Inductance

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Inductance is the property of an electrical circuit causing voltage to be generated proportional to the rate of change in current in a circuit. (Wikipedia.org)






Conferences related to Inductance

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2013 26th International Conference on VLSI Design: concurrently with the 12th International Conference on Embedded Systems

The conference is a forum for researchers and designers to present and discuss various aspects of VLSI design, electronic design automation (EDA), embedded systems, and enabling technologies. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry.


2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

The IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan focuses on the most leading-edge components packaging and manufacturing packaging technology for electronics devices, such as System in a Package (SiP), 3D Packaging, Optoelectronics Packaging and Wafer-level Packaging within Materials and Electrical Performance & Thermal Management.

  • 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

    The IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan focuses the most leading-edge components packaging and manufacturing packaging technology for electronics devices, such as System in a Package (SiP), 3D Packaging and Wafer-level Packaging within Materials and Electrical Performance & Thermal Management.

  • 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

    IEEE CPMT Symposium Japan provides component, packaging, and manufacturing researchers/engineers who wish to extend their activities beyond borders with opportunities to exchange technical information and perspective.


2013 International Conference on Electrical Machines and Systems (ICEMS)

Main Topics1) PM, DC Machines and Drives2) Power Converters/Inverters3) Induction Machines and Drives4) Synchronous Machines and Drives5) Linear Machines and Magnetic Levitation6) Special Machines and Applications7) Renewable Energy and Related Topics8) Field Analysis and Computational Method9) Motion Control10) Fault and Diagnosis11) Designing, Manufacturing, Testing and Standards12) Transformers and High Voltage Machines13) OthersSpecial Topics1) High Speed Machine and Drives2) Personal Mobility3) EMI/EMC4) High Speed Train5) xEVs and Applications6) In-wheel Motors and Drives7) x-by-wire TechnologySpecial Topics1. High Speed Machine and Drives2. Personal Mobility3. In-wheel Motors and Drives4. x-by-wire Technology5. Electric Propulsion6. High Speed Train

  • 2012 15th International Conference on Electrical Machines and Systems (ICEMS)

    The conference will provide a big opportunity for researchers and professionals from all over the world to present the latest researches and developments and to exchange useful information and experiences in the fields of electrical machines and systems such as motor drive systems, turbine generators, linear machines, transformers, electric vehicles, renewable energy, power converters, etc.

  • 2011 International Conference on Electrical Machines and Systems (ICEMS)

    Electrical machines, power electronics and systems.

  • 2010 International Conference on Electrical Machines and Systems (ICEMS)

    1) Power Converters/Inverters 2) Systems for Renewable Energy 3) Motor Drives 4) PM Machines and DC Machines 5) Induction, Synchronous Machines 6) Transformers and High Voltage Machines 7) Linear Machines 8) Special Machines and Their Applications 9) Field Analysis and optimal Design Technologies 10) Electrical Technologies for the Next Generation Vehicle

  • 2009 International Conference on Electrical Machines and Systems (ICEMS)

    The aims of ICEMS2009 are to provide an opportunity for scientists and experts to present the latest research developments in the field of electrical machines and systems (rotating and other machines, power electronics, motion control, and motor drives) and to exchange useful information and experiences in research, trends and applications.

  • 2008 International Conference on Electrical Machines and Systems (ICEMS)

    The conference is a forum for specialists and engineers engaged in the field of electrical machines and drive systems to exchange their latest achievements and experiences of developments, trends and applications.


