Integrated circuit noise
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Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.
Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.
Measurements and instrumentation utilizing electrical and electronic techniques.
Microwave theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of microwaves.
The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as device modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete ...
Introzzi, R.; Rajteri, M.; Brida, G. Applied Superconductivity, IEEE Transactions on, 2007
This work addresses the problem of designing superconducting photodetector readout circuits. A preliminary investigation of a selection of commercially available components to implement a radio-frequency, broadband, low-noise preamplifier operated in a cryogenic environment is presented. Wide band, high gain, low noise and stability under input mismatching load conditions have been the leading criteria taken into account to choose the devices. ...
Head, L.M. Integrated Reliability Workshop Final Report, 1997 IEEE International, 1997
Noise measurements taken under accelerated stressing conditions do not work for the prediction of VLSI interconnect lifetime. This is because a crucial feature of the resistance changes under accelerated bias, which could provide insight into metallization reliability, is obscured by spectral analysis. Distinctive resistance transients occur sporadically during accelerated life testing and it is the presence of these transients that ...
Joseph, E.D.; Kar, B.K.; Rohrkemper, R.; Muh-ling Ger Circuits and Systems, 1996. ISCAS '96., Connecting the World., 1996 IEEE International Symposium on, 1996
The MMAS40G is a highly miniaturized accelerometer developed for automotive applications. This two-chip system includes a capacitive micromechanical silicon chip and an associated CMOS integrated circuit for interfacing and signal conditioning each with a die size of 130 mil 2. The accelerometer requires a 5 V power supply and consumes 3.8 mA of quiescent current. The frequency response is flat ...
Archambeault, B.; Cocchini, M.; Selli, G.; Jun Fan; Knighten, J.L.; Connor, S.; Orlandi, A.; Drewniak, J. Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on, 2008
This paper's goal is to help designers go through a step-by-step process to design the decoupling strategy for the charge supply. The distance to the decoupling capacitors, the number of decoupling capacitors, and the inductance associated with the connection of the decoupling capacitor to the power and ground-reference planes will all influence how much charge is delivered.
Che-Wei Chang; Yu-Tzung Lin; Ying-Yu Tzou Power Electronics and Drive Systems, 2009. PEDS 2009. International Conference on, 2009
Primary-side sensing (PSS) technique can be used for the output voltage or current regulation by employing an auxiliary winding. However, the sensed voltage may be corrupted by switching noise due to leakage inductance, winding resistance, and nonlinearity of the magnetic core, therefore the sensed voltage can only achieve limited accuracy. With the advance of power control IC realization technology, more ...
IMS 2012 Microapps - Integrated Electrothermal Solution Delivers Thermally Aware Circuit Simulation Rick Poore, Agilent EEsof
Sources of Innovation
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
Tutorial of Shlomo Engelberg on use of noise to make measurements
Micro-Apps 2013: Designing an ETSI E-Band Circuit for a MM Wave Wireless System
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
BSIM Spice Model Enables FinFET and UTB IC Design
IMS 2012 Microapps - Phase Noise Choices in Signal Generation: Understanding Needs and Tradeoffs Riadh Said, Agilent
IMS 2011 Microapps - Ultra Low Phase Noise Measurement Technique Using Innovative Optical Delay Lines
IMS 2011 Microapps - A Comparison of Noise Parameter Measurement Techniques
Education for Analog ICs
Surgical Robotics: Medical robotics and computer-integrated interventional medicine
The Evolution and Future of RF Silicon Technologies for THz Applications
Micro-Apps 2013: Determining Circuit Material Dielectric Constant from Phase Measurements
Micro-Apps 2013: Class F Power Amplifier Design, Including System-to-Circuit-to-EM Simulation
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
IMS 2012 Microapps - Improve Microwave Circuit Design Flow Through Passive Model Yield and Sensitivity Analysis
IMS 2012 Microapps - Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
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