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2019 IEEE Pulsed Power & Plasma Science (PPPS)

Combined conference of the IEEE International Conference on Plasma Science and the IEEE International Pulsed Power Conference


2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAM

  • 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

    Process & Device Technologies1. Channel Engineering2. High-k/Metal gate Technology3. Advanced Source/Drain Technology4. Interconnect Technology5. Advanced 3D Integration6. Novel Process Technologies7. Ultra-Thin Body Transistors and Device Variability8. Advanced High-k Metal Gate SoC and High Performance CMOS Platforms 9. CMOS Performance Enhancing and Novel Devices 10. Advanced FinFETs and Nanowire FETs11. CNT, MTJ Devices and Nanowire Photodiodes12. Low- Power and Steep Slope Switching Devices13. Graphene Devices14. Advanced Technologies for Ge MOSFETs15. Organic semiconductor devices and technologies16. Compound semiconductor devices and Technology 17. Ultra High Speed Transistors, HEMT/HBT etc. 18. Advanced Power Devices and Reliability19. Flash Memory20. IT Magnetic RAM21. Resistive RAMs22. Phase Change Memory23. 3-Dimensional Memory24. MEMS Technology25. Thin Film Transistors26. Biosensors27. PV and Energy Harvesting28. Front End of Line (FEOL) R

  • 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High Kdielectric , Advance Memories , nano -electronics, Organic and Compound semiconductor devices ,sensors and MEMS, Semiconductor material erization, Reliability , Modeling and simulation,Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low -power, RF devices & circuits, ICCAD

  • 2010 IEEE 10th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

    Silicon IC, Silicon/germanium devices , Interconnect , Low K and High K dielectric , Advance Memories , nano-electronics, Organic and Compound semiconductor devices , sensors and MEMS, Semiconductor material characterization, Reliability , Modeling and simulation, Packaging and testing , Digital, Analog, Mixed Signal IC and SOC design technology,Low-power, RF devices & circuits, IC CAD .

  • 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2006 8th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)

  • 2004 7th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT)


2018 25th IEEE International Conference on Image Processing (ICIP)

The International Conference on Image Processing (ICIP), sponsored by the IEEE Signal Processing Society, is the premier forum for the presentation of technological advances and research results in the fields of theoretical, experimental, and applied image and video processing. ICIP 2018, the 25th in the series that has been held annually since 1994, brings together leading engineers and scientists in image and video processing from around the world.


2018 9th International Particle Accelerator Conference (IPAC)

Topics cover a complete survey of the field of charged particle accelerator science and technology and infrastructure.


2018 Asia-Pacific Microwave Conference (APMC)

The conference topics include microwave theory and techniques, and their related technologies and applications. They also include active devices and circuits, passive components, wireless systems, EMC and EMI, wireless power transfer and energy harvesting, antennas and propagation, and others.


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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


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Using a Second-Order Integral Equation Method to Study the High-Altitude Nuclear EMP

[{u'author_order': 1, u'affiliation': u'College of Electronic and Optical Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210046, China (e-mail: zhzhangj@outlook.com)', u'full_name': u'Jin Zhang'}, {u'author_order': 2, u'affiliation': u'College of Electronic and Optical Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210046, China (e-mail: zhangyr@njupt.edu.cn)', u'full_name': u'Ye-Rong Zhang'}] IEEE Transactions on Electromagnetic Compatibility, None

A zero-order integral equation method (IEM) in our former report was introduced to simulate the high-altitude electromagnetic pulse (HEMP). The planar gamma source model was employed and results of the zero-order IEM matched those of the outgoing wave method (OWM). In this paper, a second-order IEM is introduced for the calculation of the HEMP. The point gamma source model is ...


Time-domain finite difference analysis of EMP coupling to double wires

[{u'author_order': 1, u'affiliation': u'School of Electronic Science and Engineering, Nanjing University of Posts and Telecommunications, 66 Xinmofan Road Nanjing, Jiangsu, China 210003', u'full_name': u'Zhongwei Yang'}, {u'author_order': 2, u'affiliation': u'School of Electronic Science and Engineering, Nanjing University of Posts and Telecommunications, 66 Xinmofan Road Nanjing, Jiangsu, China 210003', u'full_name': u'Feng Xu'}, {u'author_order': 3, u'affiliation': u'School of Electronic Science and Engineering, Nanjing University of Posts and Telecommunications, 66 Xinmofan Road Nanjing, Jiangsu, China 210003', u'full_name': u'Junlin Zhan'}, {u'author_order': 4, u'affiliation': u'Département de Génie Électrique, École Polytechnique de Montreal, 25 00, Chemin Polytechnique, Montreal, H3T 1J4, QC, Canada', u'full_name': u'Ke Wu'}] 2017 Sixth Asia-Pacific Conference on Antennas and Propagation (APCAP), None