2012 16th International Symposium on Electromagnetic Launch Technology (EML)

The scope of EML2012 is: Launchers EM Coilguns EM Railguns Electrothermal / Electrothermal-Chemical Launchers Projectiles Armatures Integrated Launch Packages Launch Package Components High-G Sensors Guidance, Navigation, and Control Pulsed-Power Supply Technology Energy Storage Power Conditioning Switching Controls Modeling and Simulation Computational Techniques Modeling / Simulation Comparison Diagnostics Diagnostic Techniques

  • 2010 15th International Symposium on Electromagnetic Launch Technology (EML)

    The EML Symposium is a biennial event that serves as the principal forum for the discussion, interchange, and presentation of research on critical technologies for accelerating macroscopic objects or projectiles to hypervelocities using electromagnetic or electrothermochemical launchers. The EML Symposia have a long-standing international reputation as a catalyst for stimulating research in the eld of electromagnetic launch. During the Symposium, researchers share and exchange a wealth of knowledge through

  • 2008 14th Symposium on Electromagnetic Launch Technology (EML)


IECON 2011 - 37th Annual Conference of IEEE Industrial Electronics

industrial applications of electronics, control, robotics, signal processing, computational and artificial intelligence, sensors and actuators, instrumentation electronics, computer networks, internet and multimedia technologies.


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Periodicals related to Inductance

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Magnetics, IEEE Transactions on

Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The Transactions publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.


Nanotechnology, IEEE Transactions on

The proposed IEEE Transactions on Nanotechnology will be devoted to the publication of manuscripts of archival value in the general area of nanotechnology, that is rapidly emerging as one of the fastest growing and most promising new technological developments for the next generation and beyond.




Xplore Articles related to Inductance

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High T/sub c/ dc SQUID utilizing bicrystal junctions with 30 degree misorientation angle

K. Enpuku; T. Minotani; F. Shiraishi; A. Kandori; S. Kawakami IEEE Transactions on Applied Superconductivity, 1999

Performances of high T/sub c/ dc SQUID utilizing bicrystal junctions with 30/spl deg/ misorientation angle have been studied. Junction resistance R/sub s/=10 /spl Omega/ and critical current I/sub 0/=10-20 /spl mu/A can be obtained rather easily at T=77 K with this technology. As a result, voltage modulation depth as high as 50 /spl mu/V, and flux noise as low as ...


Steady state analysis & design of switched capacitor DC-DC convertors

Jian Liu; Zhiming Chen Industrial Electronics Society, 1999. IECON '99 Proceedings. The 25th Annual Conference of the IEEE, 1999

This paper presents a new approach to modelling switched capacitor (SC) DC-DC power converters in the steady-state. The distinguishing feature of SC DC-DC converters, i.e., no inductance elements and therefore the relationship in electricity quantity among the component capacitors can be determined, is made full use of, thus the analysis is much simplified. The analysis results reveals that a SC ...


Design of avalanche capability of Power MOSFETs by device simulation

I. Pawel; R. Siemieniec; M. Rosch; F. Hirler; C. Geissler; A. Pugatschow; L. J. Balk 2007 European Conference on Power Electronics and Applications, 2007

The avalanche behavior of new 150 V trench power MOSFETs was designed with the help of two- dimensional device simulation techniques. The devices employ the compensation principle for low on-state losses. A new edge-termination structure ensures that avalanche breakdown always occurs in the cell region of the device. For the transistor cells, two different destruction regimes were identified: energy-related destruction ...


Magnetics design and optimization for tapped-series-capacitor (TSC) power converters

Minjie Chen 2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL), 2017

High voltage conversion ratio dc-dc converters are needed in a wide range of applications including power supplies for data centers and robotics. Hybrid switched-capacitor-magnetics power converters can leverage the advantages of capacitor-based circuits and inductor-based circuits to achieve high efficiency and high power density. This paper investigates the design method for an emerging family of hybrid switched-capacitor-magnetics circuits - tapped-series-capacitor ...


Design considerations for a level-2 on-board PEV charger based on interleaved boost PFC and LLC resonant converters

Haoyu Wang; Serkan Dusmez; Alireza Khaligh 2013 IEEE Transportation Electrification Conference and Expo (ITEC), 2013

In this paper, a two-stage on board battery charger is proposed for plug-in electric vehicles (PEVs). An interleaved boost topology is employed in the first stage for power factor correction (PFC) and to reduce total harmonic distortion (THD). In the second stage, a half bridge LLC multi-resonant converter is adopted for galvanic isolation and dc-dc conversion. Design considerations are discussed ...


