End Of Life
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2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and Approaches Novel Device Reliability and Failure Mechanisms Novel Gate Stack/Dielectrics and FEOL Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanisms
2013 IEEE International Integrated Reliability Workshop (IIRW)
We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliab
2013 IEEE International Symposium on Technology and Society (ISTAS)
The environment around us is becoming smarter . Soon there will be a camera in nearly every streetlight to do better occupancy sensing, and ultimately a camera in every light fixture. And modern automatic flush toilets, faucets, and sensor-operated showers are starting to use more sophisticated camera-based computer-vision technologies. In a world of smart things like smart lights, smart toilets, smart grids, smart meters, smart roads, and the like, what happens when you have smart people (i.e. p
Wenyuan Wang; Tseng, M.M. Responsive Manufacturing - Green Manufacturing (ICRM 2010), 5th International Conference on, 2010
In terms of sustainable manufacturing, reuse, remanufacturing and recycling of end-of-life products are widely recognized as preferable product end-of-life strategies over direct disposal. Different end-of-life strategies basically, require distinct processes, techniques and management during a product's end- of-life phase. Consequently, specific and efficient implementation of various appropriate end-of-life strategies of an entire product is the only way to achieve sustainable ...
Reimer, B.; Sodhi, M.S.; Knight, W.A. Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on, 2000
Increasing environmental concerns about the disposal of mass produced products have resulted in efforts to take back end-of-life consumer products. Legislation aimed at forcing manufacturers to take back electronics products at the end of their useful lives along with shrinking landfill capacity and the reluctance of communities to open new waste sinks, underscores the importance of developing methods and models ...
Huisman, J.; Stevels, A.L.N.; Stobbe, I. Electronics Packaging Manufacturing, IEEE Transactions on, 2004
In order to improve the eco-efficiency at the end-of-life phase of consumer electronic products, comprehensive assessments should be made. The Quotes for environmentally WEighted RecyclabiliTY and Eco-Efficiency method (QWERTY/EE) developed at the Delft University of Technology is applied to aim at minimal end-of-life treatment costs against maximal environmental recovery. In this paper, the outcomes of this eco-efficiency concept are presented ...
Sexton, E.D.; Nelson, R.F.; Olson, J.B. Applications and Advances, 2001. The Sixteenth Annual Battery Conference on, 2001
Summary form only given. As valve regulated lead-acid (VRLA) batteries age, they demonstrate a predictable drop in end-of-charge voltage and concomitant rise in end-of-charge temperature. This is attributed to the increasing dominance of the oxygen recombination cycle, which results from the negative plate not being fully charged over several cycles. Unchecked, the battery at its end of life experiences a ...
Ansems, A.; van Gijlswijk, R.; Huisman, J. Electronics and the Environment, 2002 IEEE International Symposium on, 2002
In order to enlarge the insight of the behaviour of heavy metals during the processing of end-of-life electronic products more assessment analyses should be made. The aim is to improve the control and management of heavy metal loops during the end-of-life treatment of these products. Four relevant end-of-life options are simulated by modelling and, related to calculated and appointed distribution ...
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To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.