End Of Life
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2015 IEEE International Reliability Physics Symposium (IRPS)
Sharing information related to cause, effects and solutions in the deign and manufacture of electronics and related components
2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die-Level / Package-Level Failure Analysis Case Study & Failure Mechanisms Product Reliability Evaluation and ApproachesNovel Device Reliability and Failure MechanismsNovel Gate Stack/Dielectrics and FEOL Reliability and Failure MechanismsAdvanced Interconnects and BEOL Reliability and Failure Mechanisms
2013 IEEE International Integrated Reliability Workshop (IIRW)
We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics: resistive memories, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, III-V, SOI, emerging memory technologies, transistor reliability including hot carriers and NBTI/PBTI, root cause defects (physical mechanisms and simulations), Cu interconnects and low-k dielectrics, impact of transistor degradation on circuit reliability, designing-in reliability (products, circuits,systems, processes), customer product reliability requirements / manufacturer reliability tasks, waferlevel reliability tests (test approaches and reliability test structures), reliability modeling and simulation,optoelectronics, and single event upsets.
ISTAS is an annual international forum sponsored by the IEEE Society on Social Implications of Technology. ISTAS 2011 is co-sponsored by the ACM Special Interest Group on Computers and Society. ISTAS welcomes engineers; scientists; philosophers; researchers in social sciences, arts, law, and humanities; and policy experts in technology and society.
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...
Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.
Design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally-friendly processing, and computer-integrated manufacturing for the production of electronic assemblies, products, and systems.
IEEE Transactions on Industrial Informatics focuses on knowledge-based factory automation as a means to enhance industrial fabrication and manufacturing processes. This embraces a collection of techniques that use information analysis, manipulation, and distribution to achieve higher efficiency, effectiveness, reliability, and/or security within the industrial environment. The scope of the Transaction includes reporting, defining, providing a forum for discourse, and informing ...
Artificial intelligence techniques, including speech, voice, graphics, images, and documents; knowledge and data engineering tools and techniques; parallel and distributed processing; real-time distributed processing; system architectures, integration, and modeling; database design, modeling, and management; query design, and implementation languages; distributed database control; statistical databases; algorithms for data and knowledge management; performance evaluation of algorithms and systems; data communications aspects; system ...
Pengpeng Ren; Runsheng Wang; Ru Huang 2016 International Conference on IC Design and Technology (ICICDT), 2016
In this paper, the newly-found time-dependent layout dependent effects (LDE) due to layout dependency of device aging is presented. BTI and HCI degradation in nanoscale HKMG devices exhibits evident layout dependency, which will significantly complicate the circuit design. With the analysis on circuit level, the time-dependent LDE should be considered to ensure enough design margin, especially at end of life. ...
Christine Cole; Tim Cooper; Alex Gnanapragasam 2016 Electronics Goes Green 2016+ (EGG), 2016
Discarded electrical and electronic equipment (EEE) is a rapidly growing waste stream. This has increased, in part, because advances in technology have contributed to shorter product lifetimes. As such, waste electrical and electronic equipment (WEEE) has received increasing attention from policy makers. Previous research has revealed the large proportion of end-of-life consumer electronics disposed of through residual waste collections and ...
Eliette Restrepo; Rolf Widmer; Mathias Schluep 2016 Electronics Goes Green 2016+ (EGG), 2016
As a result of the replacement of cathode ray tube screens (CRTs) by flat screens, the world is confronted with stranded end-of-life CRTs. CRTs contain 1 to 1.5 kg of lead per screen; mainly found in the funnel and neck glass for radiation protection purposes. The lead content makes this CRT glass unsuitable in most glass applications. Thus, there is ...
C. Birzer; B. Rakow; R. Steiner; J. Walter 2005 7th Electronic Packaging Technology Conference, 2005
We present drop test results based on the JEDEC method JESD22-B111 for a laminate based lead-free fine pitch ball grid array (FBGA). We especially focus on the influence of substrate technology and solder ball composition. For all our tests we determine the electrical drop test failure rates until end-of-life and the main failure modes by means of cross sectioning. We ...
Jiajie Fan; Wei He; Christopher Hendricks; Michael Pecht; Kam-Chuen Yung 2015 IEEE International Conference on Information and Automation, 2015
Lithium-ion batteries are increasingly used in industry as an energy storage system for applications ranging from portable electronics to high-energy electric vehicle systems. Their reliability and performance in the field can be affected by variations in environmental and loading conditions. Performance characterization testing provides health and performance features that can be used to assess a battery's performance and reliability under ...
Telecommunications Energy Conference, 2002. INTELEC. 24th Annual International, 2002
Various schemes exist for monitoring the condition of batteries connected to telecommunications power systems. Such schemes may be divided into those which provide online data by means of continuous monitoring, and those which rely on a discharge test or the connection of external equipment to provide results. There are advantages and disadvantages in all present methods, thus a simple method ...
T&D Conference and Exposition, 2014 IEEE PES, 2014
Ingledow is the most important substation in BC Hydro's electrical system. The station, situated in Surrey, BC, serves as a major switching hub, receiving energy from the hydroelectric stations in Northern and North-Eastern BC and distributing it to the energy-hungry users in the Lower Mainland and NE USA. By the year 2007 most of the 500kV equipment in this 1965-vintage ...
