250 resources related to Liquid cooling
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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.
2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)
2013 International Conference on Electrical Machines and Systems (ICEMS)
Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train
The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...
Wei Huang; Stan, M.R.; Gurumurthi, S.; Ribando, R.J.; Skadron, K. Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE, 2010
It is predicted that two important trends are likely to accompany traditional CMOS semiconductor technology scaling - chip multiprocessors and 3D integration. With the ever-increasing power consumption and the consequent difficulty in heat removal, it is important to consider the limits and implications of different cooling methods for the upcoming many-core and 3D era. In this paper, we consider both ...
Joshi, Y.; Bar-Cohen, A.; Bhavnani, S. Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th, 1999
Over the past year, a multi-institution team has pioneered the development of a series of internet based instructional modules on thermal design of electronic products. These include web based tutorials on specialized topics, case studies, and a virtual laboratory tour. These efforts are summarized, and the best practices usable in other similar undertakings are identified in this paper. The case ...
Gromoll, B. Semiconductor Thermal Measurement and Management Symposium, 1994. SEMI-THERM X., Proceedings of 1994 IEEE/CPMT 10th, 1994
Future 3D electronics packaging systems will require micro cooling systems that can be integrated and permit the continued use of air as a coolant. To achieve this, new types of silicon micro heat exchangers were made using an anisotropic etching process. Various heat exchanger configurations and sizes were made using sandwich and stacking techniques. They can be used either as ...
Pal, A.; Joshi, Y. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on, 2006
Liquid cooling with phase change is a very attractive option for thermal management of electronics because it achieves very high heat transfer coefficients compared to single phase liquid cooling. Phase change liquid cooling can be implemented in a thermosyphon loop, where heat is transferred from the heated surface to the evaporator and rejected to the ambient from the condenser. Optimized ...
Daud, M.M.M.; Bin Mohd Nor, N.; Ibrahim, T. Power Engineering and Optimization Conference (PEDCO) Melaka, Malaysia, 2012 Ieee International, 2012
The aim of this project is to develop a hybrid system to increase efficiency of electricity generation. Two sources of energy are used in this project. One of the energy is solar, that converts radiant light to electrical energy and heat energy which will convert heat to electricity. Photovoltaic (PV) cell and thermoelectric (TE) module is used in this project ...
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