Conferences related to End Of Life

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.

  • 2006 IEEE International Integrated Reliability Workshop (IRW)


2011 IEEE International Symposium on Technology and Society (ISTAS)

ISTAS is an annual international forum sponsored by the IEEE Society on Social Implications of Technology. ISTAS 2011 is co-sponsored by the ACM Special Interest Group on Computers and Society. ISTAS welcomes engineers; scientists; philosophers; researchers in social sciences, arts, law, and humanities; and policy experts in technology and society.

  • 2010 IEEE International Symposium on Technology and Society (ISTAS)

    Social Implications of Emerging Technologies

  • 2009 IEEE International Symposium on Technology and Society (ISTAS)

    The IEEE International Symposium on Technology and Society (ISTAS) is an annual international forum exploring the social implications of technology. ISTAS 09 will be held concurrently with the IEEE International Symposium on Sustainable Systems and Technology (ISSST), with joint sessions related to an overall conference theme of sustainability.



Periodicals related to End Of Life

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Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Industrial Informatics, IEEE Transactions on

IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...


Knowledge and Data Engineering, IEEE Transactions on

Artificial intelligence techniques, including speech, voice, graphics, images, and documents; knowledge and data engineering tools and techniques; parallel and distributed processing; real-time distributed processing; system architectures, integration, and modeling; database design, modeling, and management; query design, and implementation languages; distributed database control; statistical databases; algorithms for data and knowledge management; performance evaluation of algorithms and systems; data communications aspects; system ...



Most published Xplore authors for End Of Life

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Xplore Articles related to End Of Life

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Life cycle inventory of PVC: disposal options for a PVC monitor housing

A. Brinkley; J. R. Kirby; I. L. Wadehra; J. Besnainou; R. Coulon; S. Goybet Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on, 1995

IBM is evaluating the environmental burdens associated with the use of polyvinyl chloride (PVC) in major structural parts for information technology equipment. The evaluation involves developing life cycle inventories of the following four stages: (I) production of PVC from raw materials, (II) PVC compounding, (III) molding, finishing (for electromagnetic compatibility (EMC) and decorative appearance) and (IV) the end-of-life disposal options ...


End of life management of medium voltage equipments

M. Hassanzadeh; W. Daoud Electricity Distribution - Part 2, 2009. CIRED 2009. The 20th International Conference and Exhibition on, 2009

The degradation of some natural resources and the increasingly strict regulatory constraints have led a large number of manufacturers to modify their approach to production with the aim of minimizing the consumption of raw materials and optimizing the recovery of spent products. To date, the issue of recycling is addressed in two different ways: firstly, the integration of eco- design ...


Acceptance tests and monitoring of the next generation polarimetric weather radar network in Switzerland

M. Gabella; M. Sartori; O. Progin; U. Germann Electromagnetics in Advanced Applications (ICEAA), 2013 International Conference on, 2013

MeteoSwiss has recently renewed its weather radar network with an innovative state-of-the-art solution. The main reason for such renewal was the end-of- life of the existing radar systems. During both the acceptance tests and the current operational working time, carefully planned, innovative measurements have being performed on site using both a passive and an active calibrators.


Proceedings of 1994 IEEE International Symposium on Electronics and The Environment

Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on, 1994

The following topics were dealt with: design for environment; electronics; manufacturing; life cycle analysis; re-use issues; integrated life cycle analysis; materials recycling; pollution prevention; life cycle stages; end- of-life issues; and packaging and supplies


Assuming Software Maintenance of a Large, Embedded Legacy System from the Original Developer

William L. Miller; Lawrence B. Compton; Bruce L. Woodmansee Software Maintenance (ICSM), 2013 29th IEEE International Conference on, 2013

Transferring software maintenance and support for a mission critical system from one organization to another demonstrates the importance of having a complete and accurate documentation and anticipating the potential end-of-life issues for software development tools. The authors present the challenges and lessons learned during the transfer of responsibility for all future software maintenance for a large, real-time, mission critical system ...


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Educational Resources on End Of Life

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eLearning

Life cycle inventory of PVC: disposal options for a PVC monitor housing

A. Brinkley; J. R. Kirby; I. L. Wadehra; J. Besnainou; R. Coulon; S. Goybet Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on, 1995

IBM is evaluating the environmental burdens associated with the use of polyvinyl chloride (PVC) in major structural parts for information technology equipment. The evaluation involves developing life cycle inventories of the following four stages: (I) production of PVC from raw materials, (II) PVC compounding, (III) molding, finishing (for electromagnetic compatibility (EMC) and decorative appearance) and (IV) the end-of-life disposal options ...


End of life management of medium voltage equipments

M. Hassanzadeh; W. Daoud Electricity Distribution - Part 2, 2009. CIRED 2009. The 20th International Conference and Exhibition on, 2009

The degradation of some natural resources and the increasingly strict regulatory constraints have led a large number of manufacturers to modify their approach to production with the aim of minimizing the consumption of raw materials and optimizing the recovery of spent products. To date, the issue of recycling is addressed in two different ways: firstly, the integration of eco- design ...


Acceptance tests and monitoring of the next generation polarimetric weather radar network in Switzerland

M. Gabella; M. Sartori; O. Progin; U. Germann Electromagnetics in Advanced Applications (ICEAA), 2013 International Conference on, 2013

MeteoSwiss has recently renewed its weather radar network with an innovative state-of-the-art solution. The main reason for such renewal was the end-of- life of the existing radar systems. During both the acceptance tests and the current operational working time, carefully planned, innovative measurements have being performed on site using both a passive and an active calibrators.


Proceedings of 1994 IEEE International Symposium on Electronics and The Environment

Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on, 1994

The following topics were dealt with: design for environment; electronics; manufacturing; life cycle analysis; re-use issues; integrated life cycle analysis; materials recycling; pollution prevention; life cycle stages; end- of-life issues; and packaging and supplies


Assuming Software Maintenance of a Large, Embedded Legacy System from the Original Developer

William L. Miller; Lawrence B. Compton; Bruce L. Woodmansee Software Maintenance (ICSM), 2013 29th IEEE International Conference on, 2013

Transferring software maintenance and support for a mission critical system from one organization to another demonstrates the importance of having a complete and accurate documentation and anticipating the potential end-of-life issues for software development tools. The authors present the challenges and lessons learned during the transfer of responsibility for all future software maintenance for a large, real-time, mission critical system ...


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IEEE.tv Videos

No IEEE.tv Videos are currently tagged "End Of Life"

IEEE-USA E-Books

  • Sustainable Software Development

    While most of the ongoing work in Green IT is focused on manufacturing, deployment and disposal of IT hardware, there is still little awareness regarding the environmental impact of software itself. For example, a new piece of demanding software that requires a hardware upgrade generates e-waste, because it forces the user to dispose a computer that still has not reached its physical end-of-life. Such concern is rarely considered during the software development process. This chapter describes the issues associated with software and sustainability, and it introduces a methodology to measure and incrementally minimize the environmental, social and economic impact of software production. This methodology introduces a set of metrics that can be easily integrated into the team's current software development process, while also bringing business value to stakeholders.

  • Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, LifeCycle Design, and End of Life

    This chapter contains sections titled: Introduction Substances of Environmental Concern Design for Environment/Energy Efficiency Recycling and Take-Back Summary References



Standards related to End Of Life

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IEEE Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.