impacts
Food Engineering - The Future is Now: 2017 Brain Fuel President's Chat
Expert Panel: Opportunity Landscape Review - Internet Inclusion: Global Connect Stakeholders Advancing Solutions, Washington DC, 2016
IEEE 3D Standards-Based Medical Applications and 3D Printing: Young Lae Moon
Transportation Electrification: Green Public & Comercial Transportation
Quadrotor Trajectory Tracking with L1 Optimal control
IEEE 5G Podcast with the Experts: What challenges do you foresee that could affect deployment of 5G?
IEEE 5G Podcast with the Experts: The Future of Mobile Beyond 5G: Part 1 - Mischa Dohler
Brooklyn 5G Summit 2017 - Day 2 Full Stream
IEEE 5G Podcast with the Experts: What is your boldest vision of what 5G can bring us?
Q&A with Dr. Bill Tonti: IEEE Rebooting Computing Podcast, Episode 3
IEEE 5G Podcast with the Experts: The Future of Mobile Beyond 5G: Part 2 - Mischa Dohler
Algorithmic Decision Making: Impacts and Implications - IEEE Internet Initiative Webinar
Voltage Metrology with Superconductive Electronics
Charging Ahead: the Case for Plug-in Hybrid Cars

IEEE-USA E-Books

  • Riding the Flat Wheel Limited"Overseeing a Mass Production Industry

  • Supplying a Mass Production IndustryThe Civilian Government Steps In

  • Interconnects

    This chapter discusses the hierarchy of interconnection in ball grid array (BGA). The combination of eutectic bumps and the organic (FR4)‐based manufacturing processes are sound in thermal hierarchy, and thus, become mass production technology. The chapter focuses on the introduction to Level 1 interconnection, and gap in FC‐PBGA interconnection, and Level 0.5 interconnection. It presents discussion on the changing dynamics in business for more Moore (MM) and more than Moore (MTM), as a result of new through silicon via (TSV) interconnection technology. The chapter also discusses the changing semiconductor business dynamics. It summarizes the metallization used in silicon and III‐V compound semiconductors for wirebond and flip chip interconnections. The chapter shows that aluminum pads only exist on silicon, Gold (Au) pads only exist on III‐V, and Copper (Cu) can exist on both silicon and III‐V compound semiconductor integrated circuits (IC).

  • Flexible OLEDs

    One of the significant advantages of OLEDs is that they can be fabricated on flexible substrates. The use of flexible substrates instead of conventional glass substrates can significantly reduce the thickness and weight of displays and lighting. In addition, flexible OLEDs bring about additional attractive features from the product design point of view, because flexible OLEDs can provide such unique designs as curved, bent, folded, rolled, and ultimately flexible. Moreover, use of flexible substrates has great potential of production innovation such as utilization of roll¿¿¿to¿¿¿roll (R2R) process with low mass¿¿¿production cost. As the candidates for flexible substrates, ultra¿¿¿thin glasses, stainless steel foils and plastic films are well known. This chapter describes current status and future potential of three types of flexible substrates and their applications to flexible OLED displays and lightings.

  • Samuel Insull: Architect and Prime Mover of the Electric Utility Business in the United States

    This chapter contains sections titled: Dynamics of Growth and Consolidation, Early Years, Chicago, Urban Politics, Natural Monopoly, and State Regulation, Growth and Mass Production, Regional Outreach, Origins of the Holding Company, Lessons Learned, Holding Company Principles Applied, Political Backlash, Restless Expansion; Pyramiding and the Crash, New Deal; Trial; Acquittal, Legislative Response, Coda

  • Affordable Manufacturing



Standards related to Mass production

Back to Top

No standards are currently tagged "Mass production"


Jobs related to Mass production

Back to Top