Conferences related to End Of Life

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2014 IEEE International Reliability Physics Symposium (IRPS)

reliability, physics, irps


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and Approaches Novel Device Reliability and Failure Mechanisms Novel Gate Stack/Dielectrics and FEOL Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliab

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.

  • 2006 IEEE International Integrated Reliability Workshop (IRW)


2011 IEEE International Symposium on Technology and Society (ISTAS)

ISTAS is an annual international forum sponsored by the IEEE Society on Social Implications of Technology. ISTAS 2011 is co-sponsored by the ACM Special Interest Group on Computers and Society. ISTAS welcomes engineers; scientists; philosophers; researchers in social sciences, arts, law, and humanities; and policy experts in technology and society.

  • 2010 IEEE International Symposium on Technology and Society (ISTAS)

    Social Implications of Emerging Technologies

  • 2009 IEEE International Symposium on Technology and Society (ISTAS)

    The IEEE International Symposium on Technology and Society (ISTAS) is an annual international forum exploring the social implications of technology. ISTAS 09 will be held concurrently with the IEEE International Symposium on Sustainable Systems and Technology (ISSST), with joint sessions related to an overall conference theme of sustainability.



Periodicals related to End Of Life

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Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Industrial Informatics, IEEE Transactions on

IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...


Knowledge and Data Engineering, IEEE Transactions on

Artificial intelligence techniques, including speech, voice, graphics, images, and documents; knowledge and data engineering tools and techniques; parallel and distributed processing; real-time distributed processing; system architectures, integration, and modeling; database design, modeling, and management; query design, and implementation languages; distributed database control; statistical databases; algorithms for data and knowledge management; performance evaluation of algorithms and systems; data communications aspects; system ...




Xplore Articles related to End Of Life

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Economic analysis of product end-of-life strategies to achieve design for sustainable manufacturing

Wenyuan Wang; Tseng, M.M. Responsive Manufacturing - Green Manufacturing (ICRM 2010), 5th International Conference on, 2010

In terms of sustainable manufacturing, reuse, remanufacturing and recycling of end-of-life products are widely recognized as preferable product end-of-life strategies over direct disposal. Different end-of-life strategies basically, require distinct processes, techniques and management during a product's end- of-life phase. Consequently, specific and efficient implementation of various appropriate end-of-life strategies of an entire product is the only way to achieve sustainable ...


Optimizing electronics end-of-life disposal costs

Reimer, B.; Sodhi, M.S.; Knight, W.A. Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on, 2000

Increasing environmental concerns about the disposal of mass produced products have resulted in efforts to take back end-of-life consumer products. Legislation aimed at forcing manufacturers to take back electronics products at the end of their useful lives along with shrinking landfill capacity and the reluctance of communities to open new waste sinks, underscores the importance of developing methods and models ...


Eco-efficiency considerations on the end-of-life of consumer electronic products

Huisman, J.; Stevels, A.L.N.; Stobbe, I. Electronics Packaging Manufacturing, IEEE Transactions on, 2004

In order to improve the eco-efficiency at the end-of-life phase of consumer electronic products, comprehensive assessments should be made. The Quotes for environmentally WEighted RecyclabiliTY and Eco-Efficiency method (QWERTY/EE) developed at the Delft University of Technology is applied to aim at minimal end-of-life treatment costs against maximal environmental recovery. In this paper, the outcomes of this eco-efficiency concept are presented ...


Life prediction for valve regulated lead acid batteries from early current/voltage data

Sexton, E.D.; Nelson, R.F.; Olson, J.B. Applications and Advances, 2001. The Sixteenth Annual Battery Conference on, 2001

Summary form only given. As valve regulated lead-acid (VRLA) batteries age, they demonstrate a predictable drop in end-of-charge voltage and concomitant rise in end-of-charge temperature. This is attributed to the increasing dominance of the oxygen recombination cycle, which results from the negative plate not being fully charged over several cycles. Unchecked, the battery at its end of life experiences a ...


End of life control and management of heavy metals out of electronics

Ansems, A.; van Gijlswijk, R.; Huisman, J. Electronics and the Environment, 2002 IEEE International Symposium on, 2002

In order to enlarge the insight of the behaviour of heavy metals during the processing of end-of-life electronic products more assessment analyses should be made. The aim is to improve the control and management of heavy metal loops during the end-of-life treatment of these products. Four relevant end-of-life options are simulated by modelling and, related to calculated and appointed distribution ...


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Standards related to End Of Life

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IEEE Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.