254 resources related to Liquid cooling
- Topics related to Liquid cooling
- IEEE Organizations related to Liquid cooling
- Conferences related to Liquid cooling
- Periodicals related to Liquid cooling
- Most published Xplore authors for Liquid cooling
2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.
2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)
2013 International Conference on Electrical Machines and Systems (ICEMS)
Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train
The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...
Solovitz, S.A.; Arik, M. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on, 2010
Many novel thermal management technologies have been developed to ameliorate the losses from modern electronics. As these techniques are developed, designers endeavor to compare each method with existing concepts. However, many of these comparative metrics can be system-dependent, leading to inconclusive results. One of the most common metrics, the thermal resistance, is a simple relationship between the total heat transfer ...
Xue-Xin Liu; Kuangya Zhai; Zao Liu; Kai He; Tan, S.X.-D.; Wenjian Yu Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, 2015
In this brief, we propose an efficient parallel finite difference-based thermal simulation algorithm for 3-D-integrated circuits (ICs) using generalized minimum residual method (GMRES) solver on CPU-graphic processing unit (GPU) platforms. First, the new method starts from basic physics-based heat equations to model 3-D-ICs with intertier liquid cooling microchannels and directly solves the resulting partial differential equations. Second, we develop a ...
Guoping Xu Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE, 2007
A high performance liquid cooling architecture for high power processors in less than 45 mm height electronics chassis (1U rack space) was proposed and investigated experimentally. A review of several system cooling approaches from CPU to data center was also provided. The present proposed method employs conventional heat pipes to transport local CPU heat to the edge of an electronics ...
Iyengar, M.; David, M.; Parida, P.; Kamath, V.; Kochuparambil, B.; Graybill, D.; Schultz, M.; Gaynes, M.; Simons, R.; Schmidt, R.; Chainer, T. Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE, 2012
This paper summarizes the concept design and hardware build efforts as part of a US Department of Energy cost shared grant, two year project (2010-2012) that was undertaken to develop highly energy efficient, warm liquid cooled servers for use in chiller-less data centers. Significant savings are expected in data center energy, refrigerant and make up water use. The technologies being ...
Fowler, K. Instrumentation & Measurement Magazine, IEEE, 2001
All electronics generate heat. No device operates at 100% efficiency. The energy lost within a circuit dissipates as heat. That heat is the difference between the input and output power. The author suggests that the design for cooling is too often delayed in a project until too late. The resulting fixes or solutions are usually far from optimal, and they ...
No standards are currently tagged "Liquid cooling"