Kelvin

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The kelvin is a unit of measurement for temperature. It is one of the seven base units in the International System of Units (SI) and is assigned the unit symbol K. (Wikipedia.org)






Conferences related to Kelvin

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2015 IEEE International Conference on Plasma Sciences (ICOPS)

Basic Processes in Fully and Partially Ionized Plasmas; Microwave Generation and Plasma Interactions; Charged Particle Beams and Sources; High Energy Density Plasmas and Applications; Industrial, Commercial, and Medical Plasma Applications; Plasma Diagnostics; Pulsed Power and other Plasma Applications.


2013 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2013 IEEE NEMS is the 8th annual International Conference on Nano/Micro Engineered and Molecular Systems which started in 2006. It covers Nano science and technology, Micro/nanofluidics and Bio chip, Micro/nano fabrication & metrology, Micro/Nano sensors, actuators and systemd, Flexible MEMS and printed electronics, Carbon Nanotube and Graphene based devices, etc.

  • 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanomaterials; Carbon Nanotube based Devices and Systems; Molecular Sensors, Actuators, and Systems; Nanobiology, Nano-bio-informatics, Nanomedicine; Microfluidics and Nanofluidics;Micro and Nano Heat Transfer.

  • 2011 IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Nanotechnology is an important emerging field. On the other hand, MEMS is indispensable in spanning nano devices into systems. It is evident that MEMS and Nanotechnology will soon merge together and this marriage will significantly impact many industries across the globe. This conference is the annual IEEE Nanotechnology Council meeting to bring together world-leading researchers in several advanced topics of MEMS and Nanotechnology to disseminate their latest research results and allow cross-disciplinary.

  • 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    Micro and Nano Fabrication Micro/Nano Sensors and Actuators Nanophotonics Nanomaterials Microfluidics and Nanofluidics Micro and Nano Heat Transfer Nanobiology, Nano-bio-informatics, Nanomedicine Nanoscale Robotics, Assembly, and Automation Carbon Nanotube based Devices and Systems Micro/Nanoelectromechanical Systems (M/NEMS) Molecular Sensors, Actuators, and Systems

  • 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

    IEEE-NEMS is a premier conference of the IEEE Nanotechnology Council to bring together world-leading researchers in the several focused topics of MEMS and Nanotechnology to disseminate their latest research results and allow cross-disciplinary exchange of knowledge to further advance both technological areas. MEMS is naturally continuing its downsizing into Nanoelectromechanical Systems but at the same time it is indispensable in constructing complete Nano devices and systems. It is foreseeable that MEMS an


2013 Asia-Pacific Conference on Synthetic Aperture Radar (APSAR)

The Asia-Pacific Conference on Synthetic Aperture Radar (APSAR) is an international conference devoted to AR technology development and applications. The conference toopics include SAR and general radar technologies. SAR systems, innovative SAR operation concept for spaceborne and UAV appllications. Various image processings techniques and their applications are also major subjects.

  • 2011 3rd International Asia-Pacific Conference on Synthetic Aperture Radar (APSAR)

    The Asia-Pacific Conference on Synthetic Aperture Radar (APSAR) is an international conference devoted to AR technology development and applications. The conference toopics include SAR and general radar technologies. SAR systems, innovative SAR operation concept for spaceborne and UAV appllications. Various image processings techniques and their applications are also major subjects.

  • 2009 2nd Asian-Pacific Conference on Synthetic Aperture Radar (APSAR)

    The Asia-Pacific Conference on Synthetic Aperture Radar (APSAR) is an international conference devoted to SAR technology development and applications. The APSAR is a forum of SAR engineers and scientists from all over the world, especially from the Asia-Pacific region. The bi-annual APSAR conference will be held every two years in China, Japan, Korea, Australia, and Singapore, in turn.


2012 15th Biennial IEEE Conference on Electromagnetic Field Computation (CEFC)

The aims of the IEEE CEFC are to present the latest developments in modeling and simulation methodologies for the analysis of electromagnetic fields and wave interactions, with the application emphasis being on the computer-aided design of low and high frequency devices, components and systems. Scientists and engineers worldwide are invited to submit original contributions in the areas of Static and Quasi-static Fields, Wave Propagation, Material Modeling, Coupled Problems, Numerical Techniques, Optimization and Design, Software Methodology, Nanomagnetics, Nanophotonics, Bioelectric Field Computation as well as Devices and Applications.

  • 2010 14th Biennial IEEE Conference on Electromagnetic Field Computation (CEFC)

    IEEE CEFC presents the latest developments in modeling and simulation methodologies for the analysis of electromagnetic fields and wave interactions, with the application emphasis being on the computer-aided design of low and high frequency devices, components and systems.

  • 2008 13th Biennial IEEE Conference on Electromagnetic Field Computation (CEFC)

    The scope of the IEEE CEFC are to present the latest developments in modeling and simulation methodologies for the analysis of electromagnetic fields and interactions, with the application emphasis being on the computer- aided design of low and high frequency devices, components and systems.

  • 2006 12th Biennial IEEE Conference on Electromagnetic Field Computation (CEFC)


2010 International Conference on Mechanic Automation and Control Engineering (MACE)

Manufacturing Control and Automation Engineering,CAD/CAM/CIM and Simulation, Materials Processing and Control, Instruments and Vibration Control



Periodicals related to Kelvin

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Latin America Transactions, IEEE (Revista IEEE America Latina)

The IEEE Region 9 is releasing the IEEE Latin America Transactions to enable the publication of non-published and technically excellent papers from Latin American engineers, in Spanish or Portuguese languages. Engineers and researchers from Portugal and Spain (and others countries with the same language) are also very welcome to submit their proposals.


