Conferences related to End Of Life

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.

  • 2006 IEEE International Integrated Reliability Workshop (IRW)


2011 IEEE International Symposium on Technology and Society (ISTAS)

ISTAS is an annual international forum sponsored by the IEEE Society on Social Implications of Technology. ISTAS 2011 is co-sponsored by the ACM Special Interest Group on Computers and Society. ISTAS welcomes engineers; scientists; philosophers; researchers in social sciences, arts, law, and humanities; and policy experts in technology and society.

  • 2010 IEEE International Symposium on Technology and Society (ISTAS)

    Social Implications of Emerging Technologies

  • 2009 IEEE International Symposium on Technology and Society (ISTAS)

    The IEEE International Symposium on Technology and Society (ISTAS) is an annual international forum exploring the social implications of technology. ISTAS 09 will be held concurrently with the IEEE International Symposium on Sustainable Systems and Technology (ISSST), with joint sessions related to an overall conference theme of sustainability.



Periodicals related to End Of Life

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Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Industrial Informatics, IEEE Transactions on

IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...


Knowledge and Data Engineering, IEEE Transactions on

Artificial intelligence techniques, including speech, voice, graphics, images, and documents; knowledge and data engineering tools and techniques; parallel and distributed processing; real-time distributed processing; system architectures, integration, and modeling; database design, modeling, and management; query design, and implementation languages; distributed database control; statistical databases; algorithms for data and knowledge management; performance evaluation of algorithms and systems; data communications aspects; system ...




Xplore Articles related to End Of Life

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Using end-of-life cost estimates to perform design for environment investment analysis. A Hewlett-Packard case study

A. Muller Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357), 1999

This paper discusses a methodology to estimate the potential product return, recycling and disposal costs incurred as a consequence of European takeback mandates, corporate leasing arrangements and volunteer takeback initiatives. Furthermore, this paper illustrates the use of these end-of-life costs to estimate the economic benefits of design for environment (DFE). At Hewlett- Packard, the end-of-life costs were estimated for a ...


Optimal End-of-Life Management in Closed-Loop Supply Chains Using RFID and Sensors

Onder Ondemir; Mehmet Ali Ilgin; Surendra M. Gupta IEEE Transactions on Industrial Informatics, 2012

Wireless communication and monitoring devices, namely, radio frequency identification (RFID) tags and sensors, capture and store dynamic life-cycle information during the economic life of the products. RFID tags deliver this information to a computer system when the products are returned to disassembly centers in a closed loop supply chain (CLSC) system. By means of this technology, content of each product ...


Fmit-The Fusion Materials Irradiation Test Facility

Don Liska; Milton D. Machalek IEEE Transactions on Nuclear Science, 1981

One of the major problems facing future fusion reactor designers will be the choice of materials with which to build the containment vessel. Although hundreds of millions of dollars are being invested in fusion research around the world, and optimism exists that fusion power will become available by the end of the century, we cannot today build a practical power ...


End-of-life treatment from technical and economical perspectives-a cornerstone of efficient design for recycling

J. Nilsson; M. Bjorkman Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357), 1999

Emending take-back legislation and rising customer awareness drive manufacturers to implement design for recycling initiatives. At Nokia Multimeda Terminals in Sweden, a study was carried out to improve the design of satellite receivers. The study included how take-back legislation will motivate design changes, and what effect present and future end-of-life treatment technology could have on the design. From this, design ...


Waste not, want not [EU End-of-Life Vehicle Directive]

Manufacturing Engineer, 2002

The European Union's "End-of-Life Vehicle Directive", which will impact upon all manufacturers that supply the European automotive market, is due to be adopted by the UK Government in July 2002. The actual legislation that each country will introduce will vary, but BMW has been an early pioneer of vehicle recycling and is ready for the Directive


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Educational Resources on End Of Life

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eLearning

Using end-of-life cost estimates to perform design for environment investment analysis. A Hewlett-Packard case study

A. Muller Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357), 1999

This paper discusses a methodology to estimate the potential product return, recycling and disposal costs incurred as a consequence of European takeback mandates, corporate leasing arrangements and volunteer takeback initiatives. Furthermore, this paper illustrates the use of these end-of-life costs to estimate the economic benefits of design for environment (DFE). At Hewlett- Packard, the end-of-life costs were estimated for a ...


