251 resources related to Liquid cooling
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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.
2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)
2013 International Conference on Electrical Machines and Systems (ICEMS)
Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train
The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...
Zhang, H.Y.; Pinjala, D.; Wong, T.N.; Joshi, Y.K. Components and Packaging Technologies, IEEE Transactions on, 2005
In this paper, development of single-phase liquid cooling techniques for flip chip ball grid array packages (FBGAs) with high flux heat dissipations is reported. Two thermal test chips with different footprints, 12 mm× 12 mm and 10 mm ×10 mm, respectively, were used for high heat flux characterizations. A liquid-cooled aluminum heat sink with an area of 15 mm (L) ...
Upadhya, G.; Munch, M.; Peng Zhou; Horn, J.; Werner, D.; McMaster, M. Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE, 2006
The requirements for thermal management in high performance computers are rapidly outpacing the capabilities of the best commercial heat sinks, including those with integrated heat pipes. The problem lies in three compounding trends: a) higher total chip power, b) higher local heat flux in chip hotspots, and c) smaller system enclosures. Pumped liquid cooling is a promising alternative, but this ...
Gromoll, B. Semiconductor Thermal Measurement and Management Symposium, 1994. SEMI-THERM X., Proceedings of 1994 IEEE/CPMT 10th, 1994
Future 3D electronics packaging systems will require micro cooling systems that can be integrated and permit the continued use of air as a coolant. To achieve this, new types of silicon micro heat exchangers were made using an anisotropic etching process. Various heat exchanger configurations and sizes were made using sandwich and stacking techniques. They can be used either as ...
Coskun, A.K.; Atienza, D.; Rosing, T.S.; Brunschwiler, Thomas; Michel, Bruno Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010, 2010
Liquid cooling has emerged as a promising solution for addressing the elevated temperatures in 3D stacked architectures. In this work, we first propose a framework for detailed thermal modeling of the microchannels embedded between the tiers of the 3D system. In multicore systems, workload varies at runtime, and the system is generally not fully utilized. Thus, it is not energy- ...
Sabry, M.M.; Coskun, A.K.; Atienza, D.; Rosing, T.S.; Brunschwiler, Thomas Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on, 2011
3-D stacked systems reduce communication delay in multiprocessor system-on- chips (MPSoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates temperature-induced problems such as reliability degradation. Liquid cooling is a highly efficient solution to overcome the accelerated thermal problems in 3-D architectures; however, it brings new challenges in modeling and run-time management ...
ITRI: Technology Advances in Flexible Displays and Substrates
Superconducting MAGLEV in Japan - ASC-2014 Plenary series - 13 of 13 - Friday 2014/8/15
Advances in MgB2 - ASC-2014 Plenary series - 7 of 13 - Wednesday 2014/8/13
ASC-2014 SQUIDs 50th Anniversary: 4 of 6 - Keiji Enpuku
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