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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.
2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)
2013 International Conference on Electrical Machines and Systems (ICEMS)
Main Topics 1) PM, DC Machines and Drives 2) Power Converters/Inverters 3) Induction Machines and Drives 4) Synchronous Machines and Drives 5) Linear Machines and Magnetic Levitation 6) Special Machines and Applications 7) Renewable Energy and Related Topics 8) Field Analysis and Computational Method 9) Motion Control 10) Fault and Diagnosis 11) Designing, Manufacturing, Testing and Standards 12) Transformers and High Voltage Machines 13) Others Special Topics 1) High Speed Machine and Drives 2) Personal M
The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)
Bilski, W.J.; Baldassarre, G.; Connors, M.; Toth, J.; Wert, K.L. Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE , 2008
Electronic thermal packaging design continues to look for novel solutions for enhancing the performance of microelectronic cooling solutions. Driven by increasing thermal performance requirements, particularly in densely packaged militarized electronic systems and other high density or extreme use products, thermal designers are showing that to achieve the necessary cooling, combinations of existing technologies may offer further enhancement than has already ...
Iyengar, M.; David, M.; Parida, P.; Kamath, V.; Kochuparambil, B.; Graybill, D.; Schultz, M.; Gaynes, M.; Simons, R.; Schmidt, R.; Chainer, T. Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE , 2012
This paper summarizes the concept design and hardware build efforts as part of a US Department of Energy cost shared grant, two year project (2010-2012) that was undertaken to develop highly energy efficient, warm liquid cooled servers for use in chiller-less data centers. Significant savings are expected in data center energy, refrigerant and make up water use. The technologies being ...
Ezzahri, Y.; Shakouri, Ali Thermal Issues in Emerging Technologies, 2008. ThETA '08. Second International Conference on , 2008
Thermal design requirements are mostly driven by the peak temperatures. Reducing or eliminating hot spots could alleviate the design requirement for the whole package. Combination of solid-state and liquid cooling will allow removal of both hot spots and background heating. In this paper, we analyze the performance of thin film Bi2Te3 microcooler and the 3D SiGe based microrefrigerator and optimize ...
Ouchi, M.; Abe, Y.; Fukagaya, M.; Ohta, H.; Shinmoto, Y.; Sato, M.; Iimura, K. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on , 2012
Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the ...
Chu, R.C. Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE , 1999
This paper provides a review of twenty-five years of IBM sponsored research at universities intended to advance basic heat transfer technology for application in cooling computers. The research discussed covers a broad range of heat transfer topics, including natural convection and forced convection air cooling. Liquid forced convection, pool boiling, falling films, flow boiling, and liquid jet impingement. Examples of ...
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Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...