Interpolation

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In the mathematical field of numerical analysis, interpolation is a method of constructing new data points within the range of a discrete set of known data points. (Wikipedia.org)






Conferences related to Interpolation

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2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


2019 56th ACM/IEEE Design Automation Conference (DAC)

EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2018 55th ACM//IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2019 IEEE 58th Conference on Decision and Control (CDC)

The CDC is recognized as the premier scientific and engineering conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, systems and control, and related areas.The 58th CDC will feature contributed and invited papers, as well as workshops and may include tutorial sessions.The IEEE CDC is hosted by the IEEE Control Systems Society (CSS) in cooperation with the Society for Industrial and Applied Mathematics (SIAM), the Institute for Operations Research and the Management Sciences (INFORMS), the Japanese Society for Instrument and Control Engineers (SICE), and the European Union Control Association (EUCA).


2019 IEEE Energy Conversion Congress and Exposition (ECCE)

IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2018 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.

  • 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

    ECCE is the premier global conference covering topics in energy conversion from electric machines, power electronics, drives, devices and applications both existing and emergent

  • 2016 IEEE Energy Conversion Congress and Exposition (ECCE)

    The Energy Conversion Congress and Exposition (ECCE) is focused on research and industrial advancements related to our sustainable energy future. ECCE began as a collaborative effort between two societies within the IEEE: The Power Electronics Society (PELS) and the Industrial Power Conversion Systems Department (IPCSD) of the Industry Application Society (IAS) and has grown to the premier conference to discuss next generation technologies.

  • 2015 IEEE Energy Conversion Congress and Exposition

    The scope of ECCE 2015 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power and power electronics.

  • 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

    Those companies who have an interest in selling to: research engineers, application engineers, strategists, policy makers, and innovators, anyone with an interest in energy conversion systems and components.

  • 2013 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the congress interests include all technical aspects of the design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power conversion and power electronics.

  • 2012 IEEE Energy Conversion Congress and Exposition (ECCE)

    The IEEE Energy Conversion Congress and Exposition (ECCE) will be held in Raleigh, the capital of North Carolina. This will provide a forum for the exchange of information among practicing professionals in the energy conversion business. This conference will bring together users and researchers and will provide technical insight as well.

  • 2011 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE 3rd Energy Conversion Congress and Exposition follows the inagural event held in San Jose, CA in 2009 and 2nd meeting held in Atlanta, GA in 2010 as the premier conference dedicated to all aspects of energy processing in industrial, commercial, transportation and aerospace applications. ECCE2011 has a strong empahasis on renewable energy sources and power conditioning, grid interactions, power quality, storage and reliability.

  • 2010 IEEE Energy Conversion Congress and Exposition (ECCE)

    This conference covers all areas of electrical and electromechanical energy conversion. This includes power electrics, power semiconductors, electric machines and drives, components, subsystems, and applications of energy conversion systems.

  • 2009 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the conference include all technical aspects of the design, manufacture, application and marketing of devices, circuits, and systems related to electrical energy conversion technology


2019 IEEE International Conference on Image Processing (ICIP)

The International Conference on Image Processing (ICIP), sponsored by the IEEE SignalProcessing Society, is the premier forum for the presentation of technological advances andresearch results in the fields of theoretical, experimental, and applied image and videoprocessing. ICIP 2019, the 26th in the series that has been held annually since 1994, bringstogether leading engineers and scientists in image and video processing from around the world.


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Periodicals related to Interpolation

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Broadcasting, IEEE Transactions on

Broadcast technology, including devices, equipment, techniques, and systems related to broadcast technology, including the production, distribution, transmission, and propagation aspects.


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


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Most published Xplore authors for Interpolation

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Xplore Articles related to Interpolation

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A Study On High Efficiency Coding Of HDTV At 50Mbps

[{u'author_order': 1, u'affiliation': u'Matsushita Electric Industrial Co., Ltd.', u'authorUrl': u'https://ieeexplore.ieee.org/author/37281716300', u'full_name': u'S. Kadono', u'id': 37281716300}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37370479100', u'full_name': u'C. Yamamitsu', u'id': 37370479100}] IEEE 1992 International Conference on Consumer Electronics Digest of Technical Papers, 1992

None


IEE Colloquium on 'Adaptive Interpolation in Images' (Digest No.112)

[] IEE Colloquium Adaptive Interpolation in Images, 1991

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Analysis of inconsistent data in power planning

[{u'author_order': 1, u'authorUrl': u'https://ieeexplore.ieee.org/author/37288706000', u'full_name': u'S. Rahman', u'id': 37288706000}, {u'author_order': 2, u'authorUrl': u'https://ieeexplore.ieee.org/author/37284133400', u'full_name': u'G. Shrestha', u'id': 37284133400}] IEEE Power Engineering Review, 1991

