Conferences related to Liquid cooling

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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.

2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)

electronics cooling

2013 International Conference on Electrical Machines and Systems (ICEMS)

Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train

  • 2012 15th International Conference on Electrical Machines and Systems (ICEMS)

    The conference will provide a big opportunity for researchers and professionals from all over the world to present the latest researches and developments and to exchange useful information and experiences in the fields of electrical machines and systems such as motor drive systems, turbine generators, linear machines, transformers, electric vehicles, renewable energy, power converters, etc.

  • 2011 International Conference on Electrical Machines and Systems (ICEMS)

    Electrical machines, power electronics and systems.

  • 2010 International Conference on Electrical Machines and Systems (ICEMS)

    1) Power Converters/Inverters 2) Systems for Renewable Energy 3) Motor Drives 4) PM Machines and DC Machines 5) Induction, Synchronous Machines 6) Transformers and High Voltage Machines 7) Linear Machines 8) Special Machines and Their Applications 9) Field Analysis and optimal Design Technologies 10) Electrical Technologies for the Next Generation Vehicle

  • 2009 International Conference on Electrical Machines and Systems (ICEMS)

    The aims of ICEMS2009 are to provide an opportunity for scientists and experts to present the latest research developments in the field of electrical machines and systems (rotating and other machines, power electronics, motion control, and motor drives) and to exchange useful information and experiences in research, trends and applications.

2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications (ThETA)

Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)

Periodicals related to Liquid cooling

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.

Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...

Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...

Xplore Articles related to Liquid cooling

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Understanding the performance metrics for advanced cooling methodologies

Solovitz, S.A.; Arik, M. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on, 2010

Many novel thermal management technologies have been developed to ameliorate the losses from modern electronics. As these techniques are developed, designers endeavor to compare each method with existing concepts. However, many of these comparative metrics can be system-dependent, leading to inconclusive results. One of the most common metrics, the thermal resistance, is a simple relationship between the total heat transfer ...

Parallel Thermal Analysis of 3-D Integrated Circuits With Liquid Cooling on CPU-GPU Platforms

Xue-Xin Liu; Kuangya Zhai; Zao Liu; Kai He; Tan, S.X.-D.; Wenjian Yu Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, 2015

In this brief, we propose an efficient parallel finite difference-based thermal simulation algorithm for 3-D-integrated circuits (ICs) using generalized minimum residual method (GMRES) solver on CPU-graphic processing unit (GPU) platforms. First, the new method starts from basic physics-based heat equations to model 3-D-ICs with intertier liquid cooling microchannels and directly solves the resulting partial differential equations. Second, we develop a ...

Evaluation of a Liquid Cooling Concept for High Power Processors

Guoping Xu Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE, 2007

A high performance liquid cooling architecture for high power processors in less than 45 mm height electronics chassis (1U rack space) was proposed and investigated experimentally. A review of several system cooling approaches from CPU to data center was also provided. The present proposed method employs conventional heat pipes to transport local CPU heat to the edge of an electronics ...

Server liquid cooling with chiller-less data center design to enable significant energy savings

Iyengar, M.; David, M.; Parida, P.; Kamath, V.; Kochuparambil, B.; Graybill, D.; Schultz, M.; Gaynes, M.; Simons, R.; Schmidt, R.; Chainer, T. Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE, 2012

This paper summarizes the concept design and hardware build efforts as part of a US Department of Energy cost shared grant, two year project (2010-2012) that was undertaken to develop highly energy efficient, warm liquid cooled servers for use in chiller-less data centers. Significant savings are expected in data center energy, refrigerant and make up water use. The technologies being ...

Heat transfer and cooling

Fowler, K. Instrumentation & Measurement Magazine, IEEE, 2001

All electronics generate heat. No device operates at 100% efficiency. The energy lost within a circuit dissipates as heat. That heat is the difference between the input and output power. The author suggests that the design for cooling is too often delayed in a project until too late. The resulting fixes or solutions are usually far from optimal, and they ...

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