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Educational Resources on Inductance

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High T/sub c/ dc SQUID utilizing bicrystal junctions with 30 degree misorientation angle

K. Enpuku; T. Minotani; F. Shiraishi; A. Kandori; S. Kawakami IEEE Transactions on Applied Superconductivity, 1999

Performances of high T/sub c/ dc SQUID utilizing bicrystal junctions with 30/spl deg/ misorientation angle have been studied. Junction resistance R/sub s/=10 /spl Omega/ and critical current I/sub 0/=10-20 /spl mu/A can be obtained rather easily at T=77 K with this technology. As a result, voltage modulation depth as high as 50 /spl mu/V, and flux noise as low as ...


Steady state analysis & design of switched capacitor DC-DC convertors

Jian Liu; Zhiming Chen Industrial Electronics Society, 1999. IECON '99 Proceedings. The 25th Annual Conference of the IEEE, 1999

This paper presents a new approach to modelling switched capacitor (SC) DC-DC power converters in the steady-state. The distinguishing feature of SC DC-DC converters, i.e., no inductance elements and therefore the relationship in electricity quantity among the component capacitors can be determined, is made full use of, thus the analysis is much simplified. The analysis results reveals that a SC ...


Design of avalanche capability of Power MOSFETs by device simulation

I. Pawel; R. Siemieniec; M. Rosch; F. Hirler; C. Geissler; A. Pugatschow; L. J. Balk 2007 European Conference on Power Electronics and Applications, 2007

The avalanche behavior of new 150 V trench power MOSFETs was designed with the help of two- dimensional device simulation techniques. The devices employ the compensation principle for low on-state losses. A new edge-termination structure ensures that avalanche breakdown always occurs in the cell region of the device. For the transistor cells, two different destruction regimes were identified: energy-related destruction ...


Magnetics design and optimization for tapped-series-capacitor (TSC) power converters

Minjie Chen 2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL), 2017

High voltage conversion ratio dc-dc converters are needed in a wide range of applications including power supplies for data centers and robotics. Hybrid switched-capacitor-magnetics power converters can leverage the advantages of capacitor-based circuits and inductor-based circuits to achieve high efficiency and high power density. This paper investigates the design method for an emerging family of hybrid switched-capacitor-magnetics circuits - tapped-series-capacitor ...


Design considerations for a level-2 on-board PEV charger based on interleaved boost PFC and LLC resonant converters

Haoyu Wang; Serkan Dusmez; Alireza Khaligh 2013 IEEE Transportation Electrification Conference and Expo (ITEC), 2013

In this paper, a two-stage on board battery charger is proposed for plug-in electric vehicles (PEVs). An interleaved boost topology is employed in the first stage for power factor correction (PFC) and to reduce total harmonic distortion (THD). In the second stage, a half bridge LLC multi-resonant converter is adopted for galvanic isolation and dc-dc conversion. Design considerations are discussed ...


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  • Frontmatter

    The prelims comprise: Half Title Title Copyright Dedication Contents Preface

  • Techniques for Driving Interconnect

    This chapter contains sections titled: Introduction Technology Scaling Trends Problems and Solutions Regarding Capacitance Problems and Solutions Regarding Inductance Problems and Solutions Regarding Resistance Problems and Solutions Regarding Long Distance Routing Conclusion This chapter contains sections titled: Acknowledgments References

  • Inductance Phenomena

    Inductance as a property of electrical systems, and specifically designed in a component such as an inductor, reactor, or transformer presents hazards to people who are working on the equipment or systems. The first hazard may be coming in contact with the energized conductors. Another important hazard is induced currents in conductive materials, which may cause electrical shocks, arcing, and heating. The inductance of an open-wire line increases as the conductors are separated. Infinite separation, as in a one-wire line, would mean infinite inductance. The skin effect is not strictly a form of inductance, but a frequency effect on resistance. The skin effect changes the internal inductance of a solid conductor, because the conduction occurs along the surface, making the inductance approach that of a tube rather than a cylinder. The surge impedance will determine the ratio of voltage and current for a transient wave traveling down the line.