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Orientation estimation: Conventional techniques and a new non-differential approach

[{u'author_order': 1, u'affiliation': u'J.W. Goethe-Universität Frankfurt, Institute for Applied Physics, Robert-Mayer-Str. 2-4, D-60054 Frankfurt/M., Germany', u'full_name': u'Rudolf Mester'}] 2000 10th European Signal Processing Conference, 2000

The estimation approach discussed in this paper is based on a signal-theoretic and statistical analysis of the notion of orientation. In contrast to other approaches, it does not require the computation of gray value gradients, or the power spectrum of the given signal patch, or quadrature filter outputs, but directly estimates a small central part of the autocovariance function (acf) ...


Past input reconstruction in backward consistent fast least-squares algorithms

[{u'author_order': 1, u'affiliation': u'Departement Signal & Image, Institut National des Telecommunications, 9, rue Charles Fourier, F-91011 Evry cedex France', u'full_name': u'Phillip A. Regalia'}] 1996 8th European Signal Processing Conference (EUSIPCO 1996), 1996

We present an analytic solution to the past input reconstruction problem, which consists in describing all past input sequences which would give rise to a given set of variables in fast least-squares algorithms, whenever the variables in questionare reachable.


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Educational Resources on Interpolation

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eLearning

No eLearning Articles are currently tagged "Interpolation"

IEEE-USA E-Books

  • Radial-Basis Function Networks

    This chapter focuses on the radial-basis function (RBF) network as an alternative to multilayer perceptrons. It will be interesting to find that in a multilayer perceptron, the function approximation is defined by a nested set of weighted summations, while in a RBF network, the approximation is defined by a single weighted sum. The chapter focuses on the use of a Gaussian function as the radial-basis function. The reason behind the choice of the Gaussian function as the radial-basis function in building RBF networks is that it has many desirable properties, which will become evident as the discussion progresses. It is important to point out that RBF networks and multilayer perceptrons can be trained in alternative ways besides those presented. For multilayer perceptrons, the backpropagation algorithm is simple to compute locally and it performs stochastic gradient descent in weight space when the algorithm is implemented in an online learning mode.

  • Two-Dimensional Migration Algorithms

    This chapter focuses on data in the frequency domain and the time domain. In both cases, the chapter focuses on the case of common offset data gathered at the air-soil interface, as well as to the case of only dielectric soils and dielectric targets. The migration formula in frequency domain essentially consists in an interpolation of the spectrum of the data multiplied times a known function and then back Fourier transformed in the spatial domain. It has the drawback that it requires some interpolation of the spectrum of the data, but has the computational advantage that it is a two-dimensional (2D) inverse Fourier transform and therefore can be implemented by means of computationally effective IFFT algorithms. Several commercial codes for ground penetrating radar (GPR) data processing allow us to choose the number of traces to be taken into account when performing the Kirchhoff's migration.

  • Three-Dimensional Migration Algorithms

    This chapter provides three-dimensional (3D) migration formulas, namely for the data gathered at the air-soil interface in common offset on a nonmagnetic soil and without magnetic targets. The source is assimilated to a Hertzian dipole, and the received signal is approximated as the projection of the field along the direction of the receiving dipole in the observation point. The chapter exposes the physical reason why in the formulas of the 2D migration in the time domain, the datum is integrated versus the time, whereas in the homologous 3D formulas the integration along the time disappears.

  • Channel Estimation and Equalization

    Channel estimation can be classified into pilot‐assisted channel estimation, blind channel estimation, and decision DDCE. This chapter focuses on pilot‐assisted channel estimation in OFDM systems. There are two main design issues for channel estimation in OFDM systems. The first one is pilot design and the second one is channel estimator design with both low complexity and accuracy. An interpolation technique should be performed to obtain a channel estimation value at each data subcarrier. Channel estimation for MIMO‐OFDM systems is more complicated than single antenna systems but the basic principle is similar to the single antenna systems. The purpose of equalizers is to find the inverse function of the channel response and eliminate an Inter‐Symbol Interference (ISI) caused by the dispersive nature of the channel. The channel estimator and the equalizer are designed according to the system requirements such as pilot assignment, antenna array, system complexity, latency, and power.