An effective mathematical procedure is developed for investigation transient current responses of double wires illuminated by an external electromagnetic pulse. The numerical algorithm is based on the finite difference method in time domain and combining with the thin-strut formalism. The variation of the induced current on two thin wires is obtained. The response characteristics of the thin wires illuminated by ...


Investigation on the terminal response of a twisted-wire pair excited by EMP

[{u'author_order': 1, u'affiliation': u'Science and Technology on EMC Laboratory, Wuhan, China', u'full_name': u'Qi-Feng Liu'}, {u'author_order': 2, u'affiliation': u'Center for EMC, Beijing Hang Kong Hang Tian University, Peking, China', u'full_name': u'Qi Wu'}, {u'author_order': 3, u'affiliation': u'Science and Technology on EMC Laboratory, Wuhan, China', u'full_name': u'Sheng-quan Zheng'}, {u'author_order': 4, u'affiliation': u'Science and Technology on EMC Laboratory, Wuhan, China', u'full_name': u'Yu Zuo'}, {u'author_order': 5, u'affiliation': u'Science and Technology on EMC Laboratory, Wuhan, China', u'full_name': u'Li-Tao'}] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), None

It is great harmful that high-power electromagnetic pulse (EMP) enviromment coupling into the electronic instrumentation and system through the different cables and slots. Electromagnetism defense of electronic system should be brought to the radio forefront. So paying attention to coupling characteristic of the twisted wire pair (TWP) excited by high-power EMP in the equipment and system is very necessary. In ...


Modeling of EMP coupling to lossless MTLs in time domain based on analytical Gauss-Seidel iteration technique

[{u'author_order': 1, u'affiliation': u"State Key laboratory of Electrical Insulation and Power Equipment, Electrical Engineering College, Xi'an Jiaotong University, Xi'an, Shannxi, China", u'full_name': u'Jun Guo'}, {u'author_order': 2, u'affiliation': u"State Key laboratory of Electrical Insulation and Power Equipment, Electrical Engineering College, Xi'an Jiaotong University, Xi'an, Shannxi, China", u'full_name': u'Yan-zhao Xie'}, {u'author_order': 3, u'affiliation': u'Electromagnetic Compatibility Laboratory, Swiss Federal Institute of Technology, Lausanne (EPFL), CH-1015 Lausanne, Switzerland', u'full_name': u'Farhad Rachidi'}] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), None

This paper provides an efficient way to simulate the transient electromagnetic field coupling to overhead multi-conductor transmission lines in time domain based on an analytical iterative technique. The method is entirely in time domain and therefore can handle straightforwardly nonlinear loads. In this method, the interaction between the line conductors are represented by distributed sources, and the time domain analytical ...


EMP Coupling to a Straight Conductor Above Ground: Transmission Line Formulation Based on Electromagnetic Reciprocity

[{u'author_order': 1, u'affiliation': u'School of Electrical Engineering and Computer Science, Washington State University, Pullman, WA 99164-2752 USA (e-mail: bgolsen@wsu.edu).', u'full_name': u'Robert G. Olsen'}, {u'author_order': 2, u'affiliation': u'Oak Ridge National Laboratory, Oak Ridge, TN 37831 USA (e-mail: tarditiag@ornl.gov).', u'full_name': u'Alfonso G. Tarditi'}] IEEE Transactions on Electromagnetic Compatibility, None

A simple model for coupling of an electromagnetic plane wave incident on a conductor above ground has been developed using reciprocity theory, providing some advantages as compared to the conventional transmission line approach. The model is developed using a semi-infinitely long single conductor above a lossy ground plane and connected by an arbitrary load impedance to a vertical grounding conductor. ...


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  • Signals through Space

    This chapter contains sections titled: Light, Other Electromagnetic Signals, Biological Effects of High-Frequency Electromagnetic Signals, Biological Effects of Non-Ionizing Radiation, Standards for Exposure, Project Sanguine- Seafarer-ELF, A Natural Resource Gone, Appendix 8.1 EMP (Electromagnetic Pulse), Review Questions, Problems




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