Liquid cooling

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Conferences related to Liquid cooling

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2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.


2012 15th International Conference on Electrical Machines and Systems (ICEMS)

The conference will provide a big opportunity for researchers and professionals from all over the world to present the latest researches and developments and to exchange useful information and experiences in the fields of electrical machines and systems such as motor drive systems\, turbine generators\, linear machines\, transformers\, electric vehicles\, renewable energy\, power converters\, etc.

  • 2011 International Conference on Electrical Machines and Systems (ICEMS)

    Electrical machines\, power electronics and systems.

  • 2010 International Conference on Electrical Machines and Systems (ICEMS)

    1) Power Converters/Inverters 2) Systems for Renewable Energy 3) Motor Drives 4) PM Machines and DC Machines 5) Induction, Synchronous Machines 6) Transformers and High Voltage Machines 7) Linear Machines 8) Special Machines and Their Applications 9) Field Analysis and optimal Design Technologies 10) Electrical Technologies for the Next Generation Vehicle

  • 2009 International Conference on Electrical Machines and Systems (ICEMS)

    The aims of ICEMS2009 are to provide an opportunity for scientists and experts to present the latest research developments in the field of electrical machines and systems (rotating and other machines, power electronics, motion control, and motor drives) and to exchange useful information and experiences in research, trends and applications.


2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM)

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An international forum dedicated to the thermal design and characterization of electronic components and systems. The symposium fosters the exchange of knowledge between practitioners and leading experts from industry\, as well as the exchange of information on the latest academic and industrial advances in electronics thermal management.


2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Tthe essential thermal questions of microelectronic microstructures and electronic parts in general; in addition to the traditional thermal management problems\, also stress and thermal stress related reliability issues\, both in micro and opto electronics fields.


2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications (ThETA)

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Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)



Xplore Articles related to Liquid cooling

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  • Electronics Cooling Using a Self-Contained, Sub-Cooled Pumped Liquid System

    Bilski, W.J.; Baldassarre, G.; Connors, M.; Toth, J.; Wert, K.L. Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE, 2008

    Electronic thermal packaging design continues to look for novel solutions for enhancing the performance of microelectronic cooling solutions. Driven by increasing thermal performance requirements, particularly in densely packaged militarized electronic systems and other high density or extreme use products, thermal designers are showing that to achieve the necessary cooling, combinations of existing technologies may offer further enhancement than has already ...

  • A review of IBM sponsored research and development projects for computer cooling

    Chu, R.C. Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE, 1999

    This paper provides a review of twenty-five years of IBM sponsored research at universities intended to advance basic heat transfer technology for application in cooling computers. The research discussed covers a broad range of heat transfer topics, including natural convection and forced convection air cooling. Liquid forced convection, pool boiling, falling films, flow boiling, and liquid jet impingement. Examples of ...

  • Server liquid cooling with chiller-less data center design to enable significant energy savings

    Iyengar, M.; David, M.; Parida, P.; Kamath, V.; Kochuparambil, B.; Graybill, D.; Schultz, M.; Gaynes, M.; Simons, R.; Schmidt, R.; Chainer, T. Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE, 2012

    This paper summarizes the concept design and hardware build efforts as part of a US Department of Energy cost shared grant, two year project (2010-2012) that was undertaken to develop highly energy efficient, warm liquid cooled servers for use in chiller-less data centers. Significant savings are expected in data center energy, refrigerant and make up water use. The technologies being ...

  • Solid-state microrefrigeration in conjonction with liquid cooling

    Ezzahri, Y.; Shakouri, Ali Thermal Issues in Emerging Technologies, 2008. ThETA '08. Second International Conference on, 2008

    Thermal design requirements are mostly driven by the peak temperatures. Reducing or eliminating hot spots could alleviate the design requirement for the whole package. Combination of solid-state and liquid cooling will allow removal of both hot spots and background heating. In this paper, we analyze the performance of thin film Bi<sub>2</sub>Te<sub>3</sub> microcooler and the 3D SiGe based microrefrigerator and optimize ...

  • Thermal management systems for data centers with liquid cooling technique of CPU

    Ouchi, M.; Abe, Y.; Fukagaya, M.; Ohta, H.; Shinmoto, Y.; Sato, M.; Iimura, K. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, 2012

    Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the ...

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Periodicals related to Liquid cooling

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  • Device and Materials Reliability, IEEE Transactions on

    Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...