  • Cell Counting

    In the elderly population, complete blood cell counting is one of the most informative blood tests reflecting metabolic syndrome and hence indicating the overall health status. This chapter presents one miniaturized optofluidic imaging system for cell counting based on Complementary Metal Oxide Semiconductor (CMOS) Image Sensors (CIS) and the super‐resolution (SR) image processing. In optofluidic contact imaging system, the dynamic range (DR) quantifies the ability of a CIS to response under both bright highlight and dark shadow conditions. The chapter tackles the SR problems by employing two efficient machine‐learning based approaches, namely extreme learning machine (ELM)‐based SR (ELMSR) and convolutional neural network (CNN)‐based SR (CNNSA). The chapter shows the proposed contact‐imaging based microfluidic cytometer for flowing cell recognition and counting. For the microfluidic cytometer prototype with ELMSR and CNNSR, the off‐line training image libraries of blood cells and HepG2 tumor cells were first built.

  • Image Quality

    The performance assessment of image interpolation algorithms can be categorized into objective and subjective assessments. This chapter introduces the different image features and the image artifacts commonly observed in interpolated images. It discusses the classification of quality assessment algorithms according to the sources of reference images. The source of the reference image adopted in different quality assessment algorithms categorizes the algorithms into three groups, including _full‐reference image quality index_ (FRIQ), _no‐reference image quality index_ (NRIQ), and _reduced‐reference image quality index_ (RRIQ). Smoothing or blurring is observed when the high frequency components are lost, which can happen in the texture‐rich regions or along/across edges. The edge halo can be considered as a visual artifact that is opposite to smoothing. Among various FRIQ metrics, the mean squares error (MSE) and the peak signal‐to‐noise ratio (PSNR) are two commonly used metrics.

  • Edge‐Directed Interpolation

    This chapter discusses a few selected adaptive interpolation methods known as the edge‐directed interpolation (EDI), which are considered to be the class of image interpolation method that can preserve the edge structure with high visual quality. It focuses on the EDI methods that classify pixels into edge or non‐edge type by comparing the relative intensity or frequency variation with its neighboring pixels. The _Canny edge interpolation_ (CEI) is well received as a simple and efficient image interpolation method. The most basic de‐interlacing methods among the many of its varieties is _edge‐based line averaging_ (ELA). The ELA can be divided into two steps: edge estimation and interpolation. The _directional‐orientation interpolation_ (DOI) is a variation of the ELA method aiming to achieve higher accuracy and finer resolution in edge detection. The _error‐amended sharp edge_ (EASE) method extends the structural correlation measurement to four directions to obtain more accurate edge information for image interpolation.

  • Machine Learning: Data Pre‐processing

    In prognostics and health management (PHM), data pre‐processing generally involves the following tasks: data cleansing, normalization, feature discovery, and imbalanced data management. Data cleansing is the process of detecting and correcting corrupt or inaccurate data. Feature engineering is the process of using domain knowledge of the data to create features that make machine learning algorithms work. Feature extraction, also known as dimensionality reduction, is the transformation of high‐dimensional data into a meaningful representation of reduced dimensionality, which should have a dimensionality that corresponds to the intrinsic dimensionality of the data. Linear discriminant analysis (LDA) is commonly used as a dimensionality reduction technique in the data pre‐processing step for classification and machine learning applications. Feature selection, also called variable selection/attribute selection, is the process of selecting a subset of relevant features for use in model construction. The synthetic minority oversampling technique (SMOTE) algorithm produces artificial data based on the feature space similarities between minority data points.

  • Transform Domain

    Transform domain image processing can be applied in image interpolation for both algorithmic efficiency and quality improvement. This chapter considers a simpler problem of interpolating a 1D sampled signal in the Fourier domain to visualize how transform domain processing can be applied in image interpolation. The 2D discrete cosine transform (DCT) interpolation theorem suggests the application of zero padding in DCT domain to perform image interpolation. When using zero‐padded block‐based transformation to interpolate images, the main problem is the blocking artifacts. The blocking artifact is observed to behave like random white noise in nature but is translation variant. The chapter discusses discuss extendible inverse discrete cosine transform (EIDCT), which performs interpolated inverse discrete Fourier transform (IDFT) over DCT transformed signal. When both blocked zero‐padded DCT interpolated image and EIDCT‐based blocked zero‐padded DFT interpolated image are available, a better image can be obtained by computing the average image from these two images.

  • Partitioned Fractal Interpolation

    This chapter studies the application of fractal image coding to interpolate images. It focuses on partitioned fractal image (PFI) representation based on iterated function system (IFS). The convergence of the IFS defined by a contractive transformation is the result of the “fixed‐point theorem”. The direct application of the IFS suggests the representation of any given image as contractive transformation of itself. The main idea of the fractal image interpolation is rather simple. It is based on the assumption that the fractal coding is really a fractal process and the fractal code's attractor is a fractal object. Fractal image representation technique is a block‐based technique, and hence blocking fractal artifact is observed to be heavy and considered to be the most important visual artifact in the decoded image. When this technique is applied to interpolate an image, the blocking artifact is emphasized and is usually highly visible.



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