Conferences related to Liquid cooling

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Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2009

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2007

  • OCEANS 2006

  • OCEANS 2005

  • OCEANS 2004

  • OCEANS 2003

  • OCEANS 2002

  • OCEANS 2001

  • OCEANS 2000

  • OCEANS '99

  • OCEANS '98

  • OCEANS '97

  • OCEANS '96


2019 IEEE 28th Symposium on Fusion Engineering (SOFE)

fusion engineering, physics and materials, plasma heating, vacuum technology, tritium processing, fueling, first walls, blankets and divertors


2019 IEEE 58th Conference on Decision and Control (CDC)

The CDC is recognized as the premier scientific and engineering conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, systems and control, and related areas.The 58th CDC will feature contributed and invited papers, as well as workshops and may include tutorial sessions.The IEEE CDC is hosted by the IEEE Control Systems Society (CSS) in cooperation with the Society for Industrial and Applied Mathematics (SIAM), the Institute for Operations Research and the Management Sciences (INFORMS), the Japanese Society for Instrument and Control Engineers (SICE), and the European Union Control Association (EUCA).


2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2019 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Liquid cooling

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications Surveys & Tutorials, IEEE

Each tutorial reviews currents communications topics in network management and computer and wireless communications. Available tutorials, which are 2.5 to 5 hours in length contains the original visuals and voice-over by the presenter. IEEE Communications Surveys & Tutorials features two distinct types of articles: original articles and reprints. The original articles are exclusively written for IEEE Communications Surveys & Tutorials ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Liquid cooling

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Xplore Articles related to Liquid cooling

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Experimental study on the liquid cooling of a test MCM using paraffin slurry

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 1998

This study investigated the effects of the experimental parameters on the cooling performance of the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5/spl sim/7.5%, heat flux of 10/spl sim/40 W/cm/sup 2/ for the simulated VLSI chips and Reynolds numbers of 5,300/spl sim/16,000. The apparatus consisted of a test section, paraffin slurry ...


IEEE Draft Standard for the Design, Testing and Application of Liquid-Immersed Distribution, Power and Regulating Transformers Using High-Temperature Insulation Systems and Operating at Elevated Temperatures

IEEE PC57.154/D9, March 2012, 2012

This standard applies to all liquid-immersed distribution, power and regulating transformers that are designed to operate at temperatures that exceed the normal thermal limits of C57.12.00, under continuous load, in the designed average ambient and at rated conditions. This standard provides specific requirements and guidance in the design, testing and application of the transformers covered within its scope. These transformers ...


Direct liquid cooling of a stacked multichip module

4th Electronics Packaging Technology Conference, 2002., 2002

With the advances in microfabrication techniques and high performance chips, the heat flux from electronic components is reaching a point where air-cooling is unlikely to meet the cooling requirements for future generation computer chips. Direct single-phase liquid cooling of a stacked multichip module using FC-77 is examined in this paper. Three-dimensional numerical simulation is conducted to investigate the flow and ...


Performance improvement of stacked graphite sheets for cooling applications

2008 58th Electronic Components and Technology Conference, 2008

We realized a thin slice of vertically stacked pyrolytic graphite for the thermal interface use. The maximum size of the slice achieved was 37 times 37 mm<sup>2</sup> with a thickness about 500 mum. This system shows a heat resistance better than 20 mm<sup>2</sup>C/W, which is almost independent of the thickness. The heat resistance can be drastically improved by modifying the ...


Liquid cooling high power compact electronics

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004

Conventional electronics liquid cooling are used in automatic test equipment (ATE) and military equipment, it is implemented using blind-mate fluid disconnects packaged alongside the card edge connectors, or using hoses and manual latching fluid disconnects. This paper describe a novel rack-mount liquid cooling packaging architecture. This arrangement utilizes manual latching fluid disconnects, so that the fluid transport lines to the ...


