72 resources related to MIM devices
- Topics related to MIM devices
- IEEE Organizations related to MIM devices
- Conferences related to MIM devices
- Periodicals related to MIM devices
- Most published Xplore authors for MIM devices
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
premier components, packaging and technology conference
the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.
2015 IEEE MTT-S International Microwave Symposium (IMS2015)
The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh
2013 26th International Conference on VLSI Design: concurrently with the 12th International Conference on Embedded Systems
The conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), embedded systems, and enabling technologies. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry.
2013 IEEE International Conference on Microelectronic Test Structures (ICMTS)
This conference focuses on new developments in test structures, as well as their implementation and/or application, related to silicon, semiconductors, nanotechnology and MEMS. Suggested topics include Material and Process Characterization, Device and Circuit Modeling, Parameter Extraction, Yield Enhancement and Production Process Control and so on.
Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.
Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.
El-Kareh, B.; Balster, S.; Leitz, W.; Steinmann, P.; Yasuda, H.; Corsi, M.; Dawoodi, K.; Dirnecker, C.; Foglietti, P.; Haeusler, A.; Menz, P.; Ramin, M.; Scharnagl, T.; Schiekofer, M.; Schober, M.; Schulz, U.; Swanson, L.; Tatman, D.; Waitschull, M.; Weijtmans, J.W.; Willis, C. Bipolar/BiCMOS Circuits and Technology Meeting, 2003. Proceedings of the, 2003
A novel complementary-SiGe BiCMOS technology developed for ultra-high speed precision analog circuits is presented. The modular process offers comparable NPN and PNP performance utilizing unique interface and SiGe base process.
Periasamy, P.; O'Hayre, R.P.; Berry, J.J.; Parilla, Philip A.; Ginley, D.S.; Packard, C.E. Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE, 2011
Metal-Insulator-Metal (MIM) devices are crucial components for applications ranging from optical rectennas for harvesting sunlight to infrared detectors. To date, the relationship between materials properties and device performance in MIM devices is not fully understood, partly due to the difficulty in making and reproducing reliable devices. One configuration that is popular due to its simplicity and ease of fabrication is ...
Hudait, M.K.; Andre, C.L.; Kwon, O.; Palmisiano, M.N.; Ringel, S.A. Electron Device Letters, IEEE, 2002
In/sub 0.53/Ga/sub 0.47/As-based monolithic interconnected modules (MIMs) of thermophotovoltaic (TPV) devices lattice-matched to InP were grown by solid source molecular beam epitaxy. The MIM device consisted of ten individual In/sub 0.53/Ga/sub 0.47/As TPV cells connected in series on an InP substrate. An open-circuit voltage (V/sub oc/) of 4.82 V, short-circuit current density (J/sub sc/) of 1.03 A/cm/sup 2/ and fill ...
Wilt, D.M.; Fatemi, Navid S.; Jenkins, P.P.; Weizer, V.G.; Hoffman, R.W., Jr.; Murray, C.S.; Riley, D.R. Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety, 1997
There has been a traditional trade-off in thermophotovoltaic (TPV) energy conversion development between system efficiency and power density. This tradeoff originates from the use of front surface spectral controls such as selective emitters and various types of filters. A monolithic interconnected module (MIM) structure has been developed which allows for both high power densities and high system efficiencies. The MIM ...
Agarwal, V.K.; Lin, F.; Smith, R.B. Electrical Insulation and Dielectric Phenomena, 1988. Annual Report., Conference on, 1988
The authors report preliminary results on the capacitance versus voltage (C-V) characteristics of MIS devices containing thermally grown fatty-acid films as insulators. A comparative study is carried out between the C-V plots of devices with Si-SiO2 and with Si-SiO 2-fatty-acid film interfaces. The authors also discuss results on the DC breakdown behavior of these films in metal- insulator-metal type devices. ...
Analog Devices SP4T RF MEMS Switch with Integrated Driver Circuitry for RF Instrumentation: MicroApps 2015 - Analog Devices
IEEE Life Sciences: Wearable Medical Devices Advancing bioengineering
The Long Term Reliability of Gallium Nitride
Radiated Performance Assessment of Wireless Communications Devices - An Operator's Perspective
Bridging the gap for wearable electronics
Smart Textile Computational Systems
IMS 2015 Keynote: Soft Assemblies of Radios, Sensors and Circuits for the Skin
APEC 2015: KeyTalks - How to Optimize Performance and Reliability of GaN Power Devices
ASC-2014 SQUIDs 50th Anniversary: 3 of 6 - Bob Fagaly
CES 2015 DAY 1: TAN LE AND MIND-CONTROL TECHNOLOGY
Open Sesame: Design Guidelines for Invisible Passwords
Transphorm: GaN Champions
Evaluating Over-The-Air Performance of MIMO Wireless Devices
The IMS Core, Wireless Network Architecture and LTE
IMS 2011 - CREE Overview
IMS 2011 Microapps - Volume Manufacturing Trends for Automotive Radar Devices
Mobile Internet Devices at Intel
Care Innovations: Toxics In Electronics (com legendas em portugues)
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