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.


Microwave Theory and Techniques, IEEE Transactions on

Microwave theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of microwaves.


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Xplore Articles related to Kelvin

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History and magnetics of compass adjusting

G. W. Barber; A. S. Arrott IEEE Transactions on Magnetics, 1988

A brief review of the developments in the compass and its use in response to the change to iron ships in the 19th century is given in commemoration of the 100th anniversary of the adoption of Kelvin's compass by the British Royal Navy


Temperature regulation in multicore processors using adjustable-gain integral controllers

K. Rao; W. Song; S. Yalamanchili; Y. Wardi 2015 IEEE Conference on Control Applications (CCA), 2015

This paper considers the problem of temperature regulation in multicore processors by dynamic voltage-frequency scaling. We propose a feedback law that is based on an integral controller with adjustable gain, designed for fast tracking convergence in the face of model uncertainties, time-varying plants, and tight computing-timing constraints. Moreover, unlike prior works we consider a nonlinear, time-varying plant model that trades ...


Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure

Da-Quan Yu; Tai Chong Chai; Meei Ling Thew; Yue Ying Ong; Vempati Srinivasa Rao; Leong Ching Wai; John H. Lau 2009 59th Electronic Components and Technology Conference, 2009

Electromigration (EM) of micro bumps of 50 mum pitch was studied using four- point Kelvin structure. Two kinds of bumps, i. e., SnAg solder bump and Cu post with SnAg solder were tested. These bumps with thick Cu under bump metallization (UBM) were bonded with electroless Ni/Au (ENIG) pads. The results showed different EM features comparing with larger flip chip ...


Kitchen table testing of 10 GHz superconducting electronic circuits

C. J. Fourie; W. J. Perold; U. Buttner 2004 IEEE Africon. 7th Africon Conference in Africa (IEEE Cat. No.04CH37590), 2004

As the clock speeds of experimental digital electronic circuits increase beyond the measurement ranges of commercial oscilloscopes, the testing and verification thereof becomes a significant problem. Superconducting circuits add further complications, such as 4 Kelvin operating temperatures, output signal levels of around 300 muV, and the need for comprehensive magnetic field screening. This article discusses the testing of such circuits ...


Design and integration of electrical-based dimensional process-window checking infrastructure

K. Y. Y. Doong; R. C. J. Wang; J. C. H. Huang; S. C. Lin; L. J. Hung; S. Z. Lee; K. L. Young International Conference on Microelectronic Test Structures, 2003., 2003

The purpose of this work is to provide a design infrastructure for electrical- based dimensional process-window checking. With the aid of the novel test vehicle design platform, the discrepancy among design rule set, test structure design and testing plan can be minimized. Using the function-independent Test Structure Design Intellectual Properties (TSD-IP) provided by this infrastructure, the process-window could be quantified ...


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Educational Resources on Kelvin

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eLearning

History and magnetics of compass adjusting

G. W. Barber; A. S. Arrott IEEE Transactions on Magnetics, 1988

A brief review of the developments in the compass and its use in response to the change to iron ships in the 19th century is given in commemoration of the 100th anniversary of the adoption of Kelvin's compass by the British Royal Navy


Temperature regulation in multicore processors using adjustable-gain integral controllers

K. Rao; W. Song; S. Yalamanchili; Y. Wardi 2015 IEEE Conference on Control Applications (CCA), 2015

This paper considers the problem of temperature regulation in multicore processors by dynamic voltage-frequency scaling. We propose a feedback law that is based on an integral controller with adjustable gain, designed for fast tracking convergence in the face of model uncertainties, time-varying plants, and tight computing-timing constraints. Moreover, unlike prior works we consider a nonlinear, time-varying plant model that trades ...


Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure

Da-Quan Yu; Tai Chong Chai; Meei Ling Thew; Yue Ying Ong; Vempati Srinivasa Rao; Leong Ching Wai; John H. Lau 2009 59th Electronic Components and Technology Conference, 2009

Electromigration (EM) of micro bumps of 50 mum pitch was studied using four- point Kelvin structure. Two kinds of bumps, i. e., SnAg solder bump and Cu post with SnAg solder were tested. These bumps with thick Cu under bump metallization (UBM) were bonded with electroless Ni/Au (ENIG) pads. The results showed different EM features comparing with larger flip chip ...


Kitchen table testing of 10 GHz superconducting electronic circuits

C. J. Fourie; W. J. Perold; U. Buttner 2004 IEEE Africon. 7th Africon Conference in Africa (IEEE Cat. No.04CH37590), 2004

As the clock speeds of experimental digital electronic circuits increase beyond the measurement ranges of commercial oscilloscopes, the testing and verification thereof becomes a significant problem. Superconducting circuits add further complications, such as 4 Kelvin operating temperatures, output signal levels of around 300 muV, and the need for comprehensive magnetic field screening. This article discusses the testing of such circuits ...


Design and integration of electrical-based dimensional process-window checking infrastructure

K. Y. Y. Doong; R. C. J. Wang; J. C. H. Huang; S. C. Lin; L. J. Hung; S. Z. Lee; K. L. Young International Conference on Microelectronic Test Structures, 2003., 2003

The purpose of this work is to provide a design infrastructure for electrical- based dimensional process-window checking. With the aid of the novel test vehicle design platform, the discrepancy among design rule set, test structure design and testing plan can be minimized. Using the function-independent Test Structure Design Intellectual Properties (TSD-IP) provided by this infrastructure, the process-window could be quantified ...


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Standards related to Kelvin

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