Conferences related to Liquid cooling

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2019 IEEE 28th Symposium on Fusion Engineering (SOFE)

fusion engineering, physics and materials, plasma heating, vacuum technology, tritium processing, fueling, first walls, blankets and divertors


2019 IEEE Pulsed Power & Plasma Science (PPPS)

Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference


2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration ofthermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

Semiconductor thermal management and modeling


2018 9th International Particle Accelerator Conference (IPAC)

Topics cover a complete survey of the field of charged particle accelerator science and technology and infrastructure.


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Periodicals related to Liquid cooling

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications Surveys & Tutorials, IEEE

Each tutorial reviews currents communications topics in network management and computer and wireless communications. Available tutorials, which are 2.5 to 5 hours in length contains the original visuals and voice-over by the presenter. IEEE Communications Surveys & Tutorials features two distinct types of articles: original articles and reprints. The original articles are exclusively written for IEEE Communications Surveys & Tutorials ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Xplore Articles related to Liquid cooling

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IEEE Approved Draft Guide for Acceptance and Maintenance of Natural Ester Insulating Liquid in Transformers

None IEEE PC57.147/D5, November 2017, 2017

Assistance to equipment manufacturers and service companies to evaluate the suitability of unused natural ester insulating liquids being received from suppliers is provided in this guide. Information for transformer operators in evaluating and maintaining natural ester insulating liquids in serviceable condition is also provided.


Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages

[{u'author_order': 1, u'affiliation': u'Institute of Microelectronics', u'full_name': u'H. Y. Zhang'}, {u'author_order': 2, u'full_name': u'D. Pinjala'}, {u'author_order': 3, u'full_name': u'Y. K. Joshi'}, {u'author_order': 4, u'full_name': u'T. N. Wong'}, {u'author_order': 5, u'full_name': u'K. C. Toh'}] 53rd Electronic Components and Technology Conference, 2003. Proceedings., None

First Page of the Article ![](/xploreAssets/images/absImages/01216313.png)


Thermal-aware design of 3D ICs with inter-tier liquid cooling

[{u'author_order': 1, u'affiliation': u'Embedded Systems Laboratory (ESL), Ecole Polytechnique Fédérale de Lausanne (EPFL), Switzerland', u'full_name': u'David Atienza'}] 2010 International Electron Devices Meeting, None

Microchannel-based liquid cooling is a promising technology solution to overcome the thermal challenges of 3D MPSoCs. However, intelligent control of the coolant flow rate is needed to avoid wasted energy consumption for over- cooling the system when the system is under-utilized. Therefore, this paper proposes a novel system-level thermal-aware design as an affective method to achieve thermally-balanced 3D MPSoCs.


Comparison of Overhead Supply and Underfloor Supply with Rear Heat Exchanger in High Density Data Center Clusters

[{u'author_order': 1, u'affiliation': u'Department of Mechanical Engineering, University of Texas at Arlington, Arlington, Texas 76019, ravi.udakeri@uta.edu', u'full_name': u'Ravi Udakeri'}, {u'author_order': 2, u'affiliation': u'Department of Mechanical Engineering, University of Texas at Arlington, Arlington, Texas 76019, mulay@uta.edu', u'full_name': u'Veerendra Mulay'}, {u'author_order': 3, u'affiliation': u'Department of Mechanical Engineering, University of Texas at Arlington, Arlington, Texas 76019, agonafer@uta.edu', u'full_name': u'Dereje Agonafer'}] 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, None

The power trend for server systems continues to grow thereby making thermal management of data centers a very challenging task. Although various configurations exist, the raised floor plenum with computer room air conditioners (CRACs) providing cold air is a popular operating strategy. In prior work, numerous data center layouts employing raised floor plenum and the impact of design parameters such ...


Liquid Cooling of Power Thyristors

[{u'author_order': 1, u'affiliation': u'Semiconductor Products Department, General Electric Company, Auburn, N.Y. 13021.', u'full_name': u'Forest B. Golden'}] IEEE Transactions on Industry Applications, 1972

A method of determining a given heat exchanger's thermal properties from the characteristics of the cooling medium is discussed. A test method is presented with an example which helps to clarify the results. It is concluded from running tests using three to four different liquids that heat exchanger thermal performance data can be derived for liquids having a wide range ...


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Standards related to Liquid cooling

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