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Educational Resources on Liquid cooling

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IEEE-USA E-Books

  • Experimental study on the liquid cooling of a test MCM using paraffin slurry

    This study investigated the effects of the experimental parameters on the cooling performance of the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5/spl sim/7.5%, heat flux of 10/spl sim/40 W/cm/sup 2/ for the simulated VLSI chips and Reynolds numbers of 5,300/spl sim/16,000. The apparatus consisted of a test section, paraffin slurry maker, pump, constant temperature baths, flowmeter, etc. The test section contains an in-line, four-row array of 12 heat sources for simulation of a 4/spl times/3 multichip module, which were flush mounted on the top wall of a horizontal rectangular channel with an aspect ratio of 0.2. The inlet temperature was 20/spl deg/C for all experiments. The paraffin slurry size of between 10/spl sim/40 /spl mu/m did not change before or after the experiment. The chip surface temperatures for paraffin slurry with a mass fraction of 7.5% were lower by 16/spl deg/C than those for water when the heat flux is 40 W/cm/sup 2/. The local heat transfer coefficients for the paraffin slurry with a mass fraction of 7.5% were larger by 17/spl sim/25% than those of water at the first and the fourth row. The local heat transfer coefficients reached a row-number-independent, thermally fully developed value approximately at the third row. The local average Nusselt numbers at the fourth row for paraffin slurry with a mass fraction of 7.5% were larger by 23/spl sim/29% than those for water. The liquid cooling method using paraffin slurry can be applied for high heat flux cases over 40 W/cm/sup 2/.

  • IEEE Draft Standard for the Design, Testing and Application of Liquid-Immersed Distribution, Power and Regulating Transformers Using High-Temperature Insulation Systems and Operating at Elevated Temperatures

    This standard applies to all liquid-immersed distribution, power and regulating transformers that are designed to operate at temperatures that exceed the normal thermal limits of C57.12.00, under continuous load, in the designed average ambient and at rated conditions. This standard provides specific requirements and guidance in the design, testing and application of the transformers covered within its scope. These transformers incorporate high-temperature insulation systems or systems that use a combination of high- temperature and conventional insulation.

  • Direct liquid cooling of a stacked multichip module

    With the advances in microfabrication techniques and high performance chips, the heat flux from electronic components is reaching a point where air-cooling is unlikely to meet the cooling requirements for future generation computer chips. Direct single-phase liquid cooling of a stacked multichip module using FC-77 is examined in this paper. Three-dimensional numerical simulation is conducted to investigate the flow and the conjugated convection-conduction heat transfer in the cooling structure. The effects of the top clearance, the side clearance, flow rate, heating arrangement on the maximum chip temperature and velocity distribution are presented.

  • Performance improvement of stacked graphite sheets for cooling applications

    We realized a thin slice of vertically stacked pyrolytic graphite for the thermal interface use. The maximum size of the slice achieved was 37 times 37 mm<sup>2</sup> with a thickness about 500 mum. This system shows a heat resistance better than 20 mm<sup>2</sup>C/W, which is almost independent of the thickness. The heat resistance can be drastically improved by modifying the surface structure and/or small amount of fluorinated chemical. We report the characteristics and improvement of the thermal performance of this material.

  • Liquid cooling high power compact electronics

    Conventional electronics liquid cooling are used in automatic test equipment (ATE) and military equipment, it is implemented using blind-mate fluid disconnects packaged alongside the card edge connectors, or using hoses and manual latching fluid disconnects. This paper describe a novel rack-mount liquid cooling packaging architecture. This arrangement utilizes manual latching fluid disconnects, so that the fluid transport lines to the electronics below are also front-side accessible. The system enables single or two-phase heat transfer between the fluid and the electronics as long as the heat load ensures only liquid passes to the pump. The liquid cooling system itself relies on the ambient air to dissipate the heat; it only transports the heat to a rack location where it easier to dissipate the heat.

  • Thermal performance of a dual 1.2 kV, 400 a silicon-carbide MOSFET power module

    Power electronics are reaching the temperature limits of silicon; therefore alternative materials such as silicon carbide (SiC) are currently being explored. An all SiC 1.2 kV, 400 A dual MOSFET power module has been fabricated and tested for thermal performance. The module was designed as a dropin replacement for standard commercial modules with an integrated liquid cooling system that reduces thermal resistance. The heat sink has been experimentally tested up to 400 A (158 W/cm2) showing a device temperature rise of as little as 24°C. Thermal modeling was also performed and the results were compared to experimental data.

