Conferences related to Liquid cooling

Back to Top

2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.


2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)

electronics cooling


2013 International Conference on Electrical Machines and Systems (ICEMS)

Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train

  • 2012 15th International Conference on Electrical Machines and Systems (ICEMS)

    The conference will provide a big opportunity for researchers and professionals from all over the world to present the latest researches and developments and to exchange useful information and experiences in the fields of electrical machines and systems such as motor drive systems, turbine generators, linear machines, transformers, electric vehicles, renewable energy, power converters, etc.

  • 2011 International Conference on Electrical Machines and Systems (ICEMS)

    Electrical machines, power electronics and systems.

  • 2010 International Conference on Electrical Machines and Systems (ICEMS)

    1) Power Converters/Inverters 2) Systems for Renewable Energy 3) Motor Drives 4) PM Machines and DC Machines 5) Induction, Synchronous Machines 6) Transformers and High Voltage Machines 7) Linear Machines 8) Special Machines and Their Applications 9) Field Analysis and optimal Design Technologies 10) Electrical Technologies for the Next Generation Vehicle

  • 2009 International Conference on Electrical Machines and Systems (ICEMS)

    The aims of ICEMS2009 are to provide an opportunity for scientists and experts to present the latest research developments in the field of electrical machines and systems (rotating and other machines, power electronics, motion control, and motor drives) and to exchange useful information and experiences in research, trends and applications.


2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.


2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications (ThETA)

Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)



Periodicals related to Liquid cooling

Back to Top

Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...




Xplore Articles related to Liquid cooling

Back to Top

Integration of micro heat sink in silicon technology

Perret, C.; Schaeffer, C.; Boussey, J. Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on, 1998

The use of microchannels in silicon substrates as a forced liquid cooling device for power integrated circuits is investigated. The new concept presented in this work consists of placing water cooled heat sink structure directly inside the silicon substrate in order to be as close as possible to the heat generation source (circuit) and to reduce the number of heterojunctions ...


Super cooling structures for power electronics

Raj, E.; Lisik, Z.; Langer, M.; Rudzki, J. Power Electronics and Applications, 2005 European Conference on, 2005

The paper presents the microchannel cooling structure. This very efficient heat sink is dedicated for power electronic applications characterised by high heat flux densities combined with high overall power levels. The conducted measurements show that to meet both thermal and mechanical demands; the structure can achieve thermal resistance of 0.1 K/W


Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

Gong Yue Tang; Siow Pin Tan; Khan, N.; Pinjala, D.; Lau, J.H.; Ai Bin Yu; Vaidyanathan, K.; Kok Chuan Toh Components and Packaging Technologies, IEEE Transactions on, 2010

In this paper, an integrated liquid cooling system for 3-D stacked modules with high dissipation level is proposed. The fluidic interconnects in this system are elaborated and the sealing technique for different fluid interfaces is discussed. Meanwhile, the pressure drop for each part of the system is analyzed. The optimized fluidic interconnects minimizing the pressure drop have been designed and ...


Thermal performance modeling of hybrid liquid-air cooled servers

Zeighami, R.; Saunders, W.A.; Coles, H.; Branton, S. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on, 2014

This paper discusses data center scale performance characterization of hybrid liquid-air cooling solutions for a full 42U rack of servers. Using data collected in a production data center at Lawrence Berkeley Laboratories, we interpret the results with a simple three parameter model which allows characterization of the major factors affecting heat recovery efficiency of the system. The model is shown ...


Effect of warm water cooling for an isolated hybrid liquid cooled server

Addagatla, A.; Fernandes, J.; Mani, D.; Agonafer, D.; Mulay, V. Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st, 2015

Data center cooling strategies have changed overtime due to increases in power densities and server cooling power requirement. Traditionally, most data centers adopt air cooling where the computer room air conditioner (CRAC) units pump volumes of chilled air to cool information technology (IT) equipment and dispose the heat to the ambient. With demand for energy-efficient and cost- effective data centers ...


More Xplore Articles

Educational Resources on Liquid cooling

Back to Top

eLearning

Integration of micro heat sink in silicon technology

Perret, C.; Schaeffer, C.; Boussey, J. Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on, 1998

The use of microchannels in silicon substrates as a forced liquid cooling device for power integrated circuits is investigated. The new concept presented in this work consists of placing water cooled heat sink structure directly inside the silicon substrate in order to be as close as possible to the heat generation source (circuit) and to reduce the number of heterojunctions ...


Super cooling structures for power electronics

Raj, E.; Lisik, Z.; Langer, M.; Rudzki, J. Power Electronics and Applications, 2005 European Conference on, 2005

The paper presents the microchannel cooling structure. This very efficient heat sink is dedicated for power electronic applications characterised by high heat flux densities combined with high overall power levels. The conducted measurements show that to meet both thermal and mechanical demands; the structure can achieve thermal resistance of 0.1 K/W


Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

Gong Yue Tang; Siow Pin Tan; Khan, N.; Pinjala, D.; Lau, J.H.; Ai Bin Yu; Vaidyanathan, K.; Kok Chuan Toh Components and Packaging Technologies, IEEE Transactions on, 2010

In this paper, an integrated liquid cooling system for 3-D stacked modules with high dissipation level is proposed. The fluidic interconnects in this system are elaborated and the sealing technique for different fluid interfaces is discussed. Meanwhile, the pressure drop for each part of the system is analyzed. The optimized fluidic interconnects minimizing the pressure drop have been designed and ...


Thermal performance modeling of hybrid liquid-air cooled servers

Zeighami, R.; Saunders, W.A.; Coles, H.; Branton, S. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on, 2014

This paper discusses data center scale performance characterization of hybrid liquid-air cooling solutions for a full 42U rack of servers. Using data collected in a production data center at Lawrence Berkeley Laboratories, we interpret the results with a simple three parameter model which allows characterization of the major factors affecting heat recovery efficiency of the system. The model is shown ...


Effect of warm water cooling for an isolated hybrid liquid cooled server

Addagatla, A.; Fernandes, J.; Mani, D.; Agonafer, D.; Mulay, V. Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st, 2015

Data center cooling strategies have changed overtime due to increases in power densities and server cooling power requirement. Traditionally, most data centers adopt air cooling where the computer room air conditioner (CRAC) units pump volumes of chilled air to cool information technology (IT) equipment and dispose the heat to the ambient. With demand for energy-efficient and cost- effective data centers ...


More eLearning Resources

IEEE.tv Videos

No IEEE.tv Videos are currently tagged "Liquid cooling"

IEEE-USA E-Books

No IEEE-USA E-Books are currently tagged "Liquid cooling"



Standards related to Liquid cooling

Back to Top

No standards are currently tagged "Liquid cooling"


Jobs related to Liquid cooling

Back to Top