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Inductance is the property of an electrical circuit causing voltage to be generated proportional to the rate of change in current in a circuit. (

Conferences related to Inductance

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2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)

1. Power Electronic Devices (Si and Wide band-gap) and Applications, 2. Power electronic packaging and integration, 3. Modeling, Simulation and EMI, 4. Lighting Technologies and Applications, 5. Wireless Power Transfer, 6. Uncontrolled Rectifiers and AC/DC Converters, 7. AC/AC Converters, 8. DC/AC Inverters, 9. DC/DC Converters, 10. Multilevel Power Converters, 11. Electric Machines, Actuators and Sensors, 12. Motor Control and Drives, 13. Sensorless and Sensor-Reduction Control, 14. Renewable Energy and Distributed Generation Systems, 15. Smart/Micro Grid, 16. DC Distribution 17. Power Quality (or Power Electronics for Utility Interface), 18. Energy Storage and Management Systems, 19. Power Electronics for Transportation Electrification, 20. Reliability, diagnosis, prognosis and protection, 21. High Voltage DC Transmission, 22. Other Selected Topics in Power Electronics

  • 2015 IEEE 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia)

    Power electronics, renewable energy, electric vehicle, smart grid

  • 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 ECCE-ASIA)

    The seventh International Power Electronics Conference, IPEC-Hiroshima 2014 -ECCE Asia-, will be held from May 18 to May 21, 2014 in Hiroshima, Japan. The conference venue will be the International Conference Center Hiroshima, which is located in Hiroshima Peace Memorial Park. Power electronics has been providing numerous new technologies in the fields of electric energy conversion and motor drive systems for more than 40 years. In recent years, global energy and environmental issues are becoming more serious and power electronics is expected to play a key role in solving such problems. The IPEC-Hiroshima 2014 -ECCE Asia- will provide a unique opportunity for researchers, engineers, and academics from all over the world to present and exchange the latest information on power electronics, motor drives, and related subjects.

  • 2011 IEEE 8th International Conference on Power Electronics & ECCE Asia (ICPE 2011- ECCE Asia)

    01. Power Semiconductor Devices and Packaging 02. Modeling, Simulation, EMI and Reliability 03. Electric Machines, Actuators and Sensors 04. Motor Control and Drives 05. Sensorless Control 06. Renewable Green Energy (Wind, Solar, Tidal Power Generation) 07. Micro Grid and Distributed Generation 08. Electric Propulsion System (EV, Train, Electric Ship) 09. Electric and Hybrid Vehicles 10. Power Supplies and EV Chargers 11. Power Electronics and Drives for Home Appliance 12. Power Elect

  • 2007 7th International Conference on Power Electronics (ICPE)

    - Power Semiconductor Devices - DC-DC Converters - Inverters and Inverter Control Techniques - Motor Drives - Rectifiers and AC-AC Converters - Renewable Energy - Power Quality and Utility Applications - Automotive Applications and Traction Drives - Energy Storage - Control Techniques Applied to Power Electronics - Modeling, Analysis, and Simulation - Consumer Applications - Other Power Applications

2019 IEEE International Electric Machines & Drives Conference (IEMDC)

The IEEE International Electric Machines and Drives Conference (IEMDC) has been established to be one of the major events in the field of electrical machines and drives. IEMDC is a refernce forum to disseminate and exchange state of art in the filed of the Electrical Machines and Drives. The 2018 edition started in 1997 and the 2019 edition will be 11th one.

2018 13th IEEE Conference on Industrial Electronics and Applications (ICIEA)

Industrial Informatics, Computational Intelligence, Control and Systems, Cyber-physicalSystems, Energy and Environment, Mechatronics, Power Electronics, Signal and InformationProcessing, Network and Communication Technologies

2018 14th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)

The goal of the 14th ASME/IEEE MESA2018 is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances in the area, discuss future research directions, and exchange application experience. The main achievement of MESA2018 is to bring out and highlight the latest research results and developments in the IoT (Internet of Things) era in the field of mechatronics and embedded systems.

2018 19th International Symposium on Quality Electronic Design (ISQED)

19th International Symposium on Quality Electronic Design (ISQED 2018) is the premier interdisciplinary and multidisciplinary Electronic Design conference?bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integratedcircuit technologies, semiconductor technology,packaging, assembly & test to achieve design quality.

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Periodicals related to Inductance

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.

Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.

Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission

Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.

Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.

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Most published Xplore authors for Inductance

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Xplore Articles related to Inductance

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A Method for Realisation of Inductance and Quality Factor to 1 MHz

[{u'author_order': 1, u'affiliation': u'RISE Research Institutes of Sweden, Boras, Sweden', u'full_name': u'Karl-Erik Rydler'}, {u'author_order': 2, u'affiliation': u'RISE Research Institutes of Sweden, Boras, Sweden', u'full_name': u'Tobias Bergsten'}, {u'author_order': 3, u'affiliation': u'RISE Research Institutes of Sweden, Boras, Sweden', u'full_name': u'Gunnar Eklund'}] 2018 Conference on Precision Electromagnetic Measurements (CPEM 2018), 2018

This paper describes a method for realisation of inductance and quality factor to high frequencies by determining the frequency response of gain-and phase- error of an inductance meter using two coils made of a single copper wire. As a starting point a traceable calibration of inductance at 1 kHz is used.

A new inductance measurement method for permanent magnet synchronous linear motor

[{u'author_order': 1, u'affiliation': u'Department of Electrical Engineering, Harbin Institute of Technology, Harbin 150080, China', u'full_name': u'He Zhang'}, {u'author_order': 2, u'affiliation': u'Department of Electrical Engineering, Harbin Institute of Technology, Harbin 150080, China', u'full_name': u'Baoquan Kou'}, {u'author_order': 3, u'affiliation': u'Department of Electrical Engineering, Harbin Institute of Technology, Harbin 150080, China', u'full_name': u'Liqiang Wang'}, {u'author_order': 4, u'affiliation': u'Department of Electrical Engineering, Harbin Institute of Technology, Harbin 150080, China', u'full_name': u'Yinxi Jin'}, {u'author_order': 5, u'affiliation': u'Department of Electrical Engineering, Harbin Institute of Technology, Harbin 150080, China', u'full_name': u'Hailin Zhang'}] 2014 17th International Conference on Electrical Machines and Systems (ICEMS), 2014

A new inductance measurement method for permanent magnet synchronous linear motor is proposed in this paper. Through the theoretical analysis, the relational expression between d- and q-axis inductance and the line voltage is derived. Therefore, we can obtain the accurate inductance value only by measuring the basic electrical parameters at two special mover positions. Compared with conventional inductance measurement methods, ...

Evaluation and comparison of mounted inductance for decoupling capacitor

[{u'author_order': 1, u'affiliation': u'Laboratoire SATIE, ENS de Paris-Saclay, Cachan, France', u'full_name': u'Benoit Goral'}, {u'author_order': 2, u'affiliation': u'Laboratoire SATIE, ENS de Paris-Saclay, Cachan, France', u'full_name': u'Cyrille Gautier'}, {u'author_order': 3, u'affiliation': u"Laboratoire d'Int\xe9grit\xe9 du Signal, Thales Communications and Security, Cholet, France", u'full_name': u'Alexandre Amedeo'}] 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), 2018

In this article, different patterns for decoupling capacitor routed on a dedicated test vehicle are compared. The aim of this study is, on one hand to confirm design rules for enhanced decoupling on printed circuit board and on the other hand, to estimate the value of the mounted inductance introduced by each pattern. Each mounting pattern and the particular parameter ...

Network representation of resonators for wireless power transfer

[{u'author_order': 1, u'affiliation': u"Dipartimento di Ingegneria Elettronica e dell'Informazione, Università di Perugia via G. Duranti 93 06125 Perugia, Italy", u'full_name': u'Marco Dionigi'}, {u'author_order': 2, u'affiliation': u"Dipartimento di Ingegneria Elettronica e dell'Informazione, Università di Perugia via G. Duranti 93 06125 Perugia, Italy", u'full_name': u'Mauro Mongiardo'}] 2013 International Conference on Electromagnetics in Advanced Applications (ICEAA), 2013

We introduce a planar substrate-based resonator suitable for magnetic resonant wireless power transfer (WPT) applications. Its advantages are: flatness, limited space occupation, ease of manufacture, low cost and a relatively high Q. Resonators for WPT should operate by using magnetic field coupling and by avoiding external electric fields. In the proposed structure, the electric field is primarily confined inside the ...

