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IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.
IEEE Design & Test of Computers offers original works describing the methods used to design and test electronic product hardware and supportive software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. Topics include IC/module design, low-power design, electronic design automation, design/test verification, practical technology, and standards. IEEE Design & Test of ...
Educational methods, technology, and programs; history of technology; impact of evolving research on education.
The IEEE Region 9 is releasing the IEEE Latin America Transactions to enable the publication of non-published and technically excellent papers from Latin American engineers, in Spanish or Portuguese languages. Engineers and researchers from Portugal and Spain (and others countries with the same language) are also very welcome to submit their proposals.
Bayes procedures; buried-object detection; dielectric measurements; Doppler measurements; geomagnetism; sea floor; sea ice; sea measurements; sea surface electromagnetic scattering; seismology; sonar; acoustic tomography; underwater acoustics; and underwater radio communication.
Bansal, Rajeev Antennas and Propagation Magazine, IEEE, 2014
As I reported in a previous column , from July 1922 to December 1983 (when it ceased publication), the Bell System Technical Journal (BSTJ) published not only original research in the field of electrical communications, but also reprints on ??important research and development work in the communication field generally so that the results of such work may be given greater ...
Stoukatch, Serguei; Walewyns, Thomas; Tooten, Ester; Axisa, Fabrice; Francis, Laurent A.; Destine, Jacques Microelectronics Packaging Conference (EMPC) , 2013 European, 2013
We have proposed and demonstrated a novel sequence in MEMS fabrication process flow. The novel MEMS fabrication process flow can be shortly described as a "packaging first, MEMS release second", whereas a standard process starts form MEMS release and ends up with packaging. The process is explored on a 3D capacitive MEMS sensor (3 × 3 mm2). Unreleased wafer is ...
Harris, C.B.; Webber, M.E. Innovative Smart Grid Technologies Conference (ISGT), 2014 IEEE PES, 2014
It is anticipated that plug-in electric vehicles (PEVs), which rely exclusively on a battery to provide some or all of their driving range, will grow in popularity in the coming decades. In anticipation of the growth in electricity demand to support PEV charging, extensive study has been devoted to assessing the effects of these loads. While optimal charging strategies could ...
Sahal, R.; Khattab, S. M.; Omara, F. A. Informatics and Systems (INFOS), 2012 8th International Conference on, 2012
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Taib, A.; Idin, M.A.Mohamad Intelligent and Advanced Systems (ICIAS), 2012 4th International Conference on, 2012
Micro Electromechanical Systems (MEMS) relays consists of three types of relay based on actuation methods; electrostatic, electrothermal and electromagnetic. This paper focuses on electromagnetic micro relay only. The study will focus on analyzing the magnetic behaviors of a specific electromagnetic micro relay. It involves validation of results and data acquisition. Investigations on magnetic behaviors of the electromagnetic micro relay are ...
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