Mass production

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Mass production (also called flow production, repetitive flow production, series production, or serial production) is the production of large amounts of standardized products, including and especially on assembly lines. (Wikipedia.org)






Conferences related to Mass production

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 IEEE 13th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

IEEE CPE-POWERENG is one important conference of the IEEE Industrial Electronics Society devoted to the dissemination of new ideas, research and works in progress within the fields of power generation, transmission and distribution, power electronics, renewable energy integration, power systems electro-mechanical energy conversion, automation and EMI issues. IEEE CPE-POWERENG 2019 will be held in Sonderborg, Denmark, from April 23 to 25, 2019.

  • 2017 11th IEEE International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

    IEEE CPE-POWERENG is one important conference of the IEEE Industrial Electronics Society devoted to the dissemination of new ideas, research and works in progress within the fields of power generation, transmission and distribution, power electronics, renewable energy integration, power systems electro-mechanical energy conversion, automation and EMI issues. Topics: The scope of the conference will cover, but will not be limited to, the following topics:• Power Generation, Transmission and Distribution• Smartgrid Technologies & Applications• Power electronics and controllers for microgrids• Specific power electronics for high-power systems• Integration of Renewable Energy Sources• Energy storage systems • Power Electronics Controllers for Power Systems• Electro-Mechanical Energy Conversion• Power Electronic Systems and Applications• Power electronics for electric vehicles• Advanced Control methods for power systems• EMI Issues

  • 2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

    CPE-POWERENG’2016 will be a joint conference of the 10th edition of CPE (the International Conference on Compatibility and Power Electronics) and the 6th edition of POWERENG (International Conference on Power Engineering, Energy and Electrical Drives). Conference CPE-POWERENG 2016 will be an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of both power electronics and power engineering application in different systems.

  • 2015 9th International Conference on Compatibility and Power Electronics (CPE)

    In the field of electrical engineering, power electronics is being dynamically developed, finding its application in several industrial branches. Many production technologies became more efficient, when applying power electronics equipment. Power electronics and energy systems integration provide high standards of human friendly environment. The next generation of power electronics systems must change environmental factors, customer concerns and reliability.International Conference on Compatibility and Power Electronics is an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.The first conference of the International Conference-Workshop on Compatibility and Power Electronics series was first held in 1999. From its beginning the objective of CPE has been to offer a wide forum of discussion to power electronics specialists.

  • 2013 International Conference on Compatibility and Power Electronics (CPE)

    Conference-Workshop CPE 2013 will be an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.

  • 2011 7th International Conference-Workshop "Compatibility And Power Electronics" (CPE)

    Conference-Workshop CPE'2011 will be an International wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.

  • 2009 Compatibility and Power Electronics (CPE)

    Conference-Workshop CPE 2009 will be an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.

  • 2007 Compatibility in Power Electronics (CPE)

  • 2005 Compatibility in Power Electronics (CPE)


2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

The conference is the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 28th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

A: BREAKDOWN AND FLASHOVERA1. Vacuum breakdown and pre-breakdown phenomenaA2. Surface discharges and flashover phenomenaB: VACUUM ARCSB1. Switching in vacuum and related phenomenaB2. Interaction of vacuum arcs with magnetic fieldsB3. Vacuum arc physicsB4. Computer modeling and computer aided designB5. Pulsed power physics and technologyC: APPLICATIONSC1. Vacuum interrupters and their applicationsC2. Surface modification and related technologiesC3. Electron, ion, neutron, X-ray and other beam and light sources


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Periodicals related to Mass production

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Xplore Articles related to Mass production

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Evaluation of mass-produced commercial LiTaO/sub 3/ single crystals using the LFB ultrasonic material characterization system

[{u'author_order': 1, u'affiliation': u'Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan', u'full_name': u'J. Kushibiki'}, {u'author_order': 2, u'affiliation': u'Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan', u'full_name': u'Y. Ohashi'}, {u'author_order': 3, u'full_name': u'M. Mochizuki'}] IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2004

A mass-production line of lithium tantalate (LiTaO/sub 3/) crystals with a maximum charge number of 60 for surface acoustic wave (SAW) devices was evaluated with the line-focus-beam (LFB) ultrasonic material characterization system. Some serious problems associated with chemical compositions were observed and resolved by measuring the velocities of Rayleigh-type leaky surface acoustic waves (LSAWs), V/sub LSAW/, for two groups of ...


