Conferences related to End Of Life

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.

  • 2006 IEEE International Integrated Reliability Workshop (IRW)


2011 IEEE International Symposium on Technology and Society (ISTAS)

ISTAS is an annual international forum sponsored by the IEEE Society on Social Implications of Technology. ISTAS 2011 is co-sponsored by the ACM Special Interest Group on Computers and Society. ISTAS welcomes engineers; scientists; philosophers; researchers in social sciences, arts, law, and humanities; and policy experts in technology and society.

  • 2010 IEEE International Symposium on Technology and Society (ISTAS)

    Social Implications of Emerging Technologies

  • 2009 IEEE International Symposium on Technology and Society (ISTAS)

    The IEEE International Symposium on Technology and Society (ISTAS) is an annual international forum exploring the social implications of technology. ISTAS 09 will be held concurrently with the IEEE International Symposium on Sustainable Systems and Technology (ISSST), with joint sessions related to an overall conference theme of sustainability.



Periodicals related to End Of Life

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Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Industrial Informatics, IEEE Transactions on

IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...


Knowledge and Data Engineering, IEEE Transactions on

Artificial intelligence techniques, including speech, voice, graphics, images, and documents; knowledge and data engineering tools and techniques; parallel and distributed processing; real-time distributed processing; system architectures, integration, and modeling; database design, modeling, and management; query design, and implementation languages; distributed database control; statistical databases; algorithms for data and knowledge management; performance evaluation of algorithms and systems; data communications aspects; system ...



Most published Xplore authors for End Of Life

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Xplore Articles related to End Of Life

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Bottom-up organized recycling networks as strategies for corporate sustainability

Steffen Heyer; Peter Krämer; Ramona Götze; Maximilian Ueberschaar; Gotthard Walter; Sabine Flamme; Susanne Rotter; Günther Seliger 2012 Electronics Goes Green 2012+, 2012

Sustainability has become an urgent requirement and challenge for society as well as for decision makers in policy and economy, considering the limited resources and growing consumption. Sustainability is interpreted in ecological, economic and social dimensions. Ecologically, non-renewable resources must not be disposed anymore but regained in product and material cycles. Managing material cycles requires the coordination of companies along ...


Presentation of EIME methodology and its adaptation to Japanese requirements

S. Adda; P. Jean Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 1999

Under constant pressure through both national and EC-wide regulations as well as increased consumer awareness, industry has become more and more concerned with improving the environmental profiles of its products. Namely the end-of- life aspects have been pushed into the center of interest. Trying to minimize recycling and disposal cost and to increase potential revalorisation profits, companies strive to integrate ...


Probabilistic assessment of the reduction in tensile strength of an overhead transmission line's conductor with reference to climatic data

K. Adomah; Y. Mizuno; K. Naito Transmission & Distribution Construction, Operation & Live-Line Maintenance Proceedings, 1998. ESMO '98. 1998 IEEE 8th International Conference on, 1998

The tensile strength of an overhead transmission line's conductor in response to a growing load is being assessed in this paper. It is the authors' view that the percentage reduction in the conductor's tensile strength is a key index that can be used to determine a conductor's end of life. This paper describes a probabilistic method of assessing this index ...


Piping reliability analysis of AHWR down-comer piping using PFM

P. A. Jadhav; Rastogi Rohit; Bhasin Vivek; K. K. Vaze 2010 2nd International Conference on Reliability, Safety and Hazard - Risk-Based Technologies and Physics-of-Failure Methods (ICRESH), 2010

Probabilistic Fracture Mechanics (PFM) is widely used for the reliability assessment of Nuclear Power Plant (NPP) piping. In PFM, the methods of fracture mechanics and structural reliability theory are combined for assessing the reliability of components, which contain cracks. In this work, reliability assessment of Advanced Heavy Water Reactor (AHWR) down-comer piping is done using PFM. AHWR down-comer piping is ...


Disassembly complexity and recyclability analysis of new designs from CAD file data

V. Mani; S. Das; R. Caudill Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190), 2001

It is well known that most decisions that effect the end-of-life disposal and recycling of a product are made during the product design phase. The premise of a design for environment (DfE) approach is that product designers will evaluate and improve their designs from an environmental perspective. The authors' survey of designers indicates they are typically overburdened with product functionality ...


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Educational Resources on End Of Life

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eLearning

Bottom-up organized recycling networks as strategies for corporate sustainability

Steffen Heyer; Peter Krämer; Ramona Götze; Maximilian Ueberschaar; Gotthard Walter; Sabine Flamme; Susanne Rotter; Günther Seliger 2012 Electronics Goes Green 2012+, 2012

Sustainability has become an urgent requirement and challenge for society as well as for decision makers in policy and economy, considering the limited resources and growing consumption. Sustainability is interpreted in ecological, economic and social dimensions. Ecologically, non-renewable resources must not be disposed anymore but regained in product and material cycles. Managing material cycles requires the coordination of companies along ...


Presentation of EIME methodology and its adaptation to Japanese requirements

S. Adda; P. Jean Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 1999

Under constant pressure through both national and EC-wide regulations as well as increased consumer awareness, industry has become more and more concerned with improving the environmental profiles of its products. Namely the end-of- life aspects have been pushed into the center of interest. Trying to minimize recycling and disposal cost and to increase potential revalorisation profits, companies strive to integrate ...


