Conferences related to MIM devices

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2020 IEEE International Symposium on Applications of Ferroelectrics (ISAF)

Ferroelectric materials and applications


2018 13th European Microwave Integrated Circuits Conference (EuMIC)

The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premierEuropean technical conference for RF microelectronics. Aim of the conference is to promote thediscussion of recent developments and trends, and to encourage the exchange of scientific andtechnical information covering a broad range of high-frequency related topics, from materialsand technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything aboutmicrowave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latestadvances in the field and meet recognized experts from both Industry and Academia.

  • 2017 12th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of theiraspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2016 11th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC's, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS® Association and EuMA and is the premier European technical conference for RF microelectronics. Aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications, that will be addressed in all of their aspects: theory, simulation, design and measurement. If you are interested in anything about microwave and RF IC’s, the EuMIC conference is an exceptional venue to learn about the latest advances in the field and meet recognized experts from both Industry and Academia.

  • 2014 9th European Microwave Integrated Circuits Conference (EuMIC)

    The EuMIC conference is jointly organized by GAAS

  • 2013 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre -wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2012 European Microwave Integrated Circuit Conference (EuMIC)

    Microwave integrated circuits: modelling, simulation and characterisation of devices and circuits; technologies and devices; circuit design and applications.

  • 2011 European Microwave Integrated Circuit Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS/LTE, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physical and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2010 European Microwave Integrated Circuits Conference (EuMIC)

    EuMIC is the leading conference for MMICs/RFICs and their applications in Europe. The aim of the conference is to promote the discussion of recent developments and trends, and encourage the exchange of scientific and technical information on physical fundamentals, material technology, process development and technology, physics based and empirical behavioral modeling of microwave and optoelectronic active devices and design of monolithic ICs

  • 2009 European Microwave Integrated Circuits Conference (EuMIC)

    The 4th European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2008 European Microwave Integrated Circuits Conference (EuMIC)

    The third European Microwave Integrated Circut Conference, EuMIC, in Amsterdam, The Netherlands, is one of four conferences at the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. EuMIC is the leading European conference for RFIC/MMIC technology and applications. The aim of the conference is to cover recent research and development on material technology, process development/technology.

  • 2007 European Microwave Integrated Circuits Conference (EuMIC)

    RF and microwave devices for telecommunication and sensor systems including UMTS, LMDS and other systems working in the microwave and millimetre-wave range. Covering recent development and trends in physical fundamentals, physicas and behavoural modeling, microwave and opto-electric devices and monolithic design in GaAs, InP, SiGe, GaN and SiC technologies.

  • 2006 European Microwave Integrated Circuits Conference (EuMIC) (Formerly GAAS)

  • GAAS 2005 - European Gallium Arsenide and Other Semiconductors Application Symposium


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz2018)

Covering terahertz, far infrared and millimeter wave science, technology and applications


2018 48th European Microwave Conference (EuMC)

The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessionsand workshops are held on the full range of microwave technology from field theory, throughcomponents and subsystems to systems.

  • 2017 47th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology.The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2016 46th European Microwave Conference (EuMC)

    The Premier European event for the disemination of knowledge about Microwave Technology. The event caters for the seasoned industrial engineer as well as the graduate student. Sessions and workshops are held on the full range of microwave technology from field theory, through components and subsystems to systems.

  • 2015 European Microwave Conference (EuMC 2015)

    The 45th European Microwave Conference (EuMC) represents the main event in the European Microwave Week 2015, the largest event in Europe dedicated to microwave components, systems and technology. It is the premier event to present the current status and future trends in the field of microwave, millimeter-wave and terahertz systems and technologies. A broad range of high frequency related topics, from materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.The European Microwave Conference provides many opportunities of networking and interaction with international experts in a wide variety of specialties, attracting delegates with academic as well as industrial backgrounds. In addition to scientific papers, contributions on industrial applications are also encouraged, covering the fields of instrumentation, medical, telecommunication, radar, space, automotive and defense systems.