  • Study on Temperature Control Design and High Protection of Charger

    There are many problems such as air inlet hole is easy to be blocked, external salt spray affects component's life and seeping water affects equipment's performance in the module of fast charger by using air-cooling. The advantages and disadvantages of four temperature control schemes such as air-cooling, heat exchanger, air conditioning and liquid cooling were compared and analyzed in this research. Four new temperature control schemes were designed to solve the high heat dissipation and high protection problem of the fast charger. In these schemes, compressor refrigeration is not required and the main power consumption components are fans. Maximizing the energy saving of products is an outstanding characteristic. The research result has certain guiding significance in the engineering design of fast charger with increasingly miniaturization and high power.

  • Design, Fabrication and Characterization of a Mini Heat Exchanger for Data Centre Cooling Application

    In this study, a compact size liquid to liquid heat exchanger used in the cooling system for the servers in a data center has been optimized, fabricated and characterized. The proposed heat exchanger is firstly optimized under the given conditions, including of the space constraints in the blade server rack, the requirement of the heat exchange capability, and requirement of energy efficiency and effectiveness. Then the optimized heat exchanger is fabricated and implemented into a cooling system for test and characterization. Finally, the thermal performance and energy effectiveness of the developed mini heat exchanger has demonstrated and characterized. The developed heat exchanger is with compact size and meets the size requirement of the cooling system for the servers in data center. The developed heat exchanger has been demonstrated with the heat transfer capability of 548W under the specified conditions, meeting the heat dissipation capability requirements (500W) of the developed cooling system. Meanwhile, the developed heat exchanger has been demonstrated with high effectiveness of 0.9 and with high energy efficiency. In addition, the simulation results match well with the measurement results, indicating the proposed simulation model and schemes are valid for liquid-liquid heat exchanger development.

  • Numerical Investigation on the Condensation Heat Transfer of FC72 in the Presence of Air

    Condensation of FC72 in the presence of air has been numerically investigated. The influence of concentration of inlet non-condensable gas on the condensation heat transfer has been examined. It is found that when air is introduced at the inlet, condensation heat transfer deteriorates, more so in the case of condensation under natural convection. The diffusion layer, in which the gradient of non-condensable gas concentration is very high, can clearly ne observed adjacent to the interface. The formation of the diffusion layer provides a driving force for the vapor to reach the interface for continuous condensation. However, it is the presence of this layer that causes a very low vapor partial pressure near the interface, which dramatically decreases the condensation temperature at the interface. This will cause a much smaller temperature difference across the condensate film, which will eventually result in a poorer condensation rate compared with the pure vapor case. It is concluded that effective disturbance or even breakdown of this diffusion layer is the key to enhance condensation heat transfer if the presence of air in the system is inevitable.

  • Long-term deployment of liquid-cooled High Frequency (HF) radar

    A liquid cooling system has been incorporated into a 5 MHz (long-range) SeaSonde HF radar system from CODAR Ocean Sensors. The cooling system consists of commercially available heat exchangers, connected in series and applied to various heat sources within the system. These include the central module within the transmitter chassis, as well as four locations within the receiver chassis. In addition, heat exchangers were also installed on the processor, northbridge, and hard drive of the Apple Mac mini computer used to govern the system. Bench testing showed that these heat exchangers are sufficient to effectively dissipate the roughly 200 W of heat generated by the radar equipment. We also designed and built a cooling reservoir for the dissipation of this heat to the external environment. In order to minimize power consumption, a passive cooling reservoir was developed. Four 55 gallon high- density polyethylene barrels are used to store the water, which is cooled by ambient air and wind. Water is circulated through the system by a single 39 W pump operating off of 24 VDC. This system was field-deployed for one year at Matagorda Island, located in Texas off the coast of the Gulf of Mexico. This is a remote site at which commercial power is unavailable. Instead, the system is powered by a photovoltaic array. Air conditioning at this site would more than double the total power requirements of the installation. In contrast, the water cooling system requires less than 20% of the total electrical power. From August 2008 to August 2009, the system operated with high reliability, producing surface current radial data which was transmitted in near real-time via a cellular signal to the National HF Radar Network and is publically available via the World Wide Web.



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