Mass production

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Mass production (also called flow production, repetitive flow production, series production, or serial production) is the production of large amounts of standardized products, including and especially on assembly lines. (Wikipedia.org)






Conferences related to Mass production

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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 IEEE 13th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

IEEE CPE-POWERENG is one important conference of the IEEE Industrial Electronics Society devoted to the dissemination of new ideas, research and works in progress within the fields of power generation, transmission and distribution, power electronics, renewable energy integration, power systems electro-mechanical energy conversion, automation and EMI issues. IEEE CPE-POWERENG 2019 will be held in Sonderborg, Denmark, from April 23 to 25, 2019.

  • 2017 11th IEEE International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

    IEEE CPE-POWERENG is one important conference of the IEEE Industrial Electronics Society devoted to the dissemination of new ideas, research and works in progress within the fields of power generation, transmission and distribution, power electronics, renewable energy integration, power systems electro-mechanical energy conversion, automation and EMI issues. Topics: The scope of the conference will cover, but will not be limited to, the following topics:• Power Generation, Transmission and Distribution• Smartgrid Technologies & Applications• Power electronics and controllers for microgrids• Specific power electronics for high-power systems• Integration of Renewable Energy Sources• Energy storage systems • Power Electronics Controllers for Power Systems• Electro-Mechanical Energy Conversion• Power Electronic Systems and Applications• Power electronics for electric vehicles• Advanced Control methods for power systems• EMI Issues

  • 2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

    CPE-POWERENG’2016 will be a joint conference of the 10th edition of CPE (the International Conference on Compatibility and Power Electronics) and the 6th edition of POWERENG (International Conference on Power Engineering, Energy and Electrical Drives). Conference CPE-POWERENG 2016 will be an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of both power electronics and power engineering application in different systems.

  • 2015 9th International Conference on Compatibility and Power Electronics (CPE)

    In the field of electrical engineering, power electronics is being dynamically developed, finding its application in several industrial branches. Many production technologies became more efficient, when applying power electronics equipment. Power electronics and energy systems integration provide high standards of human friendly environment. The next generation of power electronics systems must change environmental factors, customer concerns and reliability.International Conference on Compatibility and Power Electronics is an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.The first conference of the International Conference-Workshop on Compatibility and Power Electronics series was first held in 1999. From its beginning the objective of CPE has been to offer a wide forum of discussion to power electronics specialists.

  • 2013 International Conference on Compatibility and Power Electronics (CPE)

    Conference-Workshop CPE 2013 will be an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.

  • 2011 7th International Conference-Workshop "Compatibility And Power Electronics" (CPE)

    Conference-Workshop CPE'2011 will be an International wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.

  • 2009 Compatibility and Power Electronics (CPE)

    Conference-Workshop CPE 2009 will be an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems.

  • 2007 Compatibility in Power Electronics (CPE)

  • 2005 Compatibility in Power Electronics (CPE)


2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

The conference is the primary forum for cross-industry and multidisciplinary research in automation. Its goal is to provide a broad coverage and dissemination of foundational research in automation among researchers, academics, and practitioners.


2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.


2018 28th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

A: BREAKDOWN AND FLASHOVERA1. Vacuum breakdown and pre-breakdown phenomenaA2. Surface discharges and flashover phenomenaB: VACUUM ARCSB1. Switching in vacuum and related phenomenaB2. Interaction of vacuum arcs with magnetic fieldsB3. Vacuum arc physicsB4. Computer modeling and computer aided designB5. Pulsed power physics and technologyC: APPLICATIONSC1. Vacuum interrupters and their applicationsC2. Surface modification and related technologiesC3. Electron, ion, neutron, X-ray and other beam and light sources


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Periodicals related to Mass production

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Xplore Articles related to Mass production

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A 256-kbit flash E/SUP 2/PROM using triple-polysilicon technology

[{u'author_order': 1, u'full_name': u'F. Masuoka'}, {u'author_order': 2, u'full_name': u'M. Asano'}, {u'author_order': 3, u'full_name': u'H. Iwahashi'}, {u'author_order': 4, u'full_name': u'T. Komuro'}, {u'author_order': 5, u'full_name': u'N. Tozawa'}, {u'author_order': 6, u'full_name': u'S. Tanaka'}] IEEE Journal of Solid-State Circuits, 1987

A high-density 256-kb flash electrically erasable PROM (E/SUP 2/PROM) with a single transistor per bit has been developed by utilizing triple-polysilicon technology. As a result of achieving a novel compact cell that is as small as 8×8 μm/SUP 2/, even with relatively conservative 2.0-μm design rules, a small die size of 5.69×5.78 mm/SUP 2/ is realized. This flash E/SUP 2/PROM ...


