Conferences related to End Of Life

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.

  • 2006 IEEE International Integrated Reliability Workshop (IRW)


2011 IEEE International Symposium on Technology and Society (ISTAS)

ISTAS is an annual international forum sponsored by the IEEE Society on Social Implications of Technology. ISTAS 2011 is co-sponsored by the ACM Special Interest Group on Computers and Society. ISTAS welcomes engineers; scientists; philosophers; researchers in social sciences, arts, law, and humanities; and policy experts in technology and society.

  • 2010 IEEE International Symposium on Technology and Society (ISTAS)

    Social Implications of Emerging Technologies

  • 2009 IEEE International Symposium on Technology and Society (ISTAS)

    The IEEE International Symposium on Technology and Society (ISTAS) is an annual international forum exploring the social implications of technology. ISTAS 09 will be held concurrently with the IEEE International Symposium on Sustainable Systems and Technology (ISSST), with joint sessions related to an overall conference theme of sustainability.



Periodicals related to End Of Life

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Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Industrial Informatics, IEEE Transactions on

IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...


Knowledge and Data Engineering, IEEE Transactions on

Artificial intelligence techniques, including speech, voice, graphics, images, and documents; knowledge and data engineering tools and techniques; parallel and distributed processing; real-time distributed processing; system architectures, integration, and modeling; database design, modeling, and management; query design, and implementation languages; distributed database control; statistical databases; algorithms for data and knowledge management; performance evaluation of algorithms and systems; data communications aspects; system ...




Xplore Articles related to End Of Life

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Stability Analysis of Laser Trimmed Thin Film Resistors

G. Bulger IEEE Transactions on Parts, Hybrids, and Packaging, 1975

Laser trimmed tantalum nitride thin film resistors age at a greater rate than untrimmed films. The high energy required to vaporize material in the cut, or' kerf, modifies the aging characteristics of film contiguous to the kerf. This undesirable feature could be mitigated if a design procedure were available to assure that end of life tolerances were manageable. In this ...


A Novel Low-rate Satellite Communication System Based on SIGSO Satellite

Jun-xia Cui; Hu-li Shi; Jun Pei; Chun-lin Ning; Feng Pang 2009 International Conference on Information Management and Engineering, 2009

Normally, in-orbit satellites are adopted in the satellite communication systems, which provide mainly high-rate data and voice transmission, such as Iridium system, International Maritime Satellite Organization (Inmarsat) system, and so on. When the satellites are close to the end of life, they will be pushed away from their original orbits and become space rubbish. However, if some special adjustment is ...


Orientation of Measurement Sensors for Optimum End-of-Life Performance

P. K. Mazaika IEEE Transactions on Aerospace and Electronic Systems, 1981

Relative orientations of on-board measurement sensors are found that ensure the best possible measurement accuracy in the end-of-life situation when all but three sensors have failed. For five and six sensors, the optimum orientations are, respectively, the single cone and dodecahedron configurations. For seven and eight sensors, new configurations are found that are, respectively, 25 and 20 percent more accutate ...


A new coverglass adhesive for space applications - methodology for extrapolation of the degradation determined in a simulated space environment

C. G. Zimmermann; D. Pueyo; C. Semprimoschnig; S. Taylor 2008 33rd IEEE Photovoltaic Specialists Conference, 2008

The space grade silicone elastomers Elastosil S-690 was subjected to the environmental loads experienced by a coverglass adhesive in a geostationary orbit environment. UV radiation, particle radiation as well as elevated temperatures all might impact the transmission of the silicone in orbit. In parallel with the established coverglass adhesives DC93-500 and Elastosil S-695, Elastosil S-690 was subjected to 10000 equivalent ...


Absolute vs. comparative end-of-life age

A. M. Bruning; D. G. Kasture; H. E. Ascher IEEE Transactions on Dielectrics and Electrical Insulation, 1996

Conventional insulation statistics typically use test averages of a normal, log normal, or Weibull distribution to compare the quality of different materials or constructions. None of these numbers characterizes an age at end of life with a near 100% reliability, which is necessary to predict when failure occurs. This is a major fundamental and misleading aspect in the manner in ...