High-frequency and high-power operation of tunnel diodes

[{u'author_order': 1, u'affiliation': u'Electronics Laboratory, General Electric Co., Syracuse, NY, USA', u'full_name': u'C. Kim'}, {u'author_order': 2, u'full_name': u'J. Hopkins'}] 1961 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1961


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Educational Resources on Inductance

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No eLearning Articles are currently tagged "Inductance"


  • Energy Storage in Capacitor Banks

    This chapter covers various aspects involved in the design and construction of energy storage capacitor banks. Methods are described for reducing a complex capacitor bank system into a simple equivalent circuit made up of L, C, and R elements. The chapter presents typical configurations and constructional aspects of capacitor banks. The two most common implementations of capacitor/switch assemblies are common. One is to have a module make up of one or two capacitors with switch mounted directly over the capacitor terminals so that each module has its individual switch. Another is a topology in which a group of capacitors are connected in parallel by a bus bar or parallel plate transmission line and share a start switch placed nearby. The chapter also shows a typical system layout for a high‐energy storage capacitor bank. It further lists some capacitor banks, and summarizes a few details regarding their ratings, location, switches, transmission line, and trigger pulse generator.

  • Non‐Periodic Synthesized Transmission Lines for Circuit Miniaturization

    Non‐periodic synthesized transmission lines are realized by quasi‐lumped/lumped networks without any periodicity. In this sort of designs, the synthesized line is realized by a network associated with a significant amount of electrical length (i.e., phase delay). In this chapter, a number of non‐periodic synthesized transmission lines, using quasi‐lumped/lumped elements in microstrip and coplanar waveguide (CPW) forms on printed circuit boards (PCBs), are introduced using the design principles. Essential building blocks in the feeding network of a phased array, including the hybrid couplers and Butler matrix, are realized by synthesized microstrip lines. A bandpass filter, based on a synthesized dual‐mode ring resonator, is investigated and demonstrated. The ring resonator has more stringent restrictions on the unloaded quality factor of the line used. Coupled synthesized lines using CPW structures or lumped elements are studied and applied to realize directional couplers, Marchand baluns, and reflection‐type phase shifters. Finally, the concept of vertical inductors is introduced.

  • Design of Z-Source and Quasi-Z-Source Inverters

    Inductance and capacitance are the two main parameters to be designed in the Z-source/quasi-Z-source inverter. This chapter focuses on the network parameters, loss calculations, voltage and current stress, coupled inductor of Z-source/quasi-Z source inverters and also efficiency, cost, and volume, in comparison to the conventional inverter. For three-phase qZSI, the inductor and capacitor should be designed to limit the switching frequency current and voltage ripple. However, for single-phase qZSI, the double line-frequency ripple will be the main concern for design of the inductor and capacitor, because larger inductance and capacitance are required to limit the switching frequency ripple. The total loss consists of those of the H-bridge device, qZS diode, inductor, and capacitor of qZS network. The voltage and current stresses depend on the modulation methods. The presented modeling, circuit analysis, and power loss evaluation provided an illustration for the future building and development of impedance source inverters/converters.

  • Hardware‐in‐the‐Loop Systems with Power Electronics: A Powerful Simulation Tool

    The chapter points out that sequential switching is not only applicable to IGBT modules with integrated diodes mounted closely on a heat sink, but also to complete industrial standard two‐level voltage source inverters (VSIs). Thus, the power capability and the overall switching frequency of these products can be increased by using several of them in parallel with sequential switching. Using this approach, a novel electrical test bench for drive inverters can be set up with a minimum effort on design and development. This provides an alternative for manufacturers of drive inverters to test their complete product range under real power levels without the requirement for a multitude of real machines.The discussion provided in the chapter proves that the so called virtual machine (VM) is a Hardware‐in‐the‐Loop system allowing an inverter to be tested at real power levels without the need for installing and operating real machines. The VM has the same characteristics as a real induction motor or even a synchronous motor. Different machines and their respective load conditions can be emulated by software, which means that the drive inverter under test can operate in its normal mode (as usual). No modification has to be done to the inverter or to the control unit.


    The study of electrical machines is a classic subject in electrical engineering and usually involves the understanding of transformers and rotating devices. Several simulation programs can give a good platform to help the electrical engineer to find a reasonable solution with quite accurate loading predictions and minimum costs. This chapter gives the foundations of this subject that might be very important for students, engineers, and designers to work through a model based on a simulation design approach. There are two simple ways of simulating an induction machine (IM) in PSIM: either using an equivalent circuit PSIM block made up with electrical components or using the premade equivalent block that can be embedded in the electrical circuit simulation. Some types of rotating loads demand for a good speed control. In laboratory tests, it is very common to use a DC motor driving a loaded self‐excited induction generator (SEIG) to keep constant its load frequency.