Development of transparent biochip platform for patch clamp technology

[{u'author_order': 1, u'affiliation': u'Institute of nanotechnology and microsystems engineering, National Cheng Kung University, Tainan, Taiwan', u'full_name': u'Hao-Kai Ken'}, {u'author_order': 2, u'affiliation': u'Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan', u'full_name': u'Shin-Hung Kuo'}, {u'author_order': 3, u'affiliation': u'Institute of nanotechnology and microsystems engineering, National Cheng Kung University, Tainan, Taiwan', u'full_name': u'Jheng-Jhang Li'}, {u'author_order': 4, u'affiliation': u'Institute of nanotechnology and microsystems engineering, National Cheng Kung University, Tainan, Taiwan', u'full_name': u'Chih-Yuan Chen'}, {u'author_order': 5, u'affiliation': u'Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan', u'full_name': u'Ching-Hsing Luo'}] 2009 IEEE Sensors, None

In this study, we present a novel three-level pillars silicon master to fabricate the transparent polydimethylsiloxane (PDMS) biochip with 1 ¿m aperture. The three-level pillars silicon master was manufactured by photolithography and ICP etching processes. Especially, we use the IR (image reversal) mode to fabricate the third pillar in silicon master for increasing the successful rate. Due to the three-level ...


Design and characteristics of two Rogowski coils based on printed circuit board

[{u'author_order': 1, u'affiliation': u'Coll. of Electr. & Electron. Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China', u'full_name': u'Chen Qing'}, {u'author_order': 2, u'affiliation': u'Coll. of Electr. & Electron. Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China', u'full_name': u'Li Hong-bin'}, {u'author_order': 3, u'affiliation': u'Coll. of Electr. & Electron. Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China', u'full_name': u'Zhang Ming-ming'}, {u'author_order': 4, u'affiliation': u'Coll. of Electr. & Electron. Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China', u'full_name': u'Liu Yan-bin'}] IEEE Transactions on Instrumentation and Measurement, 2006

Rogowski coils are special types of mutual inductors often used to measure large alternating and transient currents. Traditional handmade Rogowski coils lack accuracy and cannot be easily mass-produced. Two new structures of Rogowski coils based on printed circuit board are presented. Theoretical analyses on the mutual inductances of two designs are discussed. The measurements of basic characteristics, linearity tests, frequency-response ...


RoSe: A Subgigahertz Wireless Sensor Platform With Housing-Integrated Overmolded Antenna

[{u'author_order': 1, u'affiliation': u'Electronics and Signal Processing Laboratory, École Polytechnique Fédérale de Lausanne, Neuchâtel, Switzerland', u'full_name': u'Mitko Tanevski'}, {u'author_order': 2, u'affiliation': u'Laboratory of Electromagnetics and Acoustics, École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland', u'full_name': u'Francesco Merli'}, {u'author_order': 3, u'affiliation': u'Electronics and Signal Processing Laboratory, École Polytechnique Fédérale de Lausanne, Neuchâtel, Switzerland', u'full_name': u'Alexis Boegli'}, {u'author_order': 4, u'affiliation': u'Laboratory of Electromagnetics and Acoustics, École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland', u'full_name': u'Anja K. Skrivervik'}, {u'author_order': 5, u'affiliation': u'Laboratory of Electromagnetics and Acoustics, École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland', u'full_name': u'Jean-Fran\xe7ois Zurcher'}, {u'author_order': 6, u'affiliation': u'Electronics and Signal Processing Laboratory, École Polytechnique Fédérale de Lausanne, Neuchâtel, Switzerland', u'full_name': u'Pierre-Andr\xe9 Farine'}] IEEE Transactions on Instrumentation and Measurement, 2012

A wireless sensor platform for use in ultralow-power wireless sensor networks (WSNs) is presented. The proposed round sensor (RoSe) node is physically robust, is resistant to humidity, and has a housing that can be in direct contact with food. These characteristics are achieved via injection molding technology which is investigated at both the component and the system levels. The results ...


