Conferences related to End Of Life

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2015 IEEE International Reliability Physics Symposium (IRPS)

Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components


2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms


2013 IEEE International Integrated Reliability Workshop (IIRW)

We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.

  • 2012 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

  • 2011 IEEE International Integrated Reliability Workshop (IIRW)

    The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems through tutorials, paper presentations, discussion groups and special interest groups.

  • 2010 IEEE International Integrated Reliability Workshop (IIRW)

    The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and f

  • 2009 IEEE International Integrated Reliability Workshop (IRW)

    Semiconductor Reliability in general; and Wafer Level Reliability in specific. Covering areas like (but not limited to): Design-in Reliability, reliability characterization, deep sub-micron transistor and circuit reliability, customer reliability requirements, wafer level reliability tests, and reliability root cause analysis, etc.

  • 2008 IEEE International Integrated Reliability Workshop (IRW)

    The workshop focuses on ensuring device reliability through fabrication, design, testing, characterization and simulation as well as identification of the defects and mechanisms responsible for reliability problems. It provides a unique environment for understanding, developing and sharing reliability technology and test methodology.

  • 2007 IEEE International Integrated Reliability Workshop (IRW)

    The Workshop focuses on ensuring semiconductor reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliabilty problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding and developing reliability technology and test methodology.

  • 2006 IEEE International Integrated Reliability Workshop (IRW)


2011 IEEE International Symposium on Technology and Society (ISTAS)

ISTAS is an annual international forum sponsored by the IEEE Society on Social Implications of Technology. ISTAS 2011 is co-sponsored by the ACM Special Interest Group on Computers and Society. ISTAS welcomes engineers; scientists; philosophers; researchers in social sciences, arts, law, and humanities; and policy experts in technology and society.

  • 2010 IEEE International Symposium on Technology and Society (ISTAS)

    Social Implications of Emerging Technologies

  • 2009 IEEE International Symposium on Technology and Society (ISTAS)

    The IEEE International Symposium on Technology and Society (ISTAS) is an annual international forum exploring the social implications of technology. ISTAS 09 will be held concurrently with the IEEE International Symposium on Sustainable Systems and Technology (ISSST), with joint sessions related to an overall conference theme of sustainability.



Periodicals related to End Of Life

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Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electronics Packaging Manufacturing, IEEE Transactions on

Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.


Industrial Informatics, IEEE Transactions on

IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...


Knowledge and Data Engineering, IEEE Transactions on

Artificial intelligence techniques, including speech, voice, graphics, images, and documents; knowledge and data engineering tools and techniques; parallel and distributed processing; real-time distributed processing; system architectures, integration, and modeling; database design, modeling, and management; query design, and implementation languages; distributed database control; statistical databases; algorithms for data and knowledge management; performance evaluation of algorithms and systems; data communications aspects; system ...




Xplore Articles related to End Of Life

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Layout dependent BTI and HCI degradation in nano CMOS technology: A new time-dependent LDE and impacts on circuit at end of life

Pengpeng Ren; Runsheng Wang; Ru Huang 2016 International Conference on IC Design and Technology (ICICDT), 2016

In this paper, the newly-found time-dependent layout dependent effects (LDE) due to layout dependency of device aging is presented. BTI and HCI degradation in nanoscale HKMG devices exhibits evident layout dependency, which will significantly complicate the circuit design. With the analysis on circuit level, the time-dependent LDE should be considered to ensure enough design margin, especially at end of life. ...


Extending product lifetimes through WEEE reuse and repair: Opportunities and challenges in the UK

Christine Cole; Tim Cooper; Alex Gnanapragasam 2016 Electronics Goes Green 2016+ (EGG), 2016

Discarded electrical and electronic equipment (EEE) is a rapidly growing waste stream. This has increased, in part, because advances in technology have contributed to shorter product lifetimes. As such, waste electrical and electronic equipment (WEEE) has received increasing attention from policy makers. Previous research has revealed the large proportion of end-of-life consumer electronics disposed of through residual waste collections and ...


A critical review of recycling and disposal options for leaded glass from cathode ray tubes (CRTs)

Eliette Restrepo; Rolf Widmer; Mathias Schluep 2016 Electronics Goes Green 2016+ (EGG), 2016

As a result of the replacement of cathode ray tube screens (CRTs) by flat screens, the world is confronted with stranded end-of-life CRTs. CRTs contain 1 to 1.5 kg of lead per screen; mainly found in the funnel and neck glass for radiation protection purposes. The lead content makes this CRT glass unsuitable in most glass applications. Thus, there is ...


Drop test reliability improvement of lead-free fine pitch BGA using different solder ball composition

C. Birzer; B. Rakow; R. Steiner; J. Walter 2005 7th Electronic Packaging Technology Conference, 2005

We present drop test results based on the JEDEC method JESD22-B111 for a laminate based lead-free fine pitch ball grid array (FBGA). We especially focus on the influence of substrate technology and solder ball composition. For all our tests we determine the electrical drop test failure rates until end-of-life and the main failure modes by means of cross sectioning. We ...


