Conferences related to Liquid cooling

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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.


2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)

electronics cooling


2013 International Conference on Electrical Machines and Systems (ICEMS)

Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train

  • 2012 15th International Conference on Electrical Machines and Systems (ICEMS)

    The conference will provide a big opportunity for researchers and professionals from all over the world to present the latest researches and developments and to exchange useful information and experiences in the fields of electrical machines and systems such as motor drive systems, turbine generators, linear machines, transformers, electric vehicles, renewable energy, power converters, etc.

  • 2011 International Conference on Electrical Machines and Systems (ICEMS)

    Electrical machines, power electronics and systems.

  • 2010 International Conference on Electrical Machines and Systems (ICEMS)

    1) Power Converters/Inverters 2) Systems for Renewable Energy 3) Motor Drives 4) PM Machines and DC Machines 5) Induction, Synchronous Machines 6) Transformers and High Voltage Machines 7) Linear Machines 8) Special Machines and Their Applications 9) Field Analysis and optimal Design Technologies 10) Electrical Technologies for the Next Generation Vehicle

  • 2009 International Conference on Electrical Machines and Systems (ICEMS)

    The aims of ICEMS2009 are to provide an opportunity for scientists and experts to present the latest research developments in the field of electrical machines and systems (rotating and other machines, power electronics, motion control, and motor drives) and to exchange useful information and experiences in research, trends and applications.


2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.


2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications (ThETA)

Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)



Periodicals related to Liquid cooling

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...




Xplore Articles related to Liquid cooling

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Development of liquid cooling techniques for flip chip ball grid array packages with High Heat flux dissipations

Zhang, H.Y.; Pinjala, D.; Wong, T.N.; Joshi, Y.K. Components and Packaging Technologies, IEEE Transactions on, 2005

In this paper, development of single-phase liquid cooling techniques for flip chip ball grid array packages (FBGAs) with high flux heat dissipations is reported. Two thermal test chips with different footprints, 12 mm× 12 mm and 10 mm ×10 mm, respectively, were used for high heat flux characterizations. A liquid-cooled aluminum heat sink with an area of 15 mm (L) ...


Micro-scale liquid cooling system for high heat flux processor cooling applications

Upadhya, G.; Munch, M.; Peng Zhou; Horn, J.; Werner, D.; McMaster, M. Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE, 2006

The requirements for thermal management in high performance computers are rapidly outpacing the capabilities of the best commercial heat sinks, including those with integrated heat pipes. The problem lies in three compounding trends: a) higher total chip power, b) higher local heat flux in chip hotspots, and c) smaller system enclosures. Pumped liquid cooling is a promising alternative, but this ...


Advanced micro air-cooling systems for high density packaging

Gromoll, B. Semiconductor Thermal Measurement and Management Symposium, 1994. SEMI-THERM X., Proceedings of 1994 IEEE/CPMT 10th, 1994

Future 3D electronics packaging systems will require micro cooling systems that can be integrated and permit the continued use of air as a coolant. To achieve this, new types of silicon micro heat exchangers were made using an anisotropic etching process. Various heat exchanger configurations and sizes were made using sandwich and stacking techniques. They can be used either as ...


Energy-efficient variable-flow liquid cooling in 3D stacked architectures

Coskun, A.K.; Atienza, D.; Rosing, T.S.; Brunschwiler, Thomas; Michel, Bruno Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010, 2010

Liquid cooling has emerged as a promising solution for addressing the elevated temperatures in 3D stacked architectures. In this work, we first propose a framework for detailed thermal modeling of the microchannels embedded between the tiers of the 3D system. In multicore systems, workload varies at runtime, and the system is generally not fully utilized. Thus, it is not energy- ...


Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures

Sabry, M.M.; Coskun, A.K.; Atienza, D.; Rosing, T.S.; Brunschwiler, Thomas Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on, 2011

3-D stacked systems reduce communication delay in multiprocessor system-on- chips (MPSoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates temperature-induced problems such as reliability degradation. Liquid cooling is a highly efficient solution to overcome the accelerated thermal problems in 3-D architectures; however, it brings new challenges in modeling and run-time management ...


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