Conferences related to Liquid cooling

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Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2009

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2007

  • OCEANS 2006

  • OCEANS 2005

  • OCEANS 2004

  • OCEANS 2003

  • OCEANS 2002

  • OCEANS 2001

  • OCEANS 2000

  • OCEANS '99

  • OCEANS '98

  • OCEANS '97

  • OCEANS '96


2019 IEEE 28th Symposium on Fusion Engineering (SOFE)

fusion engineering, physics and materials, plasma heating, vacuum technology, tritium processing, fueling, first walls, blankets and divertors


2019 IEEE 58th Conference on Decision and Control (CDC)

The CDC is recognized as the premier scientific and engineering conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, systems and control, and related areas.The 58th CDC will feature contributed and invited papers, as well as workshops and may include tutorial sessions.The IEEE CDC is hosted by the IEEE Control Systems Society (CSS) in cooperation with the Society for Industrial and Applied Mathematics (SIAM), the Institute for Operations Research and the Management Sciences (INFORMS), the Japanese Society for Instrument and Control Engineers (SICE), and the European Union Control Association (EUCA).


2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2019 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Liquid cooling

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications Surveys & Tutorials, IEEE

Each tutorial reviews currents communications topics in network management and computer and wireless communications. Available tutorials, which are 2.5 to 5 hours in length contains the original visuals and voice-over by the presenter. IEEE Communications Surveys & Tutorials features two distinct types of articles: original articles and reprints. The original articles are exclusively written for IEEE Communications Surveys & Tutorials ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Liquid cooling

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Xplore Articles related to Liquid cooling

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Experimental study on the liquid cooling of a test MCM using paraffin slurry

[{u'author_order': 1, u'affiliation': u'Sung Kyun Kwan Univ., Suwon, South Korea', u'authorUrl': u'https://ieeexplore.ieee.org/author/38128288000', u'full_name': u'K. Cho', u'id': 38128288000}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/38125214000', u'full_name': u'M.G. Choi', u'id': 38125214000}] ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 1998

This study investigated the effects of the experimental parameters on the cooling performance of the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5/spl sim/7.5%, heat flux of 10/spl sim/40 W/cm/sup 2/ for the simulated VLSI chips and Reynolds numbers of 5,300/spl sim/16,000. The apparatus consisted of a test section, paraffin slurry ...


IEEE Draft Standard for the Design, Testing and Application of Liquid-Immersed Distribution, Power and Regulating Transformers Using High-Temperature Insulation Systems and Operating at Elevated Temperatures

[] IEEE PC57.154/D9, March 2012, 2012

This standard applies to all liquid-immersed distribution, power and regulating transformers that are designed to operate at temperatures that exceed the normal thermal limits of C57.12.00, under continuous load, in the designed average ambient and at rated conditions. This standard provides specific requirements and guidance in the design, testing and application of the transformers covered within its scope. These transformers ...


Direct liquid cooling of a stacked multichip module

[{u'author_order': 1, u'affiliation': u'Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore', u'authorUrl': u'https://ieeexplore.ieee.org/author/37278213200', u'full_name': u'X.Y. Chen', u'id': 37278213200}, {u'author_order': 2, u'affiliation': u'Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore', u'authorUrl': u'https://ieeexplore.ieee.org/author/38181534800', u'full_name': u'K.C. Toh', u'id': 38181534800}, {u'author_order': 3, u'affiliation': u'Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore', u'authorUrl': u'https://ieeexplore.ieee.org/author/37270898800', u'full_name': u'J.C. Chai', u'id': 37270898800}, {u'author_order': 4, u'authorUrl': u'https://ieeexplore.ieee.org/author/37064734900', u'full_name': u'D. Pinjala', u'id': 37064734900}] 4th Electronics Packaging Technology Conference, 2002., 2002

With the advances in microfabrication techniques and high performance chips, the heat flux from electronic components is reaching a point where air-cooling is unlikely to meet the cooling requirements for future generation computer chips. Direct single-phase liquid cooling of a stacked multichip module using FC-77 is examined in this paper. Three-dimensional numerical simulation is conducted to investigate the flow and ...