Optimal End-of-Life Management in Closed-Loop Supply Chains Using RFID and Sensors

Onder Ondemir; Mehmet Ali Ilgin; Surendra M. Gupta IEEE Transactions on Industrial Informatics, 2012

Wireless communication and monitoring devices, namely, radio frequency identification (RFID) tags and sensors, capture and store dynamic life-cycle information during the economic life of the products. RFID tags deliver this information to a computer system when the products are returned to disassembly centers in a closed loop supply chain (CLSC) system. By means of this technology, content of each product ...


Fmit-The Fusion Materials Irradiation Test Facility

Don Liska; Milton D. Machalek IEEE Transactions on Nuclear Science, 1981

One of the major problems facing future fusion reactor designers will be the choice of materials with which to build the containment vessel. Although hundreds of millions of dollars are being invested in fusion research around the world, and optimism exists that fusion power will become available by the end of the century, we cannot today build a practical power ...


End-of-life treatment from technical and economical perspectives-a cornerstone of efficient design for recycling

J. Nilsson; M. Bjorkman Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357), 1999

Emending take-back legislation and rising customer awareness drive manufacturers to implement design for recycling initiatives. At Nokia Multimeda Terminals in Sweden, a study was carried out to improve the design of satellite receivers. The study included how take-back legislation will motivate design changes, and what effect present and future end-of-life treatment technology could have on the design. From this, design ...


Waste not, want not [EU End-of-Life Vehicle Directive]

Manufacturing Engineer, 2002

The European Union's "End-of-Life Vehicle Directive", which will impact upon all manufacturers that supply the European automotive market, is due to be adopted by the UK Government in July 2002. The actual legislation that each country will introduce will vary, but BMW has been an early pioneer of vehicle recycling and is ready for the Directive


More eLearning Resources

IEEE.tv Videos

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IEEE-USA E-Books

  • A REVIEW ON END¿¿?OF¿¿?LIFE BATTERY MANAGEMENT: CHALLENGES, MODELING, AND SOLUTION METHODS

    End¿¿?of¿¿?life (EOL) battery packs may have significant residual value for secondary use and are too expensive to simply recycle. Quality variation adds complexity to EOL decision¿¿?making among multiple EOL options including disposal, recycling, remanufacturing, and reuse in secondary applications. The aim of the modeling and analysis for battery¿¿?remanufacturing systems is to determine the battery's optimal EOL decisions that maximize cost savings or minimize life cycle cost. This chapter considers the quality variation of EOL returns, resulting in different EOL decisions as well as different routes of remanufacturing processes and inventory level. It discusses some of the basics of battery remanufacturing, including the economic and ecological benefits, principles, operational strategy, and processes of battery remanufacturing. Several emerging issues of battery remanufacturing have been discussed with a main focus on modeling and analysis of electric vehicles (EVs) battery¿¿?remanufacturing system as well as decision¿¿?making related to the remanufacturing processes, inventory control, and reassembly strategy.

  • Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, LifeCycle Design, and End of Life

    This chapter contains sections titled: Introduction Substances of Environmental Concern Design for Environment/Energy Efficiency Recycling and Take-Back Summary References

  • Sustainable Software Development

    While most of the ongoing work in Green IT is focused on manufacturing, deployment and disposal of IT hardware, there is still little awareness regarding the environmental impact of software itself. For example, a new piece of demanding software that requires a hardware upgrade generates e-waste, because it forces the user to dispose a computer that still has not reached its physical end-of-life. Such concern is rarely considered during the software development process. This chapter describes the issues associated with software and sustainability, and it introduces a methodology to measure and incrementally minimize the environmental, social and economic impact of software production. This methodology introduces a set of metrics that can be easily integrated into the team's current software development process, while also bringing business value to stakeholders.



Standards related to End Of Life

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IEEE Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.



Jobs related to End Of Life

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