  • 2014 44th European Microwave Conference (EuMC)

    EuMC is the premier European conference in the microwave field, which represent the ideal venue for prospective authors to present the status and trends in microwave and millimetre-wave systems and frequency related topics, from materials and technologies to integrated circuits, systems their aspects: theory, simulation, design and measurement including passive components, design of high frequency and high data rate photonics, highly stable and noiseless microwave wave sources, new linearisation techniques and the impact of new packaging technologies.

  • 2013 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre -wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in alltheir aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development

  • 2012 European Microwave Conference (EuMC)

    Microwave and millimeter wave: active/passive devices, antennas, electromagnetics, bio-interaction, circuits, manufacturing and measurement, MEMS, meta-materials, sensor networks, cognitive radio, 4G communications, space technology and applications.

  • 2011 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging technologies on development app

  • 2010 European Microwave Conference (EuMC)

    The European Microwave Conference is the premier forum for presentation of the present status and future trends in the field of microwave, millimetre- and submillimetre-wave systems and technologies.

  • 2009 European Microwave Conference (EuMC)

    The 39th European Microwave Conference (EuMC), is the core of the European Microwave Week 2009, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2008 European Microwave Conference (EuMC)

    The 38th European Microwave Conference (EuMC) in Amsterdam, The Netherlands, from 27 to 31 October, is the core of the European Microwave Week 2008, the largest event in Europe dedicated to microwave electronics. It is the premier forum to present the actual status and future trends in the field of materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design and measurement.

  • 2007 European Microwave Conference (EuMC)

    Status and trends in microwave and millimetre-wave systems and technologies. High-frequency related topics, from materials and technologies to integrated circuits, systems and applications in all their aspects: theory, simulation, design and measurement including passive components, modelling and design of high frequency and high data rate photonics, highly stable and noiseless microwave and millimetre-wave sources, new linearisation techniques and the impact of new packaging.

  • 2006 European Microwave Conference (EuMC)

  • 2005 European Microwave Conference (EuMC)

  • 2004 European Microwave Conference (EuMC)

  • 2003 European Microwave Conference (EuMC)

  • 1998 28th European Microwave Conference (EuMC)

  • 1997 27th European Microwave Conference (EuMC)


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Periodicals related to MIM devices

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Communications Letters, IEEE

Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


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Xplore Articles related to MIM devices

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A high image-quality LCD addressed by lateral MIM

[{u'author_order': 1, u'affiliation': u'Seiko Epson Corp., Nagano, Japan', u'full_name': u'K. Takahashi'}, {u'author_order': 2, u'affiliation': u'Seiko Epson Corp., Nagano, Japan', u'full_name': u'T. Ushiki'}, {u'author_order': 3, u'affiliation': u'Seiko Epson Corp., Nagano, Japan', u'full_name': u'J. Sugiyama'}, {u'author_order': 4, u'affiliation': u'Seiko Epson Corp., Nagano, Japan', u'full_name': u'T. Ushiyama'}, {u'author_order': 5, u'affiliation': u'Seiko Epson Corp., Nagano, Japan', u'full_name': u'N. Ono'}, {u'author_order': 6, u'affiliation': u'Seiko Epson Corp., Nagano, Japan', u'full_name': u'T. Araki'}, {u'author_order': 7, u'affiliation': u'Seiko Epson Corp., Nagano, Japan', u'full_name': u'K. Kaneko'}, {u'author_order': 8, u'affiliation': u'Seiko Epson Corp., Nagano, Japan', u'full_name': u'H. Aruga'}, {u'author_order': 9, u'affiliation': u'Seiko Epson Corp., Nagano, Japan', u'full_name': u'K. Oguchi'}] Conference Record of the 1991 International Display Research Conference, None

A novel lateral MIM-LCD, (liquid crystal display) has been developed which has a high pixel density (about 270 dpi) and a high contrast ratio over a wide temperature range (over 130:1 from 0 degrees C-80 degrees C). Two types of lateral MIM-LCD are presented: a 4.2-in-diagonal, 640-pixel*240-pixel LCD with each pixel addressed by eight parallel-lateral-MIMs and a 2.98-in-diagonal 640-pixel*480 pixel ...