Systems, Man, and Cybernetics, 1999. IEEE SMC '99 Conference Proceedings. 1999 IEEE International Conference on, 1999
Diagnosis and assessment and recycling planning are the two information- extensive processes in the inverse life-cycle of worn-out products. After the duality between production and recycling is identified, it is immediately seen that the process models of product development are totally unsuitable for the exploitation of worn-out products. This paper proposes an evolutionary informatic process model (EIPM) for the exploitation ...
Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE, 2000
SHARP and NASDA (National Space Development Agency of Japan) have been engaged in the development of silicon space solar cells since 1970s. We started the project to improve the radiation hardness of silicon solar cells in 1998. This project gave fruitful results in BJ (both-side junction) and AHES (advanced high efficiency silicon) structure. The design and manufacturing process for the ...
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd, 2008
Technologypsilas impact on human health has been a concern for at least 200 years. These concerns range from the waste and pollution due to mining and heavy manufacturing to emissions from the automobile and fossil fuel power plants. Now the proliferation of electronic products and their manufacture can pose additional threats to the now fragile balance in the Earthpsilas eco ...
Oral History: Jerry Minter
IMS MicroApps: Silicon Technology Solutions for Wireless Front End Modules
Giving Small Robots New Ways to Move
IEEE Medal of Honor Recipient (2007): Thomas Kailath
IEEE Medal of Honor Recipient (2008): Dr. Gordon Moore
ICRA Keynote: Dr. Takeo Kanade
Making Orthogonal Transitions with Climbing Mini-Whegs
AM37x Sitara EVM Demonstration
International Broadcast Conference(IBC) News: Segment 2
CES 2008: Herman Miller's C2 Climate Control for the desktop
IEEE 125th Anniversary Media Event: Cognitive Computing
Richard Schreier Ph.D: Understanding Delta Sigma Data Converters
Oral History: Earl Bakken
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
Doing the Right Thing: Social Implications of Technology (Member Access)
EMBC 2011-Workshop- Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Ali Khademhosseini
Electric Ship Technologies Symposium (Member Access)
Larson Collection interview with Linus Pauling, part 2
APEC Exhibitor Showcase - Texas Instruments Power Management
This chapter contains sections titled: Introduction Substances of Environmental Concern Design for Environment/Energy Efficiency Recycling and Take-Back Summary References
While most of the ongoing work in Green IT is focused on manufacturing, deployment and disposal of IT hardware, there is still little awareness regarding the environmental impact of software itself. For example, a new piece of demanding software that requires a hardware upgrade generates e-waste, because it forces the user to dispose a computer that still has not reached its physical end-of-life. Such concern is rarely considered during the software development process. This chapter describes the issues associated with software and sustainability, and it introduces a methodology to measure and incrementally minimize the environmental, social and economic impact of software production. This methodology introduces a set of metrics that can be easily integrated into the team's current software development process, while also bringing business value to stakeholders.
End¿¿?of¿¿?life (EOL) battery packs may have significant residual value for secondary use and are too expensive to simply recycle. Quality variation adds complexity to EOL decision¿¿?making among multiple EOL options including disposal, recycling, remanufacturing, and reuse in secondary applications. The aim of the modeling and analysis for battery¿¿?remanufacturing systems is to determine the battery's optimal EOL decisions that maximize cost savings or minimize life cycle cost. This chapter considers the quality variation of EOL returns, resulting in different EOL decisions as well as different routes of remanufacturing processes and inventory level. It discusses some of the basics of battery remanufacturing, including the economic and ecological benefits, principles, operational strategy, and processes of battery remanufacturing. Several emerging issues of battery remanufacturing have been discussed with a main focus on modeling and analysis of electric vehicles (EVs) battery¿¿?remanufacturing system as well as decision¿¿?making related to the remanufacturing processes, inventory control, and reassembly strategy.
To provide the user with a recommended procedure that is safe and easily understood, for the selection, application, and determination of the remaining life in molded case circuit breakers.
Electrical Engineer, Power Systems
Configuration Management/QA Engineer - ATAS 1172
Georgia Tech Research Institute (GTRI)
Senior Research Fellow - Device Fabrication Facility Manager
University of Massachusetts Amherst
Electrical Engineer, Wireless Powering, Verily Life Sciences
Electrical Engineer, Neuromodulation, Microcontrollers, Verily Life Sciences
Electrical Engineer, Wearable Devices and Accessories, Verily Life Sciences
Electrical Engineer, Diabetes Management, Verily Life Sciences
Staff Electrical Engineer
United Technologies Corporation
Director of Public Utilities
Waters & Company, A Springsted Company
Engineer-Softwware/Systems Integration 4
L3 Mission Integration
Engineer-Softwware/Systems Integration 3
L3 Mission Integration
Senior Electrical Engineer (Design Engineering)
Syska Hennessy Group
Electrical Engineer (Design Engineer)
Syska Hennessy Group
Electrical Engineer Supervisor (Electrical Engineering)
Syska Hennessy Group
Technical Project Manager
Sonata Software North America
Electrical Engineer III
Senior Electrical Engineer – Lifecycle Engineering
Electrical Engineering, Junior Project Designer
Senior Electrical Engineer
Intemediate/Senior Electrical Engineer