Performance improvement of stacked graphite sheets for cooling applications

[{u'author_order': 1, u'affiliation': u'IBM Research, Tokyo Research Laboratory, 1623-14 Shimotsuruma, Yamato-shi, Kanagawa, Japan 242-8502', u'authorUrl': u'https://ieeexplore.ieee.org/author/37282518300', u'full_name': u'Yoichi Taira', u'id': 37282518300}, {u'author_order': 2, u'affiliation': u'IBM Research, Tokyo Research Laboratory, 1623-14 Shimotsuruma, Yamato-shi, Kanagawa, Japan 242-8502', u'authorUrl': u'https://ieeexplore.ieee.org/author/37976591700', u'full_name': u'Sayuri Kohara', u'id': 37976591700}, {u'author_order': 3, u'affiliation': u'IBM Research, Tokyo Research Laboratory, 1623-14 Shimotsuruma, Yamato-shi, Kanagawa, Japan 242-8502', u'authorUrl': u'https://ieeexplore.ieee.org/author/37282520100', u'full_name': u'Kuniaki Sueoka', u'id': 37282520100}] 2008 58th Electronic Components and Technology Conference, 2008

We realized a thin slice of vertically stacked pyrolytic graphite for the thermal interface use. The maximum size of the slice achieved was 37 times 37 mm<sup>2</sup> with a thickness about 500 mum. This system shows a heat resistance better than 20 mm<sup>2</sup>C/W, which is almost independent of the thickness. The heat resistance can be drastically improved by modifying the ...


Liquid cooling high power compact electronics

[{u'author_order': 1, u'affiliation': u'Teradyne Inc., Nashua, NH, USA', u'authorUrl': u'https://ieeexplore.ieee.org/author/37284830900', u'full_name': u'A.C. Pfahnl', u'id': 37284830900}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37271891200', u'full_name': u'Hsing-Sheng Liang', u'id': 37271891200}] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004

Conventional electronics liquid cooling are used in automatic test equipment (ATE) and military equipment, it is implemented using blind-mate fluid disconnects packaged alongside the card edge connectors, or using hoses and manual latching fluid disconnects. This paper describe a novel rack-mount liquid cooling packaging architecture. This arrangement utilizes manual latching fluid disconnects, so that the fluid transport lines to the ...


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Educational Resources on Liquid cooling

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eLearning

No eLearning Articles are currently tagged "Liquid cooling"

IEEE-USA E-Books

  • Health Assessment of Liquid Cooling System in Aircrafts: Data Visualization, Reduction, Clustering, and Classification (2012-01-2106)

    This paper addresses the issues of data reduction, visualization, clustering and classification for fault diagnosis and prognosis of the Liquid Cooling System (LCS) in an aircraft. LCS is a cooling system that consists of a left and a right loop, where each loop is composed of a variety of components including a heat exchanger, source control units, a compressor, and a pump. The LCS data and the fault correlation analysis used in the paper are provided by Hamilton Sundstrand (HS) - A United Technologies Company (UTC). This data set includes a variety of sensor measurements for system parameters including temperatures and pressures of different components, along with liquid levels and valve positions of the pumps and controllers. A graphical user interface (GUI) is developed in Matlab that facilitates extensive plotting of the parameters versus each other, and/or time to observe the trends in the data. The parameters that reflect interesting information are selected by observing the correlations between different parameters. The data are analyzed using the wavelet transform to highlight the interclass separation and subdue the within class differences for more accurate classification. Subsequently, the number of parameters is significantly reduced using theprincipal component analysis(PCA). PCA-based data reduction resulted in different clusters when applied to the healthy data, and faulty data of the left and right loops. Several classification methods have been tested and their performance was evaluated. The results of this paper will be used for the purpose of fault diagnosis and prognosis in LCS. The methodology used in this paper can also be applied to other HS systems.

  • Engine Design III: Valves and Valve Gear. Gears and Auxiliary Systems

    This chapter contains sections titled: Poppet Valves, Valves And Ports for 2-Cycle Engines, Valve-Gear Design, Gearing, Superchargers and Scavenging Pumps, Manifolding, Ignition Systems, Injection Systems, Cooling Systems, Liquid, Cooling Systems, Air, Lubrication Systems, Auxiliaries, Gaskets And Seals, Over-All Design Criteria



Standards related to Liquid cooling

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No standards are currently tagged "Liquid cooling"


Jobs related to Liquid cooling

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