A practical design of reliability and performance test for portable lithium-ion batteries

Jiajie Fan; Wei He; Christopher Hendricks; Michael Pecht; Kam-Chuen Yung 2015 IEEE International Conference on Information and Automation, 2015

Lithium-ion batteries are increasingly used in industry as an energy storage system for applications ranging from portable electronics to high-energy electric vehicle systems. Their reliability and performance in the field can be affected by variations in environmental and loading conditions. Performance characterization testing provides health and performance features that can be used to assess a battery's performance and reliability under ...


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Educational Resources on End Of Life

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eLearning

Enhanced continuous battery monitoring

Telecommunications Energy Conference, 2002. INTELEC. 24th Annual International, 2002

Various schemes exist for monitoring the condition of batteries connected to telecommunications power systems. Such schemes may be divided into those which provide online data by means of continuous monitoring, and those which rely on a discharge test or the connection of external equipment to provide results. There are advantages and disadvantages in all present methods, thus a simple method ...


A 500kV AIS switchyard rejuvenation in British Columbia using Hybrids

T&D Conference and Exposition, 2014 IEEE PES, 2014

Ingledow is the most important substation in BC Hydro's electrical system. The station, situated in Surrey, BC, serves as a major switching hub, receiving energy from the hydroelectric stations in Northern and North-Eastern BC and distributing it to the energy-hungry users in the Lower Mainland and NE USA. By the year 2007 most of the 500kV equipment in this 1965-vintage ...


Evolutionary informatic process model for exploitation of worn-out products

Systems, Man, and Cybernetics, 1999. IEEE SMC '99 Conference Proceedings. 1999 IEEE International Conference on, 1999

Diagnosis and assessment and recycling planning are the two information- extensive processes in the inverse life-cycle of worn-out products. After the duality between production and recycling is identified, it is immediately seen that the process models of product development are totally unsuitable for the exploitation of worn-out products. This paper proposes an evolutionary informatic process model (EIPM) for the exploitation ...


Improved radiation hardness of silicon solar cells

Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE, 2000

SHARP and NASDA (National Space Development Agency of Japan) have been engaged in the development of silicon space solar cells since 1970s. We started the project to improve the radiation hardness of silicon solar cells in 1998. This project gave fruitful results in BJ (both-side junction) and AHES (advanced high efficiency silicon) structure. The design and manufacturing process for the ...


Electronics, energy, and the environment

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd, 2008

Technologypsilas impact on human health has been a concern for at least 200 years. These concerns range from the waste and pollution due to mining and heavy manufacturing to emissions from the automobile and fossil fuel power plants. Now the proliferation of electronic products and their manufacture can pose additional threats to the now fragile balance in the Earthpsilas eco ...


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IEEE-USA E-Books

  • Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, LifeCycle Design, and End of Life

    This chapter contains sections titled: Introduction Substances of Environmental Concern Design for Environment/Energy Efficiency Recycling and Take-Back Summary References

  • Sustainable Software Development

    While most of the ongoing work in Green IT is focused on manufacturing, deployment and disposal of IT hardware, there is still little awareness regarding the environmental impact of software itself. For example, a new piece of demanding software that requires a hardware upgrade generates e-waste, because it forces the user to dispose a computer that still has not reached its physical end-of-life. Such concern is rarely considered during the software development process. This chapter describes the issues associated with software and sustainability, and it introduces a methodology to measure and incrementally minimize the environmental, social and economic impact of software production. This methodology introduces a set of metrics that can be easily integrated into the team's current software development process, while also bringing business value to stakeholders.

  • A REVIEW ON END¿¿?OF¿¿?LIFE BATTERY MANAGEMENT: CHALLENGES, MODELING, AND SOLUTION METHODS

    End¿¿?of¿¿?life (EOL) battery packs may have significant residual value for secondary use and are too expensive to simply recycle. Quality variation adds complexity to EOL decision¿¿?making among multiple EOL options including disposal, recycling, remanufacturing, and reuse in secondary applications. The aim of the modeling and analysis for battery¿¿?remanufacturing systems is to determine the battery's optimal EOL decisions that maximize cost savings or minimize life cycle cost. This chapter considers the quality variation of EOL returns, resulting in different EOL decisions as well as different routes of remanufacturing processes and inventory level. It discusses some of the basics of battery remanufacturing, including the economic and ecological benefits, principles, operational strategy, and processes of battery remanufacturing. Several emerging issues of battery remanufacturing have been discussed with a main focus on modeling and analysis of electric vehicles (EVs) battery¿¿?remanufacturing system as well as decision¿¿?making related to the remanufacturing processes, inventory control, and reassembly strategy.



Standards related to End Of Life

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IEEE Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.