  • Appendix D: Self Inductance of a Straight Finite Cylindrical Wire

    This classic text offers you the key to understanding short circuits, open conductors and other problems relating to electric power systems that are subject to unbalanced conditions. Using the method of symmetrical components, acknowledged expert Paul M. Anderson provides comprehensive guidance for both finding solutions for faulted power systems and maintaining protective system applications. You'll learn to solve advanced problems, while gaining a thorough background in elementary configurations. Features you'll put to immediate use: Numerous examples and problems Clear, concise notation Analytical simplifications Matrix methods applicable to digital computer technology Extensive appendices

  • Introduction

    This chapter contains sections titled: Historical Background Fundamental Concepts of Lumped Circuits Outline of the Book Loop Inductance vs. Partial Inductance

  • Distributed Windings and Rotating Electric Machinery

    This chapter focuses on a complicated winding arrangement known as a distributed winding, which is often used in rotating electric machinery. In these machines, the goal is to establish a continuously rotating set of north and south poles on the stator, which interact with an equal number of north and south poles on the rotor, to produce uniform torque. The winding function has three important uses. First, it is useful in determining the MMF caused by distributed windings. Second, it is used to determine how much flux links a winding. Third, the winding function is instrumental in calculating winding inductances. The chapter talks about the air-gap magnetomotive force (MMF). It explains the calculation of inductances of distributed windings. The problem of the computation of leakage inductance of a stator winding and the problem of finding the resistance of a distributed winding are considered.

  • Magnetic Fields of DC Currents (Steady Flow of Charge)

    This chapter contains sections titled: Magnetic Field Vectors and Properties of Materials Gauss's Law for the Magnetic Field and the Surface Integral The Biot-Savart Law Ampÿre's Law and the Line Integral Vector Magnetic Potential Determining the Inductance of a Current Loop: A Preliminary Discussion Energy Stored in the Magnetic Field The Method of Images Steady (DC) Currents Must Form Closed Loops

  • Electric Power Transmission

    This chapter contains sections titled: Introduction Electric Transmission Line Parameters Line Inductance Line Capacitance Two-Port Networks Transmission Line Models Problems

  • Partial Inductances of Conductors of Rectangular Cross Section

    This chapter contains sections titled: Formulation for the Computation of the Partial Inductances of PCB Lands Self Partial Inductance of PCB Lands Mutual Partial Inductance between PCB Lands Concept of Geometric Mean Distance Computing the High-Frequency Partial Inductances of Lands and Numerical Methods

  • Experimental Results and Modeling Techniques for Substrate Noise in MixedSignal Integrated Circuits

    Switching transients in digital MOS circuits can perturb analog circuits integrated on the same die by means of coupling through the substrate. This paper describes an experimental technique for observing the effects of such substrate noise. Various approaches to reducing substrate crosstalk (the use of physical separation of analog and digital circuits, guard rings, and a low- inductance substrate bias) are evaluated experimentally for a CMOS technology with a substrate comprised of an epitaxial layer grown on a heavily doped bulk wafer. Observations indicate that reducing the inductance in the substrate bias is more effective than either physical separation or guard rings in minimizing substrate crosstalk between analog and digital circuits fabricated on epitaxial substrates. To enhance understanding of the experimental results, two-dimensional device simulations are used to show how crosstalk propagates via the heavily doped bulk. Device simulations are also used to predict the nature of substrate crosstalk in CMOS technologies integrated in uniform, lightly doped bulk substrates, showing that in such cases the substrate noise is highly dependent on layout geometry. Finally, a method of including substrate effects in SPICE simulations for circuits fabricated on epitaxial, heavily doped substrates has been developed using a single-node substrate model.



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