Optimization of the distribution of the observations of the oscillatory system

[{u'author_order': 1, u'affiliation': u'Inst. of Space Res., Acad. of Sci., Moscow, Russia', u'full_name': u'B. T. Bakhshiyan'}, {u'author_order': 2, u'full_name': u'O. A. Bayuk'}] 1997 1st International Conference, Control of Oscillations and Chaos Proceedings (Cat. No.97TH8329), None

Let θ be the m-vector of the unknown parameters, and suppose ri(i=l,...m) are number of the measurements of the functions HiTθ, where HiT are given vectors. Assume, that the errors of the measurements εi are mutually uncorrelated random values with expectations being zero and variances being σi. So, if yi are the mean values of ri measured values then averaged ...


New approach: Sample preparation methodology for P-V metal void inspection

[{u'author_order': 1, u'affiliation': u'United Microelectronics Corporation, Ltd. No. 3, Li-Hsin Rd. II, Hsinchu Science Park, Taiwan 300, China', u'full_name': u'Po Fu Chou'}, {u'author_order': 2, u'affiliation': u'United Microelectronics Corporation, Ltd. No. 3, Li-Hsin Rd. II, Hsinchu Science Park, Taiwan 300, China', u'full_name': u'Ru Yu Lin'}, {u'author_order': 3, u'affiliation': u'United Microelectronics Corporation, Ltd. No. 3, Li-Hsin Rd. II, Hsinchu Science Park, Taiwan 300, China', u'full_name': u'Tung-Hung Chen'}] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, None

The metal void information is very important for engineers to monitor the stability of the process and equipment during mass production and process tuning. However, traditional methods (X-S and P-V) are not efficient for metal void inspection. Therefore, the novel methodology is developed in this paper to provide a time efficient sample preparation method and acceptable view region for plane-view ...


Increasing signal accuracy of automotive wheel-speed sensors by online learning

[{u'author_order': 1, u'affiliation': u'Inst. of Autom. Control, Darmstadt Univ. of Technol., Germany', u'full_name': u'R. Schwarz'}, {u'author_order': 2, u'full_name': u'O. Nelles'}, {u'author_order': 3, u'full_name': u'P. Scheerer'}, {u'author_order': 4, u'full_name': u'R. Isermann'}] Proceedings of the 1997 American Control Conference (Cat. No.97CH36041), None

The wheel speed is an important signal for modern automotive control systems. The performance of these systems is closely related to the quality of the processed wheel speed. However, due to manufacturing tolerances or corrosion respectively of the sensor gear wheel, the quality of the signal is affected negatively. In this paper a software-based method to compensate for the mechanical ...


Cellulose modification study by e-beam irradiation & its applications

[{u'author_order': 1, u'affiliation': u'Korea Accelerator and Plasma Research Association, Cheorwon 269-843, South Korea', u'full_name': u'Kangok Lee'}, {u'author_order': 2, u'affiliation': u'Korea Accelerator and Plasma Research Association, Cheorwon 269-843, South Korea', u'full_name': u'Gyuyeop Lee'}, {u'author_order': 3, u'affiliation': u'Korea Accelerator and Plasma Research Association, Cheorwon 269-843, South Korea', u'full_name': u'Kyeongho Han'}, {u'author_order': 4, u'affiliation': u'Korea Accelerator and Plasma Research Association, Cheorwon 269-843, South Korea', u'full_name': u'Jaedek Han'}, {u'author_order': 5, u'affiliation': u'Korea Accelerator and Plasma Research Association, Cheorwon 269-843, South Korea', u'full_name': u'Kiehyung Chung'}] 2008 IEEE 35th International Conference on Plasma Science, None

Fossil fuel reserves would be exhausted at the current rate of consumption in the near future. So an alternative renewable energy technique for producing alcohol by fermenting an alcohol spawn of grain has been developed in many countries. Cellulose is not easy to hydrolyze and lignin and hemi-cellulose are bad in accessibility, a manufacturing process is lengthy and not efficient. ...