Design of High Gain Two-Layer Electromagnetically Coupled Patch Antenna in the ISM Band

[{u'author_order': 1, u'affiliation': u'Department of Electronics & Telecommunication, Dr. Babasaheb Ambedkar Technological University, Lonere, Maharashtra State, INDIA. e-mail: abnandgaonkar@yahoo.com, tel.: +91 2140 275101, fax: +91 2140 275040, Mob.: +91 94212 52248', u'full_name': u'A. B. Nandgaonkar'}, {u'author_order': 2, u'affiliation': u'Department of Electronics & Telecommunication, Dr. Babasaheb Ambedkar Technological University, Lonere, Maharashtra State, INDIA. e-mail: sbdeosarkar@yahoo.com, tel.: +91 2140 275101, fax: +91 2140 275040, Mob.: +91 94231 40516', u'full_name': u'S. B. Deosarkar'}] 2007 International Conference on Electromagnetics in Advanced Applications, None

Microstrip Antennas (MSAs) have several advantages, including that they are light weight and small volume and that they can be made conformal to the host surface. In addition, MSAs are manufactured using printed circuit technology, so that mass production can be achieved at a low cost. In comparison to traditional antenna elements, however, the electrical performance of the basic microstrip ...


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Educational Resources on Mass production

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IEEE.tv Videos

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Q&A with Dr. Bill Tonti: IEEE Rebooting Computing Podcast, Episode 3
IEEE 5G Podcast with the Experts: The Future of Mobile Beyond 5G: Part 2 - Mischa Dohler
Algorithmic Decision Making: Impacts and Implications - IEEE Internet Initiative Webinar

IEEE-USA E-Books

  • Supplying a Mass Production IndustryThe Civilian Government Steps In

    This chapter contains sections titled: * ?>To Provide for the Common Defense by Acquiring Stocks of Strategic and Critical Materials ..." * ?>In Summary, Your Proposed Stockpile Is One Which Is Impossible to Meet Prior to about 1950" * ?>An Immediate Increase in the Inspection Rate of the Bureau of Standards Is Imperative" * ?>The Metals Reserve Company, an Agency of the Government of the United States, Is Hereby Designated as the Buyer" * ?>The U.S. Commission Here Are Ruining the Market and Making Damn Fools of Themselves ..." * ?>We Feel That You Are Contributing a Very Valuable Service to the War Effort in the Transportation of This Strategic Raw Material" * ?>One Small Consumer Is Complaining Bitterly about the Quality of the Material Which He Received" * ?>It Has Come to the Attention of This Office That the Monitor Piezo Company Is Now Closed Down Because They Have No Quartz ..." * ?>The British Maintained It Was Absolutely Impossible for Their Industry to Use Any Low Quality Material Whatsoever"

  • Riding the Flat Wheel Limited"Overseeing a Mass Production Industry

    This chapter contains sections titled: * ?>The Action of One Producer in Withholding From the Industry Information Pertinent to the Best Processing Methods ... Must Not Be Tolerated" * ?>It Is Recommended That This Machine Be Investigated..." * ?>I Spent Many Nights on Trains between Washington, Chicago, and Kansas City" * ?>The Crystal Department Has Been the Stepchild ..." * ?>If You Fellas Can Demonstrate the Ability to Make Crystals, We Will Give Both of You Deferments" * ?>I Don't Need Any More Equipment for Testing" * ?>In View of the Extremely Critical Raw Quartz Supply Situation ..."

