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2015 IEEE International Conference on Plasma Sciences (ICOPS)
Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.
2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
2013 IEEE NEMS is the 8th annual International Conference on Nano/Micro Engineered and Molecular Systems which started in 2006. It covers Nano science and technology, Micro/nanofluidics and Bio chip, Micro/nano fabrication & metrology, Micro/Nano sensors, actuators and systemd, Flexible MEMS and printed electronics, Carbon Nanotube and Graphene based devices, etc.
2013 Asia-Pacific Conference on Synthetic Aperture Radar (APSAR)
The Asia-Pacific Conference on Synthetic Aperture Radar (APSAR) is an international conference devoted to AR technology development and applications. The conference toopics include SAR and general radar technologies. SAR systems, innovative SAR operation concept for spaceborne and UAV appllications. Various image processings techniques and their applications are also major subjects.
2012 15th Biennial IEEE Conference on Electromagnetic Field Computation (CEFC)
The aims of the IEEE CEFC are to present the latest developments in modeling and simulation methodologies for the analysis of electromagnetic fields and wave interactions, with the application emphasis being on the computer-aided design of low and high frequency devices, components and systems. Scientists and engineers worldwide are invited to submit original contributions in the areas of Static and Quasi-static Fields, Wave Propagation, Material Modeling, Coupled Problems, Numerical Techniques, Optimization and Design, Software Methodology, Nanomagnetics, Nanophotonics, Bioelectric Field Computation as well as Devices and Applications.
2010 International Conference on Mechanic Automation and Control Engineering (MACE)
Manufacturing Control and Automation Engineering,CAD/CAM/CIM and Simulation, Materials Processing and Control, Instruments and Vibration Control
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.
The IEEE Region 9 is releasing the IEEE Latin America Transactions to enable the publication of non-published and technically excellent papers from Latin American engineers, in Spanish or Portuguese languages. Engineers and researchers from Portugal and Spain (and others countries with the same language) are also very welcome to submit their proposals.
Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.
Hsiao-Yun Chen; Da-Yuan Shih; Cheng-Chang Wei; Chih-Hang Tung; Yi-Li Hsiao; Yu, D.C.-H.; Yu-Chun Liang; Chih Chen Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 2013
An immortal solder micro-bump (μbump) electromigration (EM) lifetime has been demonstrated for 3D IC integration. This ultimate goal was achieved under strictly controlled conditions, including the optimal design of bump metallurgy, geometry, optimized processes, along with well-defined stressing conditions and manufacturing window. The current carrying capability and EM lifetime of μbump have been investigated as functions of stressing conditions which ...
Farrar, S.; Jones, L. Microwave Radiometry and Remote Sensing of the Environment (MicroRad), 2014 13th Specialist Meeting on, 2014
In 1998, the Tropical Rainfall Measuring Mission observatory performed a set of maneuvers known as Deep Space Calibration (DSC) that allowed the TRMM Microwave Imager conically scanning antenna beam to view a known non-polarized calibration scene of 2.7 Kelvin. However, during this period the radiometric transfer function (radiometric counts-to-TA) was only valid for only a very short portion of main ...
Dierickx, B.; Simoen, E.; Vermeiren, J.; Claeys, C. Solid State Device Research Conference, 1988. ESSDERC '88. 18th European, 1988
The operation of ``accumulation mode'' or ``majority carrier'' MOS transistors at liquid helium temperature is reported and compared with normal (minority carrier) MOSFET's. The adverse kink/hysteresis effects are absent, while the current levels are highly comparable. This offers an alternative for cryogenic CMOS: under certain reserves, a well-less CMOS technology based on n+ nn+ and p+ np+ MOSFET's in a ...
d'Aquino, M.; Miano, G.; Serpico, C.; Zamboni, W. Magnetics, IEEE Transactions on, 2003
The problem of electromagnetic forces in polarizable fluids is discussed and classical formulas for volume force density (Kelvin, Helmholtz) are reviewed. The general problem of hydrostatic equilibrium of a liquid dielectric subject to electric field is formulated. On the basis of this formulation, the displacement of a linear dielectric fluid subject to the field produced by planar electrodes dipped in ...
Santander, J.; Lozano, M.; Gotz, A.; Cané , C.; Lora-Tamayo, E. Microelectronic Test Structures, 1996. ICMTS 1996. Proceedings. 1996 IEEE International Conference on, 1996
An accurate procedure to extract contact resistivity from contact resistance measurements made on both D-Resistor and L-Resistor type Kelvin cross test structures with both upper and lower resistive layers is presented. The method is based on the obtention of a set of "Universal Surfaces" through computer simulation. Using adimensional variables these surfaces can be employed in all experimental conditions, eliminating ...
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