Conferences related to End Of Life

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.

  • 2006 IEEE International Integrated Reliability Workshop (IRW)


2011 IEEE International Symposium on Technology and Society (ISTAS)

ISTAS is an annual international forum sponsored by the IEEE Society on Social Implications of Technology. ISTAS 2011 is co-sponsored by the ACM Special Interest Group on Computers and Society. ISTAS welcomes engineers; scientists; philosophers; researchers in social sciences, arts, law, and humanities; and policy experts in technology and society.

  • 2010 IEEE International Symposium on Technology and Society (ISTAS)

    Social Implications of Emerging Technologies

  • 2009 IEEE International Symposium on Technology and Society (ISTAS)

    The IEEE International Symposium on Technology and Society (ISTAS) is an annual international forum exploring the social implications of technology. ISTAS 09 will be held concurrently with the IEEE International Symposium on Sustainable Systems and Technology (ISSST), with joint sessions related to an overall conference theme of sustainability.



Periodicals related to End Of Life

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Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Industrial Informatics, IEEE Transactions on

IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...


Knowledge and Data Engineering, IEEE Transactions on

Artificial intelligence techniques, including speech, voice, graphics, images, and documents; knowledge and data engineering tools and techniques; parallel and distributed processing; real-time distributed processing; system architectures, integration, and modeling; database design, modeling, and management; query design, and implementation languages; distributed database control; statistical databases; algorithms for data and knowledge management; performance evaluation of algorithms and systems; data communications aspects; system ...




Xplore Articles related to End Of Life

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Forecasting sales and generation of obsolete computers in the U.S.

Yan Yang; Eric Williams 2008 IEEE International Symposium on Electronics and the Environment, 2008

Our goal is to characterize future trends in the generation of obsolete computers in the U.S. Our definition of obsolete is based on a user purchasing a replacement computer, after which the old one is stored, resold, or sent for waste management. Starting from historical sales data on new computers and assuming a plausible first life span distribution of desktop ...


A comparison of electrical insulation degradation from various chemical sprays in loss of coolant accident (LOCA) environments

R. Pierson 1983 EIC 6th Electrical/Electronical Insulation Conference, 1983

Nuclear environmental equipment qualification is used to insure equipment operability at an end of life condition following a design basis event. The environmental effects must be accounted for when making this determination. One aspect of the design basis event is chemical spray which is applied to mitigate the accident. The corrosive effects of typical containment sprays upon insulation systems commonly ...


Analyzing the State of Health of Diode Layers by using Structure Functions

Martin Richter; Michael Kopp; Ruediger Schroth; Josef Lutz Integrated Power Systems (CIPS), 2014 8th International Conference on, 2014

The non-destructive quantification of a semiconductors?? state of health is difficult and extensive. The presented paper explains a precise, non- destructive analysis method for power diodes, which illustrates the state of health for each layer. The method is based on thermal impedance spectroscopy which analyzes the thermal transient, especially the cooling curve. By describing the thermal stack as an electrical ...


Comparison of AHP and reference point method in the environmental decision support model

Kai Jin; H. C. Zhang Electronics and the Environment, 2002 IEEE International Symposium on, 2002

This paper presents what the environmental decision making problem is and methodologies to solve this problem. Advantages and disadvantages of analytic hierarchy process (AHP) and the reference point method when they are used in the environmental decision support model are discussed thoroughly.


Low <inline-formula> \Delta T_{j} </inline-formula> Stress Cycle Effect in IGBT Power Module Die-Attach Lifetime Modeling

Wei Lai; Minyou Chen; Li Ran; Olayiwola Alatise; Shengyou Xu; Philip Mawby IEEE Transactions on Power Electronics, 2016

Operational management for reliability of power electronic converters requires sensitive condition monitoring and accurate lifetime modeling. This study adds to the second aspect by examining the effect of cyclic junction temperature variations ΔTj of low amplitude in different stages of the power module ageing process. It is found that such relatively minor stress cycles, which happen frequently during normal operation, ...


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Educational Resources on End Of Life

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eLearning

Forecasting sales and generation of obsolete computers in the U.S.

Yan Yang; Eric Williams 2008 IEEE International Symposium on Electronics and the Environment, 2008

Our goal is to characterize future trends in the generation of obsolete computers in the U.S. Our definition of obsolete is based on a user purchasing a replacement computer, after which the old one is stored, resold, or sent for waste management. Starting from historical sales data on new computers and assuming a plausible first life span distribution of desktop ...


A comparison of electrical insulation degradation from various chemical sprays in loss of coolant accident (LOCA) environments

R. Pierson 1983 EIC 6th Electrical/Electronical Insulation Conference, 1983

Nuclear environmental equipment qualification is used to insure equipment operability at an end of life condition following a design basis event. The environmental effects must be accounted for when making this determination. One aspect of the design basis event is chemical spray which is applied to mitigate the accident. The corrosive effects of typical containment sprays upon insulation systems commonly ...


Analyzing the State of Health of Diode Layers by using Structure Functions

Martin Richter; Michael Kopp; Ruediger Schroth; Josef Lutz Integrated Power Systems (CIPS), 2014 8th International Conference on, 2014

The non-destructive quantification of a semiconductors?? state of health is difficult and extensive. The presented paper explains a precise, non- destructive analysis method for power diodes, which illustrates the state of health for each layer. The method is based on thermal impedance spectroscopy which analyzes the thermal transient, especially the cooling curve. By describing the thermal stack as an electrical ...


Comparison of AHP and reference point method in the environmental decision support model

Kai Jin; H. C. Zhang Electronics and the Environment, 2002 IEEE International Symposium on, 2002

This paper presents what the environmental decision making problem is and methodologies to solve this problem. Advantages and disadvantages of analytic hierarchy process (AHP) and the reference point method when they are used in the environmental decision support model are discussed thoroughly.


Low <inline-formula> \Delta T_{j} </inline-formula> Stress Cycle Effect in IGBT Power Module Die-Attach Lifetime Modeling

Wei Lai; Minyou Chen; Li Ran; Olayiwola Alatise; Shengyou Xu; Philip Mawby IEEE Transactions on Power Electronics, 2016

Operational management for reliability of power electronic converters requires sensitive condition monitoring and accurate lifetime modeling. This study adds to the second aspect by examining the effect of cyclic junction temperature variations ΔTj of low amplitude in different stages of the power module ageing process. It is found that such relatively minor stress cycles, which happen frequently during normal operation, ...


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Standards related to End Of Life

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IEEE Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.



Jobs related to End Of Life

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