  • Index

    <p> <strong>A thorough examination of lab-on-a-chip circuit-level operations to improve system performance</strong> <p> A rapidly aging population demands rapid, cost-effective, flexible, personalized diagnostics. Existing systems tend to fall short in one or more capacities, making the development of alternatives a priority. <em>CMOS Integrated Lab-on-a-Chip System for Personalized Biomedical Diagnosis</em> provides insight toward the solution, with a comprehensive, multidisciplinary reference to the next wave of personalized medicine technology. <p> A standard CMOS fabrication technology allows mass-production of large-array, miniaturized CMOS-integrated sensors from multi-modal domains with smart on-chip processing capability. This book provides an in-depth examination of the design and mechanics considerations that make this technology a promising platform for microfluidics, micro- electro-mechanical systems, electronics, and lectromagnetics. <p> From CMOS fundamentals to end-user applications, all aspects of CMOS sensors are covered, with frequent diagrams and illustrations that clarify complex structures and processes. Detailed yet concise, and designed to help students and engineers develop smaller, cheaper, smarter lab-on-a-chip systems, this invaluable reference: <ul> <li>Provides clarity and insight on the design of lab-on-a-chip personalized biomedical sensors and systems</li> <li>Features concise analyses of the integration of microfluidics and micro-electro- mechanical systems</li> <li>Highlights the use of compressive sensing, super- resolution, and machine learning through the use of smart SoC processing</li> <li>Discusses recent advances in complementary metal oxide semiconductor- integrated lab-on-a-chip systems</li> <li>Includes guidance on DNA sequencing and cell counting applications using dual-mode chemica /optical and energy harvesting sensors</li> </ul> <br> <p> The conventional reliance on the microscope, flow cytometry, and DNA sequencing leaves diagnosticians tied to bulky, expensive equipment with a central problem of scale. Lab-on-a-chip technology eliminates these constraints while improving accuracy and flexibility, ushering in a new era of medicine. This book is an essential reference for students, researchers, and engineers working in diagnostic circuitry and microsystems.

  • Profiles of Early PV Companies and Organizations

    The directory in this chapter gives profiles of key organizations active in terrestrial photovoltaics during the early photovoltaic (PV) era. To make it easier to search, entries are grouped in the following categories: PV manufacturing and research companies; systems integrators, equipment suppliers, and other companies; research centers and universities; and international, national, and representative bodies. HCT Shaping Systems first introduced the wire saw, which proved to be important for mass production of crystalline silicon solar wafers and, therefore, for the early PV industry. IT Power was crucial to the deployment of renewable energy in developing countries, in particular because of its work in support of aid agencies and other finance providers in this sector. The chapter concludes with a summary of leading producers, and of major entrants and leavers, together with company flotations.

  • Interconnects

    This chapter discusses the hierarchy of interconnection in ball grid array (BGA). The combination of eutectic bumps and the organic (FR4)‐based manufacturing processes are sound in thermal hierarchy, and thus, become mass production technology. The chapter focuses on the introduction to Level 1 interconnection, and gap in FC‐PBGA interconnection, and Level 0.5 interconnection. It presents discussion on the changing dynamics in business for more Moore (MM) and more than Moore (MTM), as a result of new through silicon via (TSV) interconnection technology. The chapter also discusses the changing semiconductor business dynamics. It summarizes the metallization used in silicon and III‐V compound semiconductors for wirebond and flip chip interconnections. The chapter shows that aluminum pads only exist on silicon, Gold (Au) pads only exist on III‐V, and Copper (Cu) can exist on both silicon and III‐V compound semiconductor integrated circuits (IC).

  • Flexible OLEDs

    One of the significant advantages of OLEDs is that they can be fabricated on flexible substrates. The use of flexible substrates instead of conventional glass substrates can significantly reduce the thickness and weight of displays and lighting. In addition, flexible OLEDs bring about additional attractive features from the product design point of view, because flexible OLEDs can provide such unique designs as curved, bent, folded, rolled, and ultimately flexible. Moreover, use of flexible substrates has great potential of production innovation such as utilization of roll¿¿¿to¿¿¿roll (R2R) process with low mass¿¿¿production cost. As the candidates for flexible substrates, ultra¿¿¿thin glasses, stainless steel foils and plastic films are well known. This chapter describes current status and future potential of three types of flexible substrates and their applications to flexible OLED displays and lightings.

  • Samuel Insull: Architect and Prime Mover of the Electric Utility Business in the United States

    This chapter contains sections titled: Dynamics of Growth and Consolidation, Early Years, Chicago, Urban Politics, Natural Monopoly, and State Regulation, Growth and Mass Production, Regional Outreach, Origins of the Holding Company, Lessons Learned, Holding Company Principles Applied, Political Backlash, Restless Expansion; Pyramiding and the Crash, New Deal; Trial; Acquittal, Legislative Response, Coda

  • Affordable Manufacturing

    This chapter contains sections titled: * Introduction * Mass Production of Magnetrons for Microwave Ovens * Automated Manufacturing of High-Power MVEDs * Value Engineering Applied to TWTs * DOD Manufacturing Technology (ManTech) Efforts * Conclusions This chapter contains sections titled: * Acknowledgments * References



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