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Educational Resources on Mass production

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eLearning

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IEEE.tv Videos

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IEEE-USA E-Books

  • Riding the Flat Wheel Limited"Overseeing a Mass Production Industry

    This chapter contains sections titled: * ?>The Action of One Producer in Withholding From the Industry Information Pertinent to the Best Processing Methods ... Must Not Be Tolerated" * ?>It Is Recommended That This Machine Be Investigated..." * ?>I Spent Many Nights on Trains between Washington, Chicago, and Kansas City" * ?>The Crystal Department Has Been the Stepchild ..." * ?>If You Fellas Can Demonstrate the Ability to Make Crystals, We Will Give Both of You Deferments" * ?>I Don't Need Any More Equipment for Testing" * ?>In View of the Extremely Critical Raw Quartz Supply Situation ..."

  • Supplying a Mass Production IndustryThe Civilian Government Steps In

    This chapter contains sections titled: * ?>To Provide for the Common Defense by Acquiring Stocks of Strategic and Critical Materials ..." * ?>In Summary, Your Proposed Stockpile Is One Which Is Impossible to Meet Prior to about 1950" * ?>An Immediate Increase in the Inspection Rate of the Bureau of Standards Is Imperative" * ?>The Metals Reserve Company, an Agency of the Government of the United States, Is Hereby Designated as the Buyer" * ?>The U.S. Commission Here Are Ruining the Market and Making Damn Fools of Themselves ..." * ?>We Feel That You Are Contributing a Very Valuable Service to the War Effort in the Transportation of This Strategic Raw Material" * ?>One Small Consumer Is Complaining Bitterly about the Quality of the Material Which He Received" * ?>It Has Come to the Attention of This Office That the Monitor Piezo Company Is Now Closed Down Because They Have No Quartz ..." * ?>The British Maintained It Was Absolutely Impossible for Their Industry to Use Any Low Quality Material Whatsoever"

  • Dynamic Software Product Lines

    Economies of scope imply mass customization, which can be defined as producing goods and services to meet individual customers' needs with near mass production efficiency. Product line engineering (PLE) provides a means of customizing variants of mass-produced products. Its key aim is to create an underlying architecture for an organization's product platform in which core assets can be reused to engineer new products from the basic family. Developers have successfully applied software product lines (SPLs) in many different domains - including avionics, medical devices, and information systems - in a wide variety of organizations. In addition, modern computing and network environments demand a higher degree of adaptability from their software systems. Computing environments, user requirements, and interface mechanisms between software and hardware devices, such as sensors, can change dynamically during runtime. In dynamic software product lines (DSPLs), monitoring the current situation and controlling the adaptation are the central tasks

  • Index

    <p> <strong>A thorough examination of lab-on-a-chip circuit-level operations to improve system performance</strong> <p> A rapidly aging population demands rapid, cost-effective, flexible, personalized diagnostics. Existing systems tend to fall short in one or more capacities, making the development of alternatives a priority. <em>CMOS Integrated Lab-on-a-Chip System for Personalized Biomedical Diagnosis</em> provides insight toward the solution, with a comprehensive, multidisciplinary reference to the next wave of personalized medicine technology. <p> A standard CMOS fabrication technology allows mass-production of large-array, miniaturized CMOS-integrated sensors from multi-modal domains with smart on-chip processing capability. This book provides an in-depth examination of the design and mechanics considerations that make this technology a promising platform for microfluidics, micro- electro-mechanical systems, electronics, and lectromagnetics. <p> From CMOS fundamentals to end-user applications, all aspects of CMOS sensors are covered, with frequent diagrams and illustrations that clarify complex structures and processes. Detailed yet concise, and designed to help students and engineers develop smaller, cheaper, smarter lab-on-a-chip systems, this invaluable reference: <ul> <li>Provides clarity and insight on the design of lab-on-a-chip personalized biomedical sensors and systems</li> <li>Features concise analyses of the integration of microfluidics and micro-electro- mechanical systems</li> <li>Highlights the use of compressive sensing, super- resolution, and machine learning through the use of smart SoC processing</li> <li>Discusses recent advances in complementary metal oxide semiconductor- integrated lab-on-a-chip systems</li> <li>Includes guidance on DNA sequencing and cell counting applications using dual-mode chemica /optical and energy harvesting sensors</li> </ul> <br> <p> The conventional reliance on the microscope, flow cytometry, and DNA sequencing leaves diagnosticians tied to bulky, expensive equipment with a central problem of scale. Lab-on-a-chip technology eliminates these constraints while improving accuracy and flexibility, ushering in a new era of medicine. This book is an essential reference for students, researchers, and engineers working in diagnostic circuitry and microsystems.

