254 resources related to Liquid cooling
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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.
2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)
2013 International Conference on Electrical Machines and Systems (ICEMS)
Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train
The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...
Sahraoui, M.; Cader, T.; Ahmed, G.R. Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on, 2004
The high integration and miniaturization of semi-conductors devices has enabled more than ever before tremendous gains in communication bandwidth and processing power for high end desktop computers, servers, and data/telecom equipment. Because of the increased speed in these new applications, new technologies such as system on a chip or stacked die are being used more 6equently to achieve adequate device ...
Cho, M.; Sathe, N.; Gupta, M.; Kumar, S.; Yalamanchilli, S.; Mukhopadhyay, S. Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE, 2010
This paper presents a proactive spatiotemporal power multiplexing method to manage the thermal field in many-core processors. We first analyze the thermal field in many core processors in deep nanometer (to 16nm nodes). We show that the thermal field in many-core can have significant spatiotemporal non- uniformity along with high maximum temperature. For better reliability and improved cooling efficiency, it ...
Rubenstein, B.A.; Zeighami, R.; Lankston, R.; Peterson, E. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on, 2010
Customers who operate large data centers are looking for new ways to reduce their energy consumption and improve the ability to support higher compute density. An approach to liquid cooling that uses warm water instead of chilled water to cool system components and eliminate or greatly reduce the need for chillers in the data center is described in this paper. ...
Parsons, E.M.; Redd, C.; Gandhi, M.S.; Tuckett, R.P.; Bamberg, S.J.M. Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE, 2011
Vibrotactile threshold testing has been used to investigate activation of human somatosensory pathways. A portable vibrotactile threshold testing device called the Vibrotactile Threshold Evaluator for the Workplace (VTEW) was designed for screening of carpal tunnel syndrome in the workplace, and initially contained a small fan for cooling. During subject testing, the device is operated intermittently, which causes the linear actuator ...
Bakir, M.S.; King, C.; Sekar, D.; Thacker, H.; Dang, B.; Gang Huang; Naeemi, A.; Meindl, J.D. Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE, 2008
This paper describes a novel 3D integration technology that enables the integration of electrical, optical, and microfluidic interconnects in a 3D die stack. The electrical interconnects are used to provide power delivery and signaling, the optical interconnects are used to enable optical signal routing to all levels of the 3D stack, and the microfluidic interconnects are used to cool each ...
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