Indium phosphide

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Indium phosphide (InP) is a binary semiconductor composed of indium and phosphorus. (Wikipedia.org)






Conferences related to Indium phosphide

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2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

CSICS is a technology and integrated circuit conference showcasing many of the finest achievements made in compound semiconductor technology and circuits. CSICS has grown to encompass GaAs, InP, GaN, SiGe, SiC, InSb, nano-scale CMOS, and graphene semiconductor technologies and their application to RF, mm-wave, high-speed, and energy conversion circuits and systems. Specific technical areas of interest include: Innovative device concepts in emerging technologies, Nitrides, InP, III-V on Si, Ge on Si, Graphene, Analog, RF, mixed-signal, mm-wave, THz circuit blocks and ICs in III-V, CMOS, SiGe BiCMOS, Power conversion circuits and technologies, Optoelectronic and photonic devices and ICs, System applications, Wireless handsets and base stations, Vehicular and military RADAR, High-speed digital systems, Fiber optics and photonics, Device and circuit modeling / EM and EDA tools, Thermal simulation and advanced packaging of highpower devices and ICs, Device and IC manufacturing processes

  • 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

    The CSIC Symposium is the preeminent international forum on developments in integrated circuits using compound semiconductores such as GaAs, SiGe and other materials. Coverage embraces all aspects of the technology from materials issues and device fabrication, through IC design and testing, high volume manufacturing, and system applications.

  • 2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

    The CSIC Symposium is the preeminent international forum on developments in integrated circuits using compound semiconductors such as GaAs, SiGe and other materials. Coverage embraces all aspects of the technology from materials issues and device fabrication, through IC design and testing, high volume manufacturing, and system applications.

  • 2010 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

    The CSIC Symposium is the preeminent international forum on developments in integrated circuits using compound semiconductors such as GaAs, InP, GaN, SiGe and other materials. Coverage embraces all aspects of the technology, from materials issues and device fabrication, through IC design and testing, high volume manufacturing, and system applications.

  • 2009 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

    CSICS is the preeminent international forum for developments in compound semiconductor integrated circuits, embracing GaAs, InP, GaN, SiGe, and more recently, millimeter wave CMOS technology. Coverage includes all aspects of the technology, from materials issues and device fabrication, through IC design and testing, high volume manufacturing, and system applications.


2012 24th International Conference on Indium Phosphide & Related Materials (IPRM)

IPRM-2012 is the 24th event of this highly renowned conference series established in 1989. The conference will continue the tradition of bringing together scientists from academia and industry to share recent developments in the field. Major conference topics will include advances in materials, devices, processing, and applications in telecom and datacom, VLSI, defense, sensors and imaging. A new topical area of III-V MOS devices will be addressed to highlight the rapidly growing importance of this technology.


2012 4th Asia Symposium on Quality Electronic Design (ASQED 2012)

The 4th Asia Symposium on Quality Electronic Design (ASQED 2012) is the forth event organized by the International Society for Quality Electronic Design with technical sponsorship from several IEEE Societies. This event is being co-organized and managed by SHRDC. ASQED emphasizes innovations and the latest developments in System and IC Design, MEMS & NEMS, Bio and Nano Electronics, Photovoltaic (PV) Technology and Electronics, Semiconductor Process Technology, IC Packaging & PCB Technology, Test, and Manufacturing.

  • 2011 3rd Asia Symposium on Quality Electronic Design (ASQED 2011)

    ASQED bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality.

  • 2010 2nd Asia Symposium on Quality Electronic Design (ASQED 2010)

    ASQED 2010 strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design and intends to highlight and accelerate co-operation among the IC design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities.

  • 2009 1st Asia Symposium on Quality Electronic Design (ASQED 2009)

    ASQED 09 is aimed at bridging the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality. The conference emphasizes a holistic approach toward electronic design and intends to highlight and accelerate cooperation among the IC Design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities.


2012 IEEE 7th Nanotechnology Materials and Devices Conference (NMDC)

Graphene and Nanotube Based Materials and Devices; MEMS/NEMS for Bio-Nanotechnology; Characterization and Simulation of Nanomaterials and Nanostructures; Materials and Devices for Nanoelectronics, Nano-Optics; Materials and Devices for Energy and Environmental Applications.

  • 2011 IEEE Nanotechnology Materials and Devices Conference (NMDC)

    NMDC aims to develop critical assessment of existing work and future directions in nanotechnology research including nanomaterials and fabrications, nanoelectronics, nanophotonics, devices, and integration. This conference will bring together key researchers from every sector in the nanotechnology research field, with a special focus on materials and devices.

  • 2010 IEEE Nanotechnology Materials and Devices Conference (NMDC)

    NMDC aims to develop critical assessment of existing work and future directions in nanotechnology research including nanomaterials and fabrications, nanoelectronics, nanophotonics, devices, and integration. This conference will bring together key researchers from all over the world and from every sector of academy and industry in the nanotechnology research field, with a special focus on materials and devices.

  • 2009 IEEE Nanotechnology Materials and Devices Conference (NMDC)

    NMDC aims to develop critical assessment of existing work and future directions in nanotechnology research including nanomaterials and fabrications, nanoelectronics, nanophotonics, devices, and integration. This conference will bring together key researchers from all over the world and from every sector of academy and industry in the nanotechnology research field, with a special focus on materials and devices.

