477 resources related to Liquid cooling
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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.
2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)
2013 International Conference on Electrical Machines and Systems (ICEMS)
Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train
The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...
T. Y. T. Lee; J. Andrews; P. Chow; D. Saums Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE, 1992
A compact liquid cooling system has been evaluated in a benchmark of self- contained heat exchanger units that fit within small movable electronic equipment, such as PCs and workstations. The compact cooling system connects to a multichip module package via a pair of flexible stainless steel hoses. The system contains a fluid expansion chamber, a liquid-to-air heat exchanger core, a ...
K. M. Rahman; S. E. Schulz Industry Applications Conference, 2001. Thirty-Sixth IAS Annual Meeting. Conference Record of the 2001 IEEE, 2001
A high density and high efficiency switched reluctance (SR) motor has been designed and built for vehicle propulsion. Extensive finite element (FE) analyses have been carried out to optimize the geometry for high density. Steady state performance of the drive has been simulated to ensure good efficiency at all speeds. Special attention has been given during machine design to lower ...
Weiwen Zhang; Yonggang Wen; Yew Wong; Kok Toh; Chiu-Hao Chen IEEE Communications Surveys & Tutorials, 2016
Effective management of ICT (Information and communications technology) and cooling is critical in modern data centres for high energy efficiency. This survey paper gives an overview of the joint optimization between ICT and cooling management under conventional air-cooled technology in the data centre. We first review the enabling techniques of ICT and cooling management in the data centre, which provide ...
A. Fujisaki; M. Suzuki; H. Yamamoto Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th, 2000
Corresponding to high performance single-chip CPUs adopting 0.18 um process and copper wiring, high density wiring and multi terminal MCMs, on which the CPU and large capacity second caches can be mounted up to 4 pairs, have been newly developed. As for LSIs, bare chips are directly mounted on MCM substrates with 153 um pitch high density area bumps. The ...
A. Pal; Y. Joshi Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006., 2006
Liquid cooling with phase change is a very attractive option for thermal management of electronics because it achieves very high heat transfer coefficients compared to single phase liquid cooling. Phase change liquid cooling can be implemented in a thermosyphon loop, where heat is transferred from the heated surface to the evaporator and rejected to the ambient from the condenser. Optimized ...
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, 2008
We realized a thin slice of vertically stacked pyrolytic graphite for the thermal interface use. The maximum size of the slice achieved was 37 times 37 mm2 with a thickness about 500 mum. This system shows a heat resistance better than 20 mm2C/W, which is almost independent of the thickness. The heat resistance can be drastically improved by modifying the ...
Circuits and Systems (ISCAS), 2011 IEEE International Symposium on, 2011
3D stacked architectures reduce communication delay in multiprocessor system- on-chips (MPSoCs) and allowing more functionality per unit area. However, vertical integration of layers exacerbates the reliability and thermal problems, and cooling is a limiting factor in multi-tier systems. Liquid cooling is a highly efficient solution to overcome the accelerated thermal problems in 3D architectures. However, liquid cooling brings new challenges ...
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th, 2008
Thermal management in 3D packaging is a critical factor to be considered in enabling this technology to be exploited further. Heat density in excess of 100 W/cm2 can be achieved due to the smaller footprint of such packages. Liquid cooling through microchannels embedded within the package had been shown to improve the thermal characteristics of packages. In this work, a ...
Multimedia Technology (ICMT), 2011 International Conference on, 2011
An innovative one-side actuating piezoelectric micropump (OAPCP-micropump), which is combined with a 45 mm × 28 mm × 4 mm cold plate chamber, has been developed to drive liquid in a cooling system for a laptop. The results show that the shape and the numbers of the fins inside the cold plate chamber have strong effects on the pressure drops ...
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 2009
In this paper a liquid cooling solution has been reported for 3-D package in PoP format. The high heat dissipating chip is mounted on a silicon carrier, which has copper through-silicon via for electrical interconnection and through-silicon hollow via for fluidic circulation. Heat enhancement structures have been embedded in the chip carrier. Cooling liquid, de-ionized water is circulated through the ...
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ATAS Mechanical Design Engineer 1040
Georgia Tech Research Institute (GTRI)