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2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
Premier components, packaging and technology
2014 IEEE International Electron Devices Meeting (IEDM)
IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.
2013 26th International Conference on VLSI Design: concurrently with the 12th International Conference on Embedded Systems
The conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), embedded systems, and enabling technologies. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry.
2013 5th IEEE International Memory Workshop (IMW)
This conference brings the memory community together in a workshop environment to discuss the memory process and design technologies, applications, market needs and strategies. It is sponsored by the IEEE Electron Devices Society and meets annually in May. The IMW is a unique forum for specialists in all aspects of memory microelectronics and people with different backgrounds who wish to gain a better understanding of the field. The morning and afternoon technical sessions are organized in a manner to prov
Periasamy, P.; O'Hayre, R.P.; Berry, J.J.; Parilla, Philip A.; Ginley, D.S.; Packard, C.E. Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE, 2011
Metal-Insulator-Metal (MIM) devices are crucial components for applications ranging from optical rectennas for harvesting sunlight to infrared detectors. To date, the relationship between materials properties and device performance in MIM devices is not fully understood, partly due to the difficulty in making and reproducing reliable devices. One configuration that is popular due to its simplicity and ease of fabrication is ...
Gilmer, D.C.; Goel, N.; Park, H.; Park, C.; Barnett, J.; Kirsch, P.D.; Jammy, R. Memory Workshop, 2009. IMW '09. IEEE International, 2009
We demonstrate for the first time molybdenum based oxygen-bearing electrodes for improved performance in MANOS (Metal-Alumina-Nitride-Oxide) charge-trap NVM, and also MIM-DRAM type devices. The meta-stable high work- function (Wfn) molybdenum-oxynitride (MoON) electrodes result in improved retention and erase saturation for the charge trap NVM devices and improved leakage for the MIM devices. Although some of the observed improvements, compared to ...
Mass Production Worthy MIM Capacitor On Gate polysilicon(MIM-COG) Structure using HfO<inf>2</inf>/HfO<inf>x</inf>C<inf>y</inf>N<inf>z</inf>/HfO<inf>2</inf> Dielectric for Analog/RF/Mixed Signal Application
Jung-Min Park; Min-Woo Song; Weon-Hong Kim; Pan-Kwi Park; Yong-Kuk Jung; Ju-Youn Kim; Won, Seok-Jun; Jong-Ho Lee; Nae-In Lee; Ho-Kyu Kang Electron Devices Meeting, 2007. IEDM 2007. IEEE International, 2007
We have successfully integrated a mass production worthy MIM capacitor on gate polysilicon (MIM-COG) structure using HfO2/HfOxCyNz/HfO2(HNH) dielectric for the analog/RF/mixed signal application. The insertion of HfOxCyNz into HfO2 films can successfully suppress the crystallization. As a result, HNH film shows superior breakdown and VCC-a characteristics compared to HfO2-AI2O3 multilayer stack. In addition, we suggest novel MIM-COG structure, which can ...
Ming-Che Hsieh; Sheng-Tsai Wu; Chao-Huang Chen Electronic System-Integration Technology Conference (ESTC), 2010 3rd, 2010
It is well known that the Metal-Insulator-Metal (MIM) capacitor device can be a match circuit or a noise filter in RF circuit and be a loading device in digital circuit. The MIM capacitor devices are becoming most popular structures that have been massively used in system circuit designs to perform capacitors in IC and PCB processes. Because the characteristics of ...
Chit Hwei Ng; Chaw-Sing Ho; Shao-Fu Sanford Chu; Shi-Chung Sun Electron Devices, IEEE Transactions on, 2005
The relentless drive toward high-speed and high-density silicon-based integrated circuits (ICs) has necessitated significant advances in processing technology. The entrance of copper metallization in IC manufacturing has resulted in new challenges in metal-insulator-metal (MIM) capacitor fabrication, one of the key building blocks in analog/mixed signal/RFCMOS circuits. The requirement to reduce passive chip space has led to active researches for MIM ...
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Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.