Probabilistic assessment of the reduction in tensile strength of an overhead transmission line's conductor with reference to climatic data

K. Adomah; Y. Mizuno; K. Naito Transmission & Distribution Construction, Operation & Live-Line Maintenance Proceedings, 1998. ESMO '98. 1998 IEEE 8th International Conference on, 1998

The tensile strength of an overhead transmission line's conductor in response to a growing load is being assessed in this paper. It is the authors' view that the percentage reduction in the conductor's tensile strength is a key index that can be used to determine a conductor's end of life. This paper describes a probabilistic method of assessing this index ...


Piping reliability analysis of AHWR down-comer piping using PFM

P. A. Jadhav; Rastogi Rohit; Bhasin Vivek; K. K. Vaze 2010 2nd International Conference on Reliability, Safety and Hazard - Risk-Based Technologies and Physics-of-Failure Methods (ICRESH), 2010

Probabilistic Fracture Mechanics (PFM) is widely used for the reliability assessment of Nuclear Power Plant (NPP) piping. In PFM, the methods of fracture mechanics and structural reliability theory are combined for assessing the reliability of components, which contain cracks. In this work, reliability assessment of Advanced Heavy Water Reactor (AHWR) down-comer piping is done using PFM. AHWR down-comer piping is ...


Disassembly complexity and recyclability analysis of new designs from CAD file data

V. Mani; S. Das; R. Caudill Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190), 2001

It is well known that most decisions that effect the end-of-life disposal and recycling of a product are made during the product design phase. The premise of a design for environment (DfE) approach is that product designers will evaluate and improve their designs from an environmental perspective. The authors' survey of designers indicates they are typically overburdened with product functionality ...


More eLearning Resources

IEEE.tv Videos

Recycling: Computers & Electronics (com legendas em portugues)
Bill Woodward presents NEEDLES: 2016 End to End Trust and Security Workshop for the Internet of Things
Bob Martin on Industrial Internet Reference Architecture: 2016 End to End Trust and Security Workshop for the Internet of Things
Closing Panel at 2016 End to End Trust and Security Workshop for the Internet of Things
Oral History: Jerry Minter
Opening Panel: 2016 End to End Trust and Security Workshop for the Internet of Things
William J. Miller on Sensei-IoT: 2016 End to End Trust and Security Workshop for the Internet of Things
Ulf Lindqvist presents the IEEE Cybersecurity Initiative (CybSI): 2016 End to End Trust and Security Workshop for the Internet of Things
Juan Carlos Zuniga on Wi-Fi Privacy at IEEE 802 & IETF: 2016 End to End Trust and Security Workshop for the Internet of Things
IMS MicroApps: Silicon Technology Solutions for Wireless Front End Modules
Virtual World Symposium - Second Life Tech Tour
IEEE Life Scences - Paolo Bonato Interview
Two Pathways to 5G: Spectrum Sharing and Aggregation - 5G Summit, Seattle 2016
Lillie Coney on the IoT and the Ability to Defend Against the Silent Intruder: 2016 End to End Trust and Security Workshop for the Internet of Things
The Internet of Things, An Overview: Karen O'Donoghue Addresses Issues and Challenges of a More Connected World -- 2016 End to End Trust and Security Workshop for the Internet of Things
Giving Small Robots New Ways to Move
Glenn Fink on Priorities for IoT Security and Privacy From Here to 2020: End to End Trust and Security Workshop for the Internet of Things 2016
Overview of Issues Highlighted at End to End Trust and Security for the Internet of Things Workshop - ETAP Forum, February 2016
Life Sciences Grand Challenge Conference - Shangkai Gao
Life Sciences Grand Challenge Conference - Roger Kamm

IEEE-USA E-Books

  • Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, LifeCycle Design, and End of Life

    This chapter contains sections titled: Introduction Substances of Environmental Concern Design for Environment/Energy Efficiency Recycling and Take-Back Summary References

  • Sustainable Software Development

    While most of the ongoing work in Green IT is focused on manufacturing, deployment and disposal of IT hardware, there is still little awareness regarding the environmental impact of software itself. For example, a new piece of demanding software that requires a hardware upgrade generates e-waste, because it forces the user to dispose a computer that still has not reached its physical end-of-life. Such concern is rarely considered during the software development process. This chapter describes the issues associated with software and sustainability, and it introduces a methodology to measure and incrementally minimize the environmental, social and economic impact of software production. This methodology introduces a set of metrics that can be easily integrated into the team's current software development process, while also bringing business value to stakeholders.

  • A REVIEW ON END¿¿?OF¿¿?LIFE BATTERY MANAGEMENT: CHALLENGES, MODELING, AND SOLUTION METHODS

    End¿¿?of¿¿?life (EOL) battery packs may have significant residual value for secondary use and are too expensive to simply recycle. Quality variation adds complexity to EOL decision¿¿?making among multiple EOL options including disposal, recycling, remanufacturing, and reuse in secondary applications. The aim of the modeling and analysis for battery¿¿?remanufacturing systems is to determine the battery's optimal EOL decisions that maximize cost savings or minimize life cycle cost. This chapter considers the quality variation of EOL returns, resulting in different EOL decisions as well as different routes of remanufacturing processes and inventory level. It discusses some of the basics of battery remanufacturing, including the economic and ecological benefits, principles, operational strategy, and processes of battery remanufacturing. Several emerging issues of battery remanufacturing have been discussed with a main focus on modeling and analysis of electric vehicles (EVs) battery¿¿?remanufacturing system as well as decision¿¿?making related to the remanufacturing processes, inventory control, and reassembly strategy.



Standards related to End Of Life

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IEEE Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.



Jobs related to End Of Life

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