Conferences related to Liquid cooling

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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.

2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)

electronics cooling

2013 International Conference on Electrical Machines and Systems (ICEMS)

Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train

  • 2012 15th International Conference on Electrical Machines and Systems (ICEMS)

    The conference will provide a big opportunity for researchers and professionals from all over the world to present the latest researches and developments and to exchange useful information and experiences in the fields of electrical machines and systems such as motor drive systems, turbine generators, linear machines, transformers, electric vehicles, renewable energy, power converters, etc.

  • 2011 International Conference on Electrical Machines and Systems (ICEMS)

    Electrical machines, power electronics and systems.

  • 2010 International Conference on Electrical Machines and Systems (ICEMS)

    1) Power Converters/Inverters 2) Systems for Renewable Energy 3) Motor Drives 4) PM Machines and DC Machines 5) Induction, Synchronous Machines 6) Transformers and High Voltage Machines 7) Linear Machines 8) Special Machines and Their Applications 9) Field Analysis and optimal Design Technologies 10) Electrical Technologies for the Next Generation Vehicle

  • 2009 International Conference on Electrical Machines and Systems (ICEMS)

    The aims of ICEMS2009 are to provide an opportunity for scientists and experts to present the latest research developments in the field of electrical machines and systems (rotating and other machines, power electronics, motion control, and motor drives) and to exchange useful information and experiences in research, trends and applications.

2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications (ThETA)

Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)

Periodicals related to Liquid cooling

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.

Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...

Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...

Xplore Articles related to Liquid cooling

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Advanced micro air-cooling systems for high density packaging

Gromoll, B. Semiconductor Thermal Measurement and Management Symposium, 1994. SEMI-THERM X., Proceedings of 1994 IEEE/CPMT 10th, 1994

Future 3D electronics packaging systems will require micro cooling systems that can be integrated and permit the continued use of air as a coolant. To achieve this, new types of silicon micro heat exchangers were made using an anisotropic etching process. Various heat exchanger configurations and sizes were made using sandwich and stacking techniques. They can be used either as ...

Parallel Thermal Analysis of 3-D Integrated Circuits With Liquid Cooling on CPU-GPU Platforms

Liu, X.-X.; Zhai, K.; Liu, Z.; He, K.; Tan, S.X.-D.; Yu, W. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, 2014

In this brief, we propose an efficient parallel finite difference-based thermal simulation algorithm for 3-D-integrated circuits (ICs) using generalized minimum residual method (GMRES) solver on CPU-graphic processing unit (GPU) platforms. First, the new method starts from basic physics-based heat equations to model 3-D-ICs with intertier liquid cooling microchannels and directly solves the resulting partial differential equations. Second, we develop a ...

Lumped capacity thermal circuit diagram of active chip cooling schemes

Sabounchi, Poorya; Heydari, A. Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE, 2003

There is a strong need to improve our current capabilities in thermal management and electronic cooling, since estimates indicate that IC power density level could reach 50 W/cm in the near future. This paper presents an innovative approach for thermal modeling of active cooling schemes. It is shown that the principles of energy conversion can be used to overcome the ...

Cooling of an IGBT Drive System with Vaporizable Dielectric Fluid (VDF)

Howes, J.C.; Levett, D.B.; Wilson, S.T.; Marsala, J.; Saums, D.L. Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE, 2008

The use of a vaporizable dielectric fluid is proposed and demonstrated in a proof-of-concept electrical drive system utilizing medium-range 1200 VAC 450 A IGBT devices. Comparative empirical data is shown for a drive system utilizing production components for a traditional air-cooled extruded aluminum heat sink thermal solution for each IGBT module, versus several water-cooled liquid cold plate solutions and a ...

Hierarchical Thermal Management Policy for High-Performance 3D Systems With Liquid Cooling

Zanini, F.; Sabry, M.M.; Atienza, D.; De Micheli, G. Emerging and Selected Topics in Circuits and Systems, IEEE Journal on, 2011

Three-dimensional (3D) integrated circuits and systems are expected to be present in electronic products in the short term. We consider specifically 3D multi-processor systems-on-chips (MPSoCs), realized by stacking silicon CMOS chips and interconnecting them by means of through-silicon vias (TSVs). Because of the high power density of devices and interconnect in the 3D stack, thermal issues pose critical challenges, such ...

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