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Educational Resources on End Of Life

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eLearning

Stability Analysis of Laser Trimmed Thin Film Resistors

G. Bulger IEEE Transactions on Parts, Hybrids, and Packaging, 1975

Laser trimmed tantalum nitride thin film resistors age at a greater rate than untrimmed films. The high energy required to vaporize material in the cut, or' kerf, modifies the aging characteristics of film contiguous to the kerf. This undesirable feature could be mitigated if a design procedure were available to assure that end of life tolerances were manageable. In this ...


A Novel Low-rate Satellite Communication System Based on SIGSO Satellite

Jun-xia Cui; Hu-li Shi; Jun Pei; Chun-lin Ning; Feng Pang 2009 International Conference on Information Management and Engineering, 2009

Normally, in-orbit satellites are adopted in the satellite communication systems, which provide mainly high-rate data and voice transmission, such as Iridium system, International Maritime Satellite Organization (Inmarsat) system, and so on. When the satellites are close to the end of life, they will be pushed away from their original orbits and become space rubbish. However, if some special adjustment is ...


Orientation of Measurement Sensors for Optimum End-of-Life Performance

P. K. Mazaika IEEE Transactions on Aerospace and Electronic Systems, 1981

Relative orientations of on-board measurement sensors are found that ensure the best possible measurement accuracy in the end-of-life situation when all but three sensors have failed. For five and six sensors, the optimum orientations are, respectively, the single cone and dodecahedron configurations. For seven and eight sensors, new configurations are found that are, respectively, 25 and 20 percent more accutate ...


A new coverglass adhesive for space applications - methodology for extrapolation of the degradation determined in a simulated space environment

C. G. Zimmermann; D. Pueyo; C. Semprimoschnig; S. Taylor 2008 33rd IEEE Photovoltaic Specialists Conference, 2008

The space grade silicone elastomers Elastosil S-690 was subjected to the environmental loads experienced by a coverglass adhesive in a geostationary orbit environment. UV radiation, particle radiation as well as elevated temperatures all might impact the transmission of the silicone in orbit. In parallel with the established coverglass adhesives DC93-500 and Elastosil S-695, Elastosil S-690 was subjected to 10000 equivalent ...


Absolute vs. comparative end-of-life age

A. M. Bruning; D. G. Kasture; H. E. Ascher IEEE Transactions on Dielectrics and Electrical Insulation, 1996

Conventional insulation statistics typically use test averages of a normal, log normal, or Weibull distribution to compare the quality of different materials or constructions. None of these numbers characterizes an age at end of life with a near 100% reliability, which is necessary to predict when failure occurs. This is a major fundamental and misleading aspect in the manner in ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • A REVIEW ON END¿¿?OF¿¿?LIFE BATTERY MANAGEMENT: CHALLENGES, MODELING, AND SOLUTION METHODS

    End¿¿?of¿¿?life (EOL) battery packs may have significant residual value for secondary use and are too expensive to simply recycle. Quality variation adds complexity to EOL decision¿¿?making among multiple EOL options including disposal, recycling, remanufacturing, and reuse in secondary applications. The aim of the modeling and analysis for battery¿¿?remanufacturing systems is to determine the battery's optimal EOL decisions that maximize cost savings or minimize life cycle cost. This chapter considers the quality variation of EOL returns, resulting in different EOL decisions as well as different routes of remanufacturing processes and inventory level. It discusses some of the basics of battery remanufacturing, including the economic and ecological benefits, principles, operational strategy, and processes of battery remanufacturing. Several emerging issues of battery remanufacturing have been discussed with a main focus on modeling and analysis of electric vehicles (EVs) battery¿¿?remanufacturing system as well as decision¿¿?making related to the remanufacturing processes, inventory control, and reassembly strategy.

  • Sustainable Software Development

    While most of the ongoing work in Green IT is focused on manufacturing, deployment and disposal of IT hardware, there is still little awareness regarding the environmental impact of software itself. For example, a new piece of demanding software that requires a hardware upgrade generates e-waste, because it forces the user to dispose a computer that still has not reached its physical end-of-life. Such concern is rarely considered during the software development process. This chapter describes the issues associated with software and sustainability, and it introduces a methodology to measure and incrementally minimize the environmental, social and economic impact of software production. This methodology introduces a set of metrics that can be easily integrated into the team's current software development process, while also bringing business value to stakeholders.

  • Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, LifeCycle Design, and End of Life

    This chapter contains sections titled: Introduction Substances of Environmental Concern Design for Environment/Energy Efficiency Recycling and Take-Back Summary References



Standards related to End Of Life

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IEEE Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.