  • 2008 2nd Nanotechnology Materials and Devices Conference (NMDC)

    NMDC aims to develop critical assessment of existing work and future directions in nanotechnology research including nanomaterials and fabrications, nanoelectronics, nanophotonics, devices, and integration. This conference will bring together key researchers from all over the world and from every sector of academy and industry in the nanotechnology research field, with a special focus on materials and devices.

  • 2006 Nanotechnology Materials and Devices Conference (NMDC)


2009 Reliability of Compound Semiconductors Workshop (ROCS)

The ROCS Workshop brings together researchers, manufacturers and users of compound semiconductor materials, devices and circuits. Papers presenting latest results, including work-in-progress and new developments in all aspects of compound semiconductor quality and reliability are presented.

  • 2008 Reliability of Compound Semiconductors Workshop (ROCS)

    The ROCS workshop covers the reliability of electron devices fabricated from compound semiconductors including GaAs, InP, GaN, SiGe, SiC, InSb and related compounds and alloys (e.g. AlGaAs, GaSb). Topics include failure mechanisms, accelerated testing, radiation effects, thermal analysis, and quality assurance for HEMTs, PHEMTs, HBTs, MESFETs, HFETs and other devices.

  • 2007 Reliability of Compound Semiconductors Workshop (ROCS)

    The Reliability of Compound Semiconductors Workshop brings together researchers, manufacturers, & users of compound semiconductor devices to discuss the latest results and new developments in all phases of Compound Semiconductor Reliability. Original papers discussing work in progress and emerging device technologies are encouraged.



Periodicals related to Indium phosphide

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Spectrum, IEEE

IEEE Spectrum Magazine, the flagship publication of the IEEE, explores the development, applications and implications of new technologies. It anticipates trends in engineering, science, and technology, and provides a forum for understanding, discussion and leadership in these areas. IEEE Spectrum is the world's leading engineering and scientific magazine. Read by over 300,000 engineers worldwide, Spectrum provides international coverage of all ...




Xplore Articles related to Indium phosphide

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High-power linear balanced InP photodetectors for coherent analog optical links

Houtsma, V.; Hu, T.; Weimann, N.G.; Kopf, R.; Tate, A.; Frackoviak, J.; Reyes, R.; Chen, Y.-K.; Zhang, L. Avionics, Fiber- Optics and Photonics Technology Conference (AVFOP), 2011 IEEE, 2011

We demonstrated an integrated InP high-power dual pair balanced uni-traveling carrier photo-detector. Each pair delivers over 1 W of RF output power into a 50 Ω load at 2 GHz which is 6 dB higher than a discrete diode of the same junction diameter. The responsivity is 0.65 A/W and the common mode rejection ratio of the balanced diode pair ...


Patterned 1.54 /spl mu/m vertical cavity laser with mismatched defect-free mirrors

Qasaimeh, O.; Gebretsadik, H.; Bhattacharya, P.; Caneau, C.; Bhat, R. Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International, 1999

Novel 1.54 /spl mu/m InP-based vertical cavity surface-emitting lasers have been realized with defect-free patterned GaAs/AlGaAs mirrors. Lasers were designed with InP/InGaAsP bottom mirrors, a strain compensated InGaAsP quantum well active region, an InAlAs-oxide current confinement layer and short-stack oxidized GaAs/AlGaAs top DBR mirrors. Threshold current as low as 5 mA is obtained at 15/spl deg/C for an 8 /spl ...


Monolithic integrated wavelength demultiplexer based on a waveguide Rowland circle grating in InGaAsP/lnP

Jian-Jun He; Lamontagne, B.; Delage, A.; Erickson, L.; Davies, M.; Koteles, E.S. Lightwave Technology, Journal of, 1998

We present detailed modeling and experimental results for an improved design of an InGaAsP-InP wavelength demultiplexer based on a monolithically integrated Rowland circle grating. The design incorporated ten wavelength channels at 1.55 μm with a uniform spacing of 2 nm. The total on-chip loss was about 10 dB and the crosstalk between adjacent channels was as low as -25 dB. ...


InP/InGaAs heterojunction phototransistors for optoelectronic receivers

Houston, P.A.; Helme, J.; Wai Keng Ng; Chee Hing Tan Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on, 2004

A theoretical and experimental analysis of the performance of InP/InGaAs heterostructure phototransistors (HPT) has been carried out and comparisons made with avalanche photodiodes (APDs) and PIN-HBT photodetectors. Although the APDs are intrinsically faster, the HPT in travelling-wave form has demonstrated excellent responsivity and power handling capability.


Waveguide avalanche photodiode operating at 1.55 μm with a gain-bandwidth product of 320 GHz

Kinsey, G.S.; Campbell, J.C.; Dentai, A.G. Photonics Technology Letters, IEEE, 2001

An In/sub 0.52/Al/sub 0.48/As-In/sub 0.53/Ga/sub 0.47/As waveguide avalanche photodiode with a record gain-bandwidth product of over 320 GHz has been demonstrated. A bandwidth of 28 GHz was achieved at low gains with low excess noise and a quantum efficiency of 16% at 1.55 μm.


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