Impact of layout and process on RF and analog performances of 3D damascene MIM capacitors

[{u'author_order': 1, u'affiliation': u'STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France. sebastien.cremer@st.com', u'full_name': u'S. Cremer'}, {u'author_order': 2, u'affiliation': u'STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France', u'full_name': u'N. Segura'}, {u'author_order': 3, u'affiliation': u'STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France', u'full_name': u'P. Joubin'}, {u'author_order': 4, u'affiliation': u'STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France', u'full_name': u'M. Marin'}, {u'author_order': 5, u'affiliation': u'STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France', u'full_name': u'M. Thomas'}, {u'author_order': 6, u'affiliation': u'STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France', u'full_name': u'C. Richard'}, {u'author_order': 7, u'affiliation': u'STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France', u'full_name': u'S. Boret'}, {u'author_order': 8, u'affiliation': u'STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France', u'full_name': u'D. Benoit'}, {u'author_order': 9, u'affiliation': u'STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France', u'full_name': u'S. Bruyere'}] 2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting, None

RF and analog designs require high performances MIM capacitors. In order to continue the downscaling of MIM devices, we proposed and integrated a 3D damascene MIM capacitor using Si3N4 dielectric in the copper back-end of a 0.13 mum BICMOS technology. Layout and process have been recently optimized to reach excellent reliability performances while keeping very good RF performances.


Photoresponse characteristics of thin-film nickel-nickel oxide-nickel tunneling junctions

[{u'author_order': 1, u'affiliation': u'John Hopkins Univ., Baltimore, MD, USA', u'full_name': u'R. Marshalek'}, {u'author_order': 2, u'full_name': u'F. Davidson'}] IEEE Journal of Quantum Electronics, 1983

Photoinduced tunneling currents in thin-film Ni-NiO-Ni tunneling junctions were measured as a function of photon energy over the range 2.0 eVleq hf leq 2.7eV. The photoresponse mechanism was found to be consistent with a photon assisted tunneling mechanism. Inelastic electron-electron collisions were found to strongly influence the photoassisted tunneling currents.


Modeling the Mismatch of High-k MIM Capacitors

[{u'author_order': 1, u'affiliation': u'STMicroelectronics, Central R&D, 850 rue Jean Monnet, 38926 Crolles, France, e-mail: mathieu.marin@st.com, Phone: +33 4 76 92 66 92 - Fax: +33 4 76 92 57 32', u'full_name': u'Mathieu Marin'}, {u'author_order': 2, u'affiliation': u'STMicroelectronics, Central R&D, 850 rue Jean Monnet, 38926 Crolles, France', u'full_name': u'Sebastien Cremer'}, {u'author_order': 3, u'affiliation': u'STMicroelectronics, Central R&D, 850 rue Jean Monnet, 38926 Crolles, France', u'full_name': u'Jean-Christophe Giraudin'}, {u'author_order': 4, u'affiliation': u'STMicroelectronics, Central R&D, 850 rue Jean Monnet, 38926 Crolles, France', u'full_name': u'Bertrand Martinet'}] 2007 IEEE International Conference on Microelectronic Test Structures, None

In this contribution we investigate the matching properties of modern high-k metal-insulator-metal (MIM) capacitors. In particular, we derive a compact physics-based model in order to explain the observed geometry dependence of mismatch. This model is successfully applied to MIM devices processed with Ta2O5 and AI2O3 as dielectrics.


Improved High-Temperature Leakage in High-Density MIM Capacitors by Using a TiLaO Dielectric and an Ir Electrode

[{u'author_order': 1, u'affiliation': u'Nat. Chiao-Tung Univ., Hsinchu', u'full_name': u'C. H. Cheng'}, {u'author_order': 2, u'full_name': u'H. C. Pan'}, {u'author_order': 3, u'full_name': u'H. J. Yang'}, {u'author_order': 4, u'full_name': u'C. N. Hsiao'}, {u'author_order': 5, u'full_name': u'C. P. Chou'}, {u'author_order': 6, u'full_name': u'S. P. McAlister'}, {u'author_order': 7, u'full_name': u'Albert Chin'}] IEEE Electron Device Letters, 2007

We have fabricated high-kappa TaN/Ir/TiLaO/TaN metal-insulator-metal capacitors. A low leakage current of 6.6 times 10-7 A/cm2 was obtained at 125degC for 24-fF/mum2 density capacitors. The excellent device performance is due to the combined effects of the high-kappa TiLaO dielectric, a high work- function Ir electrode, and large conduction band offset.


