Conferences related to Liquid cooling

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2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

The THERMINIC Workshop is an annual event that makes it possible for researchers from industry, SME and academia from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics.

2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm)

electronics cooling

2013 International Conference on Electrical Machines and Systems (ICEMS)

Main Topics 1) PM, DC Machines and Drives 2) Power Converters/Inverters 3) Induction Machines and Drives 4) Synchronous Machines and Drives 5) Linear Machines and Magnetic Levitation 6) Special Machines and Applications 7) Renewable Energy and Related Topics 8) Field Analysis and Computational Method 9) Motion Control 10) Fault and Diagnosis 11) Designing, Manufacturing, Testing and Standards 12) Transformers and High Voltage Machines 13) Others Special Topics 1) High Speed Machine and Drives 2) Personal M

  • 2012 15th International Conference on Electrical Machines and Systems (ICEMS)

    The conference will provide a big opportunity for researchers and professionals from all over the world to present the latest researches and developments and to exchange useful information and experiences in the fields of electrical machines and systems such as motor drive systems, turbine generators, linear machines, transformers, electric vehicles, renewable energy, power converters, etc.

  • 2011 International Conference on Electrical Machines and Systems (ICEMS)

    Electrical machines, power electronics and systems.

  • 2010 International Conference on Electrical Machines and Systems (ICEMS)

    1) Power Converters/Inverters 2) Systems for Renewable Energy 3) Motor Drives 4) PM Machines and DC Machines 5) Induction, Synchronous Machines 6) Transformers and High Voltage Machines 7) Linear Machines 8) Special Machines and Their Applications 9) Field Analysis and optimal Design Technologies 10) Electrical Technologies for the Next Generation Vehicle

  • 2009 International Conference on Electrical Machines and Systems (ICEMS)

    The aims of ICEMS2009 are to provide an opportunity for scientists and experts to present the latest research developments in the field of electrical machines and systems (rotating and other machines, power electronics, motion control, and motor drives) and to exchange useful information and experiences in research, trends and applications.

2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications (ThETA)

Thermal issues in emerging technologies (microelectronics, nanotechnology, smart materials,micro -electro -mechanical systems, biomedical engineering, new engergies)

Periodicals related to Liquid cooling

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Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.

Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...

Proceedings of the IEEE

The most highly-cited general interest journal in electrical engineering and computer science, the Proceedings is the best way to stay informed on an exemplary range of topics. This journal also holds the distinction of having the longest useful archival life of any EE or computer related journal in the world! Since 1913, the Proceedings of the IEEE has been the ...

Xplore Articles related to Liquid cooling

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Electronics Cooling Using a Self-Contained, Sub-Cooled Pumped Liquid System

Bilski, W.J.; Baldassarre, G.; Connors, M.; Toth, J.; Wert, K.L. Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE, 2008

Electronic thermal packaging design continues to look for novel solutions for enhancing the performance of microelectronic cooling solutions. Driven by increasing thermal performance requirements, particularly in densely packaged militarized electronic systems and other high density or extreme use products, thermal designers are showing that to achieve the necessary cooling, combinations of existing technologies may offer further enhancement than has already ...

Server liquid cooling with chiller-less data center design to enable significant energy savings

Iyengar, M.; David, M.; Parida, P.; Kamath, V.; Kochuparambil, B.; Graybill, D.; Schultz, M.; Gaynes, M.; Simons, R.; Schmidt, R.; Chainer, T. Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE, 2012

This paper summarizes the concept design and hardware build efforts as part of a US Department of Energy cost shared grant, two year project (2010-2012) that was undertaken to develop highly energy efficient, warm liquid cooled servers for use in chiller-less data centers. Significant savings are expected in data center energy, refrigerant and make up water use. The technologies being ...

Solid-state microrefrigeration in conjonction with liquid cooling

Ezzahri, Y.; Shakouri, Ali Thermal Issues in Emerging Technologies, 2008. ThETA '08. Second International Conference on, 2008

Thermal design requirements are mostly driven by the peak temperatures. Reducing or eliminating hot spots could alleviate the design requirement for the whole package. Combination of solid-state and liquid cooling will allow removal of both hot spots and background heating. In this paper, we analyze the performance of thin film Bi2Te3 microcooler and the 3D SiGe based microrefrigerator and optimize ...

Thermal management systems for data centers with liquid cooling technique of CPU

Ouchi, M.; Abe, Y.; Fukagaya, M.; Ohta, H.; Shinmoto, Y.; Sato, M.; Iimura, K. Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, 2012

Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the ...

An in-situ performance test of liquid cooling for a server computer system

Chien-Yuh Yang; Chun-Ta Yeh; Pei-Kang Wang; Wei-Chi Liu; Kung, E.Y.-C. Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International, 2010

An IBM power series server ×3350 was tested by using the liquid cooling system developed by Yang et al.. The performance of the heat pipe based direct air cooling system equipped in the original server was also tested for comparison. Both CPU core temperature and cooling system noise level were measured in the present test, he test results of liquid ...

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