  • Profiles of Early PV Companies and Organizations

    The directory in this chapter gives profiles of key organizations active in terrestrial photovoltaics during the early photovoltaic (PV) era. To make it easier to search, entries are grouped in the following categories: PV manufacturing and research companies; systems integrators, equipment suppliers, and other companies; research centers and universities; and international, national, and representative bodies. HCT Shaping Systems first introduced the wire saw, which proved to be important for mass production of crystalline silicon solar wafers and, therefore, for the early PV industry. IT Power was crucial to the deployment of renewable energy in developing countries, in particular because of its work in support of aid agencies and other finance providers in this sector. The chapter concludes with a summary of leading producers, and of major entrants and leavers, together with company flotations.

  • Interconnects

    This chapter discusses the hierarchy of interconnection in ball grid array (BGA). The combination of eutectic bumps and the organic (FR4)‐based manufacturing processes are sound in thermal hierarchy, and thus, become mass production technology. The chapter focuses on the introduction to Level 1 interconnection, and gap in FC‐PBGA interconnection, and Level 0.5 interconnection. It presents discussion on the changing dynamics in business for more Moore (MM) and more than Moore (MTM), as a result of new through silicon via (TSV) interconnection technology. The chapter also discusses the changing semiconductor business dynamics. It summarizes the metallization used in silicon and III‐V compound semiconductors for wirebond and flip chip interconnections. The chapter shows that aluminum pads only exist on silicon, Gold (Au) pads only exist on III‐V, and Copper (Cu) can exist on both silicon and III‐V compound semiconductor integrated circuits (IC).

  • Flexible OLEDs

    One of the significant advantages of OLEDs is that they can be fabricated on flexible substrates. The use of flexible substrates instead of conventional glass substrates can significantly reduce the thickness and weight of displays and lighting. In addition, flexible OLEDs bring about additional attractive features from the product design point of view, because flexible OLEDs can provide such unique designs as curved, bent, folded, rolled, and ultimately flexible. Moreover, use of flexible substrates has great potential of production innovation such as utilization of roll¿¿¿to¿¿¿roll (R2R) process with low mass¿¿¿production cost. As the candidates for flexible substrates, ultra¿¿¿thin glasses, stainless steel foils and plastic films are well known. This chapter describes current status and future potential of three types of flexible substrates and their applications to flexible OLED displays and lightings.

  • Samuel Insull: Architect and Prime Mover of the Electric Utility Business in the United States

    This chapter contains sections titled: Dynamics of Growth and Consolidation, Early Years, Chicago, Urban Politics, Natural Monopoly, and State Regulation, Growth and Mass Production, Regional Outreach, Origins of the Holding Company, Lessons Learned, Holding Company Principles Applied, Political Backlash, Restless Expansion; Pyramiding and the Crash, New Deal; Trial; Acquittal, Legislative Response, Coda

  • Affordable Manufacturing

    This chapter contains sections titled: * Introduction * Mass Production of Magnetrons for Microwave Ovens * Automated Manufacturing of High-Power MVEDs * Value Engineering Applied to TWTs * DOD Manufacturing Technology (ManTech) Efforts * Conclusions This chapter contains sections titled: * Acknowledgments * References



Standards related to Mass production

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