248 resources related to Liquid cooling
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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.
2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)
2013 International Conference on Electrical Machines and Systems (ICEMS)
Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train
The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...
Gromoll, B. Semiconductor Thermal Measurement and Management Symposium, 1994. SEMI-THERM X., Proceedings of 1994 IEEE/CPMT 10th, 1994
Future 3D electronics packaging systems will require micro cooling systems that can be integrated and permit the continued use of air as a coolant. To achieve this, new types of silicon micro heat exchangers were made using an anisotropic etching process. Various heat exchanger configurations and sizes were made using sandwich and stacking techniques. They can be used either as ...
Liu, X.-X.; Zhai, K.; Liu, Z.; He, K.; Tan, S.X.-D.; Yu, W. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, 2014
In this brief, we propose an efficient parallel finite difference-based thermal simulation algorithm for 3-D-integrated circuits (ICs) using generalized minimum residual method (GMRES) solver on CPU-graphic processing unit (GPU) platforms. First, the new method starts from basic physics-based heat equations to model 3-D-ICs with intertier liquid cooling microchannels and directly solves the resulting partial differential equations. Second, we develop a ...
Sabounchi, Poorya; Heydari, A. Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE, 2003
There is a strong need to improve our current capabilities in thermal management and electronic cooling, since estimates indicate that IC power density level could reach 50 W/cm in the near future. This paper presents an innovative approach for thermal modeling of active cooling schemes. It is shown that the principles of energy conversion can be used to overcome the ...
Howes, J.C.; Levett, D.B.; Wilson, S.T.; Marsala, J.; Saums, D.L. Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE, 2008
The use of a vaporizable dielectric fluid is proposed and demonstrated in a proof-of-concept electrical drive system utilizing medium-range 1200 VAC 450 A IGBT devices. Comparative empirical data is shown for a drive system utilizing production components for a traditional air-cooled extruded aluminum heat sink thermal solution for each IGBT module, versus several water-cooled liquid cold plate solutions and a ...
Zanini, F.; Sabry, M.M.; Atienza, D.; De Micheli, G. Emerging and Selected Topics in Circuits and Systems, IEEE Journal on, 2011
Three-dimensional (3D) integrated circuits and systems are expected to be present in electronic products in the short term. We consider specifically 3D multi-processor systems-on-chips (MPSoCs), realized by stacking silicon CMOS chips and interconnecting them by means of through-silicon vias (TSVs). Because of the high power density of devices and interconnect in the 3D stack, thermal issues pose critical challenges, such ...
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