End Of Life
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reliability, physics, irps
2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and Approaches Novel Device Reliability and Failure Mechanisms Novel Gate Stack/Dielectrics and FEOL Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanisms
2013 IEEE International Integrated Reliability Workshop (IIRW)
We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliab
ISTAS is an annual international forum sponsored by the IEEE Society on Social Implications of Technology. ISTAS 2011 is co-sponsored by the ACM Special Interest Group on Computers and Society. ISTAS welcomes engineers; scientists; philosophers; researchers in social sciences, arts, law, and humanities; and policy experts in technology and society.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.
IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...
Artificial intelligence techniques, including speech, voice, graphics, images, and documents; knowledge and data engineering tools and techniques; parallel and distributed processing; real-time distributed processing; system architectures, integration, and modeling; database design, modeling, and management; query design, and implementation languages; distributed database control; statistical databases; algorithms for data and knowledge management; performance evaluation of algorithms and systems; data communications aspects; system ...
Wenyuan Wang; Tseng, M.M. Responsive Manufacturing - Green Manufacturing (ICRM 2010), 5th International Conference on, 2010
In terms of sustainable manufacturing, reuse, remanufacturing and recycling of end-of-life products are widely recognized as preferable product end-of-life strategies over direct disposal. Different end-of-life strategies basically, require distinct processes, techniques and management during a product's end- of-life phase. Consequently, specific and efficient implementation of various appropriate end-of-life strategies of an entire product is the only way to achieve sustainable ...
Huisman, J.; Stevels, A.L.N.; Stobbe, I. Electronics Packaging Manufacturing, IEEE Transactions on, 2004
In order to improve the eco-efficiency at the end-of-life phase of consumer electronic products, comprehensive assessments should be made. The Quotes for environmentally WEighted RecyclabiliTY and Eco-Efficiency method (QWERTY/EE) developed at the Delft University of Technology is applied to aim at minimal end-of-life treatment costs against maximal environmental recovery. In this paper, the outcomes of this eco-efficiency concept are presented ...
Reimer, B.; Sodhi, M.S.; Knight, W.A. Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on, 2000
Increasing environmental concerns about the disposal of mass produced products have resulted in efforts to take back end-of-life consumer products. Legislation aimed at forcing manufacturers to take back electronics products at the end of their useful lives along with shrinking landfill capacity and the reluctance of communities to open new waste sinks, underscores the importance of developing methods and models ...
Ansems, A.; van Gijlswijk, R.; Huisman, J. Electronics and the Environment, 2002 IEEE International Symposium on, 2002
In order to enlarge the insight of the behaviour of heavy metals during the processing of end-of-life electronic products more assessment analyses should be made. The aim is to improve the control and management of heavy metal loops during the end-of-life treatment of these products. Four relevant end-of-life options are simulated by modelling and, related to calculated and appointed distribution ...
Sexton, E.D.; Nelson, R.F.; Olson, J.B. Applications and Advances, 2001. The Sixteenth Annual Battery Conference on, 2001
Summary form only given. As valve regulated lead-acid (VRLA) batteries age, they demonstrate a predictable drop in end-of-charge voltage and concomitant rise in end-of-charge temperature. This is attributed to the increasing dominance of the oxygen recombination cycle, which results from the negative plate not being fully charged over several cycles. Unchecked, the battery at its end of life experiences a ...
IMS MicroApps: Silicon Technology Solutions for Wireless Front End Modules
Giving Small Robots New Ways to Move
Recycling: Computers & Electronics (com legendas em portugues)
IEEE Smart Grid World Forum - Martin Vesper
Making Orthogonal Transitions with Climbing Mini-Whegs
AM37x Sitara EVM Demonstration
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IEEE 125th Anniversary Media Event: Cognitive Computing
Mapping Human to Robot Motion with Functional Anthropomorphism for Teleoperation and Telemanipulation with Robot Arm Hand Systems
Safe Physical Human-Robot Collaboration
Doing the Right Thing: Social Implications of Technology (Member Access)
Oral History: Jerry Minter
The Fundamentals of Battery Charger Design
Larson Collection interview with Linus Pauling, part 2
Larson Collection interview with Linus Pauling, part 1
To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.
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