  • Pulse Forming Lines

    Many applications require energy to be delivered on faster timescales. In this case, the circuit may consist of a high‐voltage generator and a pulse forming transmission line (PFL) controlled by a closing switch. The high‐voltage generator, such as a Marx, charges the PFL in microseconds and the output switch discharges the PFL into the load. This chapter provides an insight into mechanisms of transients in the PFLs as well as the equations required for design of various PFL configurations developed to meet specific requirements. It then discusses the salient features of PFL performance parameters such as electrical breakdown, dielectric constant, self‐discharge time constant, optimum impedance, charging source, and switching techniques. The coaxial pulse forming line can be used in a transmission line pulser. Blumlein PFL geometry enables the production of an output pulse into a matched load equal to the original charging voltage of the line.

  • Single‐Input Multiple‐Output High‐voltage DC–AC Converters

    This chapter proposes several novel single‐phase/three‐phase DC‐AC converters with two or more outputs, in order to satisfy the requirement of multiple AC outputs in some high‐voltage high‐power applications. It describes the circuit topology and operating principle. The chapter provides the carrier phase‐shifted sinusoidal pulse‐width modulation (CPS‐SPWM) scheme which is applied to the proposed converters, and the simulation waveforms to prove the feasibility of the proposed multiple‐output high‐voltage DC‐AC converters. It also proposes different kinds of single‐input multiple‐output high‐voltage DC‐AC inverter with the following characteristics. Two or more single‐phase/three‐phase AC outputs can be obtained; output frequencies can be identical or different; the switching arm is made up of NSMs, and the output voltage of the converter has multiple levels and low harmonics; and voltage stress of each power switch in the sub‐module (SM) is only UDC/N.

  • Multiple‐Input Single‐Output High‐voltage AC–DC Converters

    In the high‐voltage direct current (HVDC) transmission system, there are several AC input sources which need to be converted to DC form; the common solution is to apply one AC‐DC converter for each AC source and then connect all of the DC output sides together. In order to simplify the structure of the whole system, this chapter proposes a series of AC‐DC converters with multiple AC inputs and single DC output. In order to avoid using high‐voltage capacitors in the topology, the single‐phase 2M‐arm multiple‐input single‐output AC‐DC converter can be constructed by replacing the series capacitors with switching arms. If the input voltage sources are in three‐phase form, then the three‐phase multiple‐input single‐output AC‐DC converter can be constructed by adding one general phase unit to the single‐phase 2M‐arm AC‐DC converter.

  • Multipulse SCR Rectifiers

    This chapter provides an overview of six‐pulse SCR rectifier, which is the building block for the multipulse SCR rectifiers, followed by an analysis of 12‐, 18‐, and 24‐pulse rectifiers. It investigates the line current THD and input power factor of these rectifiers, and summarises the results in a graphic format. The line current THD of the 12‐pulse SCR rectifier normally does not satisfy the harmonic guidelines set by IEEE Standard 519‐2014. The chapter presents the multipulse diode rectifiers that are normally used in voltage source inverter (VSI) fed drives while the multipulse SCR rectifiers to be can be used in current source inverter (CSI) based drives. The SCR rectifier provides an adjustable DC current for the CSI which converts the DC current to a three‐phase pulse‐width‐modulated (PWM) AC current with variable magnitude and frequency. With the presence of the line inductance, the commutation of the SCR devices will not complete instantly.

  • Inductance Phenomena

    Inductance as a property of electrical systems, and specifically designed in a component such as an inductor, reactor, or transformer presents hazards to people who are working on the equipment or systems. The first hazard may be coming in contact with the energized conductors. Another important hazard is induced currents in conductive materials, which may cause electrical shocks, arcing, and heating. The inductance of an open-wire line increases as the conductors are separated. Infinite separation, as in a one-wire line, would mean infinite inductance. The skin effect is not strictly a form of inductance, but a frequency effect on resistance. The skin effect changes the internal inductance of a solid conductor, because the conduction occurs along the surface, making the inductance approach that of a tube rather than a cylinder. The surge impedance will determine the ratio of voltage and current for a transient wave traveling down the line.

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