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Educational Resources on MIM devices

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eLearning

No eLearning Articles are currently tagged "MIM devices"

IEEE.tv Videos

Millimeter-Wave Bandpass Filter Using High-Q Conical Inductors and MOM Capacitors: RFIC Interactive Forum
IMS 2011 Microapps - Volume Manufacturing Trends for Automotive Radar Devices
IEEE Life Sciences: Wearable Medical Devices Advancing bioengineering
Analog Devices SP4T RF MEMS Switch with Integrated Driver Circuitry for RF Instrumentation: MicroApps 2015 - Analog Devices
Prototyping MIMO Systems with the AD9361: MicroApps 2015 - Analog Devices
802.19: Wireless Coexistence
Radiated Performance Assessment of Wireless Communications Devices - An Operator's Perspective
A Unified Hardware/Software Co-Design Framework for Neuromorphic Computing Devices and Applications - IEEE Rebooting Computing 2017
802.15: Wireless Personal Area Network
APEC 2015: KeyTalks - How to Optimize Performance and Reliability of GaN Power Devices
EDA Challenges in Designing Computing Systems with postCMOS Devices - IEEE Rebooting Computing 2017
IMS 2012 Special Sessions: The Evolution of Some Key Active and Passive Microwave Components - E. C. Niehenke
Mobile Internet Devices at Intel
CES 2015 DAY 1: TAN LE AND MIND-CONTROL TECHNOLOGY
IMS 2012 Special Sessions: The Evolution of Some Key Active and Passive Microwave Components - K. R. Varian
Interview with Marcel J.M. Pelgrom - The Pelgrom Law: IEEE Gustav Robert Kirchhoff Award Recipient
APEC 2011-GaN Based Power Devices in Power Electronics
Electrons May Be the New Pharmaceutical Drug
IMS 2015: Bridging the gap for wearable electronics
Evaluating Over-The-Air Performance of MIMO Wireless Devices

IEEE-USA E-Books

  • Appendix A: Selected Nonsemiconductor Devices

  • On¿¿¿Chip Realization of Synthesized Transmission Lines Using IPD Processes

    System¿¿¿on¿¿¿chip (SoC) and system¿¿¿inpackage (SiP) technologies have become the core business in communication industries over the past decade. When the operating frequency goes high, one may experience difficulties in realizing synthesized transmission lines using PCB processes due to the limitation of line resolution. To alleviate the problem, the integrated passive device (IPD) process, having received considerable attention in the SiP integration, is applied to fulfill on¿¿¿chip synthesized transmission lines and hence circuit miniaturization at higher frequencies. In this chapter, a variety of synthesized transmission lines using the IPD technology are introduced to realize on¿¿¿chip microwave/millimeter¿¿¿wave passive components. On¿¿¿chip synthesized lines, generally consisting of quasi¿¿¿lumped meander/spiral inductors, metal¿¿¿insulator¿¿¿metal (MIM) capacitors, and open stubs, feature an extremely compact size with impressive slow wave factor. The concept of multi¿¿¿mode operation is also fulfilled by quasi¿¿¿lumped components on the IPD substrate. Their applications to the multiplexer, antenna decoupling network, and liquid detector are also discussed.



Standards related to MIM devices

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IEEE Standard for Media Management System (MMS) Session Security, Authentication, Initialization Protocol (SSAIP)

Specify the protocol used to identify, authenticate and establish an initial connection between the software components of the IEEE Media Management System. Details of components of the Media Management System are specified by companion standards.



Jobs related to MIM devices

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