Conferences related to Liquid cooling

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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.

2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)

electronics cooling

2013 International Conference on Electrical Machines and Systems (ICEMS)

Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train

  • 2012 15th International Conference on Electrical Machines and Systems (ICEMS)

    The conference will provide a big opportunity for researchers and professionals from all over the world to present the latest researches and developments and to exchange useful information and experiences in the fields of electrical machines and systems such as motor drive systems, turbine generators, linear machines, transformers, electric vehicles, renewable energy, power converters, etc.

  • 2011 International Conference on Electrical Machines and Systems (ICEMS)

    Electrical machines, power electronics and systems.

  • 2010 International Conference on Electrical Machines and Systems (ICEMS)

    1) Power Converters/Inverters 2) Systems for Renewable Energy 3) Motor Drives 4) PM Machines and DC Machines 5) Induction, Synchronous Machines 6) Transformers and High Voltage Machines 7) Linear Machines 8) Special Machines and Their Applications 9) Field Analysis and optimal Design Technologies 10) Electrical Technologies for the Next Generation Vehicle

  • 2009 International Conference on Electrical Machines and Systems (ICEMS)

    The aims of ICEMS2009 are to provide an opportunity for scientists and experts to present the latest research developments in the field of electrical machines and systems (rotating and other machines, power electronics, motion control, and motor drives) and to exchange useful information and experiences in research, trends and applications.

2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications (ThETA)

Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)

Periodicals related to Liquid cooling

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.

Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...

Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...

Xplore Articles related to Liquid cooling

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Interaction of scaling trends in processor architecture and cooling

Wei Huang; Stan, M.R.; Gurumurthi, S.; Ribando, R.J.; Skadron, K. Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE, 2010

It is predicted that two important trends are likely to accompany traditional CMOS semiconductor technology scaling - chip multiprocessors and 3D integration. With the ever-increasing power consumption and the consequent difficulty in heat removal, it is important to consider the limits and implications of different cooling methods for the upcoming many-core and 3D era. In this paper, we consider both ...

Internet based instruction for thermal design of electronic products-making a global impact

Joshi, Y.; Bar-Cohen, A.; Bhavnani, S. Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th, 1999

Over the past year, a multi-institution team has pioneered the development of a series of internet based instructional modules on thermal design of electronic products. These include web based tutorials on specialized topics, case studies, and a virtual laboratory tour. These efforts are summarized, and the best practices usable in other similar undertakings are identified in this paper. The case ...

Advanced micro air-cooling systems for high density packaging

Gromoll, B. Semiconductor Thermal Measurement and Management Symposium, 1994. SEMI-THERM X., Proceedings of 1994 IEEE/CPMT 10th, 1994

Future 3D electronics packaging systems will require micro cooling systems that can be integrated and permit the continued use of air as a coolant. To achieve this, new types of silicon micro heat exchangers were made using an anisotropic etching process. Various heat exchanger configurations and sizes were made using sandwich and stacking techniques. They can be used either as ...

Boiling at sub-atmospheric conditions with enhanced structures

Pal, A.; Joshi, Y. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on, 2006

Liquid cooling with phase change is a very attractive option for thermal management of electronics because it achieves very high heat transfer coefficients compared to single phase liquid cooling. Phase change liquid cooling can be implemented in a thermosyphon loop, where heat is transferred from the heated surface to the evaporator and rejected to the ambient from the condenser. Optimized ...

Novel hybrid photovoltaic and thermoelectric panel

Daud, M.M.M.; Bin Mohd Nor, N.; Ibrahim, T. Power Engineering and Optimization Conference (PEDCO) Melaka, Malaysia, 2012 Ieee International, 2012

The aim of this project is to develop a hybrid system to increase efficiency of electricity generation. Two sources of energy are used in this project. One of the energy is solar, that converts radiant light to electrical energy and heat energy which will convert heat to electricity. Photovoltaic (PV) cell and thermoelectric (TE) module is used in this project ...

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