253 resources related to Liquid cooling
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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.
2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)
2013 International Conference on Electrical Machines and Systems (ICEMS)
Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train
The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...
Huque, M.A.; Vijayaraghavan, R.; Zhang, M.; Blalock, B.J.; Tolbert, L.M.; Islam, S.K. Power Electronics Specialists Conference, 2007. PESC 2007. IEEE, 2007
A high-voltage and high-temperature gate-driver chip for SiC FET switches is designed and fabricated using 0.8- micron, 2-poly and 3-metal BCD on SOI process. It can generate output voltage swing from -5 V to 30 V and can operate up to 175degC ambient temperature. This gate-driver chip is intended to drive SiC power FETs in DC-DC converters in a hybrid ...
Zhang, H.Y.; Mui, Y.C.; Refai-Ahmed, G. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on, 2010
The use of thermoelectric cooler (TEC) as enhanced air cooling technique for electronic generating devices has been of increasing interest. In this paper, experimental and computational studies of TEC enhanced air cooling limits are conducted. The experimental work was first conducted as a baseline study. The setup consisted of a fan-cooled heat sink, a thermal test board mounted with a ...
Chen, X.Y.; Toh, K.C.; Chai, J.C.; Pinjala, D. Electronics Packaging Technology Conference, 2002. 4th, 2002
With the advances in microfabrication techniques and high performance chips, the heat flux from electronic components is reaching a point where air-cooling is unlikely to meet the cooling requirements for future generation computer chips. Direct single-phase liquid cooling of a stacked multichip module using FC-77 is examined in this paper. Three-dimensional numerical simulation is conducted to investigate the flow and ...
Chu, R.C. Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on, 1998
Cooling technology has been a vital prerequisite for the rapid and continued advancement of computer products, ranging from lap-tops to supercomputers. This paper provides a review of the recent development of cooling technology for computers. Both air cooling and liquid cooling are included. Air cooling is discussed in terms of the advantages of impinging flow. An example of module internal ...
Stevanovic, L.D.; Beaupre, R.A.; Gowda, A.V.; Pautsch, A.G.; Solovitz, S.A. Applied Power Electronics Conference and Exposition (APEC), 2010 Twenty-Fifth Annual IEEE, 2010
A novel integral micro-channel heat sink was developed, featuring an array of sub-millimeter channels fabricated directly in the back-metallization layer of the direct bond copper or active metal braze ceramic substrate, thus minimizing the material between the semiconductor junction and fluid and the overall junction-to-fluid thermal resistance. The ceramic substrate is bonded to a baseplate that includes a set of ...
2011 IEEE Jun-ichi Nishizawa Medal - Bernard J. Lechner, T. Peter Brody and Fang-Chen Luo
ITRI: Technology Advances in Flexible Displays and Substrates
Superconducting MAGLEV in Japan - ASC-2014 Plenary series - 13 of 13 - Friday 2014/8/15
Advances in MgB2 - ASC-2014 Plenary series - 7 of 13 - Wednesday 2014/8/13
ASC-2014 SQUIDs 50th Anniversary: 4 of 6 - Keiji Enpuku
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